CN111788692A - Flexible substrate, manufacturing method thereof and electronic device - Google Patents
Flexible substrate, manufacturing method thereof and electronic device Download PDFInfo
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- CN111788692A CN111788692A CN201880087892.XA CN201880087892A CN111788692A CN 111788692 A CN111788692 A CN 111788692A CN 201880087892 A CN201880087892 A CN 201880087892A CN 111788692 A CN111788692 A CN 111788692A
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- 239000000758 substrate Substances 0.000 title claims abstract description 228
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 143
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims description 40
- 239000004642 Polyimide Substances 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 91
- 239000002346 layers by function Substances 0.000 description 20
- 230000000149 penetrating effect Effects 0.000 description 7
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000971 Silver steel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000110 poly(aryl ether sulfone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing method of a flexible substrate, which comprises the following steps: providing a rigid substrate; forming at least one patterned photoresist layer on the rigid substrate; forming a flexible substrate on each photoresist layer; and emitting laser towards one side of the rigid substrate, which is far away from the flexible substrate, so that the laser irradiates the photoresist layer after passing through the rigid substrate, and the flexible substrate and the photoresist layer are stripped from the rigid substrate, thereby forming the flexible substrate. The flexible substrate is easier to strip due to the fact that the photoresist layer is formed on the rigid substrate, stripping efficiency of the flexible substrate is improved, damage to the structure on the flexible substrate in the stripping process is avoided, and the process yield of the flexible substrate is improved. The invention also provides a flexible substrate and an electronic device.
Description
The present invention relates to the field of display technologies, and in particular, to a flexible substrate, a method for manufacturing the flexible substrate, and an electronic device.
In the field of flexible display, the main manufacturing process of the current flexible substrate is as follows: coating a flexible substrate material on a rigid substrate, heating and baking the flexible substrate material to solidify the flexible substrate material to form a flexible substrate, manufacturing an electronic component on the flexible substrate, and finally separating the flexible substrate from the rigid substrate by laser. However, when the flexible substrate is peeled off the rigid substrate by the laser, the peeling efficiency is affected by a phenomenon that the flexible substrate and the rigid substrate are easily adhered to each other.
Disclosure of Invention
In order to solve the above problems, embodiments of the present invention disclose a flexible substrate that is easily peeled off from a rigid substrate, a method of manufacturing the flexible substrate, and an electronic device.
A manufacturing method of a flexible substrate comprises the following steps:
providing a rigid substrate;
forming at least one patterned photoresist layer on the rigid substrate;
forming a flexible substrate on each photoresist layer;
and emitting laser towards one side of the rigid substrate, which is far away from the flexible substrate, so that the laser irradiates the photoresist layer after passing through the rigid substrate, and the flexible substrate and the photoresist layer are stripped from the rigid substrate, thereby forming the flexible substrate.
Further, each photoresist layer comprises a groove penetrating through the photoresist layer, each flexible substrate comprises a main body and at least one extension part formed by extending from one side of the main body, and each extension part is accommodated in one groove and connected with the rigid substrate.
Further, "forming at least one patterned photoresist layer on the rigid substrate" comprises the steps of:
coating a photo-resist material on at least one configured area of the rigid substrate;
curing the photoresist material;
exposing the photoresist material from one side of a photomask by light; and
and developing the photoresist material after exposure treatment to form the photoresist layer.
Further, the "forming a flexible substrate on each photoresist layer" includes the following steps:
coating a flexible material on the photoresist layer;
and curing the flexible material to form the flexible substrate.
Further, the flexible substrate is made of polyimide.
Further, the wavelength of the laser is 308 nm.
Further, the rigid substrate is glass.
Further, the photoresist layer is made of a positive photoresist material.
A flexible substrate comprises a flexible substrate and a patterned photoresist layer, wherein the flexible substrate is arranged on the photoresist layer.
Furthermore, the flexible substrate comprises a main body and an extension part formed by extending one side of the main body, the photoresist layer is arranged on one side of the main body, the photoresist layer comprises at least one groove penetrating through the photoresist layer, and each extension part is accommodated in one groove.
Furthermore, the photoresist layer comprises a plurality of photoresist portions arranged at intervals, and each two photoresist portions arranged at intervals form one groove.
An electronic device comprising a flexible substrate as described above.
According to the flexible substrate, the manufacturing method thereof and the electronic device, the patterned photoresist layer is formed on the rigid substrate, and the flexible substrate is formed on the photoresist layer, so that the flexible substrate is easier to peel off from the rigid substrate, and the peeling efficiency of the flexible substrate is improved. Furthermore, damage to structures/components (e.g., electronic components) provided on the flexible substrate during the peeling process can be avoided. In addition, the light resistance layer comprises at least one groove penetrating through the light resistance layer, each extending part of the flexible substrate is accommodated in one groove to be connected with the rigid substrate, the connection between the flexible substrate and the rigid substrate is ensured, the flexible substrate is further not easy to separate from the rigid substrate in a subsequent high-temperature process, and the subsequent process of the flexible substrate is prevented from being influenced. Because the photoresist layer reduces the contact area of the flexible substrate and the rigid substrate, the flexible substrate is convenient to peel off from the rigid substrate.
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flowchart of a method for manufacturing a flexible substrate according to an embodiment of the present invention.
FIG. 2 is a side view of a photoresist layer formed on a rigid substrate.
FIG. 3 is a side view of a flexible substrate formed on a photoresist layer.
Figure 4 is a side view of forming a functional layer on a flexible substrate.
Fig. 5 is a side view of a laser irradiating a side of the rigid substrate away from the flexible base.
Fig. 6 is a side view of a flexible substrate.
Fig. 7 is a flowchart of step 2 shown in fig. 1.
FIG. 8 is a top view of a photoresist applied to at least one configured region of a rigid substrate.
FIG. 9 is a side view of photoresist applied to at least one configured region of a rigid substrate.
FIG. 10 is a schematic view of light exposing the photoresist material from one side of a photomask.
FIG. 11 is a schematic view of developing the photoresist material after the exposure process to form the photoresist layer.
Fig. 12 is a flowchart of step 3 shown in fig. 1.
Fig. 13 is a schematic view of an electronic device according to an embodiment of the invention.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 6, the present invention provides a method for manufacturing a flexible substrate, including the following steps:
step 1, as shown in fig. 2, a rigid substrate 200 is provided.
Specifically, the rigid substrate 200 includes a first surface 201 and a second surface 203 disposed opposite to each other, and the first surface 201 includes at least one configuration region 205.
Further, a patterned photoresist layer 30 is formed on each of the configuration regions 205. When the number of the configuration regions 205 is greater than one, the number of the at least one patterned photoresist layer 30 is greater than one, the photoresist layers 30 disposed on the rigid substrate 200 are disposed at intervals, and an interval region 300 is formed between adjacent photoresist layers 30.
Further, each photoresist layer 30 includes a plurality of trenches 33 through the photoresist layer 30 to separate the photoresist layer 30 into a plurality of photoresist portions 35.
Further, the patterned photoresist layer 30 is obtained by providing a mask at a plurality of positions corresponding to the photoresist portions 35, respectively, and then removing portions of the photoresist layer 30 other than the mask by exposing the photoresist layer 30 from the mask side to form the trenches 33.
Further, each flexible substrate 50 includes a main body 51 and at least one extending portion 53 formed by extending one side of the main body 51, and each extending portion 53 is accommodated in one groove 33 and connected to the rigid substrate 200 to ensure that the flexible substrate 50 is adhered to the rigid substrate 200, so that the flexible substrate 50 is not easily separated from the rigid substrate 200 in a subsequent high temperature process (in this embodiment, at a high temperature of about 350-400 degrees), and the subsequent process of the flexible substrate 100 is not affected. Because the photoresist layer 30 reduces the contact area between the flexible substrate 50 and the rigid substrate 200, the flexible substrate 50 can be easily peeled off from the rigid substrate 200. In some embodiments, the flexible substrate 50 may be a structure formed by pouring a flexible substrate material on the patterned photoresist layer 30, and including the main body 51 and the extension 53 poured into the groove 33.
In this embodiment, the functional layer 70 is an electronic device layer, which includes a plurality of electronic devices, and the functional layer 70 is a thin film transistor layer, which includes structures such as a gate, a source, and a drain, which are not described herein again. In some embodiments, the functional layer 70 may also have electronic devices such as processors, memories, etc. mounted thereon. In an embodiment, the functional layer 70 has another structure, for example, the functional layer 70 is a color filter substrate.
As shown in fig. 6, the flexible substrate 100 includes a flexible substrate 50, a functional layer 70, and a patterned photoresist layer 30, wherein the flexible substrate 50 is sandwiched between the functional layer 70 and the photoresist layer 30.
Please refer to fig. 7, which is a more detailed flowchart of the foregoing step 2. Further, the step 2 of forming at least one patterned photoresist layer 30 on the rigid substrate 200 includes the following steps:
in step 201, referring to fig. 8 and 9, a photoresist 38 is coated on at least one configuration region 205 of the rigid substrate 200.
In this embodiment, the number of the arrangement regions 205 is 4, the arrangement regions 205 are spaced apart from each other, and the photoresist 38 is applied to each arrangement region 205.
In step 203, referring to fig. 10, the photoresist 38 is exposed from one side of the mask 39 by light 601.
In step 204, referring to fig. 11, the exposed photoresist material 38 is developed to form the patterned photoresist layer 30.
The patterned photoresist layer 30 is formed by etching trenches 33 in the cured photoresist 38 of each placement area 205 not covered by the mask 39. As mentioned above, the patterned photoresist layer 30 includes the photoresist portion 35 formed by the trench 33, and the position of the photoresist portion 35 corresponds to the position of the mask 39.
Please refer to fig. 12, which is a more detailed flowchart of the foregoing step 3. Further, the step 3 of forming the flexible substrate 50 on each photoresist layer 30 includes the following steps:
in step 301, a flexible material is coated on each photoresist layer 30.
In this embodiment, the flexible substrate 50 is made of a polyimide material, and the photoresist material 38 is a positive photoresist material. The rigid substrate 200 is glass, and the wavelength of the laser is 308 nm. Under the irradiation of the laser with the wavelength of 308nm, the thermal chemical stability of the photoresist layer 30 and the flexible substrate 50 is kept stable.
It is understood that the flexible substrate 50 may be made of other materials, such as polymeric materials like polyethylene terephthalate, polyarylethersulfone, polyethylene naphthalate, and the like; or, the photoresist material 38 may be a negative photoresist material, and is made of metal materials such as aluminum, copper, silver, and stainless steel; the wavelength of the laser is selected according to the material of the flexible substrate 50, the material of the photoresist layer 30, and the material of the rigid substrate 200, so as to achieve the required stripping effect. The invention is not limited to the materials and the laser wavelength, and can obtain the yield requirement of peeling the rigid substrate from the required flexible substrate by researching the physical and chemical properties of different materials and improving the process on the basis of not improving the process difficulty.
The positive photoresist layer used in the current process can bear the high temperature process (about 350-400 ℃) of a flexible material (polyimide), and can be easily stripped when the material is irradiated at 308nm, so that the stripping performance of the flexible substrate can be improved.
The rigid substrate 200 is provided with at least one configuration area 205, a photoresist layer 30 is formed in each configuration area 201, a flexible substrate 50 is formed on the photoresist layer 30 of each configuration area 205, and a functional layer 70 is formed on each flexible substrate 50, so that at least one flexible substrate 100 can be manufactured simultaneously in the same manufacturing process, and the manufacturing efficiency of the flexible substrate 100 can be improved.
It is understood that, the manufacturing method of the flexible substrate can omit the step 4, that is, omit: forming a functional layer 70 on the side of the flexible substrate 50 away from the rigid substrate 200, wherein the manufacturing method of the flexible substrate comprises the following steps: providing a rigid substrate; forming at least one patterned photoresist layer on the rigid substrate; forming a flexible substrate on each photoresist layer; and emitting laser towards one side of the rigid substrate, which is far away from the flexible substrate, so that the laser irradiates the photoresist layer after passing through the rigid substrate, and the flexible substrate and the photoresist layer are stripped from the rigid substrate, thereby forming the flexible substrate.
Referring to fig. 6 again, the present invention further provides a flexible substrate 100, which includes a flexible substrate 50, a functional layer 70 and a patterned photoresist layer 30, wherein the flexible substrate 50 is sandwiched between the functional layer 70 and the photoresist layer 30.
Further, the flexible substrate 50 includes a main body 51 and an extension portion 53 formed by extending one side of the main body 51, the functional layer 70 is disposed on one side of the main body 51 away from the extension portion 53, the photoresist layer 30 is disposed on one side of the main body 51 away from the functional layer 70, the photoresist layer 30 includes at least one groove 33 penetrating through the photoresist layer 30, and each extension portion 53 is accommodated in one groove 33.
Further, the photoresist layer 30 includes a plurality of spaced apart photoresist portions 35, and each two spaced apart photoresist portions 35 form one of the trenches 33.
When the flexible substrate 100 is manufactured, a photoresist layer 30 is formed on a first surface 201 of a rigid substrate 200, a flexible substrate 50 is formed on the photoresist layer 30, then the functional layer 70 is formed on the flexible substrate 50, and then laser is emitted toward a second surface 203 of the rigid substrate 200, so that the rigid substrate 200 is peeled off from the flexible substrate 100 and the photoresist layer 30, and the flexible substrate 100 is formed. Compared with the flexible substrate 50, the photoresist layer 30 is easier to be ablated by laser, so that the flexible substrate 100 is easier to be peeled off, the peeling efficiency of the flexible substrate 100 is improved, the functional layer 70 is prevented from being damaged in the peeling process, and the process yield of the flexible substrate 100 is improved.
In addition, the photoresist layer 30 includes at least one groove 33 penetrating through the photoresist layer 30, each extension portion 53 is received in one of the grooves 33, the photoresist layer 30 reduces the contact area between the flexible substrate 50 and the rigid substrate 200, and the photoresist layer 30 facilitates the peeling of the flexible substrate 100 from the rigid substrate 200 while ensuring the adhesion between the flexible substrate 50 and the rigid substrate 200.
In this embodiment, the photoresist layer 30 is made of a positive photoresist material, the flexible substrate 50 is made of polyimide, and the functional layer 70 is a thin film transistor layer including a gate, a source, a drain, and the like, which are not described herein.
It is understood that the functional layer 70 may be omitted from the flexible substrate 100, and the flexible substrate 100 may be used as a substrate of other structures, such as a flexible substrate of a color filter substrate, and may also be used as a substrate in manufacturing other elements or structures, which is not limited herein.
A flexible substrate 100 comprises a flexible substrate 50 and a patterned photoresist layer 30, wherein the flexible substrate 50 is disposed on the photoresist layer 30, the flexible substrate 50 comprises a main body 51 and an extension portion 53 formed by extending one side of the main body 51, the photoresist layer 30 is disposed on one side of the main body 51, the photoresist layer 30 comprises at least one groove 33 penetrating through the photoresist layer, and each extension portion 53 is accommodated in one groove 33.
Referring to fig. 13, a schematic view of an electronic device 200 according to an embodiment of the invention is shown, where the electronic device 200 includes the flexible substrate 100. The electronic device 200 may be a mobile phone, a tablet computer, a display, etc.
According to the flexible substrate and the manufacturing method thereof provided by the invention, the photoresist layer 30 is formed on the first surface 201 of the rigid substrate 200, and the flexible substrate 50 is formed on the photoresist layer 30, so that the flexible substrate 100 is easier to strip from the rigid substrate 200 due to the fact that the photoresist layer 30 is easier to be ablated by laser, the functional layer 70 is prevented from being damaged in the stripping process, the stripping efficiency of the flexible substrate 100 is improved, and the process yield of the flexible substrate 100 is further improved. In addition, the photoresist layer 30 includes at least one groove 33 penetrating through the photoresist layer 30, and each extending portion 53 of the flexible substrate 50 is accommodated in one groove 33, so as to ensure adhesion between the flexible substrate 50 and the rigid substrate 200, so that the flexible substrate 50 is not easily separated from the rigid substrate 200 in a subsequent high temperature process (in this embodiment, at a high temperature of about 350 to 450 degrees), and the subsequent process of the flexible substrate 100 is not affected. Since the photoresist layer 30 reduces the contact area between the flexible substrate 50 and the rigid substrate 200, the flexible substrate 100 is easily peeled off from the rigid substrate 200.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (14)
- A manufacturing method of a flexible substrate is characterized by comprising the following steps:providing a rigid substrate;forming at least one patterned photoresist layer on the rigid substrate;forming a flexible substrate on each photoresist layer; andand emitting laser towards one side of the rigid substrate, which is far away from the flexible substrate, so that the laser irradiates the photoresist layer after passing through the rigid substrate, and the flexible substrate and the photoresist layer are stripped from the rigid substrate, thereby forming the flexible substrate.
- The method of claim 1, wherein the photoresist layer includes a trench extending through the photoresist layer, each flexible substrate includes a main body and at least one extension extending from a side of the main body, each extension being received in one of the trenches and connected to the rigid substrate.
- The method of claim 1, wherein said forming at least one patterned photoresist layer on said rigid substrate comprises:coating a photo-resist material on at least one configured area of the rigid substrate;curing the photoresist material;exposing the photoresist material from one side of a photomask by light; andand developing the photoresist material after exposure treatment to form the photoresist layer.
- The method of claim 1, wherein said forming a flexible substrate over each photoresist layer comprises the steps of:coating a flexible material on the photoresist layer;and curing the flexible material to form the flexible substrate.
- The method of claim 1, wherein the flexible substrate is made of polyimide.
- The method of claim 1, wherein the laser light has a wavelength of 308 nm.
- The method of claim 1, wherein the rigid substrate is glass.
- The method of claim 1, wherein the photoresist layer is made of a positive photoresist material.
- The flexible substrate is characterized by comprising a flexible substrate and a patterned photoresist layer, wherein the flexible substrate is arranged on the photoresist layer.
- The flexible substrate of claim 9, wherein the flexible substrate comprises a main body and an extension portion extending from a side of the main body, the photoresist layer is disposed on a side of the main body, the photoresist layer comprises at least one groove extending through the photoresist layer, and each extension portion is received in one of the grooves.
- The flexible substrate of claim 10, wherein the photoresist layer comprises at least a plurality of spaced apart photoresist portions, each two spaced apart photoresist portions forming one of the grooves.
- The flexible substrate of claim 9, wherein the photoresist layer is made of a positive photoresist material.
- The flexible substrate of claim 9, wherein the flexible base is made of polyimide.
- An electronic device comprising the flexible substrate according to any one of claims 9 to 13.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/075645 WO2019153149A1 (en) | 2018-02-07 | 2018-02-07 | Flexible substrate and preparation method therefor, and electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN111788692A true CN111788692A (en) | 2020-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880087892.XA Pending CN111788692A (en) | 2018-02-07 | 2018-02-07 | Flexible substrate, manufacturing method thereof and electronic device |
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| WO (1) | WO2019153149A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682176A (en) * | 2013-12-06 | 2014-03-26 | 京东方科技集团股份有限公司 | Manufacturing method for rigid substrate and flexible display device and rigid substrate |
| CN103985665A (en) * | 2014-05-15 | 2014-08-13 | 深圳市华星光电技术有限公司 | Manufacturing method for flexible display |
| TW201704855A (en) * | 2015-07-24 | 2017-02-01 | 東捷科技股份有限公司 | Soft photo-mask and manufacturing method thereof |
| CN107342305A (en) * | 2017-06-13 | 2017-11-10 | 上海和辉光电有限公司 | A kind of flexible base board structure and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8729673B1 (en) * | 2011-09-21 | 2014-05-20 | Sandia Corporation | Structured wafer for device processing |
| TWI524998B (en) * | 2013-09-25 | 2016-03-11 | 友達光電股份有限公司 | Method of bonding and debonding substrate |
| CN104465479B (en) * | 2014-12-19 | 2017-03-01 | 京东方科技集团股份有限公司 | Flexible display substrates motherboard and the preparation method of flexible display substrates |
-
2018
- 2018-02-07 CN CN201880087892.XA patent/CN111788692A/en active Pending
- 2018-02-07 WO PCT/CN2018/075645 patent/WO2019153149A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682176A (en) * | 2013-12-06 | 2014-03-26 | 京东方科技集团股份有限公司 | Manufacturing method for rigid substrate and flexible display device and rigid substrate |
| CN103985665A (en) * | 2014-05-15 | 2014-08-13 | 深圳市华星光电技术有限公司 | Manufacturing method for flexible display |
| TW201704855A (en) * | 2015-07-24 | 2017-02-01 | 東捷科技股份有限公司 | Soft photo-mask and manufacturing method thereof |
| CN107342305A (en) * | 2017-06-13 | 2017-11-10 | 上海和辉光电有限公司 | A kind of flexible base board structure and preparation method thereof |
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| WO2019153149A1 (en) | 2019-08-15 |
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