CN111746828A - Thermal control device for satellite load vacuum thermal balance test - Google Patents
Thermal control device for satellite load vacuum thermal balance test Download PDFInfo
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- CN111746828A CN111746828A CN202010711821.1A CN202010711821A CN111746828A CN 111746828 A CN111746828 A CN 111746828A CN 202010711821 A CN202010711821 A CN 202010711821A CN 111746828 A CN111746828 A CN 111746828A
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- 238000012360 testing method Methods 0.000 title claims abstract description 48
- 230000017525 heat dissipation Effects 0.000 claims abstract description 163
- 238000010438 heat treatment Methods 0.000 claims abstract description 63
- 230000005855 radiation Effects 0.000 claims description 26
- 238000007789 sealing Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 description 6
- 238000007689 inspection Methods 0.000 description 5
- 238000004088 simulation Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G7/00—Simulating cosmonautic conditions, e.g. for conditioning crews
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
- G05D23/32—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature with provision for adjustment of the effect of the auxiliary heating device, e.g. a function of time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G7/00—Simulating cosmonautic conditions, e.g. for conditioning crews
- B64G2007/005—Space simulation vacuum chambers
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- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
Abstract
The invention discloses a thermal control device for a satellite load vacuum thermal balance test, which comprises: the temperature control device is used for heating and/or radiating heat for the load; the unidirectional heat dissipation device comprises a heat dissipation assembly, a first heat conduction assembly and a first heating assembly, wherein the first heat conduction assembly is connected with the heat dissipation assembly and the temperature control device, and the first heating assembly is used for heating the heat dissipation assembly; the heat dissipation assembly dissipates heat of the temperature control device through the first heat conduction assembly, adjusts the heat dissipation efficiency of the heat dissipation assembly on the temperature control device through the first heating assembly, or enables the heat dissipation assembly to radiate and heat the load through the first heating assembly. The device simulates all thermal conditions of the load in a space environment and improves the working efficiency.
Description
Technical Field
The invention belongs to the technical field of thermal balance tests, and particularly relates to a thermal control device for a satellite load vacuum thermal balance test.
Background
In the field of satellite development, after satellite load is manufactured, a series of environmental tests are carried out on the load to verify whether the load development meets the design requirements or not, and the reliability is improved. The vacuum thermal balance test is a test for simulating the temperature condition of the load in a space environment to verify various performances and functions of the load.
The satellite load thermal control device is a device for simulating various temperature working conditions of a load in a space environment, and the load can absorb and discharge heat according to an actual running state in the space thermal environment. The whole device is generally arranged in a vacuum tank to simulate a space vacuum environment, the vacuum tank is provided with a vacuum environment, a heat sink is arranged to simulate cold air, and then the temperature control device simulates different temperature conditions.
The satellite load thermal control device in the prior art cannot cover all working conditions of a load product, the tank needs to be frequently switched in a thermal balance test to adjust the simulation change of heat flow outside a space, a large amount of time and cost loss are consumed, the working efficiency in the tank is low, and meanwhile, operation risks exist.
Disclosure of Invention
In order to solve the problems, the invention aims to provide a thermal control device for a satellite load vacuum thermal balance test, which simulates all thermal conditions of a load in a space environment and improves the working efficiency.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a satellite load vacuum thermal balance test thermal control device comprises:
the temperature control device is used for heating and/or radiating heat for the load;
the unidirectional heat dissipation device comprises a heat dissipation assembly, a first heat conduction assembly and a first heating assembly, wherein the first heat conduction assembly is connected with the heat dissipation assembly and the temperature control device, and the first heating assembly is used for heating the heat dissipation assembly;
the heat dissipation assembly dissipates heat of the temperature control device through the first heat conduction assembly, adjusts the heat dissipation efficiency of the heat dissipation assembly on the temperature control device through the first heating assembly, or enables the heat dissipation assembly to radiate and heat the load through the first heating assembly.
According to an embodiment of the present invention, the temperature control device includes:
the load is arranged in the heat dissipation cover, and the first heat conduction assembly is connected with the heat dissipation assembly and the heat dissipation cover;
the second heating assembly is used for heating the heat dissipation cover;
and the temperature of the heat dissipation cover is adjusted through the second heating assembly so as to adjust the heat dissipation efficiency of the load or heat the load.
According to an embodiment of the present invention, one side surface of the heat dissipation cover is formed by a first heat dissipation plate, and the second heating element is disposed on the first heat dissipation plate.
According to an embodiment of the invention, the heat sink comprises a second heat conducting assembly, and the second heat conducting assembly is connected with the first heat dissipation plate and other side plates of the heat dissipation cover and is used for balancing the temperature of each side plate of the heat dissipation cover.
According to an embodiment of the invention, the temperature control device comprises a radiation cavity, the radiation cavity is formed by sealing a heat conduction plate, a second heat dissipation plate and a plurality of mounting plates, the second heat dissipation plate is arranged towards a heat sink in a vacuum heat balance test environment, the heat dissipation cover and the load are arranged on the outer side of the heat conduction plate, and heat of the load is radiated to the radiation cavity through the heat conduction plate and then radiated to cold air through the second heat dissipation plate to be dissipated.
According to an embodiment of the present invention, the heat dissipation assembly is a third heat dissipation plate.
According to an embodiment of the present invention, the first heating element is disposed on the third heat dissipation plate.
According to an embodiment of the present invention, the first heating element is a heating plate.
According to an embodiment of the present invention, the first heat conducting component is a heat conducting pipe.
Due to the adoption of the technical scheme, compared with the prior art, the invention has the following advantages and positive effects:
(1) the embodiment of the invention is provided with the temperature control device and the one-way heat dissipation device, and the load is heated and/or dissipated by the temperature control device so as to simulate the heating and heat dissipation environment of the load in the space environment. The heat dissipation efficiency of the temperature control device is adjusted through the one-way heat dissipation device or the load is directly subjected to radiation heating, so that the temperature of the temperature control device and the temperature of the load are fluctuated, and the temperature fluctuation caused by the change of external heat flow in a simulated space environment is realized. Through the arrangement, all working conditions of the load in a space environment can be simulated, the working conditions do not need to be changed manually by frequently switching on and off the vacuum tank, the efficiency is improved, the cost is saved, and the operation risk is reduced.
(2) The temperature control device comprises a heat dissipation cover, a second heating assembly and a radiation cavity, wherein the heat dissipation cover is used for dissipating or heating the load so as to simulate the external heat flow of the space environment of the load and the actual heat dissipation state of the load in the space environment. The radiation cavity is used for simulating the radiation of the load in the bottom surface direction, namely simulating the radiation of the load in cold air, wherein the cold air is a space cold and black environment.
(3) In the embodiment of the invention, the second heat conduction assembly is arranged, and the temperature of each side plate of the heat dissipation cover is balanced through the second heat conduction assembly, so that the temperature of the temperature control cover is more uniform.
Drawings
The following detailed description of embodiments of the invention is provided in conjunction with the appended drawings, in which:
FIG. 1 is a perspective view of a thermal control device for a satellite load vacuum thermal balance test according to the present invention;
FIG. 2 is a perspective view of a thermal control device for a satellite load vacuum thermal balance test according to the present invention;
FIG. 3 is a perspective view of a thermal control device for a satellite load vacuum thermal balance test according to the present invention;
fig. 4 is an overall schematic diagram of a thermal control device for a satellite load vacuum thermal balance test according to the invention.
Description of reference numerals:
1: a heat dissipating component; 2: a first heat conducting component; 3: a first heating assembly; 4: a heat dissipation cover; 5: a second heating assembly; 6: a radiation cavity; 7: a first heat dissipation plate; 8: a second heat conducting assembly; 9: a heat conducting plate; 10: a second heat dissipation plate; 11: a base plate; 12: a truss; 13: assembling a plate; 14: and (4) covering the skin.
Detailed Description
The invention is described in further detail below with reference to the figures and specific examples. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are all used in a non-precise ratio for the purpose of facilitating and distinctly aiding in the description of the embodiments of the invention.
Referring to fig. 1 to 4, the core of the invention is to provide a thermal control device for satellite load vacuum thermal balance test, the satellite load vacuum thermal balance test is generally carried out in a vacuum tank, so that the whole device is arranged in the vacuum tank. The load simulation system comprises a temperature control device and a one-way heat dissipation device, wherein the temperature control device is used for heating and/or dissipating heat of a load so as to simulate a heating and heat dissipation environment of the load in a space environment. The heat dissipation efficiency of the temperature control device is adjusted through the one-way heat dissipation device or the load is directly subjected to radiation heating, so that the temperature of the temperature control device and the temperature of the load are fluctuated, and the temperature fluctuation caused by the change of external heat flow in a simulated space environment is realized. Through the arrangement, all working conditions of the load in a space environment can be simulated, the working conditions do not need to be changed manually by frequently switching on and off the vacuum tank, the efficiency is improved, the cost is saved, and the operation risk is reduced.
The temperature control device comprises a heat dissipation cover 4, a second heating assembly 5 and a radiation cavity 6. The heat dissipation cover 4 is a hollow cover body, the upper end of the heat dissipation cover is open, a cavity for containing a load is formed in the middle of the heat dissipation cover, the second heating component 5 is used for heating the heat dissipation cover 4, one side face of the heat dissipation cover 4 is composed of the first heat dissipation plate 7, the first heat dissipation plate 7 is a main heat dissipation face of the heat dissipation cover 4, heat of the load is mainly dissipated through the first heat dissipation plate 7, and the outer surfaces of other side plates of the heat dissipation cover 4 are wrapped with the heat control multilayer heat insulation components to prevent the heat dissipation of the heat dissipation cover.
The first heat dissipation plate 7 is provided with a second heating assembly 5, in this embodiment, the second heating assembly 5 is a plurality of heating sheets, and is adhered to the first heat dissipation plate 7 for heating the heat dissipation cover 4.
The temperature of the heat radiating cover 4 is adjusted by the second heating unit 5 to adjust the heat radiating efficiency of the load or heat it. That is, the temperature difference between the heat dissipation cover 4 and the load is adjusted to adjust the heat dissipation efficiency of the heat dissipation cover 4 to the load or heat the load. For example, by heating the heat radiating cover 4 without making the temperature of the heat radiating cover 4 higher than the load, the temperature difference between the heat radiating cover 4 and the load is reduced, and the heat radiating efficiency of the heat radiating cover 4 to the load is naturally reduced. Further heating the heat-radiating cover 4 to a temperature higher than the load, the heat-radiating cover 4 heats the load. The external heat flow of the load in the space environment and the actual heat dissipation state of the load in the space environment are simulated by the heat dissipation cover 4.
Further, including second heat conduction subassembly 8, second heat conduction subassembly 8 is two first heat pipes in this embodiment, connects first heating panel 7 of heat exchanger 4 and other curb plates of heat exchanger 4 for balance the temperature of each curb plate of heat exchanger 4, that is to say first heat pipe passes through the temperature of each face of two-way coupling heat exchanger 4, makes the temperature of control by temperature change cover more even, and can simulate the effect influence of the different surfaces of control by temperature change cover to load vacuum heat balance temperature level.
The radiation cavity 6 is formed by sealing a heat conduction plate 9, a second heat dissipation plate 10 and a plurality of mounting plates, the second heat dissipation plate 10 is arranged towards a cold space, the second heat dissipation plate 10 is parallel to and in the same direction as the first heat dissipation plate 7, the cold space is a space cold-black environment, and heat sink in a vacuum tank is simulated during testing, so that the second heat dissipation plate 10 is actually arranged towards the heat sink, a heat dissipation cover 4 and a load are arranged on the outer side of the heat conduction plate 9, the heat dissipation cover 4 is connected to the heat conduction plate 9 through screws, heat of the load is radiated into the radiation cavity 6 through the heat conduction plate 9 and then radiated to the cold space through the second heat dissipation plate 10 to dissipate heat, namely, the radiation cavity 6 plays a role in auxiliary heat dissipation from the bottom of the load. Since the second heat dissipation plate 10 is directly opposite to the vacuum tank heat sink, most of the heat in the radiation cavity 6 is radiated to the heat sink through the second heat dissipation plate 10, and a small part of the heat is dissipated through the mounting plate. The radiation cavity 6 simulates the heat dissipation of the load in the direction of the bottom surface of the space environment, namely simulating the heat dissipation of the load in cold air.
The one-way heat dissipation device comprises a heat dissipation assembly 1, a first heat conduction assembly 2 and a first heating assembly 3 used for heating the heat dissipation assembly 1, wherein the first heat conduction assembly 2 is connected with the heat dissipation assembly 1 and a temperature control device, the first heat conduction assembly 2 is connected with the heat dissipation assembly 1 and a heat dissipation cover 4 in the embodiment, and heat of the heat dissipation cover 4 can be conducted to the heat dissipation assembly 1 to dissipate heat. According to the actual heat flow direction, the first heating component 3 is selectively opened or closed, so that the heat communication or the heat disconnection between the heat dissipation cover 4 and the heat dissipation component 1 is realized.
Specifically, the heat dissipation assembly 1 is a third heat dissipation plate, which is vertically fixed, is higher than the temperature control cover, and has a direction perpendicular to the first heat dissipation plate 7, the first heating assembly 3 is a plurality of heating sheets and is adhered to the third heat dissipation plate, the first heat conduction assembly 2 is two second heat conduction pipes, and the temperature of the second heat conduction pipe unilaterally coupled to the heat dissipation cover 4 reaches the third heat dissipation plate.
The heat dissipation efficiency of the heat dissipation assembly 1 to the temperature control device can be adjusted through the first heating assembly 3, or the heat dissipation assembly 1 is enabled to radiate and heat the load through the first heating assembly 3. For example, when the first heating element 3 is turned off, the heat of the heat dissipation cover 4 is conducted to the heat dissipation element 1 through the first heat conduction element 2 to dissipate the heat; the first heating component 3 is started to heat the heat dissipation component 1, but the temperature of the heat dissipation component 1 is not higher than that of the heat dissipation cover 4, so that the temperature difference between the heat dissipation component 1 and the heat dissipation cover 4 is reduced, and the heat dissipation efficiency of the heat dissipation component 1 to the heat dissipation cover 4 is reduced; when the first heating component 3 heats the heat dissipation component 1 to a temperature higher than that of the heat dissipation cover 4, the heat dissipation component 1 does not dissipate heat of the heat dissipation cover 4 any more, and at the moment, the heat dissipation component 1 radiatively heats the load.
When the heat dissipation assembly 1 dissipates heat from the heat dissipation cover 4, the heat dissipation area of the heat dissipation cover 4 is increased, and thus the external heat flow is reduced. When the heat dissipation assembly 1 does not dissipate heat of the heat dissipation cover 4 and radiatively heats the load, the heat dissipation assembly 1 is the radiation heat dissipation shielding surface of the heat dissipation cover 4 and the load at the moment, so that the effective heat dissipation area of the load is reduced, and the load can be heated by heat radiation, and therefore, the external heat flow is increased equivalently. The one-way heat sink can thus be used as an aid in testing to simulate external heat flow.
Furthermore, the mounting plates are divided into a bottom plate 11, a tooling plate 13 and a skin 14, and further comprise a truss 12 structure, wherein the bottom plate 11, the tooling plate 13, the skin 14, the heat conducting plate 9 and the second heat dissipation plate 10 are all arranged on the periphery of the truss 12 to wrap the truss 12, the bottom plate 11 is arranged at the bottom, the tooling plate 13 is arranged at the side end, the heat conducting plate 9 is arranged at the top, and the truss is a main bearing framework of the whole device and is also a supporting structure of the radiation cavity 6. And the plates are all made of aluminum alloy materials.
The working process of the present invention is further explained as follows:
the satellite load vacuum heat balance test can be divided into three stages: preparation before testing, testing and inspection after testing. The preparation before the test comprises the preparation and the inspection of a test model and the inspection of ground equipment and ground test equipment. After the inspection is finished, all signal cables, test cables and heating cables are connected, a vacuum simulation chamber (a vacuum tank) is closed, a vacuum system is started, and liquid nitrogen is filled into a heat sink system after a certain vacuum degree is reached, so that the heat sink is cooled to a specified temperature. And then electrifying the test simulation internal equipment and applying simulated external heat flow according to the requirements of the test outline, carrying out a test under specified working conditions, and switching to the next working condition to continue the test after the temperature of the working condition is stable. After all the tests are finished, the temperature rise and the repression of the vacuum environment simulator can be carried out. When the pressure of the space environment simulator is recovered to the normal pressure, the heat sink temperature is raised to the room temperature, the vacuum tank can be opened, the product is lifted out of the vacuum tank, appearance inspection is carried out on the product, and the phenomenon that the product is damaged or abnormal is checked.
The thermal control device mainly plays a role in providing all temperature working conditions in a test and enabling the load to absorb and discharge heat in a simulated space thermal environment according to the actual running state.
The thermal control device simulates all working conditions of the load in a space environment mainly through three-level thermal control, namely the heat dissipation cover 4, the one-way heat dissipation device and the radiation cavity 6. When the heat dissipation cover works, the heat dissipation cover 4 adjusts the temperature of vacuum heat balance of the load according to external heat flow in a test and the actual heat dissipation state of the load in the space; the unidirectional heat dissipation device is used for simulating temperature fluctuation caused by the change of heat flow outside the space; the radiation cavity 6 simulates the radiation of the satellite load in the bottom surface direction according to the actual radiation state of the load on the satellite.
The thermal control device for the satellite load vacuum thermal balance test realizes three-level thermal control of the satellite load vacuum thermal balance, and realizes high precision and high reliability of temperature control of a product in a vacuum environment test. The time cost and the expense loss that product switch jar consumed in the vacuum heat balance test are reduced, work efficiency in the jar has been improved and the operation risk has been reduced.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, it is still within the scope of the present invention if they fall within the scope of the claims of the present invention and their equivalents.
Claims (9)
1. The utility model provides a satellite load vacuum heat balance test thermal control device which characterized in that includes:
the temperature control device is used for heating and/or radiating heat for the load;
the unidirectional heat dissipation device comprises a heat dissipation assembly, a first heat conduction assembly and a first heating assembly, wherein the first heat conduction assembly is connected with the heat dissipation assembly and the temperature control device, and the first heating assembly is used for heating the heat dissipation assembly;
the heat dissipation assembly dissipates heat of the temperature control device through the first heat conduction assembly, adjusts the heat dissipation efficiency of the heat dissipation assembly on the temperature control device through the first heating assembly, or enables the heat dissipation assembly to radiate and heat the load through the first heating assembly.
2. The thermal control device for the vacuum thermal balance test of the satellite load according to claim 1, wherein the thermal control device comprises:
the load is arranged in the heat dissipation cover, and the first heat conduction assembly is connected with the heat dissipation assembly and the heat dissipation cover;
the second heating assembly is used for heating the heat dissipation cover;
and the temperature of the heat dissipation cover is adjusted through the second heating assembly so as to adjust the heat dissipation efficiency of the load or heat the load.
3. The thermal control device for the satellite load vacuum thermal balance test according to claim 2, wherein one side surface of the heat dissipation cover is composed of a first heat dissipation plate, and the second heating assembly is arranged on the first heat dissipation plate.
4. The thermal control device for the satellite load vacuum thermal balance test according to claim 3, wherein the thermal control device comprises a second heat conduction assembly, and the second heat conduction assembly is connected with the first heat dissipation plate and other side plates of the heat dissipation cover and is used for balancing the temperature of each side plate of the heat dissipation cover.
5. The thermal control device for the satellite load vacuum thermal balance test according to claim 2, wherein the thermal control device comprises a radiation cavity, the radiation cavity is formed by sealing a heat conduction plate, a second heat dissipation plate and a plurality of mounting plates, the second heat dissipation plate is arranged towards a heat sink in a vacuum thermal balance test environment, the heat dissipation cover and the load are arranged on the outer side of the heat conduction plate, and the heat of the load is radiated to the radiation cavity through the heat conduction plate and then radiated to cold air through the second heat dissipation plate to dissipate heat.
6. The thermal control device for the vacuum thermal balance test of the satellite load according to claim 1, wherein the heat dissipation assembly is a third heat dissipation plate.
7. The thermal control device for the vacuum thermal balance test of the satellite load according to claim 6, wherein the first heating assembly is arranged on the third heat dissipation plate.
8. The thermal control device for the vacuum thermal balance test of the satellite load according to claim 1, wherein the first heating assembly is a heating plate.
9. The thermal control device for the satellite load vacuum thermal balance test according to claim 1, wherein the first heat conducting component is a heat conducting pipe.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010711821.1A CN111746828B (en) | 2020-07-22 | 2020-07-22 | Thermal control device for satellite load vacuum thermal balance test |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010711821.1A CN111746828B (en) | 2020-07-22 | 2020-07-22 | Thermal control device for satellite load vacuum thermal balance test |
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| CN111746828A true CN111746828A (en) | 2020-10-09 |
| CN111746828B CN111746828B (en) | 2022-08-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113125181A (en) * | 2021-04-07 | 2021-07-16 | 深圳航天东方红卫星有限公司 | Satellite thermal control detection method and system |
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| JPH03157300A (en) * | 1989-11-13 | 1991-07-05 | Natl Space Dev Agency Japan<Nasda> | Artificial satellite |
| US6332591B1 (en) * | 1999-03-11 | 2001-12-25 | Alcatel | Method of simulating external thermal fluxes absorbed by external radiating components of a spacecraft in flight, and spacecraft for implementing the method |
| RU143028U1 (en) * | 2013-08-27 | 2014-07-10 | Открытое акционерное общество "Информационные спутниковые системы" имени академика М.Ф. Решетнёва" | HEAT AND VACUUM TEST STAND |
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2020
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|---|---|---|---|---|
| JPH03157300A (en) * | 1989-11-13 | 1991-07-05 | Natl Space Dev Agency Japan<Nasda> | Artificial satellite |
| US6332591B1 (en) * | 1999-03-11 | 2001-12-25 | Alcatel | Method of simulating external thermal fluxes absorbed by external radiating components of a spacecraft in flight, and spacecraft for implementing the method |
| RU143028U1 (en) * | 2013-08-27 | 2014-07-10 | Открытое акционерное общество "Информационные спутниковые системы" имени академика М.Ф. Решетнёва" | HEAT AND VACUUM TEST STAND |
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| 刘东晓等: "纳卫星等效空间热沉的PWM控制及其在地面模拟试验中的应用研究", 《机械工程学报》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113125181A (en) * | 2021-04-07 | 2021-07-16 | 深圳航天东方红卫星有限公司 | Satellite thermal control detection method and system |
| CN113125181B (en) * | 2021-04-07 | 2024-04-09 | 深圳航天东方红卫星有限公司 | Satellite thermal control detection method and system |
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| CN111746828B (en) | 2022-08-12 |
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