CN111786256B - 一种光发射激光器的TO-can封装结构及其封装方法 - Google Patents
一种光发射激光器的TO-can封装结构及其封装方法 Download PDFInfo
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- CN111786256B CN111786256B CN202010873250.1A CN202010873250A CN111786256B CN 111786256 B CN111786256 B CN 111786256B CN 202010873250 A CN202010873250 A CN 202010873250A CN 111786256 B CN111786256 B CN 111786256B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000012544 monitoring process Methods 0.000 claims abstract description 64
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- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims abstract description 52
- 230000005496 eutectics Effects 0.000 claims abstract description 34
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 230000003287 optical effect Effects 0.000 claims abstract description 10
- 229910052737 gold Inorganic materials 0.000 claims abstract description 8
- 239000010931 gold Substances 0.000 claims abstract description 8
- 238000005516 engineering process Methods 0.000 claims description 9
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
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- 238000006243 chemical reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
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CN202010873250.1A CN111786256B (zh) | 2020-08-26 | 2020-08-26 | 一种光发射激光器的TO-can封装结构及其封装方法 |
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CN202010873250.1A CN111786256B (zh) | 2020-08-26 | 2020-08-26 | 一种光发射激光器的TO-can封装结构及其封装方法 |
Publications (2)
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CN111786256A CN111786256A (zh) | 2020-10-16 |
CN111786256B true CN111786256B (zh) | 2021-10-29 |
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CN202010873250.1A Active CN111786256B (zh) | 2020-08-26 | 2020-08-26 | 一种光发射激光器的TO-can封装结构及其封装方法 |
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Families Citing this family (1)
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CN113067247A (zh) * | 2021-04-30 | 2021-07-02 | 广东瑞谷光网通信股份有限公司 | 一种同轴激光发射器的封装装置及封装方法 |
Citations (7)
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---|---|---|---|---|
CN203415815U (zh) * | 2013-07-16 | 2014-01-29 | 青岛海信宽带多媒体技术有限公司 | 同轴封装制冷型激光器管芯 |
US20140376579A1 (en) * | 2009-02-23 | 2014-12-25 | Cirrex Systems, Llc | Method and system for managing thermally sensitive optical devices |
CN204793610U (zh) * | 2015-07-17 | 2015-11-18 | 武汉欧普兰光电技术股份有限公司 | 一种改进背光监测性能的to封装半导体激光器 |
CN108075350A (zh) * | 2017-12-19 | 2018-05-25 | 深圳市东飞凌科技有限公司 | 同轴封装激光器 |
CN108919434A (zh) * | 2018-07-27 | 2018-11-30 | 武汉光迅科技股份有限公司 | 一种光接收器件 |
CN109473866A (zh) * | 2018-11-23 | 2019-03-15 | 武汉电信器件有限公司 | 一种具有加热功能的to-can发射组件 |
CN109818254A (zh) * | 2019-03-28 | 2019-05-28 | 广东汉瑞通信科技有限公司 | 一种带光学透镜的905nm大功率激光器及封装工艺 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0799368A (ja) * | 1993-09-29 | 1995-04-11 | Mitsubishi Electric Corp | 光半導体装置 |
JP2010199204A (ja) * | 2009-02-24 | 2010-09-09 | Sony Corp | 発光装置およびその製造方法 |
CN105261929B (zh) * | 2015-07-17 | 2018-05-04 | 武汉海赛姆光电技术有限公司 | 一种to-can封装的半导体激光器及其制作方法 |
CN109541762B (zh) * | 2018-12-29 | 2024-06-11 | 广东瑞谷光网通信股份有限公司 | 同轴封装的高速单to-can光收发器件及其加工方法 |
CN110459954B (zh) * | 2019-08-23 | 2024-06-07 | 福州中科光芯科技有限公司 | 一种半导体激光器封装结构及封装方法 |
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- 2020-08-26 CN CN202010873250.1A patent/CN111786256B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140376579A1 (en) * | 2009-02-23 | 2014-12-25 | Cirrex Systems, Llc | Method and system for managing thermally sensitive optical devices |
CN203415815U (zh) * | 2013-07-16 | 2014-01-29 | 青岛海信宽带多媒体技术有限公司 | 同轴封装制冷型激光器管芯 |
CN204793610U (zh) * | 2015-07-17 | 2015-11-18 | 武汉欧普兰光电技术股份有限公司 | 一种改进背光监测性能的to封装半导体激光器 |
CN108075350A (zh) * | 2017-12-19 | 2018-05-25 | 深圳市东飞凌科技有限公司 | 同轴封装激光器 |
CN108919434A (zh) * | 2018-07-27 | 2018-11-30 | 武汉光迅科技股份有限公司 | 一种光接收器件 |
CN109473866A (zh) * | 2018-11-23 | 2019-03-15 | 武汉电信器件有限公司 | 一种具有加热功能的to-can发射组件 |
CN109818254A (zh) * | 2019-03-28 | 2019-05-28 | 广东汉瑞通信科技有限公司 | 一种带光学透镜的905nm大功率激光器及封装工艺 |
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Address after: 523870 No. 2 Fukang Road, Sha Community, Chang'an Town, Dongguan City, Guangdong Province Patentee after: Guangdong Zhaochi Ruigu Communication Co.,Ltd. Country or region after: China Address before: 523870 No. 2 Fukang Road, Sha Community, Chang'an Town, Dongguan City, Guangdong Province Patentee before: GUANGDONG RUIGU OPTICAL NETWORK COMMUNICATION Co.,Ltd. Country or region before: China |
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Effective date of registration: 20240620 Address after: 518000, Building B, Building 1303, Phase II, Zhaochi Innovation Industrial Park, No. 128 Bulan Road, Xialilang Community, Nanwan Street, Longgang District, Shenzhen, Guangdong Province Patentee after: Shenzhen Zhaochi Ruigu Technology Co.,Ltd. Country or region after: China Address before: 523870 No. 2 Fukang Road, Sha Community, Chang'an Town, Dongguan City, Guangdong Province Patentee before: Guangdong Zhaochi Ruigu Communication Co.,Ltd. Country or region before: China |