CN111793734A - 一种3d打印透气砖及其制备方法 - Google Patents
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Abstract
一种3D打印透气砖及其制备方法,涉及一种钢铁冶炼领域,包括透气砖本体,透气砖本体从外至内依次设有钢壳B、浇注体和弥散体,在钢壳B内设有至少一个弥散体,每个弥散体的外部均设有带缺口的钢壳A,钢壳A外部均设有紧固件,浇注体在钢壳B与多个弥散体之间,钢壳B的下部设有气室,气室的下部设有与气室连通的气体输送管;通过备料、制备弥散体、钢结构、组装弥散体、浇注、养护、干燥、热处理步骤,即可获得透气砖成品;本发明通过3D打印SLS烧结技术,弥散体无需经历高温烧成,即可制备出强度较高的弥散式透气通道前期形式;且无需穿条造缝,减小了人为因素对产品质量的影响,缩短了产品的制造周期、降低了生产能耗。
Description
技术领域
本发明涉及钢铁冶炼领域,尤其是涉及一种3D打印透气砖及其制备方法。
背景技术
公知的,透气砖是炉外精炼的关键性功能元件,精炼时通过砖芯中透气通道向钢包内吹入惰性气体(如氩气)搅拌钢水,使钢包内温度、成分分布均匀,促使夹杂物上浮去除等,满足对钢液洁净度的要求。
按透气砖芯内气体流动通道类型,主要有弥散型透气砖、直通定向型透气砖及狭缝型透气砖。其中,弥散型透气砖通过烧失物烧烬造孔,以显气孔为透气通道,可有效避免如狭缝型透气砖使用时由于长时间钢液静压,底吹氩气压力不稳等造成的钻钢渗钢等情况,吹通率高,同时其特殊的透气通道吹出的气泡较小,在钢液中运行时间较长,易粘附钢液中的夹杂物,去夹杂能力强;使用过程中基本免吹扫,工人劳动强度低。但弥散型透气砖在生产、使用过程中仍存在一些问题:(1)生产工艺繁琐,生产周期长,要经过弥散砖芯成型-干燥-高温烧成、底座成型-养护-干燥-高温烧成及砖芯与底座组装-浇注外层保护浇注料-养护-干燥-包钢套焊尾管等工序方可得到成品。(2)采用刚玉颗粒及细粉为主要原料,纸浆废液作临时结合剂,生坯及成品强度偏低,生产废品率较高,使用过程抗冲刷、抗侵蚀性有待进一步提高。
狭缝型透气砖通过在砖芯内预埋数十条POPET聚酯条,通过高温烧失得到透气通道,是目前应用较为广泛的一种。而狭缝聚酯条需要通过人工进行穿条固定,对工人要求较高,若聚酯条质量、数量及位置有偏差或固定不牢等,则直接影响后期形成的气体通道质量及精炼效率。因此,人为因素影响较大。
综上,如何充分利用弥散型透气砖及狭缝型透气砖的优点,规避其不利因素,缩短生产周期,降低生产能耗,制备出兼具两者优势的透气砖是本领域技术人员的基本诉求。
发明内容
为了克服背景技术中的不足,本发明公开了一种3D打印透气砖及其制备方法。
为了实现所述发明目的,本发明采用如下技术方案:
一种3D打印透气砖,包括透气砖本体,透气砖本体从外至内依次设有钢壳B、浇注体和弥散体,在钢壳B内设有多个呈圆周分布且等距设置的弥散体,每个弥散体的外部均设有带缺口的钢壳A,在钢壳A外部均设有紧固件,相邻的钢壳A之间均通过钢筋固定为一体, 浇注体在钢壳B与多个弥散体之间,且与弥散体紧密接触,钢壳B的下部设有气室,气室由下线板和盖板围成,下线板的边缘处与钢壳B的下部边缘密封连接,下线板的下部设有盖板,下线板上设有与弥散体尺寸相匹配的开孔,钢壳A的下端分别与下线板上的开孔固定连接,下线板、盖板及钢壳B的下端之间形成所述的气室,气室的下部设有与气室连通的气体输送管。
一种3D打印透气砖,包括透气砖本体,透气砖本体从外至内依次设有钢壳B、浇注体和弥散体,在钢壳B内部的中心处设有一个弥散体,弥散体的外部设有带缺口的钢壳A,在钢壳A外部设有紧固件,浇注体在钢壳B与弥散体之间,且与弥散体紧密接触,钢壳B的下部设有气室,气室由下线板和盖板围成,下线板的边缘处与钢壳B的下部边缘密封连接,下线板的下部设有盖板,下线板上设有与弥散体尺寸相匹配的开孔,钢壳A的下端分别与下线板上的开孔固定连接,下线板、盖板及钢壳B的下端之间形成所述的气室,气室的下部设有与气室连通的气体输送管。
所述的3D打印透气砖,钢壳A的缺口位于弥散体的上端和下端之间,在钢壳A的外部均设有锚固件。
所述的3D打印透气砖,相邻的钢壳A之间的钢筋设置在钢壳A的上部。
所述的3D打印透气砖,钢壳A外部的紧固件从上至下间隔设有至少两个。
所述的3D打印透气砖,在盖板的中部设有通孔,且分别与气室、气体输送管连通。
所述的3D打印透气砖,气体输送管的上端边缘处焊接或螺纹连接在盖板的中部。
一种3D打印透气砖的制备方法,具体操作步骤如下:
(1)、备料:
取弥散体1所用的原料按比例称量并混合均匀;
弥散体1的各组分按质量百分比包括:氧化铝粉68~85%,氧化镁粉4~8%,铝粉5~10%,镁铝尖晶石粉4~12%,添加剂1~3%,结合剂树脂外加2~3%;其中,添加剂为:纳米富铝尖晶石、氧化钛粉、氧化铬粉中的任意一种或一种以上的混合;结合剂树脂为酚醛树脂。
(2)、弥散体1的制备:
将上一步骤制备的弥散体1原料的混合料加入3D陶瓷打印机,采用SLS(即选择性激光烧结)技术,通过“打印一层混合料→激光扫描树脂固化→再打印一层混合料→激光扫描树脂固化”的工序逐层打印出各弥散体;
(3)、钢结构的制备:
将钢壳B、下线板、盖板及弥散体外部的钢壳A、钢壳A外部的钢筋、锚固件进行焊接组装,制备成钢结构;
(4)、组装弥散体:
将步骤(2)制备出的各个弥散体装入步骤(3)制备出的钢结构的钢壳A内,并使用紧固件紧固;
(5)、浇注:
将上一步骤制备好的弥散体与钢结构组装件置于振动台上,将浇注体一次浇注成型为透气砖坯件;
(6)、养护、干燥、热处理:
将上一步骤的透气砖坯件先后置于养护窑及干燥窑进行养护及干燥,并将干燥后的透气砖半成品进行低温烧制处理,使弥散体中的树脂烧失,即可获得透气砖成品。
一种3D打印透气砖的制备方法,具体操作步骤如下:
(1)、备料:
取弥散体1所用的原料按比例称量并混合均匀;
弥散体1的各组分按质量百分比包括:氧化铝粉68~85%,氧化镁粉4~8%,铝粉5~10%,镁铝尖晶石粉4~12%,添加剂1~3%,结合剂树脂外加2~3%;其中,添加剂为:纳米富铝尖晶石、氧化钛粉、氧化铬粉中的任意一种或一种以上的混合;结合剂树脂为酚醛树脂。
(2)、弥散体1的制备:
将上一步骤制备的弥散体1原料的混合料加入3D陶瓷打印机,采用SLS(即选择性激光烧结)技术,通过“打印一层混合料→激光扫描树脂固化→再打印一层混合料→激光扫描树脂固化”的工序逐层打印出各弥散体;
(3)、钢结构的制备:
将钢壳B、下线板、盖板及弥散体外部的钢壳A、锚固件进行焊接组装,制备成钢结构;
(4)、组装弥散体:
将步骤(2)制备出的各个弥散体装入步骤(3)制备出的钢结构的钢壳A内,并使用紧固件紧固;
(5)、浇注:
将上一步骤制备好的弥散体与钢结构组装件置于振动台上,将浇注体一次浇注成型为透气砖坯件;
(6)、养护、干燥、热处理:
将上一步骤的透气砖坯件先后置于养护窑及干燥窑进行养护及干燥,并将干燥后的透气砖半成品进行低温烧制处理,使弥散体中的树脂烧失,即可获得透气砖成品。
由于采用了上述技术方案,本发明具有如下有益效果:
1、本发明所述的3D打印透气砖及其制备方法,通过将多个弥散式透气通道集成于透气砖中,实现了弥散式透气砖与狭缝式透气砖的优势兼顾,透气砖的吹通率高、去夹杂能力强、免吹扫等,透气砖的使用寿命及安全可靠性提高;通过在钢壳A上设置缺口,一方面便于弥散体安装及紧固,另一方面,有利于后期浇注使得浇注体与弥散体的紧密结合;多个钢壳A通过钢筋固定为一体,有利于限定其在上部的位置;在钢壳A外部设置锚固件,以进一步加强弥散体与浇注体的结合。
2、本发明所述的3D打印透气砖及其制备方法,通过3D打印SLS烧结技术,弥散体无需经历高温烧成,即可制备出强度较高的弥散式透气通道前期形式;且无需穿条造缝,减小了人为因素对产品质量的影响,缩短了产品的制造周期、降低了生产能耗。
3、本发明所述的3D打印透气砖及其制备方法,弥散体采用Al粉、适量氧化铝、氧化镁粉及树脂,其中氧化铝和氧化镁反应形成原位活性尖晶石,树脂加热分解形成碳化网络,Al粉在低氧分压下形成非氧化物,均增强了各组分间的结合,可显著提高弥散体的强度、抗冲刷性及抗渣侵蚀性。
附图说明
图1是本发明的结构示意图;
图2是图1的A-A剖视图;
图中:1、弥散体;2、钢壳A;3、紧固件;4、连接弥散体的钢筋;5、锚固件;6、浇注体;7、钢壳B;8、下线板;9、盖板;10、气室;11、气体输送管。
具体实施方式
通过下面的实施例可以详细的解释本发明,公开本发明的目的旨在保护本发明范围内的一切技术改进。
结合附图1-2所述的3D打印透气砖,包括透气砖本体,透气砖本体从外至内依次设有钢壳B7、浇注体6和弥散体1,在钢壳B7内设有多个呈圆周分布且等距设置的弥散体1,每个弥散体1的外部均设有带缺口的钢壳A2,在钢壳A2外部均设有紧固件3,相邻的钢壳A2之间均通过钢筋4固定为一体, 浇注体6在钢壳B7与多个弥散体1之间,且与弥散体1紧密接触,钢壳B7的下部设有气室10,气室10由下线板8和盖板9围成,下线板8的边缘处与钢壳B7的下部边缘密封连接,下线板8的下部设有盖板9,下线板8上设有与弥散体1尺寸相匹配的开孔,钢壳A2的下端分别与下线板8上的开孔固定连接,下线板8、盖板9及钢壳B7的下端之间形成所述的气室10,气室10的下部设有与气室10连通的气体输送管11。
一种3D打印透气砖,包括透气砖本体,透气砖本体从外至内依次设有钢壳B7、浇注体6和弥散体1,在钢壳B7内部的中心处设有一个弥散体1,在弥散体1的外部均设有带缺口的钢壳A2,钢壳A2外部设有紧固件3,浇注体6在钢壳B7与弥散体1之间,且与弥散体1紧密接触,钢壳B7的下部设有气室10,气室10由下线板8和盖板9围成,下线板8的边缘处与钢壳B7的下部边缘密封连接,下线板8的下部设有盖板9,下线板8上设有与弥散体1尺寸相匹配的开孔,钢壳A2的下端分别与下线板8上的开孔固定连接,下线板8、盖板9及钢壳B7的下端之间形成所述的气室10,气室10的下部设有与气室10连通的气体输送管11。。
所述的3D打印透气砖,钢壳A2的缺口位于弥散体1的上端和下端之间,在钢壳A2的外部均设有锚固件5。
所述的3D打印透气砖,相邻的钢壳A2之间的钢筋4设置在钢壳A2的上部。
所述的3D打印透气砖,钢壳A2外部的紧固件3从上至下间隔设有至少两个。
所述的3D打印透气砖,在盖板9的中部设有通孔,且分别与气室10、气体输送管11连通。
所述的3D打印透气砖,气体输送管11的上端边缘处焊接或螺纹连接在盖板9的中部。
一种3D打印透气砖的制备方法,具体操作步骤如下:
(1)、备料:
取弥散体1所用的原料按比例称量并混合均匀;
弥散体1的各组分按质量百分比包括:氧化铝粉68~85%,氧化镁粉4~8%,铝粉5~10%,镁铝尖晶石粉4~12%,添加剂1~3%,结合剂树脂外加2~3%;其中,添加剂为:纳米富铝尖晶石、氧化钛粉、氧化铬粉中的任意一种或一种以上的混合;结合剂树脂为酚醛树脂。
(2)、弥散体1的制备:
将上一步骤制备的弥散体1原料的混合料加入3D陶瓷打印机,采用SLS(即选择性激光烧结)技术,通过“打印一层混合料→激光扫描树脂固化→再打印一层混合料→激光扫描树脂固化”的工序逐层打印出各弥散体1;
(3)、钢结构的制备:
将钢壳B7、下线板8、盖板9及弥散体1外部的钢壳A2、钢壳A2外部的钢筋4、锚固件5进行焊接组装,制备成钢结构;
(4)、组装弥散体1:
将步骤(2)制备出的各个弥散体1装入步骤(3)制备出的钢结构的钢壳A2内,并使用紧固件3紧固;
(5)、浇注:
将上一步骤制备好的弥散体1与钢结构组装件置于振动台上,将浇注体6一次浇注成型为透气砖坯件;
(6)、养护、干燥、热处理:
将上一步骤的透气砖坯件先后置于养护窑及干燥窑进行养护及干燥,并将干燥后的透气砖半成品进行低温烧制处理,使弥散体1中的树脂烧失,即可获得透气砖成品。
一种3D打印透气砖的制备方法,具体操作步骤如下:
(1)、备料:
取弥散体1所用的原料按比例称量并混合均匀;
弥散体1的各组分按质量百分比包括:氧化铝粉68~85%,氧化镁粉4~8%,铝粉5~10%,镁铝尖晶石粉4~12%,添加剂1~3%,结合剂树脂外加2~3%;其中,添加剂为:纳米富铝尖晶石、氧化钛粉、氧化铬粉中的任意一种或一种以上的混合;结合剂树脂为酚醛树脂。
(2)、弥散体1的制备:
将上一步骤制备的弥散体1原料的混合料加入3D陶瓷打印机,采用SLS(即选择性激光烧结)技术,通过“打印一层混合料→激光扫描树脂固化→再打印一层混合料→激光扫描树脂固化”的工序逐层打印出各弥散体1;
(3)、钢结构的制备:
将钢壳B7、下线板8、盖板9及弥散体1外部的钢壳A2、锚固件5进行焊接组装,制备成钢结构;
(4)、组装弥散体1:
将步骤(2)制备出的各个弥散体1装入步骤(3)制备出的钢结构的钢壳A2内,并使用紧固件3紧固;
(5)、浇注:
将上一步骤制备好的弥散体1与钢结构组装件置于振动台上,将浇注体6一次浇注成型为透气砖坯件;
(6)、养护、干燥、热处理:
将上一步骤的透气砖坯件先后置于养护窑及干燥窑进行养护及干燥,并将干燥后的透气砖半成品进行低温烧制处理,使弥散体1中的树脂烧失,即可获得透气砖成品。
实施本发明所述的3D打印透气砖,如图1-2所示,在钢壳B7内设有多个通过钢壳A2固定的弥散体1,相邻的钢壳A2之间均通过钢筋4固定为一体,浇注体6在钢壳B7与多个弥散体1之间,且与弥散体1紧密接触,实现了弥散式透气砖与狭缝式透气砖的优势兼顾,透气砖的使用寿命及安全可靠性得到有效提高;其中,弥散体1设置为圆形或方形,设置在弥散体1外部的钢壳A2与弥散体1的形状相匹配。
3D打印透气砖的制备方法,实施例1的具体操作步骤如下:
取原料氧化铝粉80%、氧化镁粉7%、铝粉5%,镁铝尖晶石粉6%,氧化铬粉2%,外加酚醛树脂2%,按比例称量并混合均匀,将制备好的弥散体1混合料加入3D陶瓷打印机,采用SLS(即选择性激光烧结)技术,依次通过“打印一层混合料→激光扫描树脂固化→再打印一层混合料→激光扫描树脂固化”的工序逐层打印出各弥散体1;
将钢壳B7、下线板8、盖板9及弥散体1外部的钢壳A2、钢壳A2外部的钢筋4、锚固件5进行焊接组装,制备成钢结构;
将制备出的各个弥散体1装入步骤钢结构的钢壳A2内,并使用紧固件3紧固;然后将弥散体1与钢结构组装件置于振动台上,将浇注体6一次浇注成型为透气砖坯件;最后将透气砖坯件先后置于养护窑及干燥窑进行养护及干燥,并将干燥后的透气砖半成品进行低温烧制处理,使弥散体1中的树脂烧失,即可获得透气砖成品。
实施例2的具体操作步骤如下:
取原料氧化铝粉70%、氧化镁粉8%、铝粉10%,镁铝尖晶石粉10%,纳米富铝尖晶石与氧化钛粉的混合料2%,外加酚醛树脂2%,按比例称量并混合均匀,将制备好的弥散体1混合料加入3D陶瓷打印机,采用SLS(即选择性激光烧结)技术,依次通过“打印一层混合料→激光扫描树脂固化→再打印一层混合料→激光扫描树脂固化”的工序逐层打印出各弥散体1;
将钢壳B7、下线板8、盖板9及弥散体1外部的钢壳A2、钢壳A2外部的钢筋4、锚固件5进行焊接组装,制备成钢结构;
将制备出的各个弥散体1装入步骤钢结构的钢壳A2内,并使用紧固件3紧固;然后将弥散体1与钢结构组装件置于振动台上,将浇注体6一次浇注成型为透气砖坯件;最后将透气砖坯件先后置于养护窑及干燥窑进行养护及干燥,并将干燥后的透气砖半成品进行低温烧制处理,使弥散体1中的树脂烧失,即可获得透气砖成品。
实施例3的具体操作步骤如下:
取原料氧化铝粉85%、氧化镁粉4%、铝粉5%,镁铝尖晶石粉4%,纳米富铝尖晶石2%,外加酚醛树脂2%,按比例称量并混合均匀,将制备好的弥散体1混合料加入3D陶瓷打印机,采用SLS(即选择性激光烧结)技术,依次通过“打印一层混合料→激光扫描树脂固化→再打印一层混合料→激光扫描树脂固化”的工序逐层打印出各弥散体1;
将钢壳B7、下线板8、盖板9及弥散体1外部的钢壳A2、钢壳A2外部的钢筋4、锚固件5进行焊接组装,制备成钢结构;
将制备出的各个弥散体1装入步骤钢结构的钢壳A2内,并使用紧固件3紧固;然后将弥散体1与钢结构组装件置于振动台上,将浇注体6一次浇注成型为透气砖坯件;最后将透气砖坯件先后置于养护窑及干燥窑进行养护及干燥,并将干燥后的透气砖半成品进行低温烧制处理,使弥散体1中的树脂烧失,即可获得透气砖成品。
实施例4为弥散体1设置一个的实施例:
取原料氧化铝粉76%、氧化镁粉7%、铝粉7%,镁铝尖晶石粉8%,氧化钛粉2%,外加酚醛树脂2%,按比例称量并混合均匀,将制备好的弥散体1混合料加入3D陶瓷打印机,采用SLS(即选择性激光烧结)技术,依次通过“打印一层混合料→激光扫描树脂固化→再打印一层混合料→激光扫描树脂固化”的工序逐层打印出各弥散体1;
将钢壳B7、下线板8、盖板9及弥散体1外部的钢壳A2、锚固件5进行焊接组装,制备成钢结构;
将制备出的各个弥散体1装入步骤钢结构的钢壳A2内,并使用紧固件3紧固;然后将弥散体1与钢结构组装件置于振动台上,将浇注体6一次浇注成型为透气砖坯件;最后将透气砖坯件先后置于养护窑及干燥窑进行养护及干燥,并将干燥后的透气砖半成品进行低温烧制处理,使弥散体1中的树脂烧失,即可获得透气砖成品。
为了公开本发明的发明目的而在本文中选用的实施例,当前认为是适宜的,但是,应了解的是,本发明旨在包括一切属于本构思和发明范围内的实施例的所有变化和改进。
Claims (9)
1.一种3D打印透气砖,包括透气砖本体,包括透气砖本体,其特征是:透气砖本体从外至内依次设有钢壳B、浇注体和弥散体,在钢壳B内设有多个呈圆周分布且等距设置的弥散体,每个弥散体的外部均设有带缺口的钢壳A,在钢壳A外部均设有紧固件,相邻的钢壳A之间均通过钢筋固定为一体, 浇注体在钢壳B与多个弥散体之间,且与弥散体紧密接触,钢壳B的下部设有气室,气室由下线板和盖板围成,下线板的边缘处与钢壳B的下部边缘密封连接,下线板的下部设有盖板,下线板上设有与弥散体尺寸相匹配的开孔,钢壳A的下端分别与下线板上的开孔固定连接,下线板、盖板及钢壳B的下端之间形成所述的气室,气室的下部设有与气室连通的气体输送管。
2.一种3D打印透气砖,包括透气砖本体,其特征是:透气砖本体从外至内依次设有钢壳B、浇注体和弥散体,在钢壳B内部的中心处设有一个弥散体,弥散体的外部设有带缺口的钢壳A,在钢壳A外部设有紧固件,浇注体在钢壳B与弥散体之间,且与弥散体紧密接触,钢壳B的下部设有气室,气室由下线板和盖板围成,下线板的边缘处与钢壳B的下部边缘密封连接,下线板的下部设有盖板,下线板上设有与弥散体尺寸相匹配的开孔,钢壳A的下端分别与下线板上的开孔固定连接,下线板、盖板及钢壳B的下端之间形成所述的气室,气室的下部设有与气室连通的气体输送管。
3.根据权利要求1或2所述的3D打印透气砖,其特征是:钢壳A的缺口位于弥散体的上端和下端之间,在钢壳A的外部均设有锚固件。
4.根据权利要求1所述的3D打印透气砖,其特征是:相邻的钢壳A之间的钢筋设置在钢壳A的上部。
5.根据权利要求1或2所述的3D打印透气砖,其特征是:钢壳A外部的紧固件从上至下间隔设有至少两个。
6.根据权利要求1或2所述的3D打印透气砖,其特征是:在盖板的中部设有通孔,且分别与气室、气体输送管连通。
7.根据权利要求1或2所述的3D打印透气砖,其特征是:气体输送管的上端边缘处焊接或螺纹连接在盖板的中部。
8.根据权利要求1、3-7中任一权利所述的3D打印透气砖的制备方法,其特征是:具体操作步骤如下:
(1)、备料:
取弥散体1所用的原料按比例称量并混合均匀;
弥散体1的各组分按质量百分比包括:氧化铝粉68~85%,氧化镁粉4~8%,铝粉5~10%,镁铝尖晶石粉4~12%,添加剂1~3%,结合剂树脂外加2~3%;其中,添加剂为:纳米富铝尖晶石、氧化钛粉、氧化铬粉中的任意一种或一种以上的混合;结合剂树脂为酚醛树脂。
(2)、弥散体1的制备:
将上一步骤制备的弥散体1原料的混合料加入3D陶瓷打印机,采用SLS(即选择性激光烧结)技术,通过“打印一层混合料→激光扫描树脂固化→再打印一层混合料→激光扫描树脂固化”的工序逐层打印出各弥散体;
(3)、钢结构的制备:
将钢壳B、下线板、盖板及弥散体外部的钢壳A、钢壳A外部的钢筋、锚固件进行焊接组装,制备成钢结构;
(4)、组装弥散体:
将步骤(2)制备出的各个弥散体装入步骤(3)制备出的钢结构的钢壳A内,并使用紧固件紧固;
(5)、浇注:
将上一步骤制备好的弥散体与钢结构组装件置于振动台上,将浇注体一次浇注成型为透气砖坯件;
(6)、养护、干燥、热处理:
将上一步骤的透气砖坯件先后置于养护窑及干燥窑进行养护及干燥,并将干燥后的透气砖半成品进行低温烧制处理,使弥散体中的树脂烧失,即可获得透气砖成品。
9.根据权利要求2、3、5、6、7中任一权利所述的3D打印透气砖的制备方法,其特征是:具体操作步骤如下:
(1)、备料:
取弥散体1所用的原料按比例称量并混合均匀;
弥散体1的各组分按质量百分比包括:氧化铝粉68~85%,氧化镁粉4~8%,铝粉5~10%,镁铝尖晶石粉4~12%,添加剂1~3%,结合剂树脂外加2~3%;其中,添加剂为:纳米富铝尖晶石、氧化钛粉、氧化铬粉中的任意一种或一种以上的混合;结合剂树脂为酚醛树脂。
(2)、弥散体1的制备:
将上一步骤制备的弥散体1原料的混合料加入3D陶瓷打印机,采用SLS(即选择性激光烧结)技术,通过“打印一层混合料→激光扫描树脂固化→再打印一层混合料→激光扫描树脂固化”的工序逐层打印出各弥散体;
(3)、钢结构的制备:
将钢壳B、下线板、盖板及弥散体外部的钢壳A、锚固件进行焊接组装,制备成钢结构;
(4)、组装弥散体:
将步骤(2)制备出的各个弥散体装入步骤(3)制备出的钢结构的钢壳A内,并使用紧固件紧固;
(5)、浇注:
将上一步骤制备好的弥散体与钢结构组装件置于振动台上,将浇注体一次浇注成型为透气砖坯件;
(6)、养护、干燥、热处理:
将上一步骤的透气砖坯件先后置于养护窑及干燥窑进行养护及干燥,并将干燥后的透气砖半成品进行低温烧制处理,使弥散体中的树脂烧失,即可获得透气砖成品。
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