CN111750786B - Thickness measuring equipment, polishing system and polishing material management method - Google Patents
Thickness measuring equipment, polishing system and polishing material management method Download PDFInfo
- Publication number
- CN111750786B CN111750786B CN202010642359.4A CN202010642359A CN111750786B CN 111750786 B CN111750786 B CN 111750786B CN 202010642359 A CN202010642359 A CN 202010642359A CN 111750786 B CN111750786 B CN 111750786B
- Authority
- CN
- China
- Prior art keywords
- polishing
- thickness
- measuring
- lining
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a thickness measuring device, a polishing system and a polishing material management method. The thickness measuring equipment comprises a bearing platform and a measuring device; the bearing table is used for bearing the material basket, a plurality of charging openings are formed in the material basket, and the inner sides of the charging openings are correspondingly provided with linings one by one; the measuring device is positioned at one side of the bearing table and comprises a driving module and a measuring module connected with the driving module; the measuring module comprises a light source emitter, a light splitter, a light receiver and a processing unit, wherein the light source emitter is used for emitting a multicolor light source, the light splitter is used for emitting the multicolor light source to the lining after light splitting, the light receiver is used for receiving the light source reflected by the lining, and the processing module is connected with the light receiver and is used for obtaining the thickness of the lining based on the light source information received by the light receiver. The invention can find the problem of inconsistent lining thickness in time, avoid inconsistent polishing thickness caused by inconsistent lining thickness, effectively reduce misjudgment risk and reduce raw material waste.
Description
Technical Field
The invention relates to the technical field of crystal growth, in particular to thickness measuring equipment, a polishing system and a polishing material management method.
Background
With the increasing integration of integrated circuit devices and the decreasing feature sizes of the devices, the flatness of the wafer surface has a greater and greater influence on the process yield, and the wafer factory has to increase the investment to meet the requirements of customers on the higher and higher flatness of the wafer surface, and pay more and more attention to the polishing equipment and the process.
As shown in fig. 1, in a conventional polishing apparatus, a wafer 23 is clamped between polishing members 24 by holding a basket 21 (Carrier) and a liner 22 (Insert) to perform single-side or double-side polishing. Specifically, a plurality of material baskets are arranged on a single polishing device, a plurality of circular charging openings (slots) are arranged on the single material basket, the lining is fixed on the inner side of the charging openings (the lining cannot be detached from the material basket), wafers to be polished are fixed on the inner side of the lining (at least one surface of each wafer to be polished protrudes out of the surface of the lining) for polishing, and the polishing assemblies are simultaneously arranged on the material baskets to polish the wafers on the material baskets simultaneously until the parts of the wafers protruding out of the surfaces of the lining are removed to realize global planarization of the surfaces of the wafers. As can be seen from fig. 1, the thickness of the lining largely determines the polishing effect. If the thickness of the liner is close to the target thickness of the silicon wafer, the flatness of the polished wafer surface will be better, and if the thickness of the liner is different from the target thickness of the silicon wafer, the flatness will be worse (for example, if the thickness of the liner is larger, the polished wafer will be thicker). Uniformity in managing the thickness of the liner is particularly important for improving the surface flatness of the silicon wafer. It is common in the art to manage the consistency of liner thickness through post feedback mechanisms. That is, the thickness of the same batch of wafers polished on the same polishing device is measured to determine whether the thickness of all the liners on the same polishing device is consistent, if not, for example, the thickness of a plurality of wafers is too large or too small, all the baskets on the polishing device will be scrapped (the wafers with inconsistent thickness will be reworked or even scrapped), which results in waste of raw materials and increase of production cost (the unit price of the baskets is expensive). Meanwhile, the post-processing feedback mechanism also has a misjudgment risk because the reason influencing the inconsistent polishing thickness of the wafer is not only the reason of the difference of the lining thickness, such as unstable polishing head, uneven polishing material and the like, which may cause the thickness of the wafer polished on the same polishing equipment to be not completely consistent.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a thickness measuring device, a polishing system and a polishing material management method, which are used to solve the problems in the prior art that the thickness uniformity of a polished wafer is measured to determine whether the thicknesses of inner liners on the same polishing device are the same, so that there is a great risk of misjudgment, and when the thicknesses of a plurality of inner liners on the same polishing device are not the same, all material baskets on the device are scrapped, so that the raw material is wasted and the production cost is increased.
In order to achieve the above and other related objects, the present invention provides a thickness measuring apparatus, including a carrier and a measuring device; the loading platform is used for loading a material basket, a plurality of charging openings are formed in the material basket, and linings are correspondingly arranged on the inner sides of the charging openings one by one; the measuring device is positioned at one side of the bearing table and comprises a driving module and a measuring module connected with the driving module, and the driving module is used for driving the measuring module to extend to the upper part of the lining so as to measure the thickness of the lining; the measuring module comprises a light source emitter, a light splitter, a light receiver and a processing unit, the light source emitter is used for emitting a multicolor light source, the light splitter is used for splitting the multicolor light source emitted by the light source emitter and then emitting the light source to the lining, the light receiver is used for receiving the light source reflected by the lining, and the processing module is connected with the light receiver and used for obtaining the thickness of the lining based on the light source information received by the light receiver.
Optionally, the light receiver includes refraction prism and photoelectric converter, be provided with the light gathering hole on the refraction prism, the light warp of inside lining reflection the refraction prism filters the back warp the light gathering hole gets into photoelectric converter carries out the photoelectric information conversion.
Optionally, the thickness measuring apparatus further includes a rotating device, and the rotating device is connected to the carrying table and configured to drive the carrying table to rotate so as to drive the material basket to rotate.
Optionally, the plummer includes base and support frame, the support frame is located on the base, the basket is located on the support frame.
Optionally, the thickness measuring apparatus further includes a display screen, and the display screen is connected to the measuring device.
Optionally, the thickness measuring apparatus includes a central processing unit, and the central processing unit is connected to the measuring device, and is configured to store the measurement results of the measuring device, and perform matching grouping on the measurement results.
Optionally, the thickness measuring apparatus further includes a measuring cavity, and the carrier and the measuring module are located in the measuring cavity.
The invention also provides a polishing system comprising polishing equipment and the thickness measuring equipment in any one of the above schemes, wherein the polishing equipment comprises a plurality of material baskets.
The invention also provides a polishing material management method, which comprises the steps of measuring the thicknesses of the inner liners of the material baskets, and combining the material baskets with the same thickness of the inner liners on different polishing devices to the same polishing device when the thicknesses of the inner liners of a plurality of material baskets on a single polishing device are detected to be different.
Optionally, the polishing material management method further includes a step of verifying the polishing effect of the workpiece to be polished by using the combined polishing device after combining the baskets with the same lining thickness on different polishing devices to the same polishing device.
Through the improved structural design, the thickness of the lining of the material basket can be detected, the problem of inconsistent thickness of the lining can be found in time, the inconsistent thickness of the polished wafer caused by inconsistent thickness of the lining can be avoided, the misjudgment risk can be effectively reduced, and the raw material waste can be reduced. The polishing material management method provided by the invention is based on the thickness measurement equipment to measure the thickness of the lining, and then the material baskets with the same thickness on different polishing equipment are recombined and utilized, so that the production cost can be effectively reduced.
Drawings
FIG. 1 is a schematic diagram showing the positional relationship among the basket, the liner and the wafer.
Fig. 2 is a schematic structural diagram of a thickness measuring apparatus according to the present invention.
Fig. 3 is a schematic diagram illustrating the structure and measurement principle of the measurement module according to the present invention.
Fig. 4 is a schematic top view of a single basket.
Fig. 5 is a schematic diagram of a partial top view of a polishing apparatus.
FIGS. 6 to 8 are schematic views showing the processes of the polishing material management method of the present invention.
Description of the element reference numerals
11-a carrier table; 111-a base; 112-a support frame; 12-a material basket; 121-a charging port; 13-lining; 14-a measuring device; 141-a drive module; 142-a measurement module; 142 a-a light source emitter; 142 b-a beam splitter; 142 c-a light source receiver; 142 d-a processing unit; 15-a refractive prism; 151-light gathering hole; 16-a display; 18-a polishing pad; 21-material basket; 22-inner lining; 23-a wafer; 24-polishing assembly.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 2 to 8. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
As shown in fig. 2 to 5, the present invention provides a thickness measuring apparatus, which includes a carrier 11 and a measuring device 14; the bearing table 11 is used for bearing a material basket 12, a plurality of charging openings are formed in the material basket 12, and inner liners 13 are correspondingly arranged on the inner sides of the charging openings one by one; the measuring device 14 is located at one side of the susceptor 11, the measuring device 14 includes a driving module 141 and a measuring module 142 connected to the driving module 141, the driving module 141 is configured to drive the measuring module 142 to extend above the liner 13 so as to measure the thickness of the liner 13; the measuring module 142 includes a light source emitter 142a, a light splitter 142b, a light receiver 142c and a processing unit 142d, the light source emitter 142a is configured to emit a multi-color light source, the light splitter 142b is configured to split the multi-color light source emitted by the light source emitter 142a and then irradiate the light source to the liner 13, the light receiver 142c is configured to receive the light source reflected by the liner 13, and the processing module 142d is connected to the light receiver 142c and configured to obtain the thickness of the liner 13 based on the light source information received by the light receiver 142 c. Through the improved structural design, the lining thickness of the material basket can be detected, the problem of inconsistent lining thickness can be found in time, the inconsistent thickness of the polished wafer caused by inconsistent lining thickness is avoided, the misjudgment risk can be effectively reduced, the polishing quality is improved, and the raw material waste is reduced.
The material basket 12 is used in a polishing device, and the same polishing device comprises a plurality of material baskets 12, the plurality of material baskets 12 are located on the polishing pad 18, a plurality of charging openings 121, for example, 5 charging openings 121, are provided on each material basket 12, the number of charging openings 121 on a single material basket 12 is greater than or equal to 3, in this embodiment, the number of charging openings 121 is 3, and the number of charging openings 121 is uniformly distributed on the material basket 12, that is, a single polishing device can simultaneously perform polishing operation on 15 pieces of an object to be polished, the polishing efficiency is high, but the requirement on the thickness uniformity of the lining 13 is also very high; the inner liners 13 are located inside the loading port 121 of the basket 12 one by one (refer to fig. 4 in particular), a member to be polished (e.g. a wafer) is embedded inside the inner liners 13, during polishing, the member to be polished (not shown) is fixed on the polishing pads 18 by the combined action of the basket 12 and the inner liners 13, at least one surface of the member to be polished protrudes completely or partially from the surfaces of the basket 12 and the inner liners 13 (if double-sided polishing is performed, both surfaces of the member to be polished protrude completely or partially from the surfaces of the basket 12 and the inner liners 13, and the upper and lower surfaces of the three are located on the same horizontal plane after polishing), polishing heads (not shown) press the basket 12, the inner liners 13 and the member to be polished to polish (if double-sided polishing is performed, the number of the polishing pads 18 is 2, the basket 12, the inner liners 13 and the member to be polished are clamped between the upper and lower polishing pads 18), so that the part of the object to be polished, which originally protrudes from the surfaces of the basket 12 and the lining 13, is removed by the polishing operation, and thus the thickness of the basket 12 and the lining 13 greatly affects the polishing effect. The basket 12 is usually made of metal such as stainless steel, and has a relatively stable structure, and the liner 13 is preferably made of special fluorine-containing rubber such as PVDF (polyvinylidene fluoride) in order to fix the wafer and have a good buffer effect. However, the materials are easy to deform and wear in the long-term polishing operation process, so that the thickness of the materials is changed, the parts to be polished are poor in polishing or excessive in polishing, and raw materials are wasted.
As an example, the driving module 141 of the measuring device 14 includes, but is not limited to, a driving unit such as an air cylinder capable of ascending and descending, and a robot arm connected to the driving unit and capable of stretching and rotating in a horizontal direction, and the measuring module 142 is connected to an end of the robot arm not connected to the driving unit, so as to flexibly adjust the position of the measuring module 142 as needed, so that the measuring module 142 can reach a position directly above the liner 13 for thickness measurement.
As shown in fig. 3, the light receiver 142c includes a refractive prism 15 and a photoelectric converter (not shown), the refractive prism 15 is provided with a light-collecting hole 151, and the light reflected by the liner 13 is filtered by the refractive prism 15 and enters the photoelectric converter through the light-collecting hole 151 to perform photoelectric information conversion. Specifically, the light source emitter 142a emits light of a plurality of different colors, the focal positions of the light of different colors incident on the inner liner 13 are different, so that the reflected intensities of the light of different colors are different at different heights of the inner liner 13 (or the light of a single color has the strongest reflected intensity at a certain height), the reflected light is incident on the light receiver 142c, the light-gathering holes 151 in the refraction prism 15 only allow the light with the strongest reflected intensity at the same horizontal plane to pass through, the light with the strongest reflected intensities at different horizontal planes is processed by the light receiver 142c, the height values of the upper and lower surfaces of the inner liner 13 can be obtained, and the thickness of the inner liner 13 can be obtained through the processing of the processing module 142 d. For example, in fig. 3, A, B and C lights with three different colors are incident on the liner, and the reflection intensity of the light a is strongest on the surface of the liner, so that the L1 value is obtained after the processing module processes the light a; the reflection intensity of the B light is strongest in the middle of the lining, and an L2 value is obtained after the B light is processed by the processing module; and the reflection intensity of the C light is strongest at the bottom of the lining, the L3 value is obtained after the C light is processed by the processing module, and the difference value obtained by the processing module based on the maximum value L3 and the minimum value L1 is the thickness of the lining. It should be noted that the optical receiver 142c and the processing module 142d may be only functionally differentiated, and may be physically integrated, for example, a central controller, such as a computer, which integrates both photoelectric information conversion and calculation functions, and the central controller may be an overall controller of the thickness measuring apparatus, such as an overall controller that controls the operation of the driving module and the subsequent rotating device. And the thickness measuring device may further include a display connected to the processing module 142d to display the thickness of the liner 13 on the display in time, so that the worker can take measures in time. All detected thickness data of the liner 13 may be stored in the processing module 142d, or the thickness data of the liner 13 from different polishing apparatuses may be collected in the same central controller and be uniformly managed and matched by the central controller.
As an example, the thickness measuring apparatus further includes a rotating device (not shown) connected to the carrier 11 for driving the carrier 11 to rotate the basket 12, and the rotating device includes, but is not limited to, a motor.
In order to carry the basket 12 and avoid damage to the basket 12 (especially, damage to the charging hole and the lining 13 such as deformation), the carrier 11 includes a base 111 and a support 112, the support 112 is located on the base 111, the basket 12 is located on the support 112, for example, the basket 12 is placed on the support 112 with the central portion of the basket 12 as the support point (the basket 12 and the base 111 are spaced apart to prevent damage to the basket 12). The base 111 and the supporting frame 112 may be fixedly connected or movably connected, so that the rotating device may be connected to the base 111 or the supporting frame 112 according to different connection manners of the base 111 and the supporting frame 112, for example, if the base 111 and the supporting frame 112 are fixed, the rotating device may be connected to the base 111 to rotate the base 111 through the rotating device, thereby rotating the material basket 12 to measure the thickness of all the inner liners 13 on the same material basket 12.
As an example, the thickness measuring apparatus further includes a display 16, and the display 16 is connected to the measuring device to display the measuring result of the measuring device in real time.
As an example, the thickness measuring apparatus includes a central processing unit (not shown) connected to the measuring devices, and configured to store the measuring results of the measuring devices and perform matching grouping on the measuring results. Specifically, the central processing unit comprises a storage unit and a matching unit, the storage unit is connected with the measuring device and used for storing the measuring result of the measuring device, and the matching unit is connected with the storage unit and used for matching and grouping the measuring result so as to group the same lining thickness data into the same group, so that the worker can conveniently recombine and utilize the material basket based on the matched result. It should be noted that the storage unit and the matching unit may be only functionally distinguished, not physically distinguished, for example, the central processing unit may be a single chip microcomputer or an upper computer having both storage and comparison functions. In other examples, the storage function and the matching function may be physically separated from each other, for example, the thickness measuring device only performs the thickness measuring function, the measurement result is transmitted to a remote computer or other controller via a data line, or the thickness measuring device only completes the thickness measuring function and the storage function, and the worker can remotely retrieve the measuring result of the thickness measuring device and complete the matching analysis through the data line connection (or the thickness measuring device and the remote computer both have the data storage and matching functions), which is not strictly limited in this embodiment, it is preferred that the storing function and the matching function are integrated in the same device, such as a computer, the computer can be used as a general controller of the thickness measuring device to simultaneously control the operation of the aforementioned driving module and the rotating device.
In order to reduce the contamination of the material basket 12 and the lining 13 in the measuring process as much as possible, as an example, the thickness measuring apparatus further includes a measuring cavity, the carrier 11 and the measuring module 142 are located in the measuring cavity, and a movable cavity door (not labeled) may be disposed on the measuring cavity to open or close the cavity door as required. The bottom of the measuring cavity can be provided with a supporting frame, so that the height of the measuring cavity reaches the height suitable for the operation of workers. The metrology chamber may also be connected to a gas supply system to supply cleaning gas to the metrology chamber as required to clean the basket 12 and liner 13.
The invention also provides a polishing system, which comprises a polishing device and the thickness measuring device in any of the above schemes, and the introduction of the thickness measuring device is referred to the above contents, which are not repeated for brevity. The polishing apparatus generally includes a polishing pad 18, the plurality of baskets 12 are uniformly spaced on the polishing pad 18 (as shown in fig. 5), and a wafer to be polished is fixed on the inner side of the lining 13. The polishing device can be single-side polishing or single-side polishing, and when the polishing device is double-side polishing, the polishing device comprises two polishing pads 18, a plurality of material baskets 12 and wafers to be polished positioned on the inner side of the lining 13 are positioned between the two polishing pads 18 so as to realize double-side polishing of a plurality of wafers at the same time. Such a structure can greatly improve the polishing efficiency, but has the problem that the requirement for the thickness uniformity of the inner liners 13 is very high (not only the thickness of the inner liners 13 on the same basket 12 is completely the same, but also the thickness of all the inner liners 13 on the same polishing device is the same), and once the thickness of one inner liner 13 is different from that of the other inner liners 13, the thickness of the polished wafer may be inconsistent. In the prior art, whether the thickness of the lining 13 is consistent or not is judged by measuring the thickness of the polished wafer, and if the thickness of the polished wafer is inconsistent, all the material baskets 12 are discarded, but the method is a post-processing mechanism, and meanwhile, the problem that the thickness of the polished wafer is inconsistent is not the reason that only the thickness of the lining 13 is inconsistent, so that the risk of misjudgment exists, and the waste of materials can cause the increase of the production cost. The polishing system of the present application measures whether the thickness of the liner 13 of the basket 12 is consistent through the thickness measuring device before the polishing operation, so as to avoid over polishing or under polishing caused by inconsistent thickness of the liner 13 of the basket 12, and effectively avoid waste of raw materials, and meanwhile, the detected thickness data of the liner 13 can also be used as a basis for subsequent material management, for example, when the thickness of the liner 13 on different baskets 12 on the same polishing device is not completely the same, the baskets 12 with the same thickness of the liner 13 on different polishing devices can be recombined, so as to ensure that the thickness of all the liners 13 on the same polishing device is consistent (since the liner 13 and the baskets 12 are not detachable, the baskets 12 need to be scrapped or returned to a factory for maintenance when the thicknesses of a plurality of liners 13 on the same basket 12 are inconsistent), which helps to reduce material loss, the production cost is reduced.
The invention also provides a polishing material management method, which comprises the steps of measuring the thickness of the lining of the material basket on the polishing equipment (for example, measuring based on the thickness measuring equipment in any scheme), and combining the material baskets with the same thickness on different polishing equipment to the same polishing equipment when detecting that the thicknesses of the linings of a plurality of material baskets on the single polishing equipment are different. The material basket and the lining are reused through the recombination, so that the production cost can be effectively reduced.
The 12 "wafer polishing process typically uses 5 baskets, each of which can polish three wafers simultaneously. In the prior art, when the flatness problem occurs in the liner of a charging hole of one of the baskets, which results in the problem of uneven flatness of the polished wafer (for example, the flatness difference between the wafer marked by the coil in fig. 6 and other wafers is large), the whole set of baskets cannot be used any more, which causes great cost waste, and the baskets with poor flatness also cause yield loss of the product.
The first step of the polishing material management method of the present invention is to identify the damaged basket. As shown in fig. 6, 15 wafers from a batch are polished on a set of baskets, and the flatness data of the wafers corresponding to the loading port 13/14/15 from the 5 th basket is poor, we consider that the thickness of the liner of the fifth basket is problematic. At this time, the other four good baskets of the set of basket a and the good baskets in the damaged baskets are required to be recombined so as to realize that the two sets of baskets with partial basket damage and all unusable baskets are screened and then the set of good baskets is recombined and continuously used. The reforming standard is that the thickness of the liner of the basket is close to or the same, so the thickness measuring device in any of the above schemes may be used to measure the liner of the basket. The measured data is exported and then judged for reorganization. The data in figure 6 show that three baskets A and B each have a damaged charging port, but the baskets of the other charging ports are normal, and the recombination is required according to the data of the thickness of the lining of the baskets. For example, as shown in fig. 7, the charging openings 1-12 of the material basket A and the charging openings 13-15 of the material basket B are recombined into a set of good material basket C, so that a set of usable good material basket C is recombined from two sets of material baskets which cannot be used originally. Of course, it should be noted that the operation of measuring the thickness of the liner of the basket can be performed before polishing, so as to effectively prevent the problem of inconsistent flatness of the polished wafer.
In theory, the standard of the good basket is that the inner lining has the same thickness, but for the sake of safety, the polishing material management method may further include, as an example, after the baskets with the same inner lining thickness on different polishing apparatuses are combined to the same polishing apparatus, a step of verifying the polishing effect of the polishing article to be polished or the polishing article for test by using the combined polishing apparatus to ensure that the recombined polishing apparatus is kept in the optimal working state. For example, if the flatness data of the wafer polished by the recombined basket C is measured by the thickness measuring apparatus according to any of the above embodiments, and the obtained data is as shown in fig. 8, it can be determined that the recombined basket C meets the standard, so that a basket set is saved, and the adverse effect of the used bad basket on the flatness yield of the wafer can be improved.
In summary, the present invention provides a thickness measuring apparatus, a polishing system and a polishing material management method. The thickness measuring equipment comprises a bearing platform and a measuring device; the loading platform is used for loading a material basket, a plurality of charging openings are formed in the material basket, and linings are correspondingly arranged on the inner sides of the charging openings one by one; the measuring device is positioned at one side of the bearing table and comprises a driving module and a measuring module connected with the driving module, and the driving module is used for driving the measuring module to extend to the upper part of the lining so as to measure the thickness of the lining; the measuring module comprises a light source emitter, a light splitter, a light receiver and a processing unit, the light source emitter is used for emitting a multicolor light source, the light splitter is used for splitting the multicolor light source emitted by the light source emitter and then emitting the light source to the lining, the light receiver is used for receiving the light source reflected by the lining, and the processing module is connected with the light receiver and used for obtaining the thickness of the lining based on the light source information received by the light receiver. Through the improved structural design, the lining thickness of the material basket can be detected, the problem of inconsistent lining thickness can be found in time, the inconsistent thickness of the polished wafer caused by inconsistent lining thickness is avoided, the misjudgment risk can be effectively reduced, the polishing quality is improved, and the raw material waste is reduced. The polishing material management method provided by the invention has the advantages that after the thickness of the lining is detected by the thickness measuring equipment, the material baskets with the same thickness on different polishing equipment are recombined and utilized, so that the production cost can be effectively reduced. Therefore, the invention effectively overcomes various problems in the prior art and has higher industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (9)
1. The method for managing the polishing materials is characterized by comprising the steps of measuring the thicknesses of linings of material baskets by using thickness measuring equipment before polishing, and combining the material baskets with the same thicknesses of the linings on different polishing equipment to the same polishing equipment when the thicknesses of the linings of a plurality of material baskets on a single polishing equipment are detected to be different so as to prevent the problem that the flatness of polished wafers is inconsistent.
2. The polishing material management method of claim 1, wherein: the polishing material management method further comprises the step of verifying the polishing effect of the workpiece to be polished by using the combined polishing equipment after the material baskets with the same lining thickness on different polishing equipment are combined to the same polishing equipment.
3. The polishing material management method of claim 1, wherein: characterized in that, the thickness measuring equipment includes:
the material basket is provided with a plurality of charging openings, and the inner sides of the charging openings are correspondingly provided with linings one by one;
the measuring device is positioned at one side of the bearing table and comprises a driving module and a measuring module connected with the driving module, and the driving module is used for driving the measuring module to extend to the upper part of the lining so as to measure the thickness of the lining; the measuring module comprises a light source emitter, a light splitter, a light receiver and a processing module, the light source emitter is used for emitting a multicolor light source, the light splitter is used for splitting the multicolor light source emitted by the light source emitter and then emitting the light to the lining, the light receiver is used for receiving the light source reflected by the lining, and the processing module is connected with the light receiver and is used for obtaining the thickness of the lining based on the light source information received by the light receiver.
4. The polishing material management method of claim 3, wherein: the light receiver includes refraction prism and photoelectric converter, be provided with the light gathering hole on the refraction prism, the light warp of inside lining reflection the refraction prism filters the back warp the light gathering hole gets into photoelectric converter carries out the photoelectric information conversion.
5. The polishing material management method of claim 3, wherein: the thickness measuring equipment further comprises a rotating device, and the rotating device is connected with the bearing table and used for driving the bearing table to rotate so as to drive the material basket to rotate.
6. The polishing material management method of claim 3, wherein: the plummer includes base and support frame, the support frame is located on the base, the material basket is located on the support frame.
7. The polishing material management method of claim 3, wherein: the thickness measuring equipment further comprises a display screen, and the display screen is connected with the measuring device.
8. The polishing material management method of claim 3, wherein: the thickness measuring equipment comprises a central processing unit which is connected with the measuring device and used for storing the measuring results of the measuring device and carrying out matching grouping on the measuring results.
9. The polishing material management method of claim 3, wherein: the thickness measuring equipment further comprises a measuring cavity, and the bearing table and the measuring module are located in the measuring cavity.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010642359.4A CN111750786B (en) | 2020-07-06 | 2020-07-06 | Thickness measuring equipment, polishing system and polishing material management method |
| TW109137641A TWI755913B (en) | 2020-07-06 | 2020-10-29 | Thickness measuring apparatus, polishing system and managing method for polishing materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010642359.4A CN111750786B (en) | 2020-07-06 | 2020-07-06 | Thickness measuring equipment, polishing system and polishing material management method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111750786A CN111750786A (en) | 2020-10-09 |
| CN111750786B true CN111750786B (en) | 2022-03-01 |
Family
ID=72680421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010642359.4A Active CN111750786B (en) | 2020-07-06 | 2020-07-06 | Thickness measuring equipment, polishing system and polishing material management method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111750786B (en) |
| TW (1) | TWI755913B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115979150B (en) * | 2023-03-01 | 2024-03-12 | 合肥东昇智能装备股份有限公司 | Method for detecting thickness of substrate through prism refraction |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002059364A (en) * | 2000-08-23 | 2002-02-26 | Komatsu Electronic Metals Co Ltd | Surface polishing device |
| CN1726116A (en) * | 2002-10-17 | 2006-01-25 | 株式会社荏原制作所 | Polishing state monitoring apparatus and polishing apparatus and method |
| CN101660896A (en) * | 2009-09-23 | 2010-03-03 | 中国电子科技集团公司第四十五研究所 | Semiconductor wafer film thickness detecting device on basis of infrared optical interference method |
| CN102575985A (en) * | 2009-10-08 | 2012-07-11 | Vtt技术研究中心 | Measuring instrument and method for determination of the properties of an item and its surface |
| CN104097118A (en) * | 2013-04-02 | 2014-10-15 | 盛美半导体设备（上海）有限公司 | Stress-free polishing integration device |
| CN108700405A (en) * | 2016-12-06 | 2018-10-23 | 爱思开矽得荣株式会社 | Silicon wafer carrier measurer for thickness |
| CN109755152A (en) * | 2017-11-08 | 2019-05-14 | 长鑫存储技术有限公司 | Semiconductor wafer processing apparatus and semiconductor wafer processing method |
| CN110108716A (en) * | 2019-05-06 | 2019-08-09 | 华侨大学 | A kind of automation substrate wafer defect and thickness detecting system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101537854B1 (en) * | 2013-09-23 | 2015-07-21 | 에스엔유 프리시젼 주식회사 | Apparatus for measuring thickness and method for measuring thickness for the same |
| ES2917217T3 (en) * | 2016-01-07 | 2022-07-07 | Arkema Inc | Optical method to measure the thickness of coatings deposited on substrates |
-
2020
- 2020-07-06 CN CN202010642359.4A patent/CN111750786B/en active Active
- 2020-10-29 TW TW109137641A patent/TWI755913B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002059364A (en) * | 2000-08-23 | 2002-02-26 | Komatsu Electronic Metals Co Ltd | Surface polishing device |
| CN1726116A (en) * | 2002-10-17 | 2006-01-25 | 株式会社荏原制作所 | Polishing state monitoring apparatus and polishing apparatus and method |
| CN101660896A (en) * | 2009-09-23 | 2010-03-03 | 中国电子科技集团公司第四十五研究所 | Semiconductor wafer film thickness detecting device on basis of infrared optical interference method |
| CN102575985A (en) * | 2009-10-08 | 2012-07-11 | Vtt技术研究中心 | Measuring instrument and method for determination of the properties of an item and its surface |
| CN104097118A (en) * | 2013-04-02 | 2014-10-15 | 盛美半导体设备（上海）有限公司 | Stress-free polishing integration device |
| CN108700405A (en) * | 2016-12-06 | 2018-10-23 | 爱思开矽得荣株式会社 | Silicon wafer carrier measurer for thickness |
| CN109755152A (en) * | 2017-11-08 | 2019-05-14 | 长鑫存储技术有限公司 | Semiconductor wafer processing apparatus and semiconductor wafer processing method |
| CN110108716A (en) * | 2019-05-06 | 2019-08-09 | 华侨大学 | A kind of automation substrate wafer defect and thickness detecting system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111750786A (en) | 2020-10-09 |
| TWI755913B (en) | 2022-02-21 |
| TW202202807A (en) | 2022-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105424717B (en) | Optical detection device for detecting multiple defects | |
| US9287158B2 (en) | Substrate processing apparatus | |
| US11318573B2 (en) | Transfer jig and cutting blade changing method | |
| US10964567B2 (en) | Processing apparatus | |
| CN111750786B (en) | Thickness measuring equipment, polishing system and polishing material management method | |
| JP5617787B2 (en) | Chip pickup method, chip mounting method, and chip mounting apparatus | |
| CN101277787B (en) | Polishing apparatus and method with direct load platen | |
| CN108573899B (en) | Semiconductor manufacturing apparatus and control method thereof | |
| TWI328108B (en) | ||
| CN1333552A (en) | Device and method processing substrate | |
| JP2006300913A (en) | Appearance inspection apparatus of light guide plate | |
| JP2005502946A (en) | High throughput, high precision integrated micro-optic / photonics device batch pre-treatment, polishing, cleaning and inspection polishing system and method using such polishing | |
| CN211992435U (en) | Grinding equipment | |
| CN101210951B (en) | Built-in illuminating source photo-sensor detection device and test bench possessing same | |
| US6149507A (en) | Wafer polishing apparatus having measurement device and polishing method | |
| US20220234156A1 (en) | Cutting apparatus | |
| JP2002036083A (en) | Layout, block, and working device for eyeglass lens | |
| US6752694B2 (en) | Apparatus for and method of wafer grinding | |
| JP6614978B2 (en) | Polishing apparatus and polishing method | |
| CN113510868A (en) | Cutting device, method for replacing cutting tool, and method for replacing plate | |
| KR20240027135A (en) | Cutting device and method of manufacturing cut products | |
| JP7542923B2 (en) | Cutting Equipment | |
| CN108942560A (en) | A kind of burnishing device | |
| CN107139041A (en) | A kind of automatic loading/unloading device and method applied to optical lens edge polisher | |
| CN118192159A (en) | Semiconductor processing detection device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |