CN107887713B - Integrated circuit antenna oscillator and manufacturing method thereof - Google Patents
Integrated circuit antenna oscillator and manufacturing method thereof Download PDFInfo
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- CN107887713B CN107887713B CN201710979318.2A CN201710979318A CN107887713B CN 107887713 B CN107887713 B CN 107887713B CN 201710979318 A CN201710979318 A CN 201710979318A CN 107887713 B CN107887713 B CN 107887713B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
Abstract
The invention discloses an integrated circuit antenna oscillator and a manufacturing method thereof, wherein the integrated circuit antenna oscillator comprises a panel, an oscillator body, a first circuit, a second circuit, a first feeding part and a second feeding part, wherein the oscillator body is formed on the first surface of the panel in an injection molding mode; the first feed part comprises two first feed layers which are symmetrically arranged, and two ends of the first circuit are respectively connected with the two first feed layers to conduct the two first feed layers; the second feed portion comprises two second feed layers which are symmetrically arranged, two ends of the second circuit are respectively connected with the two second feed layers, and the two second feed layers are conducted. The integrated circuit antenna oscillator is of an integral structure, and compared with the existing assembly structure of a sheet metal part, a plastic fixing part and a circuit board, the integrated circuit antenna oscillator is small in weight, small in number of parts and better in dimensional stability of the integral structure, improves assembly and debugging production efficiency, and reduces manufacturing process cost.
Description
Technical Field
The invention relates to the technical field of communication antennas, in particular to an integrated circuit antenna oscillator and a manufacturing method thereof.
Background
With the continuous development and network upgrade of the 4G/5G wireless communication industry, the use frequency is higher and higher, and the demand is more and more. The structural design, material selection, manufacturing method and assembly process of the antenna guarantee the reliability, stability and durability of the antenna performance. The oscillator is the most important functional part in the antenna, and general structural design is comparatively complicated, and metal material (aluminum alloy or zinc alloy) die-casting molding is adopted to traditional manufacturing process, or the mode of sheet metal component, plastics mounting and circuit board combination.
However, the conventional metal-assembled resonator has the following disadvantages:
1. in the future, the number of the oscillators on the 4G/5G base station antenna is multiplied, and the overall weight of the antenna is increased. The antenna is generally installed on an iron tower on the roof of an outdoor building or in a suburb, and if the overall weight of the antenna is increased, the strength of an iron frame and a suspension structure for supporting the antenna is insufficient. In windy and rainy days, the antenna is easily blown off by strong wind or the support iron frame is bent and deformed, so that great potential safety hazards exist, communication operators require antenna manufacturers to reduce the weight of the antenna, and the oscillator also needs to consider the problem of weight reduction.
2. At present, the metal vibrator is generally made of zinc alloy and aluminum alloy materials, and the density of the aluminum alloy is 2.78g/cm3The density of the zinc alloy is 6.75g/cm3High density and heavy overall weight.
3. The frequency band used by the 4G/5G base station antenna is higher and higher, the requirement of the high-frequency oscillator on the size precision of the balun is high, the manufacturing process of the die-casting and metal plate oscillator is complex, the product deformation is easily caused, and the size precision is difficult to meet the requirement.
4. The die-casting aluminum alloy vibrator needs to perform the procedures of punching a pouring gate, grinding burrs, polishing and the like after die-casting molding, and then electroplating is performed, so that the process is complex, and the manufacturing cost is high.
5. Because of the easy deformation of panel beating oscillator stamping forming back, need adopt the plastic buckle to fix, then weld with the circuit board, whole part is more, and production assembly process cost is higher.
In view of the above, it is necessary to improve the conventional vibrator to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide an integrated circuit antenna oscillator which reduces the number of antenna parts, reduces the weight and improves the structural size stability and a manufacturing method thereof.
The technical scheme adopted by the invention for solving the technical problems is as follows: the integrated circuit antenna oscillator comprises a panel, an oscillator body, a first circuit, a second circuit, a first feeding part and a second feeding part, wherein the oscillator body is formed on the first surface of the panel in an injection molding mode;
the first feed part comprises two first feed layers which are symmetrically arranged, two ends of the first circuit are respectively connected with the two first feed layers, and the two first feed layers are conducted;
the second feed portion comprises two second feed layers which are symmetrically arranged, two ends of the second circuit are respectively connected with the two second feed layers, and the two second feed layers are conducted.
Preferably, the integrated circuit antenna element further comprises a first solder post and a second solder post disposed on the second surface of the panel;
the first welding column is connected with one first feed layer, one end of the first circuit is connected with the first welding column, and the other end of the first circuit is connected with the other first feed layer;
the second welding column is connected with one second feeding layer, one end of the second circuit is connected with the second welding column, and the other end of the second circuit is connected with the other second feeding layer.
Preferably, the first surface of the panel is provided with a first through hole and a second through hole which penetrate to the second surface;
one end of the first circuit extends to the second surface through the first through hole and is connected with the first welding column; one end of the second circuit extends to the second surface through the second through hole to be connected with the second welding column.
Preferably, the vibrator body is funnel-shaped and is vertically connected to the first surface of the panel; the inner peripheral surface of the vibrator body forms a first surface of the vibrator body, and the outer peripheral surface of the vibrator body forms a second surface of the vibrator body; the two first feeding layers are oppositely arranged on the inner peripheral surface of the oscillator body, and the two second feeding layers are oppositely arranged on the inner peripheral surface of the oscillator body;
the other end of the first circuit extends to the outer peripheral surface of the oscillator body and is connected with the other first feed layer through a first via hole;
the other end of the second circuit extends to the outer peripheral surface of the oscillator body and is connected with the other second feed layer through a second through hole.
Preferably, a metal layer and four separation grooves distributed on the metal layer at intervals are arranged on the second surface of the oscillator body; the separation groove divides the metal layer into four metal layer regions to form a first metal layer region corresponding to the two first feed layers and a second metal layer region corresponding to the two second feed layers;
the first metal layer region is connected with the corresponding first feeding layer, and the second metal layer region is connected with the corresponding second feeding layer.
Preferably, a first guide hole is formed in the second surface of the oscillator body where the first metal layer region is located, the first guide hole penetrates through the first surface of the oscillator body, and the first metal layer region is connected with the first feed layer through the first guide hole;
and a second guide hole is formed in the second surface of the oscillator body where the second metal layer region is located, the second guide hole penetrates through the first surface of the oscillator body, and the second metal layer region is connected with the second feed layer through the second guide hole.
Preferably, the first circuit and the second circuit are both insulated from the metal layer.
Preferably, the vibrator body is integrally connected to a middle position of the first surface of the panel; the first circuit and the second circuit surround the periphery of the vibrator body.
The invention also provides a manufacturing method of the integrated circuit antenna oscillator, which comprises the following steps:
s1, integrally forming a panel and a vibrator body connected to the first surface of the panel through injection molding;
s2, arranging a circuit pattern layer on the first surface of the panel to form a first circuit and a second circuit which are isolated from each other;
s3, arranging a feeding pattern layer on the first surface of the oscillator body to form a first feeding part and a second feeding part which are isolated from each other;
the first feed part comprises two first feed layers which are symmetrically arranged, two ends of the first circuit are respectively connected with the two first feed layers, and the two first feed layers are conducted;
the second feed portion comprises two second feed layers which are symmetrically arranged, two ends of the second circuit are respectively connected with the two second feed layers, and the two second feed layers are conducted.
Preferably, step S2 includes the steps of:
s2.1, depositing a nickel layer on the first surface of the panel;
s2.2, laser etching a boundary on the nickel layer on the first surface of the panel, scribing a region of the preset circuit pattern layer, and removing the nickel layer on the boundary;
s2.3, conducting electrifying treatment on the region of the preset circuit pattern layer;
s2.4, plating a copper layer on the region of the preset circuit pattern layer;
s2.5, removing the nickel layer of other areas except the area of the preset circuit pattern layer on the first surface of the panel;
s2.6, plating a tin layer on the copper layer in the preset circuit pattern layer area, and thus sequentially overlapping the nickel layer, the copper layer and the tin layer in the preset circuit pattern layer area to form a circuit pattern layer;
step S3 includes the following steps:
s3.1, respectively depositing nickel layers on the first surfaces of the oscillator bodies;
s3.2, laser etching a boundary on the nickel layer on the first surface of the oscillator body, scribing a region of a preset feed pattern layer, and removing the nickel layer on the boundary;
s3.3, carrying out power-on treatment on the region of the preset power feeding pattern layer;
s3.4, plating a copper layer on the region of the preset feed pattern layer;
s3.5, removing nickel layers in other areas outside the preset feed pattern layer area on the first surface of the oscillator body;
and S3.6, plating a tin layer on the copper layer in the preset feed pattern layer area, and sequentially overlapping the nickel layer, the copper layer and the tin layer in the preset feed pattern layer area to form the feed pattern layer.
According to the integrated circuit antenna oscillator, the circuit and the feeding part are respectively integrated on the panel and the oscillator body which are integrally injection-molded, so that an integral structure is formed, compared with the existing assembly structure of a sheet metal part, a plastic fixing part and a circuit board, the integrated circuit antenna oscillator is small in weight, small in part number, capable of reducing assembly procedures, good in dimensional stability of the integral structure, capable of improving assembly and debugging production efficiency and capable of reducing manufacturing process cost.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic perspective view of an integrated circuit antenna element according to an embodiment of the present invention;
fig. 2 is a top view of the integrated circuit antenna element of fig. 1;
FIG. 3 is a schematic diagram of an inverted placement of the antenna element of the integrated circuit of FIG. 1;
fig. 4 is a side view of the integrated circuit antenna element of fig. 3.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
As shown in fig. 1 and 2, the integrated circuit antenna element according to the embodiment of the present invention includes a panel 10, an element body 20 integrally connected to the panel 10, a first circuit 30 and a second circuit 40 provided on the panel 10, and a first power feeding unit 50 and a second power feeding unit 60 provided on the element body 20.
The panel 10 includes a first surface 11 and a second surface 12 opposite to each other, and the vibrator body 20 is formed on the first surface 11 of the panel 10 by injection molding. The first circuit 30 and the second circuit 40 are disposed on and isolated (not connected) to the first surface 11 of the panel 10. The vibrator body 20 includes a first surface 21 and a second surface 22 opposite to each other, and the first feeding portion 50 and the second feeding portion 60 are disposed on and insulated from the first surface 21 of the vibrator body 20.
The first feeding portion 50 includes two first feeding layers 51 symmetrically disposed, two ends of the first circuit 30 are respectively connected to the two first feeding layers 51, and the two first feeding layers 51 are electrically connected. The second feeding portion 60 includes two second feeding layers 61 symmetrically disposed, two ends of the second circuit 40 are respectively connected to the two second feeding layers 61, and the two second feeding layers 61 are electrically connected. The first circuit 30 and the second circuit 40 are respectively arranged corresponding to the polarities of the positive electrode and the negative electrode.
Specifically, the panel 10 and the vibrator body 20 are integrally injection molded by high-temperature resistant engineering plastics; the high-temperature resistant engineering plastics comprise polyphenylene sulfide (PPS), Polyetherimide (PEI), Liquid Crystal Polymer (LCP) and the like.
The panel 10 may be a flat plate, and the vibrator body 20 may be funnel-shaped, and is connected to the first surface 11 of the panel 10 with a narrow end facing the panel 10. The inner peripheral surface of the vibrator body 20 forms a first surface 21 of the vibrator body 20, and the outer peripheral surface of the vibrator body 20 forms a second surface 22 of the vibrator body 20. The two first feed layers 51 are oppositely disposed on the inner peripheral surface of the vibrator body 20 without direct conduction therebetween. The two second feed layers 61 are oppositely disposed on the inner peripheral surface of the vibrator body 20 without direct conduction therebetween.
In this embodiment, as shown in fig. 1, the vibrator body 20 is integrally connected to the middle of the first surface 11 of the panel 10; the first circuit 30 and the second circuit 40 surround the vibrator body 20.
The first and second circuits 30 and 40, and the first and second feeding portions 50 and 60 are formed by metal layers provided on the panel 10 and the vibrator body 20, respectively; the metal layer may include a nickel layer, a copper layer, and a tin layer, which are sequentially stacked. In order to meet the requirements of antenna element performance, the first circuit 30 and the second circuit 40 can be respectively and properly increased in overall length by multi-bending arrangement, and the first circuit and the second circuit are mutually avoided on the first surface 11 to avoid contact.
When two circuits intersect on the first surface 11 of the panel 10, one circuit (the first circuit 30 or the second circuit 40) can be disconnected at the position where the other circuit intersects, and the two ends of the disconnected part extend to the second surface 12 of the panel 10 through the through hole and are connected and communicated at the second surface 12. As shown in fig. 1 and 3, taking the first circuit 30 as an example, the two ends of the broken part are connected to the second panel 12 through the through hole 31.
Further, as shown in fig. 3, the integrated circuit antenna element further comprises a first solder post 70 and a second solder post 80 disposed on the second surface 12 of the panel 10.
Referring to fig. 1 to 3, the first solder post 70 is disposed on the second surface 12 of the panel 10 corresponding to the position of one first feed layer 51, and is electrically connected to the first feed layer 51, one end of the first circuit 30 is connected to the first solder post 70, and the other end is connected to another first feed layer 51, so that the two first feed layers 51 are electrically connected to each other through the first solder post 70 and the first circuit 30.
Similarly, the second welding pillar 80 is disposed on the second surface 12 of the panel 20 corresponding to the position of one second feed layer 61, and is connected and conducted with the second feed layer 61, one end of the second circuit 40 is connected to the second welding pillar 80, and the other end is connected to another second feed layer 61, so that the two second feed layers 61 are communicated with each other through the second welding pillar 80 and the second circuit 40.
Alternatively, the first surface 11 of the panel 10 is provided with a first through hole 13 and a second through hole 14 penetrating to the second surface 12. The first through hole 13 is located on the panel 10 on one side of the first welding column 70 near the first welding column 70; the second through hole 14 is located on the panel 10 near the second welding column 80 on one side of the second welding column 80.
One end of the first circuit 30 extends to the second surface 12 through the first through hole 13 to be connected to the first bonding post 70. One end of the second circuit 40 extends to the second surface 12 through the second through hole 14 and is connected to the second bonding post 80.
As shown in fig. 1, 2 and 4, the other end of the first circuit 30 may extend to the outer peripheral surface (second surface 22) of the vibrator body 20, and be connected to another first feed layer 51 through the first via 23. The other end of the second circuit 40 extends to the outer peripheral surface (second surface 22) of the vibrator body 20, and is connected to another second feed layer 62 through a second via 24.
Further, as shown in fig. 2-4, in the integrated circuit antenna element of the present invention, the second surface 22 of the element body 20 is provided with a metal layer 25 and four separation grooves 26 spaced apart from each other on the metal layer. The metal layer 25 is provided to help the antenna element generate a resonance signal, and may be formed on the element body 20 at the same time as the first circuit 30, the second circuit 40, the first feeding portion 50, and the second feeding portion 60, and the material structure layer may be the same as the first circuit 30, the second circuit 40, the first feeding portion 50, and the second feeding portion 60. According to the formation method of the metal layer 25, the metal layer is formed on the second surface 12 of the panel 10, and the metal layer is formed at the same time as the metal layer on the antenna element 20, and the material structure layer is the same. The metal layer on the panel 10 is insulated from the first circuit 30, the second circuit 40, the first solder post 70, and the second solder post 80.
The metal layer 25 is insulated from the first circuit 30 and the second circuit 40. A gap is reserved between one end of the first circuit 30 extending to the second surface 22 of the vibrator body 20 and the metal layer 25 to separate the two; a gap is reserved between one end of the second circuit 40 extending to the second surface 22 of the vibrator body 20 and the metal layer 25 to separate the two.
The four separation grooves 26 separate the metal layer 25 into four metal layer regions, forming first metal layer regions 251 corresponding to the two first feed layers 51, respectively, and second metal layer regions 252 corresponding to the two second feed layers 61, respectively. The separation groove 26 is located at a balun position on the metal layer 25 and can be formed through a laser etching process, and the precision can be controlled within +/-0.1 mm.
First metal layer region 251 and second metal layer region 252 are alternately arranged. The first metal layer region 251 is connected to the corresponding first feed layer 51, and the second metal layer region 252 is connected to the corresponding second feed layer 61.
The second surface 22 of the oscillator body 20 where the first metal layer area 251 is located is provided with a first via 261, the first via 261 penetrates through the first surface 21 of the oscillator body 20 and the first feed layer 51, and the first metal layer area 251 is connected to the first feed layer 51 through the first via 261. The second surface 22 of the vibrator body 20 where the second metal layer region 252 is located is provided with a second via 262, the second via 262 penetrates through the first surface 21 of the vibrator body 20 and the second feed layer 61, and the second metal layer region 252 is connected to the second feed layer 61 through the second via 262.
In addition, in the integrated circuit antenna element of the present invention, the opening end peripheries of the first through hole 13, the second through hole 14, the first via hole 261, the second via hole 262, the first via hole 23, the second via hole 24, the through hole 31, and the like all need to be rounded, so as to avoid the occurrence of burrs at the hole edges after electroplating, which affects the electrical performance.
Referring to fig. 1-4, the method for manufacturing an integrated circuit antenna element of the present invention may include the following steps:
s1, integrally injection-molding the panel 10 and the vibrator body 20 connected to the first surface 11 of the panel 10.
The panel 10 and the antenna element 20 are made of high temperature resistant engineering plastics such as polyphenylene sulfide (PPS), Polyetherimide (PEI), Liquid Crystal Polymer (LCP) and the like by injection molding, and the two are formed into an integral structure. Because the integral structure material is engineering plastics, the density is approximately 1.60g/cm3The antenna element is far smaller than the antenna element of the original aluminum alloy and sheet metal parts, so that the weight can be reduced by 50 percent, and the processes of deburring in a die-casting process, assembling plastic fixing parts and the like are saved.
The injection-molded panel 10 and the vibrator body 20 are also subjected to mechanical roughening treatment, so that the adhesion of a subsequent plating layer is ensured, and the conditions of plating layer falling, foaming and the like are avoided during welding.
S2, a circuit pattern layer is formed on the first surface 11 of the panel 10 to form the first circuit 30 and the second circuit 40 which are isolated from each other.
Step S2 may include the steps of:
s2.1, depositing a nickel layer on the first surface 11 of the panel 10. The thickness of the nickel layer is not more than 1 μm.
S2.2, laser etching boundary lines on the nickel layer on the first surface 11 of the panel 10, scribing regions of the preset circuit pattern layer, and removing the nickel layer on the boundary lines.
The demarcation line width may be 0.5 mm. The distribution of the preset circuit pattern layer area corresponds to the desired distribution arrangement of the first and second circuits 30 and 40.
And S2.3, electrifying the preset circuit pattern layer area to enable the preset circuit pattern layer area to be positively or negatively electrified.
And S2.4, plating a copper layer on the region of the preset circuit pattern layer. The copper layer thickness was 10 μm.
S2.5, removing the nickel layer on the first surface 11 of the panel 10 except the area of the preset circuit pattern layer.
And S2.6, plating a tin layer on the copper layer in the preset circuit pattern layer area, and thus sequentially overlapping the nickel layer, the copper layer and the tin layer in the preset circuit pattern layer area to form the circuit pattern layer.
The tin layer thickness is greater than 6 μm. The formed circuit pattern layer includes a first circuit 30 and a second circuit 40.
S3, a feeding pattern layer is provided on the first surface 21 of the vibrator body 20 to form the first feeding unit 50 and the second feeding unit 60 which are isolated from each other.
The first feeding portion 50 includes two first feeding layers 51 symmetrically disposed, two ends of the first circuit 30 are respectively connected to the two first feeding layers 51, and the two first feeding layers 51 are conducted; the second feeding portion 60 includes two second feeding layers 61 symmetrically disposed, two ends of the second circuit 40 are respectively connected to the two second feeding layers 61, and the two second feeding layers 61 are electrically connected.
Step S3 may include the steps of:
and S3.1, respectively depositing nickel layers on the first surfaces 21 of the oscillator bodies 20. The thickness of the nickel layer is not more than 1 μm.
And S3.2, laser etching a boundary on the nickel layer on the first surface 21 of the oscillator body 20, scribing a region of the preset feed pattern layer, and removing the nickel layer on the boundary.
The demarcation line width may be 0.5 mm. The distribution of the preset feeding pattern layer areas is set corresponding to the desired distribution of the first feeding portion 50 and the second feeding portion 60.
And S3.3, carrying out electrifying treatment on the preset power feeding pattern layer area to enable the preset power feeding pattern layer area to be positively or negatively electrified.
And S3.4, plating a copper layer on the region of the preset feed pattern layer. The copper layer thickness was 10 μm.
And S3.5, removing the nickel layer in other areas outside the preset feeding pattern layer area on the first surface 21 of the oscillator body 20.
And S3.6, plating a tin layer on the copper layer in the preset feed pattern layer area, and sequentially overlapping the nickel layer, the copper layer and the tin layer in the preset feed pattern layer area to form the feed pattern layer.
The tin layer thickness is greater than 6 μm. The formed feeding pattern layer includes a first feeding portion 50 and a second feeding portion 60.
Specifically, in the manufacturing of the integrated circuit antenna oscillator of the present invention, in actual operation, a nickel layer is deposited on the whole of the panel 10 and the oscillator body 20, and the nickel layer is used as a base layer to cover all surfaces of the panel 10 and the oscillator body 20. Then, laser etching is carried out on a boundary line with the width of about 0.5mm between the electroplating area and the non-electroplating area through a laser etching process, and a nickel layer on the boundary line is cleaned up through laser; the electroplating area comprises the preset circuit pattern layer area and the preset feed pattern layer area. And electrifying the electroplating area, and electroplating a copper layer with the thickness of more than 10 mu m on the surface. And removing the nickel layer on the non-plating area, wherein the non-plating area comprises the position on the first surface 11 of the panel 10 except the area of the preset circuit pattern layer and the position on the first surface 21 of the oscillator body 20 except the area of the preset feed pattern layer. In this case, since the operation of removing the nickel layer is performed on the entire of the panel 10 and the vibrator body 20, the copper layer on other regions such as the plating region is also removed by about 1 μm, and the copper layer structure layer is not affected. Finally, a tin layer with the thickness of more than 6 mu m is electroplated on the copper layer.
In the manufacturing process, a nickel layer, a copper layer and a tin layer are respectively formed on the second surface 12 of the panel 10 and the second surface 22 of the vibrator body 20 to form a metal layer.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. An integrated circuit antenna oscillator is characterized by comprising a panel (10), an oscillator body (20) injection-molded on a first surface (11) of the panel (10), a first circuit (30) and a second circuit (40) which are arranged on the first surface (11) of the panel (10) and isolated from each other, and a first feeding part (50) and a second feeding part (60) which are arranged on a first surface (21) of the oscillator body (20) and isolated from each other;
the first feeding part (50) comprises two first feeding layers (51) which are symmetrically arranged, two ends of the first circuit (30) are respectively connected with the two first feeding layers (51), and the two first feeding layers (51) are conducted;
the second feeding part (60) comprises two second feeding layers (61) which are symmetrically arranged, two ends of the second circuit (40) are respectively connected with the two second feeding layers (61), and the two second feeding layers (61) are conducted;
the panel (10) and the vibrator body (20) are formed by injection molding of high-temperature-resistant engineering plastics, and the panel and the vibrator body form an integral structure;
a metal layer (25) and four separation grooves (26) distributed on the metal layer (25) at intervals are arranged on the second surface (22) of the vibrator body (20); the separation groove (26) separates the metal layer (25) into four metal layer regions, and a first metal layer region (251) corresponding to the two first feed layers (51) and a second metal layer region (252) corresponding to the two second feed layers (61) are formed;
the first metal layer region (251) is connected to the corresponding first feed layer (51), and the second metal layer region (252) is connected to the corresponding second feed layer (61);
the first circuit (30) and the second circuit (40) are arranged on the panel (10) and the vibrator body (20) in a bent mode and are insulated from the metal layer (25).
2. An integrated circuit antenna element according to claim 1, further comprising a first (70) and a second (80) solder post disposed on the second surface (12) of the panel (10);
the first welding column (70) is connected with one first feed layer (51), one end of the first circuit (30) is connected with the first welding column (70), and the other end of the first circuit is connected with the other first feed layer (51);
the second welding column (80) is connected with one second feed layer (61), one end of the second circuit (40) is connected with the second welding column (80), and the other end of the second circuit is connected with the other second feed layer (61).
3. An integrated circuit antenna element according to claim 2, characterised in that the first surface (11) of the panel (10) is provided with a first (13) and a second (14) through hole to the second surface (12);
the peripheries of the opening ends of the first through hole (13) and the second through hole (14) are rounded;
one end of the first circuit (30) extends to the second surface through the first through hole (13) to connect the first welding column (70); one end of the second circuit (40) extends to the second surface through the second through hole (14) to connect the second welding column (80).
4. An integrated circuit antenna element according to claim 2, characterised in that the element body (20) is funnel-shaped and is connected upright to the first surface (11) of the panel (10); the inner peripheral surface of the vibrator body (20) forms a first surface (21) of the vibrator body (20), and the outer peripheral surface of the vibrator body (20) forms a second surface (22) of the vibrator body (20); the two first feed layers (51) are oppositely arranged on the inner peripheral surface of the vibrator body (20), and the two second feed layers (61) are oppositely arranged on the inner peripheral surface of the vibrator body (20);
the other end of the first circuit (30) extends to the outer peripheral surface of the oscillator body (20) and is connected with another first feed layer (51) through a first through hole (23);
the other end of the second circuit (40) extends to the outer peripheral surface of the oscillator body (20) and is connected with another second feed layer (61) through a second through hole (24);
the first metal layer region (251) is connected to the corresponding first feed layer (51), and the second metal layer region (252) is connected to the corresponding second feed layer (61).
5. An integrated circuit antenna element according to claim 1, characterised in that the second surface (22) of the element body (20) where the first metal layer region (251) is located is provided with a first via (261), the first via (261) is through to the first surface (21) of the element body (20), the first metal layer region (251) is connected to the first feed layer (51) through the first via (261);
and a second guide hole (262) is formed in the second surface (22) of the oscillator body (20) where the second metal layer region (252) is located, the second guide hole (262) penetrates through the first surface (21) of the oscillator body (20), and the second metal layer region (252) is connected with the second feed layer (61) through the second guide hole (262).
6. An integrated circuit antenna element according to any of claims 1-5, characterised in that the element body (20) is integrally attached to the panel (10) at a central position on the first surface (11); the first circuit (30) and the second circuit (40) surround the vibrator body (20).
7. A manufacturing method of an integrated circuit antenna element is characterized by comprising the following steps:
s1, integrally forming a panel (10) by injection molding and a vibrator body (20) connected to the first surface (11) of the panel (10); the panel (10) and the vibrator body (20) are also subjected to mechanical roughening treatment;
s2, arranging a circuit pattern layer on the first surface (11) of the panel (10) to form a first circuit (30) and a second circuit (40) which are isolated;
step S2 includes the following steps:
s2.1, depositing a nickel layer on the first surface (11) of the panel (10); the thickness of the nickel layer is less than 1 μm;
s2.2, laser etching a boundary line with the width of 0.5mm on the nickel layer on the first surface (11) of the panel (10), scribing a region of a preset circuit pattern layer, and removing the nickel layer on the boundary line;
s2.3, conducting electrifying treatment on the preset circuit pattern layer area;
s2.4, plating a copper layer on the region of the preset circuit pattern layer; the thickness of the copper layer is more than 10 μm;
s2.5, removing the nickel layer of the other area except the area of the preset circuit pattern layer on the first surface (11) of the panel (10);
s2.6, plating a tin layer on the copper layer in the preset circuit pattern layer area, wherein the nickel layer, the copper layer and the tin layer in the preset circuit pattern layer area are sequentially overlapped to form a circuit pattern layer; the thickness of the tin layer is more than 6 mu m;
s3, providing a feeding pattern layer on the first surface (21) of the oscillator body (20) to form a first feeding part (50) and a second feeding part (60) which are isolated from each other;
the first feeding part (50) comprises two first feeding layers (51) which are symmetrically arranged, two ends of the first circuit (30) are respectively connected with the two first feeding layers (51), and the two first feeding layers (51) are conducted;
the second feeding portion (60) comprises two second feeding layers (61) which are symmetrically arranged, two ends of the second circuit (40) are respectively connected with the two second feeding layers (61), and the two second feeding layers (61) are conducted.
8. The method of claim 7, wherein the step of forming the integrated circuit antenna element,
step S3 includes the following steps:
s3.1, respectively depositing nickel layers on the first surfaces (21) of the oscillator bodies (20); the thickness of the nickel layer is less than 1 μm;
s3.2, laser etching a boundary on the nickel layer on the first surface (21) of the oscillator body (20) through a laser etching process, scribing a region of a preset feed pattern layer, and cleaning the nickel layer on the boundary through laser;
s3.3, carrying out power-on treatment on the preset power feeding pattern layer area;
s3.4, plating a copper layer on the region of the preset feed pattern layer; the thickness of the copper layer is more than 10 μm;
s3.5, removing nickel layers in other areas outside the preset feeding pattern layer area on the first surface (21) of the oscillator body (20);
s3.6, plating a tin layer on the copper layer of the preset feed pattern layer area, and thus sequentially overlapping the nickel layer, the copper layer and the tin layer of the preset feed pattern layer area to form a feed pattern layer; the tin layer thickness is greater than 6 μm.
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| CN108417998B (en) * | 2018-05-11 | 2024-01-30 | 京信通信技术(广州)有限公司 | Antenna and radiating element thereof |
| CN112582786B (en) * | 2019-09-30 | 2023-08-25 | 深圳科创新源新材料股份有限公司 | Manufacturing method of antenna oscillator module, antenna oscillator module and base station antenna |
| CN111355022B (en) * | 2020-02-28 | 2023-03-10 | 深圳慧联达科技有限公司 | Antenna oscillator and manufacturing method thereof |
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