CN111740037A - Fingerprint identification laminating device - Google Patents
Fingerprint identification laminating device Download PDFInfo
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- CN111740037A CN111740037A CN202010700722.3A CN202010700722A CN111740037A CN 111740037 A CN111740037 A CN 111740037A CN 202010700722 A CN202010700722 A CN 202010700722A CN 111740037 A CN111740037 A CN 111740037A
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- 238000010030 laminating Methods 0.000 title claims abstract description 255
- 239000000463 material Substances 0.000 claims abstract description 179
- 238000007599 discharging Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 5
- 238000012546 transfer Methods 0.000 description 91
- 239000012528 membrane Substances 0.000 description 70
- 239000002356 single layer Substances 0.000 description 27
- 239000002699 waste material Substances 0.000 description 24
- 238000012937 correction Methods 0.000 description 23
- 238000003723 Smelting Methods 0.000 description 9
- 210000001503 joint Anatomy 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 6
- 238000011084 recovery Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000010009 beating Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000007306 turnover Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000006247 magnetic powder Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Automation & Control Theory (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention relates to the technical field of laminating processing, and discloses a fingerprint identification laminating device which comprises a laminating feeding, discharging and carrying arm, an OLED (organic light emitting diode) feeding and carrying arm, an OLED laminating upper vacuum cavity, an OLED laminating lower vacuum cavity and an OLED carrying platform, wherein the OLED feeding and carrying arm moves an OLED screen to the OLED carrying platform, the OLED carrying platform moves the OLED screen into the OLED laminating upper vacuum cavity, and the laminating feeding, discharging and carrying arm moves an IC (integrated circuit) chip to the OLED laminating lower vacuum cavity; through utilizing the laminating to go up unloading and moving arm, OLED material loading and move arm, OLED laminating upper vacuum cavity, OLED laminating lower vacuum cavity and OLED and accept the platform, the laminating process of whole OLED and IC chip is very high-efficient.
Description
Technical Field
The invention relates to the technical field of laminating processing, in particular to a fingerprint identification laminating device.
Background
With the increasing demand of touch screen electronic products such as mobile phones and the like, the security of the touch screen electronic products needs to be more and more emphasized, the fingerprint identification technology is a biological identification technology, and the fingerprint identification system is a set of mode identification system comprising fingerprint image acquisition, processing, feature extraction and comparison peer-to-peer modules; the fingerprint identification technology is commonly used in places needing personnel identity confirmation, such as an access control system, an attendance system, a notebook computer, bank internal processing, bank payment and the like, and the fingerprint identification technology gradually becomes a mainstream on touch screen electronic products.
At present, the automatic laminating machine for fingerprint identification mainly comprises an OLED feeding machine, a soft laminating machine, an IC film tearing machine, a vacuum cavity laminating machine and a finished product blanking machine.
In the prior art, an efficient fingerprint identification laminating device is lacked.
Disclosure of Invention
The invention aims to provide a fingerprint identification bonding device, and aims to provide an efficient fingerprint identification bonding device.
The invention is realized in such a way that the fingerprint identification attaching device comprises an attaching feeding and discharging carrying arm, an OLED feeding and carrying arm, an OLED attaching upper vacuum cavity, an OLED attaching lower vacuum cavity and an OLED receiving platform, the OLED loading and carrying arm moves the OLED screen to the OLED carrying platform, the OLED carrying platform moves the OLED screen into the OLED attaching vacuum cavity, the bonded upper and lower material carrying arms move the IC chip to the OLED bonded lower vacuum cavity, the OLED and the IC alignment assembly are respectively aligned with the IC chip and the OLED screen, the OLED upper vacuum cavity and the OLED lower vacuum cavity are respectively moved to a joint position, the OLED upper vacuum cavity and the OLED lower vacuum cavity are jointed, the OLED and the IC chip are jointed to form a finished product, the upper vacuum cavity moves the finished product to the laminating feeding and discharging moving arm, and the laminating feeding and discharging moving arm discharges the finished product.
Further, OLED material loading is moved the arm and is included OLED laminating material loading Z axle module, OLED laminating material loading X axle module, OLED laminating material loading R axle module, OLED laminating material loading sucking disc, OLED laminating material loading portal frame, OLED laminating material loading X axle module with OLED laminating material loading portal frame connects, OLED laminating material loading sucking disc with OLED laminating material loading R axle module attach, OLED laminating material loading R axle module with OLED laminating material loading Z axle module attach, OLED laminating material loading Z axle module, OLED laminating material loading X axle module order about OLED laminating material loading sucking disc and remove in X axle direction and Z axle direction, OLED laminating material loading R axle module order about OLED laminating material loading sucking disc is rotatory.
Furthermore, OLED and IC alignment subassembly include the subassembly of counterpointing on the OLED, OLED accepts the platform and includes that OLED accepts the vacuum chuck, OLED accepts photoelectric sensor, OLED accepts the bottom plate and OLED accepts the Y axle module, OLED accepts the vacuum chuck with OLED accepts the bottom plate and is connected, OLED goes up the subassembly of counterpointing with OLED accepts the bottom plate and is connected, OLED accepts photoelectric sensor with OLED accepts the bottom plate and is connected, OLED accepts the Y axle module and controls OLED accepts the bottom plate and move about in the Y axle direction, OLED accepts photoelectric sensor and OLED goes up the subassembly control of counterpointing the position that OLED accepts the bottom plate, OLED accepts the vacuum chuck and adsorbs the OLED screen.
Further, unloading is carried the arm and is included IC laminating material loading subassembly in the laminating, OLED and IC counterpoint subassembly include IC lower counterpoint subassembly, IC laminating material loading subassembly includes IC laminating lift cylinder, IC laminating revolving cylinder, IC laminating material loading suction nozzle and IC laminating interval X axle module, IC laminating interval X axle module with IC laminating lift cylinder connects, IC laminating revolving cylinder with IC laminating lift cylinder, IC laminating material loading suction nozzle with IC laminating revolving cylinder pneumatic connection, IC laminating lift cylinder with IC laminating revolving cylinder orders about the IC chip is rotatory or goes up and down, IC laminating interval X axle module orders about IC laminating lift cylinder with IC laminating revolving cylinder removes on X axle laminating unloading support.
Further, the arm is moved in laminating including finished product laminating unloading subassembly to last unloading of laminating, finished product laminating unloading subassembly includes finished product unloading support, finished product laminating interval X axle module and finished product unloading Z axle module, finished product unloading support with finished product unloading Z axle module connects, finished product unloading Z axle module with finished product laminating interval X axle module connects, finished product laminating interval X axle module is in on the X axle laminating unloading support remove.
Further, vacuum cavity includes smelting tool, OLED laminating XXY platform under OLED laminating pressure cylinder, the OLED laminating under the OLED laminating, OLED laminating pressure cylinder with OLED laminating XXY platform is connected, the upper surface of OLED laminating XXY platform sinks to form lower vacuum cavity, the smelting tool is located under the OLED laminating in the vacuum cavity down, lower vacuum cavity with OLED laminating pressure cylinder is pneumatic to be connected, and the IC chip is placed on the smelting tool under the OLED laminating.
Further, vacuum cavity includes that the OLED laminating moves and carries Y axle module under the OLED laminating, OLED laminating XXY platform with the OLED laminating moves and carries Y axle module connection, the OLED laminating moves and carries Y axle module and orders about the OLED laminating moves and carries Y axle module and remove in Y axle direction.
Further, vacuum cavity includes OLED laminating upper platform and OLED on the OLED laminating smelting tool, OLED on laminate the smelting tool with OLED laminates upper platform and connects, and arranges down.
Further, be formed with last vacuum cavity on the lower surface of platform on the OLED laminating, the last laminating smelting tool of OLED is located go up in the vacuum cavity.
Further, vacuum cavity includes Z axle module on the OLED laminating, OLED laminating upper mounting plate with Z axle module is connected on the OLED laminating, Z axle module is connected with the laminating portal frame on the OLED laminating, Z axle module orders about on the OLED laminating upper mounting plate reciprocates in the Z axle orientation.
Compared with the prior art, the fingerprint identification attaching device provided by the invention has the advantages that the attaching process of the whole OLED and the IC chip is very efficient by utilizing the attaching feeding and discharging carrying arm, the OLED feeding and carrying arm, the OLED attaching upper vacuum cavity, the OLED attaching lower vacuum cavity and the OLED receiving platform.
Drawings
Fig. 1 is a schematic perspective view of an automatic laminating machine for fingerprint identification according to the present invention;
FIG. 2 is a schematic perspective view of an automatic laminating machine for fingerprint identification according to the present invention;
fig. 3 is a schematic perspective view of an automatic laminating machine for fingerprint identification according to the present invention;
fig. 4 is a schematic perspective view of an automatic laminating machine for fingerprint identification according to the present invention;
fig. 5 is a schematic perspective view of an automatic laminating machine for fingerprint identification according to the present invention;
fig. 6 is a schematic perspective view of an automatic laminating machine for fingerprint identification according to the present invention;
FIG. 7 is a schematic perspective view of an OLED lift structure provided by the present invention;
FIG. 8 is a schematic perspective view of an OCA cage assembly provided by the present invention;
FIG. 9 is a schematic perspective view of an OLED take-out assembly provided by the present invention;
FIG. 10 is a schematic perspective view of an OCA cartridge assembly provided by the present invention;
FIG. 11 is a schematic perspective view of an OCA tear-off lightweight film assembly provided by the present invention;
FIG. 12 is a schematic perspective view of a peel-off patch supply structure provided by the present invention;
FIG. 13 is a schematic perspective view of an OLED tear film assembly provided by the present invention;
fig. 14 is a schematic perspective view of an OLED flip loading robot provided in the present invention;
figure 15 is a schematic perspective view of a CG-bonded gantry arm assembly provided by the present invention;
FIG. 16 is a perspective view of an IC loading arm according to the present invention;
FIG. 17 is a schematic perspective view of a peel arm on an IC provided by the present invention;
FIG. 18 is a schematic perspective view of an IC peel arm provided by the present invention;
FIG. 19 is a schematic side view of a tear-off arm on an OLED provided by the present invention;
FIG. 20 is a perspective view of the attached loading/unloading carrier arm according to the present invention;
FIG. 21 is a schematic perspective view of an OLED attached to an upper vacuum chamber provided by the present invention;
FIG. 22 is a schematic perspective view of an OLED receiving platform provided by the present invention;
FIG. 23 is a schematic perspective view of a vacuum chamber under OLED attachment provided by the present invention;
FIG. 24 is a schematic perspective view of an NG throwing assembly provided by the present invention;
fig. 25 is a perspective view of a finished transfer platform assembly provided by the present invention;
fig. 26 is a perspective view of a single-layer TRAY moving stage according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following describes the implementation of the present invention in detail with reference to specific embodiments.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms may be understood by those skilled in the art according to specific circumstances.
Referring to fig. 1-26, preferred embodiments of the present invention are provided.
The fingerprint identification laminating device that this embodiment provided for be used for laminating OLED screen and IC chip and unloading finished product.
Automatic rigging machine of fingerprint identification, including OLED material loading dyestripping structure, OLED upset and transfer structure, easily tear and paste feed structure 16, OCA folded sheet feed structure, OCA dyestripping structure, OLED and OCA laminated structure, OLED and OCA dyestripping structure, IC chip loading attachment, finished product unloading recovery structure, fingerprint identification laminating device, OLED material loading dyestripping structure, OLED upset and transfer structure are to OLED screen dyestripping and transfer, OCA folded sheet feed structure, easily tear and paste feed structure 16, OCA dyestripping structure material loading OCA and tear OCA's membrane, OLED and OCA laminated structure, OLED screen and OCA dyestripping structure laminating OLED screen and OCA, form and wait to adorn the OLED screen, IC chip loading attachment material IC chip, wait to adorn OLED screen and IC chip and be removed to fingerprint identification laminating device, fingerprint identification laminating device laminating is waited to adorn OLED screen and IC chip, retrieve by finished product unloading recovery structure after forming the finished product.
Utilize OLED material loading to tear membrane structure, OLED upset and transfer structure, easily tear and paste feed structure 16, OCA folded sheet charge-in structure, OCA tears membrane structure, OLED and OCA laminated structure, OLED and OCA tear membrane structure, IC chip loading attachment, finished product unloading recovery structure, fingerprint identification laminating device can automated processing and laminating OLED and IC chip, the handling time and the cost that significantly reduce, it is very convenient.
The OLED feeding and film tearing structure comprises an OLED real TRAY feeding conveying belt 19, a single-layer TRAY moving carrying platform 22, an OLED empty TRAY discharging conveying belt 18, an OLED lifting structure 11, an OLED material taking assembly 12, an OLED film tearing platform assembly 14 and an OLED film tearing assembly 15, the OLED real TRAY feeding conveying belt 19 conveys a TRAY disc loaded with an OLED screen, the single-layer TRAY moving carrying platform 22 moves the single-layer TRAY disc and is lifted to the material taking position of the OLED material taking assembly 12 through the OLED lifting structure 11, and after the OLED material taking assembly 12 takes materials from the single-layer TRAY disc, the single-layer TRAY disc moves to the OLED empty TRAY discharging conveying belt 18 through a transfer carrying platform 17 to be discharged; OLED material taking assembly 12 takes the OLED screen to OLED film tearing platform assembly 14, the OLED screen is placed on OLED film tearing platform assembly 14, and OLED film tearing assembly 15 tears the OLED screen.
OCA lamination loading attachment material loading OCA to and OLED upset material loading manipulator material loading OLED screen, OCA lamination loading attachment structure removes OLED and OCA laminated structure, OCA tears the membrane structure and easily tears the membrane that pastes feed structure 16 combination and tear OCA, OLED is removed to OLED and OCA laminated structure, OLED and OCA laminating OCA and OLED screen.
OLED and OCA tear film structure include that OLED moves a year platform 32, tear film arm 33 on the OLED, tear film arm 34 and OLED transfer platform 35 under the OLED, OLED moves a year platform 32 and shifts OLED screen and tear film arm 33 on OLED, tear the upper surface membrane back that removes the OLED screen, OLED moves a year platform 32 and removes OLED screen and tear film arm 34 and tear the membrane that removes OCA under OLED screen to OLED, OLED screen removes and transfers platform 35 in OLED and carry out the transfer.
IC chip loading attachment includes IC chip loading structure, IC chip and tears the membrane and shift the structure, and IC chip loading structure includes IC material loading arm 38, IC upset subassembly 39, and IC material loading arm 38 material loading IC chip, IC upset subassembly 39 upset IC chip, and IC chip tears the membrane and shifts the structure and tear the membrane and clean to IC chip.
Finished product unloading recovery structure includes IC empty TRAY unloading conveyer belt, IC reality TRAY material loading conveyer belt, NG throws material subassembly 51, IC gets the material subassembly and IC moves and carries the platform subassembly, IC empty TRAY unloading conveyer belt, IC reality TRAY material loading conveyer belt and IC get the material subassembly and connect gradually, IC reality TRAY material loading conveyer belt transportation has off-the-shelf TRAY dish, IC gets the material subassembly and takes off the finished product from the TRAY dish, unqualified quilt gets material subassembly scanning back in the finished product and throws material subassembly 51 through NG and throw away, IC empty TRAY unloading conveyer belt removes empty TRAY dish, IC gets the material subassembly and removes the finished product to IC moves and carries the platform subassembly on.
Fingerprint identification laminating device removes arm 49 including the laminating unloading, the arm 46 is removed in the OLED material loading, vacuum cavity 50 on the OLED laminating, vacuum cavity 45 and OLED accept platform 47 under the OLED laminating, the OLED material loading is removed arm 46 and is removed the OLED screen and accept platform 47 to OLED, OLED accepts platform 47 and is filtered OLED and move vacuum cavity 50 on the OLED laminating into, the laminating unloading is removed arm 49 and is removed vacuum cavity 45 under IC chip to the OLED laminating, OLED and IC counterpoint subassembly counterpoint IC chip and OLED screen, vacuum cavity laminates under vacuum cavity and the OLED on the OLED, OLED and the laminating of IC chip.
Easily tear subsides feed structure 16 and including easily tearing subsides feed block 71, receipts waste film subassembly 73, direction subassembly 74 and easily tear subsides cylinder assembly 72, easily tear and paste feed block 71 material loading, through direction subassembly 74, easily tear subsides cylinder assembly 72 and order about easily to tear the subsides flow direction and receive waste film subassembly 73, and easily tear the subsides and receive easily to tear subsides cylinder assembly 72 and order about providing the easy subsides that tear of OCA dyestripping structure.
OLED and OCA laminated structure include CG laminating longmen arm subassembly 29, OCA box with a net subassembly 30 and OCA counterpoint subassembly 23, CG laminating longmen arm subassembly 29 is connected with OCA box with a net subassembly 30, OCA counterpoint subassembly 23 counterpoint OCA and OLED screen, CG laminating longmen arm subassembly 29 orders about OCA box with a net subassembly 30 laminating OCA and OLED screen.
OCA lamination loading structure includes OCA magazine subassembly 27, OCA material loading correction transfer subassembly, OCA butt joint material loading manipulator 26, OCA magazine subassembly 27 feed, and OCA material loading correction transfer subassembly material loading and correction OCA, OCA butt joint material loading manipulator 26 remove OCA and remove to OCA box with a net subassembly 30 and laminate after tearing the membrane to OCA dyestripping structure.
Through utilizing OCA magazine subassembly 27, OCA material loading to rectify transfer subassembly, OCA butt joint material loading manipulator 26, OCA magazine subassembly 27 feed, OCA material loading is rectified the transfer subassembly material loading and is rectified OCA, and OCA butt joint material loading manipulator 26 removes OCA and removes to OCA box with a net subassembly 30 and laminate after tearing the membrane to OCA dyestripping structure, and whole process is very high-efficient.
OCA lamination loading structure includes OCA magazine subassembly 27, OCA material loading correction transfer subassembly, OCA butt joint material loading manipulator 26, OCA magazine subassembly 27 feed, and OCA material loading correction transfer subassembly material loading and correction OCA, OCA butt joint material loading manipulator 26 remove OCA and remove to OCA box with a net subassembly 30 and laminate after tearing the membrane to OCA dyestripping structure.
The OCA magazine assembly 27 comprises an OCA discharging bottom plate 62, a first receiving bottom plate 63, a second receiving bottom plate 64, a rotary cylinder connected with the second receiving bottom plate 64 and a plurality of support columns, wherein the support columns support and are connected with the first receiving bottom plate 63 and the second receiving bottom plate 64, the OCA discharging bottom plate 62 is connected with the first receiving bottom plate 63, the rotary cylinder drives the first receiving bottom plate 63 and the second receiving bottom plate 64 to rotate to drive the OCA discharging bottom plate 62, and the OCA feeding correction transfer assembly corrects the OCA butt joint feeding manipulator 26 to take materials; a stepping motor 65 is further arranged between the first receiving bottom plate 63 and the second receiving bottom plate 64, and the stepping motor 65 pushes the OCA discharging bottom plate 62 to move upwards.
OCA material loading is rectified the transfer subassembly and is included OCA material loading module, OCA correction transfer module, and OCA material loading module absorbs OCA and removes OCA correction transfer module, and OCA correction transfer module is proofreaied and correct and the transfer OCA position.
The OCA feeding module comprises an OCA feeding suction nozzle, an OCA shaking cylinder, an OCA feeding guide rail and an OCA feeding portal frame, the OCA feeding guide rail is arranged on the OCA feeding portal frame, the OCA shaking cylinder is movably connected with the OCA feeding guide rail through a mounting plate, the OCA shaking cylinder is connected with the OCA feeding suction nozzle, and the OCA feeding suction nozzle sucks OCA; OCA material loading module still includes ionic wind machine, and ionic wind machine gets rid of OCA and goes up static, and ionic wind machine is connected with OCA material loading portal frame.
The OCA correction transfer module comprises an OCA transfer suction nozzle, an OCA transfer guide rail, an OCA transfer cylinder and an OCA vacuum plate, wherein the OCA transfer cylinder is connected with the OCA transfer suction nozzle and is in sliding connection with the OCA transfer guide rail; OCA transfer cylinder is connected through the handle with OCA transfer suction nozzle between, and OCA transfer suction nozzle absorbs OCA to OCA vacuum plate on.
OCA rectifies the transfer module and still includes OCA correction guide rail, OCA correction board, OCA connecting piece and OCA correction X to the module, OCA transfer suction nozzle absorption OCA is back to OCA vacuum plate on, OCA correction board helps correcting OCA's direction, OCA corrects X and orders about OCA correction board and OCA vacuum plate fine setting to the module and removes, OCA corrects X and is connected with the OCA connecting piece to the module, OCA connecting piece and OCA correction guide rail sliding connection.
The OCA correction transfer module also comprises an OCA correction cylinder, and the OCA correction cylinder is pneumatically connected with the OCA correction X-direction module; be equipped with the buffer on the OCA rectifies the guide rail, the buffer prevents that the OCA connecting piece from removing and breaks away from OCA and rectifies the guide rail.
The OLED feeding and film tearing structure comprises an OLED real TRAY feeding conveying belt 19, a single-layer TRAY moving carrying platform 22, an OLED empty TRAY discharging conveying belt 18, an OLED lifting structure 11, an OLED material taking assembly 12, an OLED film tearing platform assembly 14 and an OLED film tearing assembly 15, the OLED real TRAY feeding conveying belt 19 conveys a TRAY disc loaded with an OLED screen, the single-layer TRAY moving carrying platform 22 moves the single-layer TRAY disc and is lifted to the material taking position of the OLED material taking assembly 12 through the OLED lifting structure 11, and after the OLED material taking assembly 12 takes materials from the single-layer TRAY disc, the single-layer TRAY disc moves to the OLED empty TRAY discharging conveying belt 18 through a transfer carrying platform 17 to be discharged; OLED material taking assembly 12 takes the OLED screen to OLED film tearing platform assembly 14, the OLED screen is placed on OLED film tearing platform assembly 14, and OLED film tearing assembly 15 tears the OLED screen.
Through OLED real TRAY material loading conveyer belt 19, individual layer TRAY removal microscope carrier 22, empty TRAY unloading conveyer belt 18 of OLED, OLED elevation structure 11, OLED get material subassembly 12, OLED tear film platform subassembly 14 and OLED tear film subassembly 15 and carry out the material loading and tear the membrane on the OLED screen to the OLED screen, very high-efficient.
The OLED real TRAY feeding conveyor belt 19 comprises an OLED conveyor, an OLED feeding guide rail, an OLED feeding belt, an OLED feeding support plate, an OLED feeding sensor and an OLED in-place sensor, wherein the OLED feeding belt is connected with the OLED feeding guide rail in a sliding mode; the OLED feeding guide rail is provided with an OLED feeding sensor and an OLED in-place sensor, the OLED feeding sensor senses feeding of an OLED real TRAY disc, and the OLED in-place sensor sends a signal when the OLED real TRAY disc passes through the OLED in-place sensor; OLED material loading backup pad supports OLED material loading guide rail.
The single-layer TRAY moving carrying platform 22 comprises a single-layer guide rail, a single-layer motor 120, a single-layer transmission shaft and a single-layer transfer assembly 119, wherein the single-layer transfer assembly 119 is connected with the single-layer guide rail, and the single-layer transmission shaft drives the single-layer guide rails on the left side and the right side to move synchronously; the single-layer transfer assembly 119 comprises a single-layer sensor, a single-layer cylinder 121 and a TRAY workpiece, the single-layer cylinder 121 drives the TRAY workpiece to move along the center of a left single-layer guide rail and a right single-layer guide rail, and the single-layer sensor senses that a TRAY disc is separated from or contacts the TRAY workpiece.
The OLED material taking assembly 12 comprises an OLED material taking structure 59, an OLED material taking portal frame, an OLED material taking Y-direction module 61 and an OLED material taking Z-direction module 60, the OLED material taking structure 59 is connected with the OLED material taking portal frame, the OLED material taking Y-direction module 61 is connected with the OLED material taking structure 59, the OLED material taking Z-direction module 60 is connected with the OLED material taking structure 59, and the OLED material taking Y-direction module 61 drives the OLED material taking structure 59 to move in the Y direction; OLED is got material structure 59 and is included OLED and get the material suction nozzle, and OLED is got material Z and is made an order about OLED to get material suction nozzle and reciprocate in the Z direction to module 60, and OLED is got material structure 59, OLED and is got material Y to module 61, OLED and get material Z and to the module 60 back-and-forth movement on OLED and get the material portal frame.
OLED dyestripping platform subassembly 14 includes OLED vacuum smelting tool board, OLED platform guide rail and OLED platform cylinder, and OLED platform cylinder is connected with OLED vacuum smelting tool board pneumatics, and OLED vacuum smelting tool board passes through OLED platform connecting piece and is connected with OLED platform guide rail.
OLED dyestripping portal frame structure includes that OLED dyestripping Z tears membrane Z to module 76, OLED dyestripping X to the module, OLED dyestripping guide rail, OLED dyestripping connecting piece, OLED dyestripping X is connected with OLED dyestripping guide rail to the module, OLED dyestripping Z tears the membrane Z to module 76 and OLED dyestripping connecting piece is connected, OLED dyestripping connecting piece and OLED dyestripping guide rail are connected, OLED dyestripping clamping jaw and OLED dyestripping connecting piece are connected.
OLED tears membrane subassembly 15 still includes OLED and tears membrane clamping jaw cylinder 75 and OLED and tears membrane servo motor, and OLED tears membrane servo motor control OLED and tears membrane clamping jaw cylinder 75 and orders about OLED and tear the membrane clamping jaw and open and close.
OLED material loading dyestripping structure still includes direction weld holder 20, and direction weld holder 20 is including direction panel beating, section bar support and connecting plate, direction panel beating and section bar support and connecting plate fixed connection, and the transportation of the empty TRAY dish of OLED or the real TRAY dish of OLED is led to the panel beating of direction.
OLED upset and transfer structure move the subassembly 28 including OLED upset manipulator 31 and OLED material loading, OLED upset manipulator 31 moves the subassembly 28 with OLED material loading and is connected, and OLED upset manipulator 31 is with OLED screen upset back, and OLED material loading moves the subassembly 28 and moves and move and carry the OLED screen.
Through utilizing OLED upset manipulator 31 and OLED material loading to move and carry subassembly 28, OLED upset manipulator 31 moves the subassembly 28 with OLED material loading and is connected, and OLED upset manipulator 31 is with OLED screen upset back, and OLED material loading moves and carries subassembly 28 and move and carry OLED screen, and whole process is very high-efficient.
OLED upset manipulator 31 includes OLED upset bottom plate 84, OLED upset mounting panel 83, OLED upset suction nozzle, OLED upset chain stay 81 and OLED upset micro joint 82, OLED upset mounting panel 83 and OLED upset bottom plate 84 fixed connection, OLED upset chain stay 81 is connected with OLED upset mounting panel 83, OLED upset suction nozzle and OLED upset micro joint 82 are connected with OLED upset chain stay 81, OLED upset chain stay 81 receives upset step motor 65 to overturn.
The plurality of OLED overturning suction nozzles are arranged on the OLED overturning fork 81 at intervals, and the plurality of OLED overturning micro connectors 82 are arranged on the OLED overturning fork 81 at intervals; the bottom plate is provided with a turnover cylinder, and the turnover cylinder is pneumatically connected with the OLED turnover suction nozzle.
The overturning mounting plate is provided with an overturning bearing seat 79, and the overturning bearing seat 79 is connected with an overturning stepping motor 65 and an OLED overturning fork 81; be equipped with bar code scanner 80 on the upset mounting panel, bar code scanner 80 passes through the upset mounting bracket with the upset mounting panel to be connected, and arranges the upper end at the mounting panel.
Be equipped with upset inductor 85 on the upset mounting panel, upset inductor 85 and 79 interval arrangements of upset bearing frame, the upset of upset inductor 85 response OLED screen.
The OLED loading transfer assembly 28 comprises an OLED loading transfer linear motor, an OLED loading transfer support, an OLED loading transfer bus plate and an OLED loading transfer suction nozzle rod, the OLED loading transfer suction nozzle rod is connected with the OLED loading transfer support, the OLED loading transfer bus plate is connected with the OLED loading transfer support, the OLED loading transfer support is connected with an OLED loading transfer bottom plate, and the OLED loading transfer bottom plate is connected with the OLED loading transfer linear motor.
The OLED feeding and transferring assembly 28 comprises an OLED feeding and transferring cylinder, the OLED feeding and transferring cylinder is pneumatically connected with an OLED feeding and transferring suction nozzle rod, and the OLED feeding and transferring cylinder is connected with an OLED feeding and transferring support.
The OLED loading and transferring assembly 28 comprises an OLED loading and transferring guide rail, and the OLED loading and transferring bottom plate is connected with the OLED loading and transferring guide rail in a sliding mode.
Easily tear a card feed structure including easily tearing and pasting material loading subassembly 71, receipts waste film subassembly 73, direction subassembly 74 and easily tearing and pasting cylinder assembly 72, easily tear and paste material loading of material loading subassembly 71, through direction subassembly 74, easily tear and paste cylinder assembly 72 and order about easily tearing to paste the flow direction and receive waste film subassembly 73, and easily tear and paste and order about providing the easy subsides that tear of OCA dyestripping structure by easily tearing and pasting cylinder assembly 72.
Through utilizing easily tearing to paste material loading subassembly 71, receipts waste film subassembly 73, direction subassembly 74 and easily tearing to paste cylinder assembly 72, easily tearing to paste material loading subassembly 71 material loading, through direction subassembly 74, easily tearing to paste cylinder assembly 72 and order about easily to tear and paste the flow direction and receive waste film subassembly 73, and easily tear to paste and receive easily to tear to paste cylinder assembly 72 and order about providing OCA dyestripping structure and easily tear the subsides, whole process is very high-efficient.
The easy-to-tear patch feeding structure comprises an easy-to-tear patch mounting plate, the guide assembly 74 comprises a plurality of easy-to-tear patch fixing columns, the easy-to-tear patch feeding assembly 71 comprises an easy-to-tear patch wheel disc, the easy-to-tear patch wheel disc is rotatably connected with the easy-to-tear patch mounting plate, and the easy-to-tear patch fixing columns are fixedly connected with the easy-to-tear patch mounting plate; a plurality of easily tear and paste the upper surface that the fixed post interval arrangement was pasted the mounting panel at easily tearing.
Easy-to-tear paste support columns are arranged on the lower surface of the easy-to-tear paste mounting plate and are arranged at the four corners of the lower surface of the easy-to-tear paste mounting plate; one side of the easy-to-tear mounting plate is provided with a tensioning assembly which is used for tensioning the easy-to-tear mounting plate.
The waste film collecting component 73 is arranged on the upper surface of the mounting plate, the waste film collecting component 73 comprises a waste film wheel disc, and the waste film wheel disc is turned to the waste film collecting wheel disc after the easy-tearing sticker is used up; the upper surface of the mounting plate is fixedly connected with the air cylinder component.
The two air cylinder assemblies are arranged among the plurality of easy-tearing and sticking fixing columns at intervals; a magnetic powder controller is arranged on the lower surface of the mounting plate and controls the easy-to-tear wheel disc to rotate; the easy-tearing sticking wheel disc is connected with the magnetic powder controller rod piece.
OCA dyestripping structure includes OCA tears light membrane subassembly 24, OCA tears light membrane subassembly 24 including tearing light membrane X to module 70, tear light membrane Y to module 67, tear light membrane Z to module 69, tear light membrane connecting piece, OCA module mounting panel, tear light membrane servo motor 66, OCA tears light membrane cylinder 68 and OCA and tears light membrane clamping jaw, OCA tears light membrane clamping jaw and OCA and tears light membrane cylinder 68 to be connected, servo motor orders OCA to tear light membrane cylinder 68 to control OCA to tear light membrane clamping jaw and presss from both sides and put, tear light membrane connecting piece and tear light membrane servo motor 66 to be connected, and with tear light membrane Y to module 67, tear light membrane Y to module 67 and tear light membrane Z to module 69 to be connected, tear light membrane Z to module 69 and OCA module mounting panel to be connected, OCA module mounting panel and tear light membrane X to module 70 to be connected, light membrane X to module 70, tear light membrane Y to module 67, tear light membrane Z to module 69, tear light membrane Z to module linkage control at OCA to tear light membrane clamping jaw at OCA, Y, Z in the direction of the moving object.
Through utilizing OCA to tear light membrane subassembly 24, OCA tears light membrane subassembly 24 including tearing light membrane X to module 70, tear light membrane Y to module 67, tear light membrane Z to module 69, tear light membrane connecting piece, OCA module mounting panel, tear light membrane servo motor 66, OCA tear light membrane cylinder 68 and OCA tear light membrane clamping jaw and tear the membrane to OCA, whole process ten minutes is high-efficient.
The OCA film tearing structure comprises a small ear feeding assembly 25, the small ear feeding assembly 25 comprises an easy-tearing-and-pasting feeding structure 16 and a waste material structure, and the easy-tearing-and-pasting feeding structure 16 is connected with the waste material structure; the easy-tear sticker feeding structure 16 comprises an easy-tear sticker mounting plate, and the waste material structure comprises a waste material box which is fixedly connected with the easy-tear sticker mounting plate.
The small ear feeding assembly 25 comprises at least two waste material boxes which are arranged in parallel, and the OCA tears the light film clamping jaw to throw the waste film on the OCA into the waste material boxes.
The waste material box upper end is equipped with the waste material box opening, and the waste material box is equipped with the waste material chamber, and waste material box opening intercommunication waste material chamber.
The OCA light film tearing clamping jaws and the OCA light film tearing air cylinders 68 are arranged on two sides of the light film tearing Y-direction module 67 in pairs; the light film tearing connecting piece comprises a light film tearing mounting rack, and an OCA light film tearing clamping jaw and an OCA light film tearing cylinder 68 are connected to two sides of the light film tearing mounting rack; the upper side part of the light film tearing mounting frame is fixedly connected with the light film tearing Y-direction module 67.
The light tearing film Y-direction module 67 comprises a light tearing film Y-direction extending frame and a light tearing film Y-direction servo motor arranged at the rear end of the light tearing film Y-direction extending frame, and the light tearing film Y-direction servo motor drives the light tearing film Y-direction extending frame to move back and forth in the Y-axis direction; be equipped with on the OCA module mounting panel and tear light membrane Z to the calandria, tear and be equipped with the well through-hole of intercommunication electric wire in the light membrane Z to the calandria.
The light tearing film X-direction module 70 is provided with a light tearing film X-direction calandria, and a middle through hole for communicating electric wires is arranged in the light tearing film X-direction calandria.
OLED and OCA laminated structure include CG laminating longmen arm subassembly 29, OCA box with a net subassembly 30 and OCA counterpoint subassembly 23, CG laminating longmen arm subassembly 29 is connected with OCA box with a net subassembly 30, OCA counterpoint subassembly 23 counterpoint OCA and OLED screen, CG laminating longmen arm subassembly 29 orders about OCA box with a net subassembly 30 laminating OCA and OLED screen.
Through utilizing CG laminating longmen arm subassembly 29, OCA box with a net subassembly 30 and OCA counterpoint subassembly 23, CG laminating longmen arm subassembly 29 is connected with OCA box with a net subassembly 30, and OCA counterpoint subassembly 23 counterpoint OCA and OLED screen, CG laminating longmen arm subassembly 29 orders about OCA box with a net subassembly 30 laminating OCA and OLED screen, and whole process is very high-efficient.
CG laminating longmen arm subassembly 29 includes attached subassembly 86 on OLED laminating portal frame and the OLED, and attached subassembly 86 swing joint on OLED laminating portal frame and the OLED is equipped with OLED laminating guide rail on the OLED laminating portal frame, attached subassembly 86 and OLED laminating guide rail sliding connection on the OLED.
CG laminating gantry arm assembly 29 includes OLED laminating X to the module, and OLED laminating X is to the module and is driven the attached subassembly 86 back-and-forth movement on OLED laminating guide rail on the OLED.
And an OLED attachment sensor is arranged on the OLED attachment guide rail and used for sensing the movement of the attachment assembly 86 on the OLED.
OCA box with a net subassembly 30 includes OCA laminating guide rail 58, OCA laminating box with a net cavity 56 and arrange OCA laminating gyro wheel 57 on cavity 56 under the OCA laminating box with a net of arranging in pairs, and OCA laminating gyro wheel 57 orders about OCA fixed arrangement under the OCA laminating box with a net on cavity 56, cavity 56 and the OCA laminating guide rail 58 sliding connection who arranges in pairs under the OCA laminating box with a net.
An OCA lower cavity for storing OCA is formed on the OCA attaching net cage lower cavity 56, and the OCA attaching rollers 57 are fixedly connected with the cavity wall of the OCA lower cavity.
Counterpoint CCD subassembly and OCA camera mounting panel arrange in pairs in the both sides of OCA counterpoint installing support's axis.
The OCA is counterpointed still and is connected with OCA counterpoint ion fan on the installing support.
OLED and OCA tear film structure include that OLED moves a year platform 32, tear film arm 33 on the OLED, tear film arm 34 and OLED transfer platform 35 under the OLED, OLED moves a year platform 32 and shifts OLED screen and tear film arm 33 on OLED, tear the upper surface membrane back that removes the OLED screen, OLED moves a year platform 32 and removes OLED screen and tear film arm 34 and tear the membrane that removes OCA under OLED, OLED screen removes and transfers platform 35 in OLED to carry out the transfer.
Move the platform 32 through utilizing OLED to move, tear membrane arm 33 on the OLED, tear membrane arm 34 and OLED transfer platform 35 under OLED, OLED moves and moves platform 32 and shifts OLED screen and tear membrane arm 33 on OLED, tear the upper surface membrane back that removes the OLED screen, OLED moves platform 32 and removes OLED screen and tears membrane arm 34 and tear the membrane that removes OCA under OLED, OLED screen moves and transfers platform 35 to OLED and carry out the transfer, whole OLED and OCA tear membrane process very high-efficient.
The OLED transfer platform 32 comprises a transfer platform A and a transfer platform B, wherein the transfer platform A comprises a transfer sucker A, a transfer vacuum solenoid valve and an IO adapter plate, and the transfer platform B comprises a transfer placing plate, a transfer sucker B, a transfer positioning block, a transfer correcting block and a vacuum pressure regulating valve; the transfer vacuum solenoid valve drives the transfer sucker A to adsorb the OLED screen, the IO adapter plate is electrically connected with the transfer vacuum solenoid valve, and the transfer vacuum solenoid valve is pneumatically connected with the transfer sucker A; the transfer sucker B, the transfer positioning block and the transfer correction block are arranged on the transfer placing plate, the OLED screen is positioned on the transfer placing plate through the transfer positioning block and the transfer correction block, and the vacuum pressure regulating valve is electrically connected with the transfer sucker.
The OLED transfer platform 32 comprises an OLED transfer X-axis guide rail, and the transfer platform A and the transfer platform B are connected on the OLED transfer X-axis guide rail in a sliding mode.
The OLED upper film tearing arm 33 comprises an OLED upper film tearing portal frame, an OLED upper film tearing cylinder 98, an OLED upper film tearing top cylinder 9793, an OLED upper film tearing clamping jaw, an upper film tearing Y-axis module, an upper film tearing shifting Z-axis module 99 and an upper film tearing rotating Q-axis module 90, an OLED upper film tearing clamping jaw is fixedly connected with an OLED upper film tearing cylinder 98 and an OLED upper film tearing jacking cylinder 9793, an upper film tearing rotary Q-axis module 90 is movably connected with the OLED upper film tearing clamping jaw through an upper film tearing connecting piece, an upper film tearing shifting Z-axis module 99 is connected with the upper film tearing rotary Q-axis module 90 through an upper film tearing connecting frame, the upper film tearing shifting Z-axis module 99 is connected with an upper film tearing Y-axis module, the upper film tearing Y-axis module is connected with an OLED upper film tearing portal frame, and the upper film tearing Y-axis module and the upper film tearing Z-axis module 92 drive the OLED upper film tearing cylinder 98, the OLED upper film tearing jacking cylinder 9793 and the OLED upper film tearing clamping jaw to move in the Y-axis direction and the Z-axis direction respectively.
The IC chip feeding structure comprises an IC feeding arm 38, an IC overturning assembly 39 and an IC feeding bin 37, the IC feeding bin 37 carries an IC chip tray, the IC feeding arm 38 comprises an IC taking manipulator, the IC taking manipulator takes materials from the IC chip tray and moves to the IC overturning assembly 39, the IC overturning assembly 39 overturns the IC chip, and the IC feeding bin 37, the IC feeding arm 38 and the IC overturning assembly 39 are sequentially connected.
By utilizing the IC feeding arm 38, the IC overturning component 39 and the IC feeding bin 37, the IC feeding bin 37 carries an IC chip tray, the IC feeding arm 38 comprises an IC material taking manipulator, the IC material taking manipulator takes materials from the IC chip tray and moves to the IC overturning component 39, the IC overturning component 39 overturns the IC chip, and the whole IC feeding and overturning process is very efficient.
The IC feeding bin 37 includes an IC feeding frame, an IC tray bearing plate, and an IC feeding lifting module, the IC feeding lifting module is fixedly connected to the IC feeding frame, and the IC tray bearing plate is connected to the IC feeding lifting module and slidably connected to the IC feeding frame.
The IC feeding frame comprises a first feeding frame body, a second feeding frame body and a third feeding frame body, the first feeding frame body, the third feeding frame body and the second feeding frame body are fixedly connected and arranged, a moving area is enclosed among the first feeding frame body, the second feeding frame body and the third feeding frame body, and an IC tray bearing plate is arranged in the moving area.
The upper end of the second feeding frame body is provided with a feeding position detection piece, and the feeding position detection piece is used for detecting whether the movement of the IC material tray bearing plate is in place.
The IC feeding arm 38 comprises an IC feeding tray X-axis module 87, an IC feeding R-axis module 89, an IC feeding Z-axis module, an IC feeding Y-axis module, an IC feeding X-axis module 88 and an IC feeding mounting chassis; IC material loading tray X axle module 87, IC material loading X axle module 88 are connected with IC material loading installation chassis, and IC material loading Z axle module is connected with IC material loading X axle module 88, and IC material loading Y axle module is connected with IC material loading Z axle module, and IC material loading Y axle module is connected with IC material loading R axle module 89.
The IC chip film tearing and transferring structure comprises an IC upper film tearing arm 40, an IC lower film tearing arm, an IC transfer platform 41, an IC transfer arm 42, a PLASMA cleaning mechanism 43 and an IC initial alignment mechanism 44, wherein the IC upper film tearing arm 40 and the IC lower film tearing arm tear films of IC chips, the IC transfer platform 41 stores IC chips after film tearing, the transfer arm moves the IC chips to the PLASMA cleaning mechanism 43 and the IC initial alignment mechanism 44, the PLASMA cleaning mechanism 43 cleans the IC chips, and the IC initial alignment mechanism 44 performs initial alignment on the IC chips.
The IC film tearing arm 40 comprises an upper film tearing X-axis module, an upper film tearing Z-axis module 92, an upper film tearing guide rail, an upper film tearing rotary Q-axis module 90, an upper film tearing clamping jaw cylinder 91 and an upper film tearing jacking cylinder 93, the upper film tearing clamping jaw cylinder 91 and the upper film tearing jacking cylinder 93 drive an upper film tearing clamping jaw to clamp, the upper film tearing rotary Q-axis module 90 is connected with the upper film tearing clamping jaw cylinder 91, the upper film tearing rotary Q-axis module 90 is connected with the upper film tearing Z-axis module 92 through an upper film tearing connecting frame, the upper film tearing Z-axis module 92 is connected with the upper film tearing X-axis module, the upper film tearing X-axis module is connected with the upper film tearing guide rail, the upper film tearing X-axis module, the upper film tearing Z-axis module 92 drives the upper film tearing clamping jaw cylinder 91 and the upper film tearing jacking cylinder 93 to move in the X-axis direction and the Z-axis direction, and the upper film tearing rotary Q-axis module 90 drives the upper film tearing clamping jaw cylinder 91 to rotate.
Finished product material loading recovery structure, including empty TRAY unloading conveyer belt 21 of finished product, finished product reality TRAY material loading conveyer belt 13, NG throws material subassembly 51, finished product gets material subassembly 52 and finished product and moves a platform subassembly, empty TRAY unloading conveyer belt 21 of finished product, finished product reality TRAY material loading conveyer belt 13 and finished product get material subassembly 52 and connect gradually, finished product reality TRAY material loading conveyer belt 13 transports the TRAY dish that has the finished product, finished product gets material subassembly 52 and takes the finished product off the TRAY dish, unqualified getting material subassembly 52 in the finished product and getting the material subassembly to scan the back through NG and throw material subassembly 51, empty TRAY unloading conveyer belt 21 of finished product removes empty TRAY dish, finished product gets material subassembly 52 and removes the finished product to the finished product and moves a platform subassembly on, finished product moves a platform and shifts the finished product to the assembly line, carries.
The finished product real TRAY feeding conveyer belt 13 comprises a finished product conveyer, a finished product feeding guide rail, a finished product feeding belt in sliding connection with the finished product feeding guide rail, a finished product feeding support plate, a finished product feeding inductor and a finished product in-place inductor, wherein the finished product conveyer is connected with the finished product feeding guide rail to drive the finished product feeding belt to rotate and drive the finished product real TRAY disc to move; a finished product feeding sensor and a finished product in-place sensor are arranged on the finished product feeding guide rail, the finished product feeding sensor senses the feeding of a finished product real TRAY disc, and the finished product in-place sensor sends a signal when the finished product real TRAY disc passes through the finished product in-place sensor; the finished product feeding support plate supports the finished product feeding guide rail.
The NG material throwing assembly 51 comprises a finished product temporary storage platform 116, a finished product material throwing platform 115 and a finished product profile bracket, wherein the finished product temporary storage platform 116 is fixedly connected with the finished product profile bracket, and the finished product material throwing platform 115 is fixedly connected with the finished product profile bracket.
Fingerprint identification laminating device removes arm 49 including the laminating unloading, the arm 46 is removed in the OLED material loading, vacuum cavity 50 on the OLED laminating, vacuum cavity 45 and OLED accept platform 47 under the OLED laminating, the OLED material loading is removed arm 46 and is removed the OLED screen to OLED and accept platform 47, OLED accepts platform 47 and is moved OLED screen immigration OLED vacuum cavity 50 on the OLED laminating, the laminating unloading is removed arm 49 and is removed IC chip 45 under the OLED laminating, OLED and IC counterpoint subassembly counterpoint IC chip and OLED screen respectively, vacuum cavity and OLED move the laminating position respectively under OLED on the OLED, vacuum cavity and OLED vacuum cavity laminating under OLED on the OLED, OLED and IC chip laminating form the finished product, go up vacuum cavity and remove arm 49 with the finished product to the unloading laminating, the arm 49 unloading finished product is removed in the unloading of laminating.
By utilizing the attaching material loading and unloading carrying arm 49, the OLED material loading carrying arm 46, the OLED attaching upper vacuum cavity 50, the OLED attaching lower vacuum cavity 45 and the OLED bearing platform 47, the attaching process of the whole OLED and the IC chip is very efficient.
OLED material loading is moved arm 46 and is included OLED laminating material loading Z axle module, OLED laminating material loading X axle module, OLED laminating material loading R axle module, OLED laminating material loading sucking disc, OLED laminating material loading portal frame, OLED laminating material loading X axle module is connected with OLED laminating material loading portal frame, OLED laminating material loading sucking disc and OLED laminating material loading R axle module attach, OLED laminating material loading R axle module and OLED laminating material loading Z axle module attach, OLED laminating material loading Z axle module, OLED laminating material loading X axle module orders about OLED laminating material loading sucking disc and removes in X axle direction and Z axle direction, OLED laminating material loading R axle module orders about OLED laminating material loading sucking disc rotatory.
The OLED and IC aligning component comprises an upper OLED aligning component, the OLED receiving platform 47 comprises an OLED receiving vacuum sucker 108, an OLED receiving photoelectric sensor 110, an OLED receiving bottom plate and an OLED receiving Y-axis module 109, the OLED receiving vacuum sucker 108 is connected with the OLED receiving bottom plate, the upper OLED aligning component is connected with the OLED receiving bottom plate, the OLED receiving photoelectric sensor 110 is connected with the OLED receiving bottom plate, the OLED receiving Y-axis module 109 controls the OLED receiving bottom plate to move back and forth in the Y-axis direction, the upper OLED receiving photoelectric sensor 110 and the upper OLED aligning component control the position of the OLED receiving bottom plate, and the OLED receiving vacuum sucker 108 absorbs the OLED screen.
Unloading is carried arm 49 and is included IC laminating material loading subassembly in the laminating, OLED and IC counterpoint subassembly include IC lower counterpoint subassembly 48, IC laminating material loading subassembly includes IC laminating lift cylinder, IC laminating revolving cylinder, IC laminating material loading suction nozzle 104 and IC laminating interval X axle module 102, IC laminating interval X axle module 102 is connected with IC laminating lift cylinder, IC laminating revolving cylinder and IC laminating lift cylinder, IC laminating material loading suction nozzle 104 and IC laminating revolving cylinder pneumatic connection, IC laminating lift cylinder orders about the rotation of IC chip or goes up and down with IC laminating revolving cylinder, IC laminating interval X axle module 102 orders about IC laminating lift cylinder and IC laminating revolving cylinder and removes on X axle laminating unloading support.
The laminating upper and lower material moving arm 49 comprises a finished product laminating blanking assembly, the finished product laminating blanking assembly comprises a finished product blanking support 105, a finished product laminating interval X-axis module 103 and a finished product blanking Z-axis module, the finished product blanking support 105 is connected with the finished product blanking Z-axis module, the finished product blanking Z-axis module is connected with the finished product laminating interval X-axis module 103, and the finished product laminating interval X-axis module 103 moves on the X-axis laminating blanking support.
The OLED attaching lower vacuum cavity 45 comprises an OLED attaching pressure cylinder 114, an OLED attaching lower jig 111 and an OLED attaching XXY platform 112, the OLED attaching pressure cylinder 114 is connected with the OLED attaching XXY platform 112, the upper surface of the OLED attaching XXY platform 112 sags to form a lower vacuum cavity, the OLED attaching lower jig 111 is located in the lower vacuum cavity, the lower vacuum cavity is pneumatically connected with the OLED attaching pressure cylinder 114, and an IC chip is placed on the OLED attaching lower jig 111; in addition, the vacuum chamber 45 under the OLED attaching includes an OLED attaching shifting Y-axis module 113, the OLED attaching XXY platform 112 is connected with the OLED attaching shifting Y-axis module 113, and the OLED attaching shifting Y-axis module 113 drives the OLED attaching shifting Y-axis module 113 to move in the Y-axis direction.
The OLED attaching upper vacuum cavity 50 comprises an OLED attaching upper platform 106 and an OLED upper attaching jig, wherein the OLED upper attaching jig is connected with the OLED attaching upper platform 106 and arranged downwards; an upper vacuum cavity is formed on the lower surface of the OLED attaching upper platform 106, and the OLED upper attaching jig is located in the upper vacuum cavity.
The OLED attached upper vacuum cavity 50 comprises an OLED attached upper Z-axis module 107, an OLED attached upper platform 106 is connected with the OLED attached upper Z-axis module 107, the OLED attached upper Z-axis module 107 is connected with the attaching portal frame, and the OLED attached upper Z-axis module 107 drives the OLED attached upper platform 106 to move up and down in the Z-axis direction.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The fingerprint identification attaching device is characterized by comprising an attaching feeding and discharging carrying arm, an OLED feeding and carrying arm, an OLED attaching upper vacuum cavity, an OLED attaching lower vacuum cavity and an OLED bearing platform, the OLED loading and carrying arm moves the OLED screen to the OLED carrying platform, the OLED carrying platform moves the OLED screen into the OLED attaching vacuum cavity, the bonded upper and lower material carrying arms move the IC chip to the OLED bonded lower vacuum cavity, the OLED and the IC alignment assembly are respectively aligned with the IC chip and the OLED screen, the OLED upper vacuum cavity and the OLED lower vacuum cavity are respectively moved to a joint position, the OLED upper vacuum cavity and the OLED lower vacuum cavity are jointed, the OLED and the IC chip are jointed to form a finished product, the upper vacuum cavity moves the finished product to the laminating feeding and discharging moving arm, and the laminating feeding and discharging moving arm discharges the finished product.
2. The fingerprint identification laminating device of claim 1, wherein the OLED loading carrying arm comprises an OLED laminating loading Z-axis module, an OLED laminating loading X-axis module, an OLED laminating loading R-axis module, an OLED laminating loading sucker and an OLED laminating loading portal frame, the OLED laminating loading X-axis module is connected with the OLED laminating loading portal frame, the OLED laminating loading sucker is connected with the OLED laminating loading R-axis module, the OLED laminating loading R-axis module is connected with the OLED laminating loading Z-axis module, the OLED laminating loading Z-axis module and the OLED laminating loading X-axis module drive the OLED laminating loading sucker to move in the X-axis direction and the Z-axis direction, and the OLED laminating loading R-axis module drive the OLED laminating loading sucker to rotate.
3. The fingerprint identification and sticking device according to claim 1, wherein the OLED and IC alignment assembly comprises an OLED upper alignment assembly, the OLED receiving platform comprises an OLED receiving vacuum chuck, an OLED receiving photoelectric sensor, an OLED receiving bottom plate and an OLED receiving Y-axis module, the OLED receiving vacuum chuck is connected with the OLED receiving bottom plate, the OLED upper alignment assembly is connected with the OLED receiving bottom plate, the OLED receiving photoelectric sensor is connected with the OLED receiving bottom plate, the OLED receiving Y-axis module controls the OLED receiving bottom plate to move back and forth in the Y-axis direction, the OLED receiving photoelectric sensor and the OLED upper alignment assembly control the position of the OLED receiving bottom plate, and the OLED receiving vacuum chuck adsorbs an OLED screen.
4. The fingerprint identification laminating device of claim 1, wherein the laminating upper and lower carrying arm comprises an IC laminating upper material assembly, the OLED and IC aligning assembly comprises an IC lower aligning assembly, the IC laminating upper material assembly comprises an IC laminating lifting cylinder, an IC laminating rotary cylinder, an IC laminating feeding suction nozzle and an IC laminating interval X-axis module, the IC laminating interval X-axis module is connected with the IC laminating lifting cylinder, the IC laminating rotary cylinder is connected with the IC laminating lifting cylinder, the IC laminating feeding suction nozzle is pneumatically connected with the IC laminating rotary cylinder, the IC laminating lifting cylinder is driven by the IC laminating rotary cylinder to rotate or lift the IC chip, and the IC laminating interval X-axis module is driven by the IC laminating lifting cylinder and the IC laminating rotary cylinder to move on an X-axis laminating lower material support.
5. The fingerprint identification attaching device according to claim 4, wherein the attaching upper and lower material carrying arms include a finished product attaching blanking assembly, the finished product attaching blanking assembly includes a finished product blanking bracket, a finished product attaching interval X-axis module and a finished product blanking Z-axis module, the finished product blanking bracket is connected with the finished product blanking Z-axis module, the finished product blanking Z-axis module is connected with the finished product attaching interval X-axis module, and the finished product attaching interval X-axis module moves on the X-axis attaching blanking bracket.
6. The fingerprint identification laminating device of claim 1, wherein the vacuum cavity under the OLED laminating includes that the frock under OLED laminating pressure cylinder, OLED laminating XXY platform, OLED laminating pressure cylinder with OLED laminating XXY platform is connected, the upper surface of OLED laminating XXY platform sinks to form lower vacuum cavity, the frock is located under the OLED laminating in the vacuum cavity, lower vacuum cavity with OLED laminating pressure cylinder is pneumatic to be connected, and the IC chip is placed on the frock under the OLED laminating.
7. The fingerprint identification attaching device according to claim 6, wherein the OLED attaching lower vacuum cavity comprises an OLED attaching shifting Y-axis module, the OLED attaching XXY platform is connected with the OLED attaching shifting Y-axis module, and the OLED attaching shifting Y-axis module drives the OLED attaching shifting Y-axis module to move in the Y-axis direction.
8. The fingerprint identification laminating device of claim 7, wherein the OLED laminating upper vacuum cavity comprises an OLED laminating upper platform and an OLED laminating jig, and the OLED laminating jig is connected with the OLED laminating upper platform and arranged downwards.
9. The fingerprint identification attaching device according to claim 8, wherein an upper vacuum chamber is formed on a lower surface of the OLED attaching upper platform, and the OLED upper attaching jig is located in the upper vacuum chamber.
10. The fingerprint identification attaching device according to claim 9, wherein the OLED attached upper vacuum cavity comprises an OLED attached upper Z-axis module, the OLED attached upper platform is connected with the OLED attached upper Z-axis module, the OLED attached upper Z-axis module is connected with the attaching portal frame, and the OLED attached upper Z-axis module drives the OLED attached upper platform to move up and down in the Z-axis direction.
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