CN104602176B - A kind of method and its application of the straight forming voice coil on insulating substrate - Google Patents
A kind of method and its application of the straight forming voice coil on insulating substrate Download PDFInfo
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- CN104602176B CN104602176B CN201410827001.3A CN201410827001A CN104602176B CN 104602176 B CN104602176 B CN 104602176B CN 201410827001 A CN201410827001 A CN 201410827001A CN 104602176 B CN104602176 B CN 104602176B
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Abstract
The present invention relates to the preparation method and application technical fields of voice coil, more particularly to a kind of method and its application of the straight forming voice coil on insulating substrate, a kind of method for specifically disclosing straight forming voice coil on insulating substrate, comprising the following steps: 1) one layer of conductive layer is formed by Electrostatic Absorption, electrostatic spraying or change plating on the outer surface of insulating substrate;2) the resulting conductive layer of step 1 is passed through into laser sintered or laser cutting straight forming voice coil, the impedance of voice coil is reconciled by the line width after the selection and laser sintered or laser cutting of conductive, simplify manufacture craft, the efficiency for substantially increasing production, reduces production cost;And it is not necessarily to coiling, space is saved, convenient for the miniaturization and fining development of electronic equipment;The application of the method using the above-mentioned straight forming voice coil on insulating substrate is also disclosed, including for Mobile phone horn, tablet computer loudspeaker or Ultrathin speaker etc., it is very widely used.
Description
Technical field
The present invention relates to the preparation method and application technical field of voice coil, more particularly to one kind on insulating substrate directly at
The method and its application of type voice coil.
Background technique
Overwhelming majority speaker voice coil is all that coiling forms on skeleton with the conducting wire with certain impedance at present, need to be by conductor
It is made into conducting wire, one layer of insulated paint in conductive line surfaces, ability after also needing to be fixed with glue or resin after the completion of conducting wire coiling
Voice coil is formed, processing step is comparatively laborious, low efficiency, higher cost.
Therefore, it is badly in need of providing a kind of method and its application of straight forming voice coil on insulating substrate, to solve existing skill
The deficiency of art.
Summary of the invention
An object of the present invention is to provide a kind of method of straight forming voice coil on insulating substrate, is made with insulating substrate
For support, voice coil is directly molded on insulating substrate by way of laser sintered or chemical plating, by controlling conduction material
Material and line width adjust the impedance value of voice coil, and simple process is high-efficient, can substantially reduce production cost.
It is a further object of the present invention to provide the applications for using the method for straight forming voice coil on above-mentioned insulating substrate, including
It is very widely used for Mobile phone horn, tablet computer loudspeaker or Ultrathin speaker etc..
To achieve the above object, the present invention adopts the following technical scheme that:
A method of the straight forming voice coil on insulating substrate, comprising the following steps:
1) one layer of conductive layer is formed by Electrostatic Absorption, electrostatic spraying or change plating on the outer surface of insulating substrate;
2) the resulting conductive layer of step 1 is passed through into laser sintered or laser cutting straight forming voice coil.
Specifically, any one of the insulating substrate in plastic cement, ceramics, glass or stone material.
The preparation step of conductive layer described in step 1 is as follows, first by copper powder, manganese powder, nickel powder, iron powder, bronze, silver powder,
Any two kinds in aluminium powder, glass putty, nickel powder or zinc powder or it is several mix in proportion, then will be above-mentioned uniformly mixed
Metal powder, on the outer surface of the insulating substrate, forms mixed metal conductive layer by Electrostatic Absorption or electrostatic spraying;
Perhaps by chemical plating in the outer surface of the insulating substrate successively plated with copper, manganese, nickel, iron, gold, silver, aluminium, tin, nickel or zinc
In any two kinds or several metal conducting layers.
Specifically, steps are as follows for laser sintered in step 2, and the insulating substrate of step 1 absorption conductive layer is placed in gas
In atmosphere, the laser machine for being then mounted with designed circuit pattern selectively scans conductive layer, the conductive layer being scanned
Moment scorification forms voice coil with insulating substrate phase welding;Finally remove not scanned conductive layer.
Specifically, the atmosphere can be nitrogen, helium, neon, argon gas or carbon dioxide gas atmosphere.
Specifically, steps are as follows for the laser cutting in step 2, the good CAD document of Installing design on laser machine, laser machine choosing
Selecting property scans the conductive layer, and other conductive layers on conductive layer in addition to designed voice coil line are cut away, and retains remaining
Conductive layer is voice coil.
Specifically, the laser machine selects near-infrared or ultraviolet laser machine, the wavelength of the electromagnetic radiation of laser machine are
248nm, 308nm, 355nm, 532nm, 1064nm, the power 200-1000W of the laser machine.
Specifically, the method for chemical plating described in step 1 is placed in insulating substrate in chemical plating pond, in PH11-13, temperature
At 40-70 DEG C, the power of ultrasonic machine is 50-250W, frequency 20-80Kz, and the insulating substrate is placed in corresponding chemical plating
5-20min is reacted in liquid, it is 1-20 μm of conductive layer that a layer thickness can be plated on the insulating substrate.
It specifically, further include step 3);The resulting voice coil outer surface of step 2 is subjected to anti-oxidant treatment, anti-oxidant treatment
Method is as follows, pastes one layer of insulating resin film in the outer surface of voice coil or plates one layer of metallic nickel anti oxidation layer.
The application of the method for the straight forming voice coil described in any of the above embodiments on insulating substrate, including it is used to prepare mobile phone
Loudspeaker, tablet computer loudspeaker or Ultrathin speaker.
Compared with prior art, the invention has the following advantages:
1, the method for the invention discloses a kind of on insulating substrate straight forming voice coil, comprising the following steps:
1) one layer of conduction is formed by Electrostatic Absorption, electrostatic spraying or change plating on the outer surface of insulating substrate
Layer;2) the resulting conductive layer of step 1 is passed through into laser sintered or laser cutting straight forming voice coil,
Voice coil is reconciled by the line width after the selection and laser sintered or laser cutting of conductive
Impedance simplifies manufacture craft, substantially increases the efficiency of production, reduces production cost;And nothing
Coiling is needed, space has been saved, convenient for the miniaturization and fining development of electronic equipment.
2, the application of the method using the above-mentioned straight forming voice coil on insulating substrate is also disclosed, including is used to prepare
Mobile phone horn, tablet computer loudspeaker or Ultrathin speaker etc., it is very widely used.
Detailed description of the invention
With attached drawing, the invention will be further described, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention.
Fig. 1 is the structural representation of the voice coil of the method preparation of the straight forming voice coil on insulating substrate using of the invention
Figure.
Fig. 2 is that another structure of the voice coil of the method preparation of the straight forming voice coil on insulating substrate using of the invention is shown
It is intended to.
Specific embodiment
The present invention is further illustrated with reference to the accompanying drawings and examples, this is presently preferred embodiments of the present invention.
Embodiment 1
1) one layer of conductive layer is formed by Electrostatic Absorption on the outer surface of plastic cement;
2) the resulting conductive layer of step 1 is passed through into laser sintered straight forming voice coil.
Specifically, the preparation step of conductive layer described in step 1 is as follows, is by weight first 1:1 by copper powder and manganese powder
It is uniformly mixed, it is of course possible to according to actual needs, adjust the weight ratio of copper powder and manganese powder to realize different impedance values;Then will
Above-mentioned uniformly mixed copper powder and manganese powder, on the outer surface of the plastic cement, form conductive layer by Electrostatic Absorption.
Wherein, it is advised between plastic cement can be selected from the thermosetting plastic of formed solid, the thermosetting plastic of the formed solid poly-
Styrene (SPS), polycarbonate (PC), nylon (PA6, PA66, PA11, PA10, PA610, PA612), polypropylene (PP) or
Acrylonitrile, butadiene, copolymer of one or more of copolymer (ABS) of the third ethylene three etc., can be most common
Commercially available plastic cement is also possible to plastic cement modified, can according to different applications, arbitrarily selection kind, size and
Shape.
Specifically, steps are as follows for laser sintered in step 2, and the plastic cement of step 1 absorption conductive layer is placed in nitrogen atmosphere
In, the laser machine for being then mounted with designed circuit pattern selectively scans conductive layer, the conductive layer moment being scanned
Scorification forms voice coil with plastic cement phase welding;Finally remove not scanned conductive layer.Entire process conditions are in nitrogen atmosphere
Middle progress can prevent conductive powder to be oxidized, make moist or by laser burnout;It, can basis when selective scanning conductive layer
It needs, with certain width selective scanning, scanned conductive layer just forms a-circle-by-a-circle conducting wire, and final molding is required
Voice coil.And the width adjusting scanned, the width of adjustable shaped conductors, the material selection with conductive layer together, realize sound
The adjustment of the impedance value of circle meets a variety of different applications.
The voice coil prepared using the method for the straight forming voice coil of the invention on insulating substrate is as depicted in figs. 1 and 2.Absolutely
Straight forming voice coil 2 on edge substrate 1.
Specifically, the laser machine selects ultraviolet laser machine, and the wavelength of the electromagnetic radiation of laser machine is 355nm, described to swash
The power 200W of ray machine.
It specifically, further include step 3);The resulting voice coil outer surface of step 2 is subjected to anti-oxidant treatment, anti-oxidant treatment
Method is as follows, pastes one layer of insulating resin film in the outer surface of voice coil.
Embodiment 2
1) one layer of conductive layer is formed by electrostatic spraying on the outer surface of ceramics;
2) the resulting conductive layer of step 1 is passed through into laser sintered straight forming voice coil.
Specifically, the preparation step of conductive layer described in step 1 is as follows, is by weight first 10:1 by copper powder and iron powder
It is uniformly mixed, it is of course possible to according to actual needs, adjust the weight ratio of copper powder and iron powder to realize different impedance values;Then will
Above-mentioned uniformly mixed copper powder and iron powder, on the outer surface of the plastic cement, form conductive layer by electrostatic spraying.
Specifically, steps are as follows for laser sintered in step 2, and the plastic cement of step 1 absorption conductive layer is placed in helium atmosphere
In, the laser machine for being then mounted with designed circuit pattern selectively scans conductive layer, the conductive layer moment being scanned
Scorification forms voice coil with plastic cement phase welding;Finally remove not scanned conductive layer.When selective scanning conductive layer, Ke Yigen
According to needs, with certain width selective scanning, scanned conductive layer just forms a-circle-by-a-circle conducting wire, and final molding is institute
The voice coil needed.And the width adjusting scanned, the width of adjustable shaped conductors, the material selection with conductive layer together, are realized
The adjustment of the impedance value of voice coil meets a variety of different applications.
Specifically, the laser machine selects ultraviolet laser machine, and the wavelength of the electromagnetic radiation of laser machine is 248nm, described to swash
The power 1000W of ray machine.
It specifically, further include step 3);The resulting voice coil outer surface of step 2 is subjected to anti-oxidant treatment, anti-oxidant treatment
Method is as follows, plates one layer of metallic nickel anti oxidation layer in the outer surface of voice coil.
Embodiment 3
1) one layer of conductive layer is formed by Electrostatic Absorption on the outer surface of stone material;
2) the resulting conductive layer of step 1 is passed through into laser sintered straight forming voice coil.
Specifically, the preparation step of conductive layer described in step 1 is as follows, is by weight first 3:1 by copper powder and zinc powder
It is uniformly mixed, it is of course possible to according to actual needs, adjust the weight ratio of copper powder and zinc powder to realize different impedance values;Then will
Above-mentioned uniformly mixed copper powder and zinc powder, on the outer surface of the plastic cement, form conductive layer by electrostatic spraying.
Specifically, steps are as follows for laser sintered in step 2, and the plastic cement of step 1 absorption conductive layer is placed in neon atmosphere
In, the laser machine for being then mounted with designed circuit pattern selectively scans conductive layer, the conductive layer moment being scanned
Scorification forms voice coil with plastic cement phase welding;Finally remove not scanned conductive layer.When selective scanning conductive layer, Ke Yigen
According to needs, with certain width selective scanning, scanned conductive layer just forms a-circle-by-a-circle conducting wire, and final molding is institute
The voice coil needed.And the width adjusting scanned, the width of adjustable shaped conductors, the material selection with conductive layer together, are realized
The adjustment of the impedance value of voice coil meets a variety of different applications.
Specifically, the laser machine selects infrared laser machine, and the wavelength of the electromagnetic radiation of laser machine is 532nm, described to swash
The power 500W of ray machine.
It specifically, further include step 3);The resulting voice coil outer surface of step 2 is subjected to anti-oxidant treatment, anti-oxidant treatment
Method is as follows, plates one layer of metallic nickel anti oxidation layer in the outer surface of voice coil.
Embodiment 4
1) one layer of conductive layer is formed by Electrostatic Absorption on the outer surface of glass;
2) the resulting conductive layer of step 1 is passed through into laser sintered straight forming voice coil.
Specifically, the preparation step of conductive layer described in step 1 is as follows, is by weight first 5:1 by copper powder and nickel powder
It is uniformly mixed, it is of course possible to according to actual needs, adjust the weight ratio of copper powder and nickel powder to realize different impedance values;Then will
Above-mentioned uniformly mixed copper powder and nickel powder, on the outer surface of the plastic cement, form conductive layer by electrostatic spraying.
Specifically, steps are as follows for laser sintered in step 2, by the plastic cement of step 1 absorption conductive layer be placed in argon gas or
In carbon dioxide atmosphere, the laser machine for being then mounted with designed circuit pattern selectively scans conductive layer, is scanned
Conductive layer moment scorification, and plastic cement phase welding forms voice coil;Finally remove not scanned conductive layer.Selective scanning is led
It when electric layer, can according to need, with certain width selective scanning, scanned conductive layer just forms a-circle-by-a-circle lead
Line, final molding are required voice coil.And the width adjusting scanned, the width of adjustable shaped conductors, the material with conductive layer
Material selection together, realizes the adjustment of the impedance value of voice coil, meets a variety of different applications.
Specifically, the laser machine selects infrared laser machine, and the wavelength of the electromagnetic radiation of laser machine is 1064nm, described to swash
The power 300W of ray machine.
It specifically, further include step 3);The resulting voice coil outer surface of step 2 is subjected to anti-oxidant treatment, anti-oxidant treatment
Method is as follows, pastes one layer of insulating resin film in the outer surface of voice coil.
Wherein, in the preparation of conductive layer, in addition to enumerated in above-described embodiment copper powder, manganese powder, nickel powder, iron powder, other than zinc powder,
Bronze, silver powder, aluminium powder, the mixing of both any or several metal powders can also be used.
Embodiment 5
1) one layer of conductive layer is formed by changing plating on the outer surface of plastic cement;
2) straight forming voice coil is cut by laser in the resulting conductive layer of step 1.
Specifically, the preparation step of conductive layer described in step 1 is as follows, and the method for chemical plating described in step 1 is by plastic cement
It is placed in chemical plating pond, is 11, under temperature 70 C in PH, the power of ultrasonic machine is 250W, frequency 80Kz, by the exhausted plastic cement
It is placed in corresponding chemical plating fluid, chemical plating fluid is copper electrolyte, and copper plating bath includes glyoxalic acid, copper sulphate, ethylenediamine tetra-acetic acid, connection
Pyridine and polyethylene glycol and phenyl polyoxyethylene ether sodium phosphate, the plastic cement is placed in above-mentioned copper electrolyte and reacts 5min
It is 10 μm of layers of copper that a layer thickness is plated on the plastic structure part, and then the plastic cement for plating layers of copper is placed in nickel plating bath, is reacted
20min, it is 10 μm of nickel layers that a layer thickness can be plated in layers of copper, is formed as the conductive layer that bottom is layers of copper, surface layer is nickel layer.Nickel
Layer itself has anti-oxidation function, and there is no need to carry out anti-oxidant treatment again.
Specifically, steps are as follows for the laser cutting in step 2, the good CAD document of Installing design on laser machine, laser machine choosing
Selecting property scans the conductive layer, and other conductive layers on conductive layer in addition to designed voice coil line are cut away, and retains remaining
Conductive layer is voice coil.
It specifically, further include step 3);The resulting voice coil outer surface of step 2 is subjected to anti-oxidant treatment, anti-oxidant treatment
Method is as follows, pastes one layer of insulating resin film in the outer surface of voice coil.
Specifically, the laser machine selects ultraviolet laser machine, the wavelength 308nm of the electromagnetic radiation of laser machine, the laser
The power 900W of machine.
Embodiment 6
1) one layer of conductive layer is formed by changing plating on the outer surface of plastic cement;
2) straight forming voice coil is cut by laser in the resulting conductive layer of step 1.
Specifically, the preparation step of conductive layer described in step 1 is as follows, and the method for chemical plating described in step 1 is by plastic cement
It is placed in chemical plating pond, is 13, at 40 DEG C of temperature in PH, the power of ultrasonic machine is 50W, frequency 20Kz, by the exhausted plastic cement
It is placed in corresponding chemical plating fluid, chemical plating fluid is copper electrolyte, and copper plating bath includes glyoxalic acid, copper sulphate, ethylenediamine tetra-acetic acid, connection
Pyridine and polyethylene glycol and phenyl polyoxyethylene ether sodium phosphate, the plastic cement is placed in above-mentioned copper electrolyte and reacts 20min
It is 15 μm of layers of copper that a layer thickness is plated on the plastic structure part, and then the plastic cement for plating layers of copper is placed in silver plating solution, is reacted
10min, it is 10 μm of silver layers that a layer thickness can be plated in layers of copper, is formed as the conductive layer that bottom is layers of copper, surface layer is silver layer.Silver
Layer is oxidized easily, it is therefore desirable to anti-oxidant treatment.
Specifically, steps are as follows for the laser cutting in step 2, the good CAD document of Installing design on laser machine, laser machine choosing
Selecting property scans the conductive layer, and other conductive layers on conductive layer in addition to designed voice coil line are cut away, and retains remaining
Conductive layer is voice coil.
Specifically, the laser machine selects ultraviolet laser machine, the wavelength 308nm of the electromagnetic radiation of laser machine, the laser
The power 900W of machine.
Embodiment 7
1) one layer of conductive layer is formed by changing plating on the outer surface of plastic cement;
2) straight forming voice coil is cut by laser in the resulting conductive layer of step 1.
Specifically, the preparation step of conductive layer described in step 1 is as follows, and the method for chemical plating described in step 1 is by plastic cement
It is placed in chemical plating pond, is 12, under temperature 50 C in PH, the power of ultrasonic machine is 150W, frequency 40Kz, by the exhausted plastic cement
It is placed in corresponding chemical plating fluid, chemical plating fluid is copper electrolyte, and copper plating bath includes glyoxalic acid, copper sulphate, ethylenediamine tetra-acetic acid, connection
Pyridine and polyethylene glycol and phenyl polyoxyethylene ether sodium phosphate, the plastic cement is placed in above-mentioned copper electrolyte and reacts 15min
It is 8 μm of layers of copper that a layer thickness is plated on the plastic structure part, and then the plastic cement for plating layers of copper is placed in zinc plating solution, is reacted
15min, it is 10 μm of zinc layers that a layer thickness can be plated in layers of copper, is formed as the conductive layer that bottom is layers of copper, surface layer is zinc layers.Zinc
Layer is oxidized easily, it is therefore desirable to anti-oxidant treatment.
Specifically, steps are as follows for the laser cutting in step 2, the good CAD document of Installing design on laser machine, laser machine choosing
Selecting property scans the conductive layer, and other conductive layers on conductive layer in addition to designed voice coil line are cut away, and retains remaining
Conductive layer is voice coil.
It specifically, further include step 3);The resulting voice coil outer surface of step 2 is subjected to anti-oxidant treatment, anti-oxidant treatment
Method is as follows, plates one layer of nickel in the outer surfaceization of voice coil.
Specifically, the laser machine selects ultraviolet laser machine, the wavelength 308nm of the electromagnetic radiation of laser machine, the laser
The power 900W of machine.
Embodiment 8
A kind of application of the method for the straight forming voice coil on insulating substrate described in embodiment 1-7, can be used for include
Mobile phone horn, tablet computer loudspeaker or Ultrathin speaker etc. are prepared, as long as having the electronic equipment of voice coil, this hair can be used
Bright method prepares voice coil, very widely used.
Due to being the straight forming voice coil on insulating substrate, it is not necessarily to coiling, without spray insulation paint, therefore technique is big
It is big to simplify, and space has been saved, be conducive to the miniaturization and fining development of electronic equipment.
It is in fact possible to for insulating substrate of the invention in addition to it is above-mentioned enumerate it is several other than, there are also many insulation
Substrate can be used, such as the plastic material of LDS (Laser-Direct-Structuring), such as commercially available bright Sheng of Germany
(LANXESS) group company PBT model: Pocan Dp7102000000;PET/PBT model: Pocan
Dp7140LDS000000;German BASF (BASF) company PA6/6T model: T4381;PBT model: 4300;Treasured reason plastics
(POLYPLASTICS) Co., Ltd. LCP model: 8201;Degussa (EVONK) Co., Ltd PBT model: VESTODUT
RS1633;DSM N. V.'s PC/ABS model: Xantar LDS 3710 etc., the LDS plastics that above-mentioned producer releases all contain copper complexing
Object can decomposite copper metal under laser pyrolysis, directly go out required voice coil using laser laser carving.
For conductive powder other than the common several conductive materials enumerated in above-mentioned several embodiments, there are many more conductive
Material may be used to the present invention, other than two kinds of conductive powder, can also be the mixing of two or more conductive powders
The mixture of object or alloy, here without enumerating.
Compared with prior art, the invention has the following advantages:
1, the method for the invention discloses a kind of on insulating substrate straight forming voice coil, comprising the following steps:
1) one layer of conductive layer is formed by Electrostatic Absorption, electrostatic spraying or change plating on the outer surface of insulating substrate;2)
By the resulting conductive layer of step 1 by laser sintered or laser cutting straight forming voice coil, pass through the selection of conductive
And line width after laser sintered or laser cutting reconciles the impedance of voice coil, simplifies manufacture craft, substantially increases life
The efficiency of production, reduces production cost;And it is not necessarily to coiling, space is saved, convenient for the miniaturization and fining of electronic equipment
Development.
2, the application of the method using the above-mentioned straight forming voice coil on insulating substrate is also disclosed, including is used to prepare
Mobile phone horn, tablet computer loudspeaker or Ultrathin speaker etc., it is very widely used.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than the present invention is protected
The limitation of range is protected, although explaining in detail referring to preferred embodiment to the present invention, those skilled in the art are answered
Work as understanding, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the reality of technical solution of the present invention
Matter and range.
Claims (8)
1. a kind of method of the straight forming voice coil on insulating substrate, which comprises the following steps:
1) one layer of conductive layer is formed by Electrostatic Absorption, electrostatic spraying or chemical plating on the outer surface of insulating substrate;
2) the resulting conductive layer of step 1) is passed through into laser sintered straight forming voice coil;
Steps are as follows for laser sintered in the step 2), and the insulating substrate of the conductive layer of the step 1) is placed in gas
In atmosphere, the laser machine for being then mounted with designed circuit pattern selectively scans conductive layer, the conductive layer being scanned
Moment scorification forms voice coil with insulating substrate phase welding;Finally remove not scanned conductive layer.
2. the method for the straight forming voice coil according to claim 1 on insulating substrate, it is characterised in that: the insulation base
Any one of material in plastic cement, ceramics, glass or stone material.
3. the method for the straight forming voice coil according to claim 1 on insulating substrate, which is characterized in that institute in step 1)
The preparation step for stating conductive layer is as follows, first by copper powder, manganese powder, nickel powder, iron powder, bronze, silver powder, aluminium powder, glass putty, nickel powder or
Any two kinds in zinc powder or it is several mix in proportion, above-mentioned uniformly mixed metal powder is then passed through into electrostatic and is inhaled
Attached or electrostatic spraying forms mixed metal conductive layer on the outer surface of the insulating substrate;Or by chemical plating, in institute
State the outer surface of insulating substrate any two kinds successively in plated with copper, manganese, nickel, iron, gold, silver, aluminium, tin, nickel or zinc or several
Kind metal conducting layer.
4. the method for the straight forming voice coil according to claim 3 on insulating substrate, it is characterised in that: the gas atmosphere
It encloses and can be nitrogen, helium, neon, argon gas or carbon dioxide gas atmosphere.
5. the method for the straight forming voice coil according to claim 3 on insulating substrate, it is characterised in that: the laser machine
Select near-infrared or ultraviolet laser machine, the wavelength of the electromagnetic radiation of laser machine is 248nm, 308nm, 355nm, 532nm,
1064nm, the power 200-1000W of the laser machine.
6. the method for the straight forming voice coil according to claim 1 on insulating substrate, it is characterised in that: step 1) is described
The method of chemical plating is placed in insulating substrate in chemical plating pond, at PH 11-13,40-70 DEG C of temperature, the power of ultrasonic machine
For 50-250W, frequency 20-80KHz, the insulating substrate is placed in corresponding chemical plating fluid and reacts 5-20min, Ji Ke
It is 1-20 μm of conductive layer that a layer thickness is plated on the insulating substrate.
7. the method for the straight forming voice coil according to claim 1 on insulating substrate, which is characterized in that further include step
3): the resulting voice coil outer surface of step 2) being subjected to anti-oxidant treatment, anti-oxidation treatment method is as follows, in the appearance face paste of voice coil
It covers one layer of insulating resin film or plates one layer of metallic nickel anti oxidation layer.
8. the application of the method for the straight forming voice coil according to claim 1-7 on insulating substrate, feature
It is: including being used to prepare Mobile phone horn, tablet computer loudspeaker or Ultrathin speaker.
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