CN111761814A - 3D printing method for manufacturing electromagnetic wave device and 3D printer - Google Patents
3D printing method for manufacturing electromagnetic wave device and 3D printer Download PDFInfo
- Publication number
- CN111761814A CN111761814A CN202010731440.XA CN202010731440A CN111761814A CN 111761814 A CN111761814 A CN 111761814A CN 202010731440 A CN202010731440 A CN 202010731440A CN 111761814 A CN111761814 A CN 111761814A
- Authority
- CN
- China
- Prior art keywords
- electromagnetic wave
- wave device
- printing
- liquid container
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/307—Handling of material to be used in additive manufacturing
- B29C64/321—Feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/379—Handling of additively manufactured objects, e.g. using robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Robotics (AREA)
Abstract
The invention discloses a method for manufacturing an electromagnetic wave device through 3D printing and a 3D printer, and belongs to the technical field of 3D printing and electromagnetic wave device manufacturing. Mixing a substance containing metal ions into a base material to obtain a printing material, then solidifying the printing material layer by layer in a 3D printing mode to form an electromagnetic wave device structure, after each layer is solidified, selectively irradiating the outer surface of the layer through laser to enable metal to be precipitated in an irradiated area, and finally forming a required conductive area on the outer surface of the electromagnetic wave device structure. The invention realizes a brand-new 3D printing manufacturing method of the electromagnetic wave device, the main body of the electromagnetic wave device manufactured by the method is non-metal, the characteristics of light weight and high elasticity can be realized, the electromagnetic wave device with a complex structure can be manufactured, and the method has good application value.
Description
Technical Field
The invention relates to the technical field of 3D printing and electromagnetic wave device manufacturing, in particular to a method for manufacturing an electromagnetic wave device through 3D printing and a 3D printer.
Background
An electromagnetic wave device is a device for realizing functions of transmitting, conducting, filtering, receiving and the like of electromagnetic waves. For example, an antenna is an important electromagnetic wave device, and is an indispensable component of a wireless communication system as a device for transmitting and receiving electromagnetic waves. With the gradual development of communication technology, especially the rapid development of mobile communication terminals, antennas and various electromagnetic wave devices have been widely used in people's daily life. For example, data communication between a mobile phone and a local area network and between a mobile phone and a base station requires an antenna as a transmitting and receiving unit of electromagnetic signals.
However, the design and manufacture of electromagnetic wave devices requires consideration of factors such as impedance, operating frequency, bandwidth, Q value, and the like. In a specific application, the problems of shape, material strength, electromagnetic compatibility and the like of the used device (such as a mobile terminal) are also considered. Therefore, the manufacturing process of the electromagnetic wave device is very complicated, the manufacturing process is complex, and the manufacturing cost is high. In addition, since the electromagnetic wave device is naturally required to be made of a metal conductor material, most of the electromagnetic wave devices have the disadvantages of high density and high mass, and are not favorable for convenient use of the mobile terminal. Currently, with the emergence of novel electronic devices such as wearable electronic equipment, wearable electromagnetic wave device still needs to satisfy the characteristics of conformal, and electromagnetic wave device can satisfy control electromagnetic wave signal on the one hand promptly, and on the other hand still needs to match with user's health appearance. This puts higher demands on the production and manufacture of electromagnetic wave devices, and requires antennas with low mass and easy wearing.
In recent years, 3D printing technology has been increasingly emerging. The technology is a technology for constructing an object by layer-by-layer solidification forming based on a computer digital model. Due to the automatic control of 3D printing and the characteristics of additive manufacturing, objects of almost any shape can be easily printed. This provides favorable technical conditions for the preparation of novel electromagnetic wave devices.
However, the existing 3D printing technology based on metal printing still has the problems of high cost and insufficient precision, and the printed object is still made of solid metal material, so that the weight of the object cannot be effectively reduced. For some complex configured devices, such as electromagnetic wave devices, metal-based 3D printing techniques are not generally straightforward to implement.
In addition, other various non-metal-based 3D printing technologies, such as resin-based and photo-curing-based 3D printing technologies, have the characteristics of high precision, low cost, and light weight of printed objects. However, the resin material is generally an insulator, and in most cases, cannot be used as an electromagnetic wave device.
Disclosure of Invention
In view of the above, the present invention provides a method for manufacturing an electromagnetic wave device by 3D printing and a 3D printer, which can print a light-weight substrate structure with high precision and selectively form a metal conductive region on the outer surface of the structure as required.
Based on the above purpose, the technical scheme provided by the invention is as follows:
a method of 3D printing an electromagnetic wave device, comprising the steps of:
(1) mixing metal ions into a base material to form a printing material;
(2) printing and curing the printing material layer by layer to form an electromagnetic wave device structure;
(3) in the printing process or after printing out the whole electromagnetic wave device, selectively irradiating the solidified printing material by using laser to separate out metal at the irradiated part;
(4) an electromagnetic wave device having a surface or an internal conductive region is formed.
Further, the matrix material is light-cured resin, ABS plastic or thermosetting resin.
Further, the metal ions are silver ions, gold ions, copper ions or platinum ions.
Further, the step (3) is followed by the following steps:
and (3) post-treating the metal precipitation part in an electroless deposition or electroplating mode to improve the conductivity of the metal precipitation part.
Further, the concentration of metal ions in the printing material is 1-20% mol/L.
In addition, the invention also provides a 3D printer for manufacturing the electromagnetic wave device, which comprises a control system, a feeding system, a lifting system, an ultraviolet illumination system and a laser irradiation system, wherein the lifting system comprises a vertical guide rail and a lifting platform arranged on the guide rail, a material liquid container is arranged right below the lifting platform, the bottom of the material liquid container is transparent, a light source of the ultraviolet illumination system is arranged below the material liquid container, and a light source of the laser irradiation system is arranged on the side of the material liquid container; the control system is used for executing the following operations:
s1, controlling the lifting system to set the lifting platform at a specified height, and enabling the gap part of the area between the lifting platform and the feed liquid container to be at a unit height;
s2, controlling the feeding system to feed the light-cured resin mixed with the metal ions into the feed liquid container, and enabling the height of the light-cured resin in the feed liquid container to be a unit height;
s3, controlling a light source of the ultraviolet illumination system to irradiate the light-cured resin in the feed liquid container from the bottom of the feed liquid container according to the shape of the current layer until the light-cured resin in the irradiation area is cured;
s4, controlling the lifting system to lift the lifting platform by a unit height;
s5, controlling a light source of the laser irradiation system to irradiate the current layer according to the shape of the conductive area on the outer surface of the current layer until metal is precipitated to form a conductive area;
s6, repeating the steps S2-S5 until the whole electromagnetic wave device is manufactured.
As can be seen from the above description, the technical scheme of the invention has the beneficial effects that:
1. the invention realizes a brand-new 3D printing manufacturing method for the electromagnetic wave device, and the electromagnetic wave device manufactured by the method has the advantages that the main body is non-metal, and the characteristics of light weight and high elasticity can be realized.
2. The present invention can manufacture an electromagnetic wave device having a complicated structure.
3. The method is simple, easy to implement and has good application value.
Drawings
To more clearly describe this patent, one or more drawings are provided below to assist in explaining the background, technical principles and/or certain embodiments of this patent.
Fig. 1 is a schematic structural diagram of a 3D printer in an embodiment of the present invention.
Detailed Description
In order to facilitate understanding of the technical solutions of the present patent by those skilled in the art, and to make the technical objects, technical solutions and advantages of the present patent more apparent and fully support the scope of the claims, the technical solutions of the present patent are described in detail in the following embodiments.
As shown in fig. 1, a 3D printer for manufacturing an electromagnetic wave device includes a support table 12, a control system, a feeding system, an elevating system, an ultraviolet illumination system 28, and a laser illumination system 30, where the elevating system includes a vertical guide rail 18, a cantilever 20 disposed on the guide rail, and an elevating platform 22 disposed on the cantilever 20, a material liquid container 14 disposed right below the elevating platform 22 is disposed on the support table 12, the bottom of the material liquid container 14 is transparent, the ultraviolet illumination system 28 emits an ultraviolet light beam 26 into the material liquid container 14 from below, and a light source of the laser illumination system 30 is disposed on a side of the material liquid container 14; the control system is used for executing the following operations:
s1, controlling the lifting system to set the lifting platform at a specified height, and enabling the gap part of the area between the lifting platform and the feed liquid container to be at a unit height;
s2, controlling the feeding system to feed the light-cured resin mixed with the metal ions into the feed liquid container, and enabling the height of the light-cured resin in the feed liquid container to be a unit height;
s3, controlling a light source of the ultraviolet illumination system to irradiate the light-cured resin in the feed liquid container from the bottom of the feed liquid container according to the shape of the current layer until the light-cured resin in the irradiation area is cured;
s4, controlling the lifting system to lift the lifting platform by a unit height;
s5, controlling a light source of the laser irradiation system to irradiate the current layer according to the shape of the conductive area on the outer surface of the current layer until metal is precipitated to form a conductive area;
s6, repeating the steps S2-S5 until the whole electromagnetic wave device is manufactured.
Specifically, in use, a substance containing metal ions (e.g., silver nitrate) is first mixed with a base material (e.g., a UV-curable resin) to form the printing material 16. The control system controls the boom 20 to move up and down along the rail 18 so that the elevator table 22 is close to the bottom of the container 14 (if there is already a structure on the elevator table 22 that has already been partially cured to form the electromagnetic wave device 24, the control system will bring the layer of the electromagnetic wave device 24 that has been most recently cured close to the bottom). The distance between the elevator table 22 (or the layer of the electromagnetic wave device 24 that has been cured most recently) and the bottom of the container 14 is a predetermined thickness of a single layer to be cured. The control system controls a material replenishment device (e.g., a liquid pump) to transfer the printing material 16 into the container 14 and into the gap between the elevator table 22 and the bottom of the container 14 (if there is already a structure on the elevator table 22 that has partially cured the electromagnetic wave device 24, this is referred to herein as the gap between the layer of the electromagnetic wave device 24 that has recently cured and the bottom of the container 14). The control system then controls the ultraviolet illumination system 28 to form a pattern of ultraviolet light 26 at the bottom of the container 14 to selectively cure the printable material 16 between the elevator table 22 and the bottom of the container 14 to form the most recently cured layer of electromagnetic wave device 24. It is noted that this pattern represents the energy density distribution of the uv light, so that so-called selective curing is achieved by controlling the energy distribution of the uv light, and that areas of the printing material 16 above a certain energy density may be cured and areas of the printing material 16 below the energy density may not be cured. When the layer of printing material 16 has been cured, the control system controls the laser irradiation system 30 to irradiate at the desired locations of the cured layer of structure, thereby causing metal ions from the metal ion-containing material in the irradiated areas to precipitate metal. The control system then translates the lift table 22 by one level up the guide 18 via the boom 20, and the control system proceeds to a lower level of curing and printing after the printing material 16 has entered between the bottom most layer of the electromagnetic wave device 24 and the bottom of the container 14.
In the above scheme, dispersing and mixing a metal ion-containing substance (e.g., silver nitrate) into a uv-curable resin is a well-known technique in the fields of chemistry and 3D printing technology. A more uniform and stable printing material is achieved if a water-soluble uv-curable resin is used. Useful metal ion-containing materials include, but are not limited to, silver nitrate, and salts of gold, platinum, and copper may also be employed. The concentration of metal ions in the printing material is 1 to 20 percent mol/L.
The use of laser light to precipitate a metal contained in a metal ion-containing substance is a well-known method in the chemical field. A laser with a wavelength of 405 nm is typically used. The irradiation energy density of the laser will affect the amount and rate of metal deposited.
The laser illumination system 30 generally refers to a laser source controlled by a control system, which is controlled to turn on and off, and the focal position. Such light sources and control systems are well known in the field of 3D printing.
In the above description, after each layer of printing material 16 is solidified into the bottom layer of the electromagnetic wave device 24, the control system controls the laser irradiation system 30 to selectively irradiate the bottom layer of the electromagnetic wave device 24. In practical use, the control system may also control the laser irradiation system 30 to selectively irradiate the outer surface of the whole structure of the electromagnetic wave device 24 after printing the whole structure of the electromagnetic wave device 24.
In the above description, the 3D printer used is an ultraviolet curing 3D printer, and in addition, other forms of 3D printers, such as an extrusion type 3D printer, may also be used. After the extrusion 3D printer prints and cures the last layer of the electromagnetic wave device 24, the control system controls the laser irradiation system 30 to selectively irradiate the last cured layer of the electromagnetic wave device 24, thereby forming a conductive layer in a designated area. Similarly, after the extrusion 3D printer prints the whole structure of the electromagnetic wave device 24, the laser irradiation system 30 may be controlled to selectively irradiate the outer surface of the whole structure.
In the above description, other materials for 3D printing, such as ABS wires or other wires, including thermosetting wires, may be used as the base material for forming the printing material 16 in addition to the ultraviolet curable resin material, as long as they can be mixed with the metal ion-containing substance. The mixing means includes mixing in a liquid state, mixing in a solid state, and mixing in a gaseous state. In practice, it is often necessary to mix a flexible curable material with a metal ion-containing substance, so that the final printed electromagnetic wave device 24 has a certain elasticity, resulting in a stretchable or flexible electromagnetic wave device 24. Such elasticity typically requires an elastic deformation of more than 5%.
In the above-mentioned scheme, the manner of controlling the laser source 30 to selectively irradiate can be realized by adjusting the focal point of the laser. The above example is realized by adjusting the focus of the laser, so that the laser energy density in the designated area exceeds a certain threshold, and the metal is deposited to form the conductive area. Furthermore, this selective irradiation can also be realized by means of a mask. The so-called mask is a device commonly used in the field of photo-curing to control the transmission of light. That is, there are some areas on the mask that allow the laser to pass through, and other areas that do not allow the laser to pass through, so that the laser energy density of the areas through which the laser can pass exceeds the above threshold, thereby realizing laser irradiation on a specific area of a surface.
The electromagnetic wave devices 24 used in different frequency bands are different in the skin depth of the electromagnetic wave. By laser irradiation, a conductive layer having a sufficient thickness can be obtained in general, and functions required for the electromagnetic wave device 24 can be realized. However, for some frequency bands with large skin depths, the electromagnetic wave device 24 is required to have higher conductivity and thicker conductive layer. In this case, the electromagnetic wave device 24 may be formed by the above-described method, and then the electromagnetic wave device 24 may be placed in a plating solution for post-treatment to increase the thickness of the metal layer. As in electroless deposition, the metal-containing regions will further acquire metal species from the metallization bath, thereby further increasing the metal thickness. In another example, during electroplating, the conductive region can further capture the metal species in the solution, thereby further increasing the thickness of the metal. In addition, platinum can be selected as metal ions in the base material, so that the metal precipitated by laser irradiation is platinum. As is well known, platinum metal can be used as a catalyst, and platinum on the outer surface of the electromagnetic wave device can be used to catalytically react with another substance, so as to form another thicker metal substance on the surface of the electromagnetic wave device 24.
The laser irradiation system 30 may generate metal deposition not only on the outer surface of the electromagnetic wave device but also in the middle of the layer that has solidified recently. Therefore, the printed electromagnetic wave device 24 may have a conductive region not only on the outer surface but also inside the electromagnetic wave device.
In a word, the invention realizes a brand-new 3D printing manufacturing method for the electromagnetic wave device, the main body of the electromagnetic wave device manufactured by the method is non-metal, the characteristics of light weight and high elasticity can be realized, the electromagnetic wave device with a complex structure can be manufactured, and the method has good application value.
It should be understood that the above description of the embodiments of the present patent is only an exemplary description for facilitating the understanding of the patent scheme by the person skilled in the art, and does not imply that the scope of protection of the patent is only limited to these examples, and that the person skilled in the art can obtain more embodiments by combining technical features, replacing some technical features, adding more technical features, and the like to the various embodiments listed in the patent without any inventive effort on the premise of fully understanding the patent scheme, and therefore, the new embodiments are also within the scope of protection of the patent.
Claims (6)
1. A method for manufacturing an electromagnetic wave device through 3D printing is characterized by comprising the following steps:
(1) mixing metal ions into a base material to form a printing material;
(2) printing and curing the printing material layer by layer to form an electromagnetic wave device structure;
(3) in the printing process or after printing out the whole electromagnetic wave device, selectively irradiating the solidified printing material by using laser to separate out metal at the irradiated part;
(4) an electromagnetic wave device having a surface or an internal conductive region is formed.
2. The method for 3D printing to manufacture an electromagnetic wave device according to claim 1, wherein the matrix material is a light-cured resin, an ABS plastic or a heat-cured resin.
3. The method for 3D printing to manufacture an electromagnetic wave device according to claim 1, wherein the metal ions are silver ions, gold ions, copper ions or platinum ions.
4. The method for 3D printing and manufacturing an electromagnetic wave device according to claim 1, wherein the step (3) is further followed by the steps of:
and (3) post-treating the metal precipitation part in an electroless deposition or electroplating mode to improve the conductivity of the metal precipitation part.
5. The method for 3D printing and manufacturing an electromagnetic wave device according to claim 1, wherein the concentration of the metal ions in the printing material is 1% to 20% mol/L.
6. A3D printer for manufacturing electromagnetic wave devices is characterized by comprising a control system, a feeding system, a lifting system, an ultraviolet illumination system and a laser irradiation system, wherein the lifting system comprises a vertical guide rail and a lifting platform arranged on the guide rail, a feed liquid container is arranged under the lifting platform, the bottom of the feed liquid container is transparent, a light source of the ultraviolet illumination system is arranged below the feed liquid container, and a light source of the laser irradiation system is arranged on the side of the feed liquid container; the control system is used for executing the following operations:
s1, controlling the lifting system to set the lifting platform at a specified height, and enabling the gap part of the area between the lifting platform and the feed liquid container to be at a unit height;
s2, controlling the feeding system to feed the light-cured resin mixed with the metal ions into the feed liquid container, and enabling the height of the light-cured resin in the feed liquid container to be a unit height;
s3, controlling a light source of the ultraviolet illumination system to irradiate the light-cured resin in the feed liquid container from the bottom of the feed liquid container according to the shape of the current layer until the light-cured resin in the irradiation area is cured;
s4, controlling the lifting system to lift the lifting platform by a unit height;
s5, controlling a light source of the laser irradiation system to irradiate the current layer according to the shape of the conductive area on the outer surface of the current layer until metal is precipitated to form a conductive area;
s6, repeating the steps S2-S5 until the whole electromagnetic wave device is manufactured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010731440.XA CN111761814A (en) | 2020-07-27 | 2020-07-27 | 3D printing method for manufacturing electromagnetic wave device and 3D printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010731440.XA CN111761814A (en) | 2020-07-27 | 2020-07-27 | 3D printing method for manufacturing electromagnetic wave device and 3D printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111761814A true CN111761814A (en) | 2020-10-13 |
Family
ID=72727255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010731440.XA Pending CN111761814A (en) | 2020-07-27 | 2020-07-27 | 3D printing method for manufacturing electromagnetic wave device and 3D printer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111761814A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111171488A (en) * | 2018-10-23 | 2020-05-19 | 中国科学院化学研究所 | Visible light curing photosensitive resin-based silver conductive material for 3D printing and product prepared from visible light curing photosensitive resin-based silver conductive material |
-
2020
- 2020-07-27 CN CN202010731440.XA patent/CN111761814A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111171488A (en) * | 2018-10-23 | 2020-05-19 | 中国科学院化学研究所 | Visible light curing photosensitive resin-based silver conductive material for 3D printing and product prepared from visible light curing photosensitive resin-based silver conductive material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208029314U (en) | A kind of electromagnetic shielding film | |
| EP1799880B1 (en) | Active filler particles in inks | |
| CN103476199B (en) | Based on the printed circuit addition preparation method of copper self-catalysis and electroless copper | |
| CN104602176B (en) | A kind of method and its application of the straight forming voice coil on insulating substrate | |
| US11826946B2 (en) | Direct metal printing with stereolithography | |
| CN105190781B (en) | For forming the composition and method and the resin structure thereon with conductive pattern of conductive pattern | |
| CN1946880A (en) | Selective catalytic activation of non-conductive substrates | |
| WO2002018080A1 (en) | Metal colloidal solution composition and conductor or ink for forming semiconductor pattern comprising it and method for forming conductor or semiconductor pattern | |
| JPH06502746A (en) | Method for metallizing substrates using depletion reaction metal oxide reduction | |
| CN105283925B (en) | For forming the composition and method of conductive pattern, and there is the resin structure of conductive pattern thereon | |
| TW201322849A (en) | Method of manufacturing plastic metallized 3D circuit | |
| KR20150018368A (en) | Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon | |
| CN104616720A (en) | Metal circuit structure, forming method and liquid trigger material for forming metal circuit structure | |
| CN104540359A (en) | Shell of electronic device like mobile phone and manufacturing method thereof | |
| KR101563302B1 (en) | Double side type nfc antenna printed by roll to roll printing and method for manufacturing thereof | |
| KR100901350B1 (en) | The method of loop antena with sticker | |
| CN111761814A (en) | 3D printing method for manufacturing electromagnetic wave device and 3D printer | |
| CN103476200A (en) | Printed circuit addition manufacturing method based on nickel catalysis and chemical copper plating | |
| CN107591607A (en) | A kind of preparation technology of the array 5G antennas of intelligent mobile phone | |
| CN112029236A (en) | Photocuring 3D printing resin, preparation method and application thereof, and 3D printing product | |
| TWI503057B (en) | Manufacturing method of double-sided printed circuit board | |
| Xiao et al. | 3D printing of metallic structures using dopamine-integrated photopolymer | |
| CN102505132B (en) | Encapsulation base plate surface electroplating method | |
| CN115023059B (en) | Manufacturing method of conformal conductive circuit on surface of dielectric material | |
| US20040078968A1 (en) | Printed circuit board manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201013 |