CN111786099A - Novel 5G array mechanism, base station antenna and production process - Google Patents
Novel 5G array mechanism, base station antenna and production process Download PDFInfo
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- CN111786099A CN111786099A CN202010710734.4A CN202010710734A CN111786099A CN 111786099 A CN111786099 A CN 111786099A CN 202010710734 A CN202010710734 A CN 202010710734A CN 111786099 A CN111786099 A CN 111786099A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Waveguide Aerials (AREA)
Abstract
The invention discloses a novel 5G array mechanism, a base station antenna and a production process, wherein the novel 5G array mechanism comprises a main body and a surface layer circuit, the main body is formed by injection molding processing of enhanced polyphenylene sulfide plastic containing metal particles, the surface layer circuit is formed by selectively electroplating on the surface of a local position of the main body, and the surface layer circuit comprises a radiation area, a balun area and a power division feed network. The main body of the invention is integrally injection molded by plastic, so the assembly is simple, the selective electroplating process avoids multiple welding, intermodulation hidden danger can not be generated, and the welding quality is easy to control. The radiation area, the balun area and the power division feed network can carry out plastic surface metallization treatment according to an optimal result, the design is flexible and convenient, and the cost advantage is obvious.
Description
Technical Field
The invention relates to the technical field of mobile communication base station antennas and the field of plastic surface metallization, in particular to a novel 5G array mechanism, a base station antenna and a production process.
Background
With the continuous development of the selective electroplating process on the plastic surface, more and more plastic parts are applied in the fields of communication, automobiles, electronics and the like on a large scale, so that a user can flexibly design complex plastic parts to replace traditional parts such as circuit board etching, metal sheet metal, die casting and the like, and the plastic parts have low cost, easy assembly and better performance.
At present, a 5G unit array is generally formed by welding a PCB oscillator and a power distribution network, and then is welded with a back connector circuit, and a partition plate needs to be welded on the side edge in order to optimize isolation and radiation performance. According to the scheme, the welding frequency is complex, the assembly is troublesome, the labor cost is high, the requirement on the welding process level is high, the mass production quality is not easily controlled, intermodulation hidden danger is easily generated, and the cost is high.
In the prior art, in order to reduce the assembly processes such as welding, patent CN108711673A discloses an integrated radiating element, comprising: radiating element body and feed network. The radiating element body comprises an insulating carrier, at least one radiating surface, at least one balun and at least one feed sheet, wherein the radiating surface is formed by electroplating conductive metal on the insulating carrier; wherein, the balun is grounded; the feed network is fixed on the radiation unit main body through a surface mounting process and is electrically connected with the feed sheet. The radiation surface, the balun and the feed plate are electroplated on the insulating carrier by adopting an electroplating process, but in the scheme group, the feed network adopts a patch process, and the connection between the feed network and the feed plate still needs to be welded, so that the requirement of quick assembly cannot be met.
Disclosure of Invention
The invention aims to provide a novel 5G array mechanism to solve the problems that the welding quality of the existing oscillator is difficult to control, the assembly is troublesome and the cost is high.
Another object of the present invention is to provide a base station antenna including the above-mentioned novel 5G array mechanism.
The invention further aims to provide a production process of the novel 5G array mechanism.
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
According to one aspect of the invention, a novel 5G array mechanism is provided, which comprises a main body and a surface layer circuit, wherein the main body is formed by injection molding of reinforced polyphenylene sulfide plastic containing metal particles, the surface layer circuit is formed by selective electroplating on the surface of a local position of the main body, and the surface layer circuit comprises a radiation area, a balun area and a power division feed network.
In one embodiment, the shape of the surface layer circuit of the novel 5G array mechanism is determined according to an optimal simulation debugging scheme.
In one embodiment, the radiation area of the novel 5G array mechanism comprises an ultra-wideband radiation unit, and the operating frequency of the ultra-wideband radiation unit is 2496 MHz-3800 MHz.
In an embodiment, the power division feed network of the novel 5G array mechanism includes a one-to-three power division feed circuit layer disposed on the upper surface of the bottom plate, the surface of the one-to-three power division feed circuit layer is metallized, and a branch port of the one-to-three power division feed circuit is in conduction connection with the balun region.
In an embodiment, the power dividing feed network of the novel 5G array mechanism further includes a ground layer disposed on the lower surface of the bottom plate and a plurality of positioning pillars, wherein metalized through holes are disposed inside the positioning pillars, the surfaces of the positioning pillars are metalized, one end of each positioning pillar is conductively connected to the one-to-three power dividing feed circuit layer, and the other end of each positioning pillar is used for being conductively connected to a connector circuit layer on the back of the antenna.
In one embodiment, the side surface of the bottom plate of the novel 5G array mechanism is provided with a reinforcing partition plate.
In one embodiment, the reinforced partition plate of the novel 5G array mechanism is provided with a partition plate area, and the partition plate area is formed by selective electroplating.
In an embodiment, a buckle is further arranged on the lower surface of the bottom plate of the novel 5G array mechanism, and the buckle is used for being clamped into a corresponding hole on the reflecting plate.
According to another aspect of the present invention, there is provided a base station antenna, including the novel 5G array mechanism in any one of the above embodiments, wherein the novel 5G array mechanism is mounted on a reflection plate.
According to another aspect of the present invention, there is also provided a process for producing a novel 5G array mechanism, comprising the steps of: the main body is formed by injection molding of enhanced polyphenylene sulfide containing metal particles, and metalized areas are partitioned in the top, side and bottom areas of the main body through selective electroplating according to an optimal simulation debugging result to form a corresponding radiation area, a balun area and a power division feed network.
The embodiment of the novel 5G array mechanism provided by the invention has the beneficial effects that: the main part is by the integrative injection moulding of plastics, consequently the equipment is simple, and selective plating process has avoided a lot of welding, can not produce intermodulation hidden danger, and welding quality manages and controls easily. The radiation area, the balun area and the power division feed network can carry out plastic surface metallization treatment according to an optimal result, the design is flexible and convenient, and the cost advantage is obvious.
The base station antenna and the production process provided by the invention have the same technical effects as the novel 5G array mechanism or corresponding technical characteristics.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
The above features and advantages of the present disclosure will be better understood upon reading the detailed description of embodiments of the disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components having similar relative characteristics or features may have the same or similar reference numerals.
FIG. 1 is a schematic perspective view of a novel 5G array mechanism of the present invention;
FIG. 2 is a bottom schematic view of the novel 5G array mechanism of the present invention;
FIG. 3 is a schematic top view of the novel 5G array mechanism of the present invention;
FIG. 4 is a schematic side view of the novel 5G array mechanism of the present invention;
wherein: 1-a body; 2-an irradiation area; 3-the balun region; 4-one-to-three power distribution feed circuit layer; 5-a ground plane; 6-positioning columns; 7-buckling; 8-reinforcing the partition plate; 9-vibrator array; 10-a bottom plate.
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments. It is noted that the aspects described below in connection with the figures and the specific embodiments are only exemplary and should not be construed as imposing any limitation on the scope of the present invention.
As shown in fig. 1 to 4, the embodiment of the invention discloses a novel 5G array mechanism, which comprises a main body 1 and a surface layer circuit, wherein the main body 1 is formed by injection molding of enhanced polyphenylene sulfide plastic (PPS + 30% glass fiber) containing metal particles, so that the strength is ensured. The surface layer circuit is formed by selective plating on the surface of a local position of the body 1, avoiding a soldering process. The surface circuit comprises a radiation area 2, a balun area 3 and a power division feed network. The shape of the surface layer circuit is determined according to the optimal scheme obtained by simulation tests such as standing wave performance simulation, in-array radiation performance simulation and the like, so that the optimal performance can be obtained.
Specifically, the main body 1 includes a ceiling-shaped oscillator array 9 and a base plate 10, the oscillator array 9 is fixedly provided on the base plate 10, the radiation region 2 is provided on the top surface of the oscillator array 9, and the balun region 3 is provided on the side surface of the support member of the oscillator array 9. In this embodiment, the radiation area 2 includes ultra-wideband radiation units distributed symmetrically in a leaf-shaped center, and the operating frequency of the ultra-wideband radiation units is 2496MHz to 3800MHz, so as to obtain the best standing wave performance and radiation performance in the array.
In a possible embodiment, the power dividing feed network includes a one-to-three power dividing feed circuit layer 4 disposed on the upper surface of the bottom plate 10, and the surface of the one-to-three power dividing feed circuit layer 4 is metalized, and its branch port is conductively connected to the balun region 3.
Furthermore, the power dividing feed network further comprises a ground layer 5 and a plurality of positioning columns 6, the ground layer 5 is arranged on the lower surface of the bottom plate 10, metallized through holes are formed in the positioning columns 6, metallization processing is performed on the metallized through holes, one end of each positioning column 6 is in conductive connection with the one-to-three power dividing feed circuit layer 4, and the other end of each positioning column is used for being in conductive connection with the connector circuit layer on the back of the antenna.
Those skilled in the art will readily appreciate that the sides of the base plate 10 may be provided with reinforcing spacers 8 to increase the longitudinal strength of the structure of the body 1. The reinforcing partition 8 is provided with a partition area (not shown in the figure) which is formed by selective electroplating and can be flexibly electroplated into a special shape according to a test result.
In order to facilitate the installation on the reflector, a buckle 7 is further arranged on the lower surface of the bottom plate, and the buckle 7 is used for being clamped into a corresponding hole on the reflector. When the novel 5G array mechanism is installed, the buckle 7 is directly clamped into the reflecting plate.
According to another aspect of the present invention, a base station antenna is further disclosed, where the base station antenna includes the novel 5G array mechanism in any of the above embodiments, and the novel 5G array mechanism may be mounted on the reflection plate through a buckle structure.
The invention also discloses a production process of the novel 5G array mechanism, which comprises the following steps:
1. the corresponding plastic part body is obtained by adopting enhanced polyphenylene sulfide (PPS + 30% glass fiber) containing metal particles through injection molding, and the finished product of the material has high yield, is stable in injection molding and is not easy to have injection molding defects such as material shortage and the like;
2. and according to the optimal simulation debugging result, the metalized areas are divided into corresponding radiation areas, balun areas and power division feed networks by a selective electroplating process in the top area, the side area and the bottom area. In a possible embodiment, when the spacer regions are included, the spacer regions are also plated together.
In conclusion, the novel 5G array mechanism provided by the invention avoids the defects of complex assembly, unstable welding, high labor cost and easy intermodulation hidden trouble generation of a conventional 5G PCB oscillator array form. The main body is formed by plastic, and the bottom of the main body is contacted with the reflecting plate, so that intermodulation hidden danger is avoided; the reinforcing partition plates arranged on the side face increase the longitudinal strength of the main body structure, and partition plate areas can be flexibly electroplated on the surface of the main body structure to optimize the isolation and radiation performance; the bottom of the main body is directly fixed with the reflecting plate by adopting a buckle mechanism, so that fastening parts such as screws and rivets are avoided, the mounting time is shortened, the labor cost is reduced, and the reflecting plate has a wide application prospect.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The above description is only a preferred example of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the scope of the present application.
Claims (10)
1. The utility model provides a novel 5G group battle array mechanism which characterized in that: the surface circuit comprises a main body and a surface layer circuit, wherein the main body is formed by injection molding and processing of enhanced polyphenylene sulfide plastic containing metal particles, the surface layer circuit is formed by selectively electroplating on the surface of a local position of the main body, the surface layer circuit comprises a radiation area, a balun area and a power division feed network, and the shape of the surface layer circuit is determined according to an optimal simulation debugging scheme.
2. The novel 5G array mechanism of claim 1, wherein: the main body comprises a vibrator array and a bottom plate, the vibrator array and the bottom plate are integrally formed, the radiation area is arranged on the top surface of the vibrator array, the balun area is arranged on the side surface of the vibrator array, and the power division feed network is arranged on the bottom plate.
3. The novel 5G array mechanism of claim 1, wherein: the radiation area comprises an ultra-wideband radiation unit, and the working frequency of the ultra-wideband radiation unit is 2496 MHz-3800 MHz.
4. The novel 5G array mechanism of claim 2, wherein: the power dividing feed network comprises a one-to-three power dividing feed circuit layer arranged on the upper surface of the bottom plate, the surface of the one-to-three power dividing feed circuit layer is subjected to metallization treatment, and a branch port of the one-to-three power dividing feed circuit is in conductive connection with the balun area.
5. The novel 5G array mechanism of claim 4, wherein: the power distribution feed network further comprises a ground layer and a plurality of positioning columns, the ground layer is arranged on the lower surface of the bottom plate, metallized through holes are formed in the positioning columns, the surfaces of the positioning columns are metallized, one ends of the positioning columns are in conduction connection with the one-to-three power distribution feed circuit layer, and the other ends of the positioning columns are used for being in conduction connection with the connector circuit layer on the back of the antenna.
6. The novel 5G array mechanism of claim 2, wherein: and a reinforcing partition plate is arranged on the side surface of the bottom plate.
7. The novel 5G array mechanism of claim 6, wherein: the reinforced partition plate is provided with a partition plate area, and the partition plate area is formed by selective electroplating.
8. The novel 5G array mechanism of claim 1, wherein: the lower surface of the bottom plate is also provided with a buckle which is used for being clamped into a corresponding hole position on the reflecting plate.
9. A base station antenna, characterized by: the base station antenna comprises the novel 5G array mechanism as claimed in any one of claims 1-8, wherein the novel 5G array mechanism is mounted on a reflecting plate.
10. A production process of a novel 5G array mechanism is characterized by comprising the following steps: the main body is formed by injection molding of enhanced polyphenylene sulfide containing metal particles, and metalized areas are partitioned in the top, side and bottom areas of the main body through selective electroplating according to an optimal simulation debugging result to form a corresponding radiation area, a balun area and a power division feed network.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010710734.4A CN111786099A (en) | 2020-07-22 | 2020-07-22 | Novel 5G array mechanism, base station antenna and production process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010710734.4A CN111786099A (en) | 2020-07-22 | 2020-07-22 | Novel 5G array mechanism, base station antenna and production process |
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| Publication Number | Publication Date |
|---|---|
| CN111786099A true CN111786099A (en) | 2020-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010710734.4A Withdrawn CN111786099A (en) | 2020-07-22 | 2020-07-22 | Novel 5G array mechanism, base station antenna and production process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736428A (en) * | 2020-12-24 | 2021-04-30 | 京信通信技术(广州)有限公司 | Radiation unit and antenna |
| CN116435759A (en) * | 2023-06-14 | 2023-07-14 | 广东盛路通信科技股份有限公司 | Base station antenna and index adjusting method thereof |
-
2020
- 2020-07-22 CN CN202010710734.4A patent/CN111786099A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736428A (en) * | 2020-12-24 | 2021-04-30 | 京信通信技术(广州)有限公司 | Radiation unit and antenna |
| CN116435759A (en) * | 2023-06-14 | 2023-07-14 | 广东盛路通信科技股份有限公司 | Base station antenna and index adjusting method thereof |
| CN116435759B (en) * | 2023-06-14 | 2023-10-27 | 广东盛路通信科技股份有限公司 | Base station antenna and index adjusting method thereof |
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Application publication date: 20201016 |
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