CN111769105A - Anti-leakage light-emitting diode seat structure - Google Patents
Anti-leakage light-emitting diode seat structure Download PDFInfo
- Publication number
- CN111769105A CN111769105A CN202010764371.2A CN202010764371A CN111769105A CN 111769105 A CN111769105 A CN 111769105A CN 202010764371 A CN202010764371 A CN 202010764371A CN 111769105 A CN111769105 A CN 111769105A
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- Prior art keywords
- arc
- semicircle ring
- emitting diode
- heat dissipation
- dissipation base
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Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 229910002804 graphite Inorganic materials 0.000 claims description 12
- 239000010439 graphite Substances 0.000 claims description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the technical field of light emitting diodes, in particular to an anti-leakage light emitting diode seat body structure which comprises a heat dissipation base, a mounting disc, a light emitting diode, a conductive mechanism, a fixing mechanism, a cover plate and a transparent plate, wherein a cavity is formed in the top of the heat dissipation base, the mounting disc is placed in the cavity, the light emitting diode is fixedly connected to the top of the mounting disc, the conductive mechanism is bonded to the top of the heat dissipation base and is electrically connected with the light emitting diode, and the fixing mechanism is bonded to the top of the conductive mechanism. According to the invention, the arc-shaped strips are fixed on the tops of the first semicircular ring and the second semicircular ring, the arc-shaped groove is formed in the bottom of the fixed disc, and the arc-shaped strips are inserted into the arc-shaped groove, so that the conductive mechanism and the fixing mechanism are bonded more firmly, the epoxy resin in the seat body can be effectively prevented from leaking, and the overall stability and the sealing property are improved.
Description
Technical Field
The invention relates to the technical field of light-emitting diodes, in particular to an anti-leakage light-emitting diode seat body structure.
Background
The diode is an electronic device made of semiconductor material, it has one-way conductivity, i.e. when the positive and negative electrodes of the diode are applied with forward voltage, the diode is conducted, when the positive and negative electrodes are applied with reverse voltage, the diode is cut off, so that the conduction and cut-off of the diode is equivalent to the on and off of the switch.
The LED is called LED for short, and is made by the compound that contains gallium, arsenic, phosphorus and nitrogen etc. in recent years, the field that LED used is more and more extensive, when the encapsulation LED pedestal, can exert the liquid epoxy of packing in to the pedestal, after long-time use, epoxy can follow the clearance seepage between electrically conductive frame and the fixed disk and come out, causes structural stability not good, simultaneously, can make outside aqueous vapor enter into the inside of pedestal, influences LED's life.
Disclosure of Invention
The invention provides an anti-leakage light-emitting diode seat body structure, which has the advantage of leakage prevention and solves the problems that after long-time use, epoxy resin or silica gel leaks out from a gap between a conductive frame and a fixed disk, so that the structural stability is poor, and meanwhile, outside moisture can enter the inside of the seat body to influence the service life of a light-emitting diode.
In order to achieve the technical problem, the invention provides an anti-leakage light emitting diode seat body structure which comprises a heat dissipation base, a mounting disc, a light emitting diode, a conductive mechanism, a fixing mechanism, a cover plate and a transparent plate, wherein a cavity is formed in the top of the heat dissipation base, the mounting disc is placed in the cavity, the light emitting diode is fixedly connected to the top of the mounting disc, the conductive mechanism is bonded to the top of the heat dissipation base and is electrically connected with the light emitting diode, the fixing mechanism is bonded to the top of the conductive mechanism, the cover plate is bonded to the top of the fixing mechanism, and the transparent plate is bonded to the middle of the top of the cover plate.
Further, electrically conductive mechanism is including first semicircle ring and second semicircle ring, first semicircle ring and second semicircle ring form a disc, the equal fixedly connected with of the looks back of first semicircle ring and second semicircle ring is electrically conductive to be put up, the semicircle orifice has all been seted up to the opposite face of first semicircle ring and second semicircle ring, the equal fixedly connected with arc strip in both sides at first semicircle ring and second semicircle ring top.
Further, fixed establishment is including the fixed disk, second toper hole has been seted up at the middle part of fixed disk, the arc wall has been seted up to the bottom of fixed disk.
Furthermore, the number of the arc-shaped grooves is four, the four arc-shaped grooves are distributed at the bottom of the fixed disc in a circumferential manner, and the bottoms of the arc-shaped strips are inserted into the arc-shaped grooves.
Furthermore, a graphite sheet is placed in the cavity in the heat dissipation base, and the graphite sheet is attached to the bottom of the mounting plate.
Furthermore, the middle part of the cover plate is provided with a first tapered hole, the transparent plate is positioned at the top of the first tapered hole, and the inner diameter of the first tapered hole is sequentially reduced from top to bottom.
Further, the internal diameter in second taper hole down reduces from last in proper order, and the internal diameter of first taper hole bottom equals with the internal diameter at second taper hole top, and the inner wall in second taper hole and first taper hole has plated the metal reflection stratum.
By means of the technical scheme, the invention provides an anti-leakage light-emitting diode seat body structure, which at least has the following beneficial effects:
1. this but LED pedestal structure of antiseep uses through electrically conductive mechanism and fixed establishment's cooperation, at the fixed arc strip in the top of first semicircle ring and second semicircle ring, and the arc wall is seted up to the bottom of fixed disk to peg graft the arc strip on the arc wall, make like this between electrically conductive mechanism and the fixed establishment bond more firmly, can effectually prevent that the epoxy in the pedestal from appearing the condition of leaking, improved holistic stability and leakproofness.
2. This but LED pedestal structure of antiseep, through the setting of heat dissipation base and graphite flake, the graphite flake is a heat conduction heat dissipation material, can follow two directions and carry out even heat conduction, can derive the heat that LED produced on the mounting disc, has played radiating effect to the mounting disc, has improved LED's life.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a partial structure of the present invention;
FIG. 3 is a schematic view of a heat dissipation base according to the present invention;
FIG. 4 is a schematic view of the conductive mechanism of the present invention;
fig. 5 is a schematic structural diagram of the fixing mechanism of the present invention.
In the figure: 1. a heat dissipation base; 2. a cavity; 3. mounting a disc; 4. a light emitting diode; 5. a conductive mechanism; 501. a first semicircular ring; 502. a second semi-circular ring; 503. a conductive frame; 504. a semicircular hole; 505. an arc-shaped strip; 6. a fixing mechanism; 601. fixing the disc; 602. a second tapered bore; 603. an arc-shaped slot; 7. a cover plate; 8. a transparent plate; 9. a graphite sheet; 10. a first tapered bore.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-5, the present invention provides a technical solution: a leakage-proof light-emitting diode seat body structure comprises a heat dissipation base 1, a mounting disc 3, a light-emitting diode 4, a conductive mechanism 5, a fixing mechanism 6, a cover plate 7 and a transparent plate 8, wherein a cavity 2 is formed in the top of the heat dissipation base 1, the mounting disc 3 is placed in the cavity 2, a graphite sheet 9 is placed in the cavity 2 in the heat dissipation base 1, the graphite sheet 9 is attached to the bottom of the mounting disc 3, through the arrangement of the heat dissipation base 1 and the graphite sheet 9, the graphite sheet 9 is a heat conduction and heat dissipation material and can conduct heat uniformly along two directions, heat generated by the light-emitting diode 4 on the mounting disc 3 can be led out, the heat dissipation effect on the mounting disc 3 is achieved, the service life of the light-emitting diode 4 is prolonged, the light-emitting diode 4 is fixedly connected to the top of the mounting disc 3, the conductive mechanism 5 is attached to the top of the heat dissipation base 1, fixing mechanism 6 bonds at the top of electrically conductive mechanism 5, and apron 7 bonds at the top of fixing mechanism 6, and transparent plate 8 bonds in the middle part at apron 7 top.
The conductive mechanism 5 comprises a first semicircular ring 501 and a second semicircular ring 502, the first semicircular ring 501 and the second semicircular ring 502 form a circular disc, the opposite surfaces of the first semicircular ring 501 and the second semicircular ring 502 are fixedly connected with a conductive frame 503, the opposite surfaces of the first semicircular ring 501 and the second semicircular ring 502 are respectively provided with a semicircular hole 504, the two sides of the top of the first semicircular ring 501 and the second semicircular ring 502 are respectively and fixedly connected with an arc-shaped strip 505, the fixing mechanism 6 comprises a fixing disc 601, the middle part of the fixing disc 601 is provided with a second conical hole 602, the bottom of the fixing disc 601 is provided with an arc-shaped groove 603, the number of the arc-shaped grooves 603 is four, the four arc-shaped grooves 603 are circumferentially distributed at the bottom of the fixing disc 601, the bottom of the arc-shaped strip 505 is inserted into the arc-shaped groove 603, the arc-shaped strip 505 is fixed at the top of the first semicircular ring 501 and the second semicircular ring 502 by matching the conductive mechanism 5 and the, the bottom of the fixed disk 601 is provided with an arc-shaped groove 603, and the arc-shaped strip 505 is inserted in the arc-shaped groove 603, thus, the bonding between the conductive mechanism 5 and the fixing mechanism 6 is firmer, the epoxy resin in the seat body can be effectively prevented from leaking, the integral stability and the sealing performance are improved, the first taper hole 10 is arranged in the middle of the cover plate 7, the transparent plate 8 is positioned at the top of the first taper hole 10, the inner diameter of the first taper hole 10 is reduced from top to bottom in sequence, the inner diameter of the second taper hole 602 is reduced from top to bottom in sequence, the inner diameter of the bottom of the first tapered hole 10 is equal to the inner diameter of the top of the second tapered hole 602, and the inner walls of the second tapered hole 602 and the first tapered hole 10 are plated with a metal reflective layer, so that the light emitted by the light emitting diode 4 crystal grain can be reflected by the tapered design and the metal reflective layer, and the light output amount of the light emitting diode 4 crystal grain is improved.
Arc strip 505 is fixed at the top of first semicircle ring 501 and second semicircle ring 502, arc groove 603 is seted up to the bottom of fixed disk 601, and peg graft arc strip 505 on arc groove 603, it is more firm to make bonding between conductive mechanism 5 and the fixed establishment 6 like this, can effectually prevent the condition that epoxy in the pedestal from appearing leaking, holistic stability and leakproofness have been improved, graphite flake 9 is a heat conduction heat dissipation material, can follow two directions and evenly conduct heat, can derive the heat that emitting diode 4 produced on the mounting disc 3, radiating effect has been played to mounting disc 3, the life of emitting diode 4 has been improved.
The anti-leakage led seat structure provided by the present invention is described in detail above. The principles and embodiments of the present invention have been explained by applying specific examples, and the above descriptions of the embodiments are only used to help understanding the method and the core idea of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (7)
1. The utility model provides a but LED pedestal structure of antiseep, includes heat dissipation base (1), mounting disc (3), emitting diode (4), electric mechanism (5), fixed establishment (6), apron (7) and transparent plate (8), its characterized in that: cavity (2) have been seted up at the top of heat dissipation base (1), place the inside at cavity (2) mounting disc (3), emitting diode (4) fixed connection is at the top of mounting disc (3), electrically conductive mechanism (5) bond at the top of heat dissipation base (1), and electrically conductive mechanism (5) are connected with emitting diode (4) electricity, fixed establishment (6) bond at the top of electrically conductive mechanism (5), apron (7) bond at the top of fixed establishment (6), transparent plate (8) bond at the middle part at apron (7) top.
2. The leak-proof led housing structure of claim 1, wherein: electrically conductive mechanism (5) are including first semicircle ring (501) and second semicircle ring (502), first semicircle ring (501) and second semicircle ring (502) form a disc, the equal fixedly connected with of the back of the body of first semicircle ring (501) and second semicircle ring (502) is electrically conductive frame (503), semicircle orifice (504) have all been seted up to the opposite face of first semicircle ring (501) and second semicircle ring (502), the equal fixedly connected with arc strip (505) in both sides at first semicircle ring (501) and second semicircle ring (502) top.
3. The leak-proof led housing structure of claim 1, wherein: fixing mechanism (6) have seted up second toper hole (602) including fixed disk (601), arc wall (603) have been seted up to the middle part of fixed disk (601).
4. The leak-proof led housing structure of claim 2, wherein: the number of the arc-shaped grooves (603) is four, the four arc-shaped grooves (603) are distributed at the bottom of the fixed disc (601) in a circumferential manner, and the bottoms of the arc-shaped strips (505) are inserted into the arc-shaped grooves (603).
5. The leak-proof led housing structure of claim 1, wherein: graphite flakes (9) are placed in the cavity (2) in the heat dissipation base (1), and the graphite flakes (9) are attached to the bottom of the mounting plate (3).
6. The leak-proof led housing structure of claim 1, wherein: the middle of the cover plate (7) is provided with a first tapered hole (10), the transparent plate (8) is located at the top of the first tapered hole (10), and the inner diameter of the first tapered hole (10) is sequentially reduced from top to bottom.
7. The leak-proof LED housing structure of claim 6, wherein: the internal diameter of second taper hole (602) down reduces from last in proper order, and the internal diameter of first taper hole (10) bottom equals with the internal diameter at second taper hole (602) top, and the inner wall of second taper hole (602) and first taper hole (10) has plated the metal reflection stratum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010764371.2A CN111769105A (en) | 2020-08-02 | 2020-08-02 | Anti-leakage light-emitting diode seat structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010764371.2A CN111769105A (en) | 2020-08-02 | 2020-08-02 | Anti-leakage light-emitting diode seat structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111769105A true CN111769105A (en) | 2020-10-13 |
Family
ID=72728243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010764371.2A Withdrawn CN111769105A (en) | 2020-08-02 | 2020-08-02 | Anti-leakage light-emitting diode seat structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111769105A (en) |
-
2020
- 2020-08-02 CN CN202010764371.2A patent/CN111769105A/en not_active Withdrawn
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Application publication date: 20201013 |