CN220755335U - Radiating assembly and intelligent screen - Google Patents

Abstract

The utility model discloses a heat radiation component and an intelligent screen, which relate to the field of electronic products and comprise the following components: the bottom shell is provided with a heat dissipation groove with a through wall thickness; the radiating fin is fixed in the radiating groove, and the first surface of the radiating fin is a heat conducting surface for being attached to an electronic component of an electronic product; the metal fixing support, the second surface of fin with metal fixing support laminating, the first surface and the second surface of fin are relative both sides surface. According to the utility model, the heat radiating grooves with the through wall thickness are formed in the bottom shell, and the heat radiating fins are arranged in the heat radiating grooves, so that the thickness of a product does not need to be increased, the whole bottom shell does not need to be made of metal, heat is transferred through the heat radiating fins, the heat radiating efficiency is high, and heat is transferred to the metal fixing support to be radiated, and the heat radiating holes do not need to be increased.

Description

Radiating assembly and intelligent screen

Technical Field

The utility model relates to the technical field of electronic products, in particular to a heat dissipation assembly and an intelligent screen.

Background

With the progress of the age, various electronic devices are pursuing thinner bodies and more excellent performances. With the extrusion of space, not only the requirements on hardware are higher and higher, but also the requirements on structural design are higher and higher. Consumers not only have more stringent requirements on the installation accuracy of the product, but also experience subjective first impressions on the whole of the device, such as the appearance, touch, and functional experience, heat dissipation effects, etc. of the product. The heat dissipation problem is easily perceived by consumers, and if the heat dissipation is poor, the use experience is greatly affected, so that the more elaborate the equipment is, the more the heat dissipation problem is not ignored.

Taking the smart screen as an example, the existing smart screen is light and thin, the hardware is more adopting a smaller electronic component processing chip, the smaller electronic component is either expensive or low in performance, the expensive electronic component is unfavorable for reducing the cost, and more heat is generated when the low-performance electronic component operates. Under the condition of enough equipment spacing, the heat generated by the equipment can be dissipated by utilizing air and hard contact, and the appearance of the product is about 50 ℃ at this stage, which belongs to the normal temperature range of the equipment. When the device is in the multithread operation for a short time, the device can be in a high-load state, the electronic component works to generate a large amount of heat, if the heat cannot be timely emitted, the heat can be generated in a large amount, the outer surface of the product, such as a touch screen, can reach 60 ℃ or above, the risk of scalding is caused in the use process of a user, and the use experience is quite poor.

In the prior art, in order to improve the heat dissipation efficiency, one common method is to increase a plurality of heat dissipation holes, and utilize the heat convection of air to dissipate heat, and the biggest shortcoming of this scheme is that IP (International Protection) grade is too low, and dust and water are easily entered, resulting in equipment failure.

Therefore, how to improve the heat dissipation efficiency without adding heat dissipation holes is a technical problem that needs to be solved by those skilled in the art at present.

Disclosure of Invention

Accordingly, the present utility model is directed to a heat dissipating assembly for improving heat dissipating efficiency without adding heat dissipating holes;

another object of the present utility model is to provide an intelligent screen with the above heat dissipating assembly.

In order to achieve the above object, the present utility model provides the following technical solutions:

a heat dissipation assembly for dissipating heat from an electronic product, comprising:

the bottom shell is provided with a heat dissipation groove with a through wall thickness;

the radiating fin is fixed in the radiating groove, and the first surface of the radiating fin is a heat conducting surface for being attached to an electronic component of an electronic product;

the metal fixing support, the second surface of fin with metal fixing support laminating, the first surface and the second surface of fin are relative both sides surface.

Optionally, in the above heat dissipating assembly, the heat dissipating fin is fixed to the bottom case by a beer-over process.

Optionally, in the above heat dissipating assembly, the first surface of the heat sink is a plane; and/or, the second surface of the radiating fin is formed with a plurality of radiating ribs.

Optionally, in the above heat dissipating assembly, the bottom case is filled with connection ribs at gaps between the heat dissipating ribs.

Optionally, in the above heat dissipating assembly, the heat dissipating ribs extend along a straight line, and each of the heat dissipating ribs is arranged in parallel; or,

the heat dissipation ribs extend along a curve, and the heat dissipation ribs are concentrically arranged.

Optionally, in the above heat dissipating assembly, the heat dissipating fin includes a first area and a second area, and the width of the first area is greater than the width of the second area, and magnetic particle placing grooves are disposed on two sides of the second area, and the magnetic particle placing grooves are used for placing an adsorption magnet to adsorb the metal fixing support.

Optionally, in the above heat dissipating assembly, the heat dissipating fin further includes a transition region between the first region and the second region, and the transition region is gradually narrowed in width in a direction from the first region to the second region.

Optionally, in the above heat dissipation assembly, a thickened frame protruding from a substrate surface of the bottom shell is formed on an outer side of the heat dissipation groove.

Optionally, in the above heat dissipation assembly, the bottom shell is a plastic bottom shell or a plastic bottom shell;

the radiating fin is a metal radiating fin.

According to the heat radiation assembly provided by the utility model, the heat radiation groove is arranged on the bottom shell of the electronic product, and the heat radiation fin is arranged in the heat radiation groove, and the first surface of the heat radiation fin is attached to the electronic component of the electronic product so as to complete heat transfer with the electronic component. The second surface of the radiating fin is attached to the metal fixing support of the electronic product so as to complete heat transfer between the radiating fin and the metal fixing support, and under the action of the radiating fin, heat generated by the electronic component is emitted to surrounding air through the metal fixing support. According to the utility model, the heat radiating grooves with the through wall thickness are formed in the bottom shell, and the heat radiating fins are arranged in the heat radiating grooves, so that the thickness of a product does not need to be increased, the whole bottom shell does not need to be made of metal, heat is transferred through the heat radiating fins, the heat radiating efficiency is high, and heat is transferred to the metal fixing support to be radiated, and the heat radiating holes do not need to be increased.

The utility model provides a wisdom screen, includes face-piece subassembly and power module and set up in radiating module between face-piece subassembly and the power module, radiating module is the radiating module as above any one, the metal fixed bolster set up in on the power module, electronic components set up in on the face-piece subassembly.

The intelligent screen disclosed by the utility model has all the technical effects of the heat dissipation assembly because of the heat dissipation assembly, and the description is omitted herein.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an intelligent screen according to an embodiment of the present utility model;

FIG. 2 is a cross-sectional view of a smart screen disclosed in an embodiment of the present utility model;

FIG. 3 is an exploded view of a smart screen according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of an assembled bottom shell and heat sink according to an embodiment of the present utility model;

fig. 5 is a cross-sectional view of a bottom case and a heat sink assembled according to an embodiment of the present utility model.

The meaning of the individual reference numerals in the figures is as follows:

100 is a power supply component, 101 is a first wiring terminal, and 102 is a metal fixing bracket;

200 is a face-piece assembly;

300 is a bottom shell, 301 is a heat dissipation groove, 302 is a magnetic particle placing groove, 303 is a terminal groove, 304 is a thickened frame;

400 is a heat sink.

Detailed Description

The core of the utility model is to provide a heat radiation component so as to improve the heat radiation efficiency on the premise of not adding heat radiation holes;

another core of the present utility model is to provide an intelligent screen with the above heat dissipation assembly.

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1, an embodiment of the present utility model discloses a heat dissipation assembly for dissipating heat of an electronic product, and is particularly suitable for dissipating heat of an intelligent screen. The intelligent screen is also called as an intelligent gateway, is a key of the intellectualization of a local area network, generally supports virtual network access, wifi access, wired broadband access and the like, and can realize the functions of information acquisition, information input, information output, centralized control, remote control, linkage control and the like of devices such as sensors, network devices, cameras, hosts and the like in the local area network. With the popularity of smart home, smart screens have also begun to enter into thousands of households to control various devices in the home. Typically, the smart screen includes a face-piece assembly 200 and a power supply assembly 100, wherein the face-piece assembly 200 has a display (typically a touch screen) and corresponding electronics, and the power supply assembly 100 is used to power the devices on the face-piece assembly 200. With the increasing functions of the intelligent screen, the heating value is greater and greater, and the intelligent screen has a trend of miniaturization development, so that the intelligent screen is more unfavorable for heat dissipation.

As shown in fig. 2-5, the heat dissipation assembly disclosed in the embodiment of the utility model is designed for heat dissipation of electronic products related to smart screens and the like. The heat dissipation assembly includes a bottom chassis 300, a heat sink 400, and a metal fixing bracket 102. The bottom case 300 is provided with a heat dissipation groove 301 with a through wall thickness, and in order to ensure higher heat dissipation efficiency, the heat dissipation groove 301 should be designed to have a large enough area without affecting other structures.

The heat sink 400 is fixed in the heat sink 301, and the shape of the heat sink 400 should be the same as that of the heat sink 301 so that the heat sink can be completely covered. The fixing manner of the heat sink 400 and the heat sink 301 may be arbitrary, and for example, the heat sink 301 may be fitted by a snap-fit manner, and the heat sink 301 may be fixed by a fastening manner. The heat sink 400 may also be fixed to the bottom chassis 300 by means of a beer-over process. The beer-sleeving process is also called a secondary injection molding process or an encapsulation process, and is a special plastic molding process. The molded fin 400 is placed in a mold for secondary molding to perform injection molding of the bottom chassis 300. And injecting a corresponding plastic material into the secondarily molded mold to perform secondary molding, so that a heat dissipation groove 301 is formed at the position of the heat dissipation plate 400, the heat dissipation plate 400 is wrapped by the plastic material, and finally, the fixing structure of the bottom shell 300 and the heat dissipation plate 400 is formed. The fixing of the cooling fin 400 and the bottom shell 300 is realized through the mode of the beer sleeving process, the yield is more easily met because the beer sleeving process belongs to a mature molding process, meanwhile, the cooling fin 400 is added on the bottom shell 300, the cooling capacity of the bottom shell 300 can be improved, the bottom shell 300 is not required to be completely designed into a metal material, the weight of a product can be controlled, and cooling holes are not required to be added on the appearance surface.

The first surface of the heat sink 400 is a heat conducting surface for adhering to the electronic component of the electronic product, and heat generated during operation of the electronic component of the electronic product is transferred to the heat sink 400 through the heat conducting surface. The bottom case 300 may be a plastic bottom case or a plastic bottom case; while the heat sink 400 may be a metal heat sink, for example, copper or aluminum may be selected as the material of the heat sink 400.

The metal fixing bracket 102 is a bracket for fixing an electronic product (smart screen) on a wall, and is usually made of metal, and the embodiment of the utility model utilizes a good heat dissipation effect of the metal, that is, the second surface of the heat sink 400 is attached to the metal fixing bracket 102, and the first surface and the second surface of the heat sink 400 are opposite side surfaces. The two sides of the heat sink 400 are respectively attached to the electronic component and the metal fixing support 102, so that the heat of the electronic component can be transferred to the metal fixing support 102 and rapidly emitted to the surrounding air.

In summary, in the heat dissipation assembly provided by the utility model, the heat dissipation groove 301 is disposed on the bottom case 300 of the electronic product, and the heat dissipation fin 400 is disposed in the heat dissipation groove 301, and the first surface of the heat dissipation fin 400 is attached to the electronic component of the electronic product, so as to complete the heat transfer with the electronic component. The second surface of the heat sink 400 is attached to the metal fixing support 102 of the electronic product, so as to complete heat transfer between the heat sink 400 and the metal fixing support 102, and under the action of the heat sink 400, heat generated by the electronic component is dissipated into surrounding air through the metal fixing support 102.

The heat dissipation groove 301 penetrating through the wall thickness is arranged on the bottom shell 300, and the heat dissipation fin 400 is arranged in the heat dissipation groove 301, so that the thickness of a product does not need to be increased, the whole bottom shell 300 does not need to be made of metal, heat is transferred through the heat dissipation fin 400, the heat dissipation efficiency is high, and heat is dissipated through transferring the heat to the metal fixing support 102, and the heat dissipation holes do not need to be increased.

As shown in fig. 3 and 5, the first surface of the heat sink 400 is a plane, so that the heat sink can be better attached to the electronic component, and a larger contact area with the electronic component is ensured. The second surface of the heat sink 400 is formed with a plurality of heat dissipating ribs. The heat dissipation gaps are formed between the heat dissipation ribs, and besides the heat dissipation ribs are attached to the metal fixing support 102 to transfer heat to the metal fixing support 102, the heat exchange area between the heat dissipation ribs and the surrounding air can be increased, so that the heat exchange with the surrounding air is quickened, and the heat dissipation effect is improved.

In one embodiment of the present utility model, the bottom chassis 300 is filled with connection ribs at gaps between the heat dissipation ribs. When the fixing of the heat sink 400 and the bottom case 300 is achieved by means of the beer sleeving process, the plastic material for injection molding the bottom case 300 fills the gaps between the heat sink ribs to form the connecting ribs, so that the contact area between the bottom case 300 and the heat sink 400 can be increased, and the reliability of connection between the bottom case 300 and the heat sink 400 is improved.

Specifically, the heat dissipation ribs extend along a straight line, and the heat dissipation ribs are arranged in parallel, although the heat dissipation ribs may also extend along a curve, and the heat dissipation ribs are arranged concentrically. The shape, extending direction and positional relationship of each heat dissipating rib are not limited in this embodiment.

In an embodiment of the present utility model, the heat sink 400 includes a first area and a second area, where the width of the first area is greater than that of the second area, and magnetic particle placing grooves 302 are disposed on two sides of the second area, and the magnetic particle placing grooves 302 are used for placing an adsorption magnet to adsorb the metal fixing support 102, so as to facilitate fixing the bottom shell 300 and the metal fixing support 102. In this embodiment, in order to increase the area of the heat sink 400, the heat sink 400 is divided into a plurality of regions, and each region is designed to have an area as large as possible according to the surrounding structure. For example, in the view shown in fig. 4, the first region of the heat sink 400 is located above the second region, and the second region is located with the magnetic particle placement groove 302, so that the width of the second region cannot be too wide in order not to affect the arrangement of the magnetic particle placement groove 302, whereas the first region located above the second region may be designed to be larger than the width of the second region because no corresponding structure is arranged, so as to increase the overall area of the heat sink 400.

Because the widths of the first area and the second area of the heat sink 400 are different, in order to avoid the occurrence of stress due to the abrupt change of the dimensions at the junction of the first area and the second area, in this embodiment, the heat sink 400 further includes a transition area located between the first area and the second area, and the width of the transition area gradually narrows from the first area to the second area in the direction of the second area, that is, the transition area is used to gradually transition the first area with a wider width to the second area with a narrower width through the slow change of the width, which is not only beneficial to the injection molding of the bottom shell 300, avoiding the occurrence of injection molding defects, but also avoiding the occurrence of stress concentration, thereby affecting the service lives of the bottom shell 300 and the heat sink 400.

In order to ensure reliability at the junction of the bottom chassis 300 and the heat sink 400, a thickened rim 304 protruding from the substrate surface of the bottom chassis 300 is formed at the outer side of the heat sink 301. I.e., the thickness of the bottom case 300 at the periphery of the heat sink 400 is greater than the thickness of the substrate of the bottom case 300, by thickening this position, the plastic material wrapped around the edge of the heat sink 400 is more, and the reliability of connection is higher.

As shown in fig. 1 to 3, the embodiment of the present utility model further discloses an intelligent screen, which includes a panel assembly 200, a power assembly 100, and a heat dissipation assembly disposed between the panel assembly 200 and the power assembly 100, wherein the heat dissipation assembly is the heat dissipation assembly disclosed in the above embodiment, the metal fixing support 102 is disposed on the power assembly 100, and the electronic components are disposed on the panel assembly 200. The power supply assembly 100 is provided with a first wiring terminal 101, the face shell assembly 200 is provided with a second wiring terminal, and the power supply assembly 100 and the face shell assembly 200 are electrically connected through the plugging of the first wiring terminal 101 and the second wiring terminal so as to supply power to electronic components. The bottom case 300 is provided with a terminal groove 303 through which the first connection terminal 101 passes. The smart screen disclosed in the embodiment of the utility model has all the technical effects of the heat dissipation assembly due to the heat dissipation assembly, and is not described herein.

It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.

As used in this application and in the claims, the terms "a," "an," "the," and/or "the" are not specific to the singular, but may include the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The inclusion of an element defined by the phrase "comprising one … …" does not exclude the presence of additional identical elements in a process, method, article, or apparatus that comprises an element.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the core concepts of the utility model. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims.

Claims (10)

1. A heat dissipation assembly for dissipating heat from an electronic product, comprising:

a bottom case (300), wherein the bottom case (300) is provided with a heat dissipation groove (301) penetrating through the wall thickness;

the heat dissipation plate (400), the heat dissipation plate (400) is fixed in the heat dissipation groove (301), and the first surface of the heat dissipation plate (400) is a heat conduction surface for being attached to an electronic component of an electronic product;

and the second surface of the radiating fin (400) is attached to the metal fixing support (102), and the first surface and the second surface of the radiating fin (400) are opposite side surfaces.

2. The heat sink assembly of claim 1, wherein the heat sink (400) is secured to the bottom case (300) by a beer over process.

3. The heat sink assembly of claim 1, wherein the first surface of the heat sink (400) is planar; and/or, the second surface of the heat sink (400) is formed with a plurality of heat dissipating ribs.

4. A heat dissipating assembly according to claim 3, wherein said bottom shell (300) is filled with connecting ribs at the gaps between said heat dissipating ribs.

5. A heat dissipating assembly according to claim 3, wherein said heat dissipating ribs extend in a straight line and each of said heat dissipating ribs is arranged in parallel; or,

the heat dissipation ribs extend along a curve, and the heat dissipation ribs are concentrically arranged.

6. The heat dissipating assembly of claim 1 wherein said heat sink (400) comprises a first region and a second region, and wherein a width of said first region is greater than a width of said second region, and wherein magnetic particle placement grooves (302) are provided on both sides of said second region, said magnetic particle placement grooves (302) being configured to place an attracting magnet to attract said metal fixture (102).

7. The heat sink assembly of claim 6 wherein the heat sink (400) further comprises a transition region between the first region and the second region, the transition region tapering in width in a direction from the first region to the second region.

8. The heat dissipating assembly of claim 1, wherein a thickened rim (304) protruding from a substrate surface of the bottom chassis (300) is formed on an outer side of the heat dissipating groove (301).

9. The heat sink assembly of any one of claims 1-8, wherein the bottom shell (300) is a plastic bottom shell or a plastic bottom shell;

the heat sink (400) is a metal heat sink.

10. An intelligent screen, characterized by, including face-piece subassembly (200) and power supply module (100) and set up in radiating subassembly between face-piece subassembly (200) and power supply module (100), radiating subassembly is the radiating subassembly of any one of claims 1-9, metal fixed bolster (102) set up in on power supply module (100), electronic components set up in on face-piece subassembly (200).