CN111751713B - Chip high-temperature testing device and method - Google Patents
Chip high-temperature testing device and method Download PDFInfo
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- CN111751713B CN111751713B CN202010806909.1A CN202010806909A CN111751713B CN 111751713 B CN111751713 B CN 111751713B CN 202010806909 A CN202010806909 A CN 202010806909A CN 111751713 B CN111751713 B CN 111751713B
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- 238000012360 testing method Methods 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 58
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims description 38
- 230000008878 coupling Effects 0.000 claims description 21
- 238000010168 coupling process Methods 0.000 claims description 21
- 238000005859 coupling reaction Methods 0.000 claims description 21
- 230000007306 turnover Effects 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 6
- 230000009471 action Effects 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000010998 test method Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- 239000012774 insulation material Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to the technical field of semiconductors and discloses a chip high-temperature testing device and a chip high-temperature testing method. According to the chip high-temperature testing device and method, through a high-temperature heating control method, a high-temperature heat insulation material, a precise positioning method of a chip and reasonable structural arrangement of a testing mechanism, the method that a chip product is precisely positioned at first and then the chip is electrically tested under a high-temperature environment state so as to detect the performance of an electronic component is realized, and meanwhile, a high-speed precise contact test is carried out on a chip contact through the high-speed precise positioning method of the chip and the testing mechanism.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a chip high-temperature testing device and method.
Background
In order to test electronic components required by automobile electronic products, the products are tested for electrical parameters in a high-temperature (30-170 ℃) environment state so as to detect the excellent performance of the electronic components. Because of the high-temperature heating control method, the high-temperature heat insulation material, the accurate positioning method of the chip and the reasonable structural arrangement of the testing mechanism in the high-temperature environment, the high-temperature heat insulation material and the chip have high requirements. The traditional method is manual or automatic, after the chip is heated, electrical parameter test and inspection are carried out, so that the test and detection temperature error is larger, the test performance parameter error of the electronic element of the production carrier is larger, the production efficiency is lower, the yield of finished products is not high, and the actual production cost is higher. However, the imported normal-high-temperature integrated machine equipment at home and abroad is high in price, and the early investment of middle and small enterprises is large, so that the development of the enterprises is severely restricted.
Therefore, we propose a device and a method for testing chips at high temperature, which are used for solving the above technical problems.
Disclosure of Invention
(One) solving the technical problems
Aiming at the defects of the prior art, the invention provides a chip high-temperature testing device and a chip high-temperature testing method, which are used for solving the technical problems.
(II) technical scheme
In order to achieve the above purpose, the present invention provides the following technical solutions: the chip high-temperature testing device comprises a tray support device, wherein a high-temperature testing mechanism is fixedly arranged at one side of the bottom end of the tray support device, a tray heating device is fixedly arranged at one side of the top end of the tray support device, and a high-temperature positioning mechanism is arranged above the tray heating device.
The support plate bracket device comprises a bottom connecting plate, wherein both sides of the top end of the bottom connecting plate are fixedly provided with support guide rod columns, the outer side of the bottom end of each support guide rod column is provided with a horizontal adjusting plate, the horizontal adjusting plate and the bottom connecting plate are fixedly provided with a test seat in place for detection through horizontal adjusting bolts, the top end of each support guide rod column is fixedly provided with a top connecting plate, the top end of each top connecting plate is fixedly provided with a bottom heat insulating plate, the top end of each bottom heat insulating plate is fixedly provided with a side heat insulating plate, both sides of the top end of each bottom heat insulating plate are respectively provided with a left heat insulating plate and a right heat insulating plate, the upper side of each bottom heat insulating plate is provided with a heat insulating cover bracket, the upper side of each heat insulating cover bracket is provided with a turnover outer cover, the back of each turnover outer cover is provided with a front outer cover, and the turnover outer cover and the heat insulating cover brackets are in limiting fixed connection through the turnover cover.
The high-temperature testing mechanism comprises an XY adjusting base, a supporting connecting frame is arranged at the top end of the XY adjusting base, a test lifting cylinder is arranged on the side face of the supporting connecting frame, a cylinder transmission link rod is arranged at the top end of the test lifting cylinder, a cylinder floating joint is fixedly arranged at the other end of the cylinder transmission link rod, a lifting tension spring is arranged on the front face of the supporting connecting frame, a mechanism lifting sliding rail is arranged on the side face of the supporting connecting frame, a sliding rail connecting plate is arranged on the side face of the mechanism lifting sliding rail, a direct-drive voice coil motor is fixedly connected to the other side of the sliding rail connecting plate, a motor output push rod is arranged at the top end of the direct-drive voice coil motor, a bearing connecting seat is arranged at the other end of the motor output push rod, a lifting link rod seat is arranged at the top end of the bearing connecting seat, a test connecting PCB is fixedly connected to the top end of the lifting link rod seat, and a chip carrier disc device is arranged at the top end of the test connecting PCB.
The high-temperature positioning mechanism comprises a mechanism mounting base, an XY fine adjustment mechanism is fixedly arranged at the top end of the mechanism mounting base, a motor mounting plate is fixedly arranged at the top end of the XY fine adjustment mechanism, a pressing sliding rail mounting block is fixedly arranged at the side surface of the mechanism mounting base, a spring positioning block is arranged at the bottom end of the pressing sliding rail mounting block, a cam tensioning spring is fixedly connected to one side of the top end of the spring positioning block, a pressing linear sliding rail is arranged at the side surface of the pressing sliding rail mounting block, a transmission cam follower is arranged at the other side of the pressing linear sliding rail, a pressing tension adjusting bolt is arranged at the side surface of the transmission cam follower, a pressing tension spring is fixedly connected to the bottom end of the pressing tension adjusting bolt, a tension overload sliding rail is fixedly connected to the other end of the tension overload sliding rail, a tensioning spring is fixedly arranged at the other end of the sliding rail coupling, a positioning pin coupling is fixedly arranged at the bottom end of the thimble spring, positioning pins are fixedly arranged at two sides of the positioning pin coupling, a positioning pin is fixedly arranged at two sides of the positioning pin, a positioning pin is fixedly arranged between a thimble carrier and a positioning plate, and a sensor is arranged on the back of the positioning plate.
Preferably, the top of upset dustcoat is fixed mounting has the handle, the top front of upset dustcoat is provided with the dustcoat fixed plate, pass through movable leaf swing joint between dustcoat fixed plate and the upset dustcoat.
Preferably, a test golden finger is fixedly arranged on one side of the top end of the test connection PCB, and a test piece pressing block is fixedly arranged on the top end of the test golden finger.
Preferably, the front surface of the bearing coupling seat is fixedly provided with a tension spring, the other end of the tension spring is fixedly connected with a tension spring hook, the tension spring hook is fixedly arranged on the front surface of the bearing coupling seat, one side of the top end of the bearing coupling seat is provided with a limiting buffer rubber cushion, and the other side of the top end of the bearing coupling seat is provided with a linear bearing.
Preferably, a servo motor is fixedly arranged on one side of the top end of the motor mounting plate, a cam positioning bearing is fixedly arranged on one side of the bottom end of the motor mounting plate, and a rotary end face cam is fixedly arranged at the bottom end of the cam positioning bearing.
A chip high-temperature test method comprises the following steps:
and the first step, putting the chip into a chip tray device with a positioning reverse mould through a front-stage procedure.
And secondly, the chip tray loading device fully heats the product in the previous stage, and then the product is tested in the tray loading heating device.
And thirdly, the high-temperature positioning mechanism moves at a high speed through a servo motor, so that the cam pushes the cam follower to move vertically downwards and linearly under the guiding action of the linear sliding rail, and positioning pins on the mechanism are used for positioning and correcting corresponding positioning pin holes in the chip tray device on the side of the cam follower, so that the position of each chip is ensured to be consistent. The mechanism locating pin design is provided with a pressure buffer device, and when the locating hole of the carrier plate is not aligned, the device position sensor can detect and alarm.
Fourth, high temperature testing mechanism carries out high-speed accurate contact test with chip product contact through the golden finger on the PCB board of test machine line hookup under voice coil motor's thrust effect, because voice coil motor possesses strength size control, avoids under the high-speed state, causes the overload compression type problem with exerting oneself to the pin of chip product.
Compared with the prior art, the invention provides a chip high-temperature testing device and method, which have the following beneficial effects:
1. According to the chip high-temperature testing device and method, through a high-temperature heating control method, a high-temperature heat insulation material, a precise positioning method of a chip and reasonable structural arrangement of a testing mechanism, the method that a chip product is precisely positioned at first and then the chip is electrically tested under a high-temperature environment state so as to detect the performance of an electronic component is realized, and meanwhile, a high-speed precise contact test is carried out on a chip contact through the high-speed precise positioning method of the chip and the testing mechanism.
2. According to the chip high-temperature testing device and the chip high-temperature testing method, through implementation of the chip high-temperature testing device and the chip high-temperature testing method, the test performance of the electronic components of the production vehicle is detected, the high-temperature error is small, the test performance parameter error of the electronic components is small, the labor is saved, and the production efficiency is improved.
3. The chip high-temperature testing device and the chip high-temperature testing method have lower production and manufacturing cost than foreign equipment in terms of equipment cost, can be suitable for the fund bearing range of small and medium-sized manufacturing enterprises, and are beneficial to development and production requirements of the small and medium-sized enterprises
Drawings
FIG. 1 is a perspective view of the structure of the present invention;
FIG. 2 is a schematic elevational view of the structure of the present invention;
FIG. 3 is an exploded view of the structure of the present invention;
FIG. 4 is a schematic view of a tray support apparatus according to the present invention;
FIG. 5 is a perspective view of the structure of the high temperature testing mechanism of the present invention;
FIG. 6 is a front view of the structure of the high temperature testing mechanism of the present invention;
FIG. 7 is a perspective view of the structure of the high temperature positioning mechanism of the present invention;
Fig. 8 is a perspective view of the structure of the chip tray device of the present invention.
Wherein: 100. a tray support device; 200. a high temperature test mechanism; 300. a tray heating device; 400. a high temperature positioning mechanism; 110. a bottom connecting plate; 120. supporting a guide rod column; 130. a horizontal adjustment plate; 131. detecting the test seat in place; 140. a horizontal adjusting bolt; 150. a top tie plate; 160. a bottom heat insulating plate; 161. a side thermal insulation board; 162. a left heat-insulating plate; 163. a right heat insulation plate; 170. a heat shield support; 180. turning over the outer cover; 181. a handle; 182. an outer cover fixing plate; 183. a flap; 190. a front cover; 191. limiting the overturning cover; 210. an XY adjustment base; 220. a support coupling frame; 221. lifting tension springs; 222. a mechanism lifting slide rail; 223. a slide rail connecting plate; 230. testing a lifting cylinder; 231. a cylinder drive link; 232. a cylinder floating joint; 240. a direct drive voice coil motor; 241. a motor output push rod; 250. a bearing coupling seat; 251. a tension spring; 252. tensioning a spring hook; 253. limiting buffer rubber cushion; 254. a linear bearing; 260. lifting the link seat; 270. testing and connecting the PCB; 271. testing a golden finger; 272. pressing a test piece into a block; 280. a chip tray device; 410. a mechanism mounting base; 420. an XY fine tuning mechanism; 430. a motor mounting plate; 431. a servo motor; 432. cam positioning bearings; 433. rotating the end cam; 440. pressing down the sliding rail mounting block; 441. a spring positioning block; 442. a cam tensioning spring; 443. pressing down the linear slide rail; 444. a drive cam follower; 445. pressing down the tension adjusting bolt; 446. pressing down the tension spring; 447. a tension overload slide rail; 448. overload slide rail connector; 449. an overload detection sensor; 450. a thimble tensioning spring; 451. a locating pin coupling; 452. a carrier plate positioning pin; 453. the chip compresses tightly the thimble.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-8, a chip high temperature testing apparatus and method includes a tray support device 100, a high temperature testing mechanism 200 fixedly installed on a bottom side of the tray support device 100, a tray heating device 300 fixedly installed on a top side of the tray support device 100, and a high temperature positioning mechanism 400 disposed above the tray heating device 300.
The tray support device 100 comprises a bottom connecting plate 110, support guide rod columns 120 are fixedly mounted on two sides of the top end of the bottom connecting plate 110, a horizontal adjusting plate 130 is arranged on the outer side of the bottom end of each support guide rod column 120, the horizontal adjusting plate 130 and the bottom connecting plate 110 are fixedly mounted through horizontal adjusting bolts 140, a test seat in-place detection 131 is arranged on the front surface of each horizontal adjusting plate 130, a top connecting plate 150 is fixedly mounted on the top end of each support guide rod column 120, a bottom heat insulating plate 160 is fixedly mounted on the top end of each top connecting plate 150, side heat insulating plates 161 are fixedly mounted on the top end of each bottom heat insulating plate 160, a left heat insulating plate 162 and a right heat insulating plate 163 are respectively mounted on two sides of the top end of each bottom heat insulating plate 160, a heat insulating plate support 170 is arranged above each bottom heat insulating plate 160, a turnover outer cover 180 is arranged above each heat insulating plate support 170, a front outer cover 190 is arranged on the back surface of each turnover outer cover 180, and the turnover outer covers 180 and the heat insulating plate supports 170 are fixedly connected through turnover cover limiting 191.
The high temperature test mechanism 200 comprises an XY adjustment base 210, a supporting connection frame 220 is arranged at the top end of the XY adjustment base 210, a test lifting cylinder 230 is arranged on the side surface of the supporting connection frame 220, a cylinder transmission link 231 is arranged at the top end of the test lifting cylinder 230, a cylinder floating joint 232 is fixedly arranged at the other end of the cylinder transmission link 231, a lifting tension spring 221 is arranged on the front surface of the supporting connection frame 220, a mechanism lifting slide rail 222 is arranged on the side surface of the supporting connection frame 220, a slide rail connection plate 223 is arranged on the side surface of the mechanism lifting slide rail 222, a direct-drive voice coil motor 240 is fixedly connected to the other side of the slide rail connection plate 223, a motor output push rod 241 is arranged at the top end of the direct-drive voice coil motor 240, a bearing connection seat 250 is arranged at the other end of the motor output push rod 241, a lifting connection rod seat 260 is arranged at the top end of the bearing connection seat 250, a test connection PCB 270 is fixedly connected to the top end of the lifting connection seat 260, and a chip carrier disc device 280 is arranged at the top end of the test connection PCB 270.
The high-temperature positioning mechanism 400 comprises a mechanism mounting base 410, an XY fine adjustment mechanism 420 is fixedly mounted at the top end of the mechanism mounting base 410, a motor mounting plate 430 is fixedly mounted at the top end of the XY fine adjustment mechanism 420, a pressing slide mounting block 440 is fixedly mounted at the side surface of the mechanism mounting base 410, a spring positioning block 441 is arranged at the bottom end of the pressing slide mounting block 440, a cam tensioning spring 442 is fixedly connected to one side of the top end of the spring positioning block 441, a pressing linear slide 443 is arranged at the side surface of the pressing slide mounting block 440, a transmission cam follower 444 is arranged at the other side of the pressing linear slide 443, a pressing tension adjusting bolt 445 is arranged at the side surface of the transmission cam follower 444, a pressing tension spring 446 is fixedly connected to the bottom end of the pressing tension adjusting bolt 445, a tension overload slide 447 is fixedly connected to the other end of the tension overload slide mounting block 440, a tensioning spring 450 is fixedly mounted at the other end of the overload slide coupling 448, a positioning pin coupling 451 is fixedly mounted at the bottom end of the tensioning spring 450, positioning pins 451 are fixedly mounted at both sides of the bottom ends of the positioning pins coupling 452, a pressing chip 449 is arranged between the positioning plates and a pressing disc 449.
Specifically, a handle 181 is fixedly installed at the top end of the turnover outer cover 180, an outer cover fixing plate 182 is arranged on the front surface of the top end of the turnover outer cover 180, and the outer cover fixing plate 182 is movably connected with the turnover outer cover 180 through a movable leaf 183.
Specifically, a test golden finger 271 is fixedly mounted on one side of the top end of the test connection PCB 270, and a test piece pressing block 272 is fixedly mounted on the top end of the test golden finger 271.
Specifically, a tension spring 251 is fixedly installed on the front surface of the bearing coupling seat 250, a tension spring hook 252 is fixedly connected to the other end of the tension spring 251, the tension spring hook 252 is fixedly installed on the front surface of the bearing coupling seat 250, a limit buffer rubber cushion 253 is installed on one side of the top end of the bearing coupling seat 250, and a linear bearing 254 is installed on the other side of the top end of the bearing coupling seat 250.
Specifically, a servo motor 431 is fixedly mounted on the top end side of the motor mounting plate 430, a cam positioning bearing 432 is fixedly mounted on the bottom end side of the motor mounting plate 430, and a rotary end-face cam 433 is fixedly mounted on the bottom end of the cam positioning bearing 432.
A chip high-temperature test method comprises the following steps:
In the first step, the chip is placed in a chip tray device 280 with positioning and reverse molding through a front-end process.
In the second step, the chip tray device 280 is arranged in the tray heating device 300 for testing after the product is fully boiled in the previous step.
And thirdly, the high-temperature positioning mechanism 400 performs high-speed rotary motion through the servo motor 431, so that the cam pushes the cam follower to perform vertical downward linear motion under the guiding action of the linear sliding rail, and positioning pins on the mechanism perform positioning correction on corresponding positioning pin holes in the chip carrier plate device 280 on the basis of the surface, so that the position of each chip is ensured to be consistent. The mechanism locating pin design is provided with a pressure buffer device, and when the locating hole of the carrier plate is not aligned, the device position sensor can detect and alarm.
Fourth, the high temperature testing mechanism 200 performs high-speed accurate contact test with the contacts of the chip product through the golden finger on the PCB connected with the testing machine line under the thrust action of the voice coil motor, and the problem of forced overload and compression deformation of the pins of the chip product under the high-speed state is avoided because the voice coil motor is provided with force control.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A chip high temperature test device, comprising a tray support device (100), characterized in that: a high-temperature testing mechanism (200) is fixedly arranged at one side of the bottom end of the tray support device (100), a tray heating device (300) is fixedly arranged at one side of the top end of the tray support device (100), and a high-temperature positioning mechanism (400) is arranged above the tray heating device (300);
The tray support device (100) comprises a bottom connecting plate (110), wherein both sides of the top end of the bottom connecting plate (110) are fixedly provided with support guide rod columns (120), the outer sides of the bottom ends of the support guide rod columns (120) are respectively provided with a horizontal adjusting plate (130), the horizontal adjusting plates (130) and the bottom connecting plate (110) are fixedly provided with a horizontal adjusting bolt (140), the front surface of the horizontal adjusting plate (130) is provided with a test seat in-place detection (131), the top end of the support guide rod columns (120) is fixedly provided with a top connecting plate (150), the top end of the top connecting plate (150) is fixedly provided with a bottom insulating plate (160), the top end of the bottom insulating plate (160) is fixedly provided with a side insulating plate (161), both sides of the top end of the bottom insulating plate (160) are respectively provided with a left insulating plate (162) and a right insulating plate (163), the upper side of the bottom insulating plate (160) is provided with a heat insulating cover bracket (170), the upper side of the heat insulating cover bracket (170) is provided with a turnover cover (180), the back surface of the turnover cover (180) is provided with a front surface cover (190), and the turnover cover (180) is fixedly connected with the heat insulating cover (170) through the heat insulating cover (170);
The high-temperature testing mechanism (200) comprises an XY adjusting base (210), a supporting connecting frame (220) is arranged at the top end of the XY adjusting base (210), a test lifting cylinder (230) is arranged on the side face of the supporting connecting frame (220), a cylinder transmission link rod (231) is arranged at the top end of the test lifting cylinder (230), a cylinder floating joint (232) is fixedly arranged at the other end of the cylinder transmission link rod (231), a lifting tension spring (221) is arranged on the front face of the supporting connecting frame (220), a mechanism lifting slide rail (222) is arranged on the side face of the supporting connecting frame (220), a slide rail connecting plate (223) is arranged on the side face of the mechanism lifting slide rail (222), a direct-drive voice coil motor (240) is fixedly connected to the other side of the slide rail connecting plate (223), a motor output push rod (241) is arranged at the top end of the direct-drive voice coil motor (240), a bearing connecting seat (250) is arranged at the top end of the bearing connecting seat (250), a lifting link rod seat (260) is fixedly connected with a test connecting plate (280), and a PCB (270) is arranged at the top end of the test connecting plate (270);
The high temperature positioning mechanism (400) comprises a mechanism mounting base (410), an XY fine adjustment mechanism (420) is fixedly arranged at the top end of the mechanism mounting base (410), a motor mounting plate (430) is fixedly arranged at the top end of the XY fine adjustment mechanism (420), a pressing sliding rail mounting block (440) is fixedly arranged at the side surface of the mechanism mounting base (410), a pressing sliding rail mounting block (440) is arranged at the bottom end of the pressing sliding rail mounting block (440), a spring positioning block (441) is arranged at the bottom end of the pressing sliding rail mounting block (440), a cam tensioning spring (442) is fixedly connected to one side of the top end of the spring positioning block (441), a pressing linear sliding rail (443) is arranged at the side surface of the pressing sliding rail mounting block (440), a transmission cam follower (444) is arranged at the other side of the pressing linear sliding rail (443), a pressing tension adjusting bolt (445) is arranged at the side surface of the transmission cam follower (444), a pressing tension spring (446) is fixedly connected to the bottom end of the pressing tension adjusting bolt (445), a tension sliding rail (447) is fixedly connected to the other end of the pressing sliding rail (447), an overload sliding rail (448) is fixedly connected to the other end of the overload sliding rail (448) and the overload sliding rail (450), the bottom end of the thimble tensioning spring (450) is fixedly provided with a locating pin connecting piece (451), both sides of the bottom end of the locating pin connecting piece (451) are fixedly provided with a carrier disc locating pin (452), a chip pressing thimble (453) is arranged between the carrier disc locating pins (452), and the back surface of the overload sliding rail connecting piece (448) is provided with an overload detection sensor (449);
The top end of the turnover outer cover (180) is fixedly provided with a handle (181), the front surface of the top end of the turnover outer cover (180) is provided with an outer cover fixing plate (182), and the outer cover fixing plate (182) is movably connected with the turnover outer cover (180) through a movable blade (183);
A test golden finger (271) is fixedly arranged on one side of the top end of the test connection PCB (270), and a test piece pressing block (272) is fixedly arranged on the top end of the test golden finger (271).
2. The chip high temperature test apparatus according to claim 1, wherein: the front of the bearing coupling seat (250) is fixedly provided with a tension spring (251), the other end of the tension spring (251) is fixedly connected with a tension spring hook (252), the tension spring hook (252) is fixedly arranged on the front of the bearing coupling seat (250), one side of the top end of the bearing coupling seat (250) is provided with a limit buffer rubber cushion (253), and the other side of the top end of the bearing coupling seat (250) is provided with a linear bearing (254).
3. The chip high temperature test apparatus according to claim 1, wherein: a servo motor (431) is fixedly arranged on one side of the top end of the motor mounting plate (430), a cam positioning bearing (432) is fixedly arranged on one side of the bottom end of the motor mounting plate (430), and a rotary end face cam (433) is fixedly arranged at the bottom end of the cam positioning bearing (432).
4. A chip high temperature test method implemented by the chip high temperature test device according to claim 1, characterized in that: the method comprises the following steps:
S1, placing a chip into a chip tray device (280) with a positioning reverse mold through a front-stage procedure;
S2, after the product is fully boiled in the front-stage process, the chip tray device (280) is arranged in a tray heating device (300) for testing;
S3, the high-temperature positioning mechanism (400) moves at a high speed through a servo motor (431) to enable a cam to push a cam follower to move vertically downwards and linearly under the guiding action of a linear sliding rail, positioning pins on the mechanism are enabled to position and correct corresponding positioning pin holes in a chip carrier disc device (280) from the surface, the position of each chip is ensured to be consistent, the mechanism positioning pins are designed to be provided with a pressure buffer device, and when the positioning holes of the carrier disc are not aligned, a device position sensor can detect and alarm;
S4, under the thrust action of the voice coil motor, the high-temperature testing mechanism (200) performs high-speed accurate contact test with the contacts of the chip products through the golden finger on the PCB connected with the testing machine line, and the problem of forced overload and compression deformation of pins of the chip products under the high-speed state is avoided due to the fact that the voice coil motor is provided with force control.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010806909.1A CN111751713B (en) | 2020-08-12 | 2020-08-12 | Chip high-temperature testing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010806909.1A CN111751713B (en) | 2020-08-12 | 2020-08-12 | Chip high-temperature testing device and method |
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| Publication Number | Publication Date |
|---|---|
| CN111751713A CN111751713A (en) | 2020-10-09 |
| CN111751713B true CN111751713B (en) | 2024-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010806909.1A Active CN111751713B (en) | 2020-08-12 | 2020-08-12 | Chip high-temperature testing device and method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113820593B (en) * | 2021-11-22 | 2022-02-15 | 深圳市诺泰芯装备有限公司 | SOIC encapsulation high temperature test device |
| CN114496866B (en) * | 2022-01-20 | 2023-03-28 | 无锡昌鼎电子有限公司 | Chip constant temperature carries a set mechanism |
| CN116106722B (en) * | 2022-12-19 | 2023-12-15 | 上海赢朔电子科技股份有限公司 | Chip high-low temperature test machine |
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