CN111712909B - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
- Publication number
- CN111712909B CN111712909B CN201980013114.0A CN201980013114A CN111712909B CN 111712909 B CN111712909 B CN 111712909B CN 201980013114 A CN201980013114 A CN 201980013114A CN 111712909 B CN111712909 B CN 111712909B
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- tray
- cleaning apparatus
- cleaning solution
- wafer
- wafer cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/048—Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to a wafer cleaning apparatus capable of preventing leakage of a cleaning solution and timely processing the cleaning solution. The invention provides a wafer cleaning device, which comprises: a cleaning tank that receives the cleaning solution and from which the cleaning solution overflows due to the immersion of the wafer; a plurality of lifting members disposed outside the cleaning tank and immersing the pod into the cleaning solution in the cleaning tank; an external water tank having a cleaning tank and a lifting member received therein, and including a discharge hole through which the cleaning solution is discharged; and a tray detachably attached to an inner bottom surface of the external water tank and collecting the cleaning solution to guide the cleaning solution to the drain hole.
Description
Technical Field
The present invention relates to a wafer cleaning apparatus capable of preventing a cleaning solution from leaking to the outside and rapidly responding thereto.
Background
Typically, silicon wafers are manufactured by the process of: a growth process for growing polycrystalline silicon into a single crystal silicon ingot, a slicing process for slicing the grown single crystal silicon ingot into a wafer shape, a grinding process for uniformizing and planarizing the thickness of the wafer, an etching process for removing or reducing damage caused by mechanical polishing, a polishing process for mirror polishing the surface of the wafer, and a cleaning process for cleaning the wafer.
Generally, a wafer cleaning apparatus is used to perform a cleaning process, and when a cleaning solution of a strongly alkaline solution is contained in an inner tank and overflows from the inner tank, a wafer moving robot immerses a wafer in the cleaning solution of the inner tank, and then a lifting member vertically shakes the wafer in the cleaning solution to clean the wafer surface.
In addition, in the wafer cleaning apparatus, the inner tank, the outer tank, and the lifting member are provided in the outer tank, but when the inner tank/outer tank is cleaned with pure water, the cleaning solution overflows due to an abnormal operation or drops when the wafer is moved, and the cleaning solution is discharged through a discharge hole provided in the outer tank.
However, when a strongly alkaline solution such as KOH is used as the cleaning solution in the wafer cleaning apparatus, when the component of the metal material is exposed to the cleaning solution having high permeability for a long period of time, the cleaning solution leaks due to aging or degradation.
Korean laid-open patent publication No. 2004-0036300 relates to a chemical looping system having a leakage sensing function of a wafer wet etching apparatus, and further provided with a screw installed in a pipe connected to a tank, a generator connected to the screw, and a leakage sensing apparatus including a sensor electrically connected to the generator.
Thus, when a leak occurs in the pipe, air introduced by the leak rises to rotate the screw, and a current generated by the generator according to the rotation of the screw is transmitted to the sensor to sense the leak.
However, according to the related art, leakage of the cleaning solution can be sensed only in the pipe connected to the cleaning tank, and the cleaning solution often leaks from the external water tank due to aging or degradation, but there is a problem in that: since the cleaning solution leaks to the outside through the external water tank, it is difficult to ensure safety.
In addition, when the cleaning solution leaks from the side of the external water tank, the cleaning process is stopped, and then the leaking portion is visually sensed and welded, but there is a problem in that: since not only the process is stopped but also it takes a long time to sense and correct the leakage portion, the production efficiency is lowered.
Disclosure of Invention
Technical problem
The present invention has been made to solve the above-mentioned problems occurring in the related art and provides a wafer cleaning apparatus capable of preventing a cleaning solution from leaking to the outside and responding thereto rapidly.
Technical proposal
The present invention provides a wafer cleaning device, comprising: a cleaning tank containing a cleaning solution, wherein the cleaning solution overflows as the wafer is immersed; a plurality of lifting members disposed outside the cleaning tank and immersing the pod in the cleaning solution in the cleaning tank; an outer tub accommodating the cleaning bath and the lifting part and having a discharge hole through which the cleaning solution is discharged; and a tray detachable from an inner bottom surface of the external water tank and collecting the cleaning solution to guide the cleaning solution to the drain hole. Accordingly, the wafer cleaning apparatus can prevent the cleaning solution from leaking to the outside, and can quickly respond to the cleaning solution leaking to the outside.
The tray may be provided with a support for supporting the washing tub and a mounting hole through which the lifting member passes, and may be provided such that a drain disposed in the drain hole of the external tub protrudes downward. Therefore, the cleaning tank can be stably mounted at a predetermined position inside the external water tank by the tray.
The tray may be provided with an outer sidewall protruding upward from a circumferential portion in contact with an inner surface of the outer tub and a plurality of inner sidewalls protruding upward from each of the mounting holes. Therefore, the wafer cleaning apparatus can prevent the cleaning solution collected in the tray from flowing into the external water tank.
The tray may be configured to be inclined downward toward the discharge port. Therefore, the cleaning solution collected in the tray can be smoothly discharged.
The wafer cleaning apparatus of the present invention may further include a first guide portion provided between the inner surface of the external water tank and the tray, and guiding the cleaning solution dropped on the inner surface of the external water tank to the tray. Therefore, even if the cleaning solution drops on the inner surface of the external water tank, the cleaning solution is guided by the first guide portion while flowing downward, and thus, the cleaning solution can be collected in the tray.
The first guide portion may be bolted to an inner surface of a lower portion of the external water tank. Accordingly, the first guide portion can be easily attached to and detached from the external water tank.
The first guide portion may be configured in a rod shape having an inclined surface for guiding the washing solution to flow downward and may be made of a non-metallic material. Thus, the first guide portion can be prevented from being corroded by the cleaning solution.
The wafer cleaning apparatus of the present invention may further include a second guide portion provided between the circumferential surface of the lifting member and the tray, and guiding the cleaning solution dropped on the circumferential surface of the lifting member to the tray. Therefore, even if the cleaning solution drops on the lifting member, the cleaning solution is guided by the second guide portion while flowing downward, and thus, the cleaning solution can be collected in the tray.
The second guide portion may be bolted to a circumferential surface of the lower portion of the lifting member. Thus, the second guide portion can be easily attached to and detached from the lifting member.
The second guide portion may be configured in a cylindrical shape having an inclined surface surrounding a lower portion of the lifting member and guiding the washing solution to flow downward, and may be made of a non-metallic material. Therefore, the second guide portion can be prevented from being corroded by the cleaning solution.
Advantageous effects
In the wafer cleaning apparatus according to the present invention, the cleaning tank and the lifting member are installed inside the external water tank, and the tray capable of collecting and discharging the cleaning solution is provided on the inner bottom surface of the external water tank, and therefore, safety can be ensured by preventing the cleaning solution from leaking to the outside in advance, and even if the cleaning solution leaks to the outside, the tray can be installed only rapidly to respond to the leakage, and thus there is an advantage in that the production efficiency can be improved.
Drawings
Fig. 1 is a front view showing a wafer cleaning apparatus according to the present invention.
Fig. 2 is a side view of a wafer cleaning apparatus according to the present invention.
Fig. 3 is a plan view showing a tray of the wafer cleaning apparatus according to the present invention.
Fig. 4 and 5 are cross-sectional views taken along lines B-B 'and C-C' of fig. 4.
Fig. 6 is a view showing a mounting structure applied to the first guide portion and the second guide portion of fig. 3.
Detailed Description
Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, the scope of the spirit of the present invention can be determined from the matters disclosed in the embodiments, and the spirit of the embodiments of the present invention includes actual modifications to the embodiments set forth below, such as addition, deletion, modification of components, and the like.
Fig. 1 and 2 are front and side views showing a wafer cleaning apparatus according to the present invention.
In the wafer cleaning apparatus according to the present invention, as shown in fig. 1 and 2, a cleaning tank 110 and four lifting members 121, 122, 123 and 124 are disposed in an external water tank 130, a tray 150 for collecting and discharging a cleaning solution is disposed in the external water tank 130, and a first guide portion 160 and a second guide portion 170 for guiding the cleaning solution to the tray 150 are provided.
The cleaning tank 110 may be composed of an inner tank 111 containing the cleaning solution and an outer tank 112 containing the cleaning solution overflowed from the inner tank 111, and may be configured such that the cleaning solution is supplied to the inner tank 111 or the cleaning solution overflowed in the outer tank 112 is circulated again to the inner tank.
In addition, rod-shaped mounting portions 113 in which grooves on which the wafers W are arranged in rows are provided in the inner groove 111, and three mounting portions 113 are provided to support three positions at a lower portion of the wafers W.
Of course, the wafer W is stored in a state in which it is accommodated in the cassette at a predetermined distance in the front-rear direction, and the wafer W can be immediately transferred while the wafer moving robot (not shown) holds the edge of the wafer W.
Therefore, the wafer moving robot immediately holds the wafer W stored in the cassette, transfers the wafer into the inner tub 111 to fix the wafer to the mounting part 113, and then washes the wafer W while overflowing the washing solution contained in the inner tub 111.
The lifting members 121, 122, 123 and 124 are provided to move up/down the frame connected to the front/rear of the loading part 113, and four lifting members are provided on both sides of the front/rear of the washing tub.
Therefore, when the lifting members 121, 122, 123 and 124 shake the loading part 113 in the vertical direction, the cleaning effect of the cleaning solution on the wafer W can be improved.
The external tub 130 is a frame made of metal and is constructed to have two side surfaces 131 and 132, a front surface 133 and a rear surface 134, and a bottom surface 135, and the washing tub 110 and the lifting parts 121, 122, 123, and 124 are mounted on an inner bottom surface of the external tub 130.
At this time, the bottom surface 135 of the outer tub is provided with a drain hole 135h through which the washing solution, pure water, etc. can be discharged, and which is provided at the rear center with respect to the washing tub 110.
Therefore, even if the supplied pure water overflows to wash the washing tub 110 itself, the washing tub 110 operates abnormally, so that the washing solution overflows to the outside of the outer tub 112, or even if the washing solution drops when the wafer W is removed from the washing tub 110, the washing solution can be discharged through the discharge hole 135h of the outer tub.
The tray 150 is mounted over the entire inner bottom surface 135 of the external sink and is preferably made of a non-metallic material (such as PVC) that does not degrade even under strong alkaline solutions.
In addition, the tray 150 may be individually mounted on the external water tank 130 by fastening members such as bolts or the like so as to be easily attached and detached, and is formed in a plate-like shape capable of collecting the cleaning solution.
At this time, the tray 150 may be provided with supports 151a and 151b for supporting the washing tub 110, and holes 154h (shown in fig. 3) in which the lifting parts 121, 122, 123 and 124 are installed and discharge holes 152h for discharging the washing solution.
Of course, the discharge hole 152h of the tray is provided at the same position as the discharge hole 135h of the external water tub.
The first guide portion 160 is provided between the external water tank 130 and the tray 150, and prevents the washing solution from dripping on the gap between the tray 150 and the both side surfaces 131 and 132 and the front and rear surfaces 133 and 134 of the external water tank, and guides the washing solution having dripped on the inner wall surface of the external water tank 130 to the tray 150.
In addition, as with the tray 150, the first guide portion 160 is made of a non-metallic material (such as PVC) that is not degraded by the cleaning solution, and is configured to be easily attached and detached by bolting to both side surfaces 131 and 132 and the front and rear surfaces 133 and 134 of the external sink.
The second guide portion 170 is provided between the lifting members 121, 122, 123 and 124 and the tray 150, prevents the cleaning solution from dropping on the gaps between the lifting members 121, 122, 123 and 124 and the tray 150, and guides the cleaning solution having dropped on the lower circumferential surfaces of the lifting members 121, 122, 123 and 124 to the tray 150.
In addition, as with the tray 150, the second guide portion 170 may be made of a non-metallic material (such as PVC) that is not degraded by the cleaning solution, and is configured to be easily detached by being bolted to the circumferential surfaces of the lifting members 121, 122, 123, and 124.
Fig. 3 is a plan view showing a tray of the wafer cleaning device according to the present invention, fig. 4 and 5 are cross-sectional views taken along the line B-B 'and the line C-C' of fig. 4, and fig. 6 is a view showing a mounting structure applied to the first guide portion and the second guide portion of fig. 3.
Referring to fig. 3 to 5, in checking the construction of the tray 150, the tray is constructed in a plate-like shape similar to the shape (shown in fig. 2) of the bottom surface 135 of the external sink.
In this case, a pair of supporting members 151a and 151b may be provided, on which the washing tub 110 (as shown in fig. 2) may be installed at the center of the tray 150, and a discharge hole 152h through which the washing solution is discharged and a discharge port 152 having a shape protruding downward from the discharge hole 152h are provided at the rear of the tray 150.
Accordingly, the drain 152 of the tray may fix the tray 150 inside the external sink 130 (shown in fig. 1), and may prevent the drain hole 135h (shown in fig. 2) of the external sink from being degraded by: in such a way as to prevent the drain hole 135h (shown in fig. 2) of the external sink from directly contacting the cleaning solution through the drain 152 of the tray.
Of course, the tray 150 is configured in a horizontal plane shape, but may be configured in an inclined form so as to guide the cleaning solution to the drain 152.
In addition, an outer sidewall 153 is provided to protrude upward around the tray 150, and the outer sidewall 153 is installed to be in contact with both side surfaces 131 and 132 (shown in fig. 1) and the front and rear surfaces 133 and 134 (shown in fig. 2) of the external water tank.
Accordingly, the outer sidewall 153 provided in the tray 150 prevents the cleaning solution from flowing to the outside of the tray 150, and the gap between the external water tank 130 (shown in fig. 2) and the tray 150 may be further reduced.
In addition, the tray 150 is provided with four mounting holes 154h for mounting the lifting members 121, 122, 123, and 124 (shown in fig. 2), and the inner side walls 154 are provided to protrude upward around each mounting hole 154 h.
Accordingly, the inner sidewall 154 of the tray 150 is mounted to be in contact with the circumferential surfaces of the lifting members 121, 122, 123, and 124 (shown in fig. 2) such that the cleaning solution does not flow down to the mounting holes 154h, and the gap between the lifting members 121, 122, 123, and 124 (shown in fig. 2) and the tray 150 may be further reduced.
The construction and installation structure of the first guide portion 160 and the second guide portion 170 will be checked as follows with reference to fig. 6.
The first and second guide portions 160 and 170 may be configured in a rod shape of a non-metallic material, and a vertical outer portion of the first guide portion 160 may be positioned to contact the inner side surfaces 131 to 134 of the outer tub, and bolt holes 160h that are bolted to the outer tub 130 may be provided to cross in a horizontal direction.
In addition, the first guide portion 160 is provided at an inner upper corner portion thereof with a downwardly inclined surface 161, and may be configured to guide the washing solution from the outer tub 130 at one side thereof to the tray 150 at the lower side thereof, but the present invention is not limited thereto.
In addition, the first guide portion 160 is positioned on the tray 150 in such a manner that a lower end portion 162 thereof protrudes downward from an inner lower portion thereof, and may be installed to be spaced apart from an inner bottom surface of the tray 150 by a predetermined distance so as not to prevent the washing solution within the tray 150 from flowing in the discharge direction, but the present invention is not limited thereto.
Of course, the lower end portion 162 of the first guide portion may be positioned inside the outer sidewall 153 of the tray 150 to doubly block the wash solution from flowing down to the outside of the tray 150.
The second guide portion 170 may be configured in a cylindrical shape of a non-metallic material, an upper inner circumferential surface of the second guide portion 170 may be installed to be in contact with the circumferences of the lifting members 121 to 124, and bolt holes 170h, which may be bolted, may be provided in a horizontal direction.
In addition, the second guide portion 170 is provided with an inclined surface 171 whose diameter increases from an upper portion to a lower portion, and which may be configured to guide the cleaning solution from the lifting members 121 to 124 positioned at the center of the second guide portion to the tray 150 positioned around the second guide portion, but the present invention is not limited thereto.
In addition, a lower end portion 172 is positioned on the tray 150, the lower end portion 172 being vertically continuous at a lower side of the inclined surface 171 of the second guide portion, and the lower end portion may be installed to be in contact with an inner bottom surface of the tray 150 to inhibit the flow of the cleaning solution to the lifting members 121 to 124, but the present invention is not limited thereto.
Of course, the lower end portion 172 of the second guide portion may be positioned outside the inner sidewall 154 of the tray to doubly block the wash solution from flowing down into the mounting holes 154h (shown in fig. 3).
When the tray 150 of a non-metal material and the first and second guide portions 160 and 170 constructed as described above are mounted on the inner bottom surface of the outer tub 130 of a metal material, even if the cleaning solution drops on the inner side of the outer tub 130, the cleaning solution is not directly contacted with the outer tub 130 through the tray 150, and the cleaning solution can be prevented from leaking to the outside due to aging or degradation of the outer tub 130 to prevent the cleaning solution from flowing into the gap between the outer tub 130 and the tray 150 or into the gap between the lifting members 121 to 124 and the tray 150 through the first and second guide portions 160 and 170 to ensure safety.
In addition, when leakage of the washing solution occurs in the external water tank 130, even if the leakage portion is not found, the tray 150 and the first and second guide portions 160 and 170 are easily installed, thereby rapidly preventing the washing solution from leaking in the external water tank 130 and immediately performing the process, and thus, the production efficiency can be improved.
Industrial applicability
The present invention is applicable to a wafer cleaning apparatus that cleans a wafer in slicing a single crystal ingot to manufacture the wafer.
Claims (13)
1. A wafer cleaning apparatus, the wafer cleaning apparatus comprising:
a rinse tank containing a rinse solution, wherein the rinse solution overflows when a cassette containing wafers is immersed;
a plurality of lifting members disposed outside the cleaning tank and immersing a cassette into the cleaning solution inside the cleaning tank;
an external water tank accommodating the cleaning tank and the lifting member and having a discharge hole through which the cleaning solution is discharged; and
a tray detachable from an inner bottom surface of the external water tank and collecting the washing solution to guide the washing solution to the drain hole,
wherein the tray is provided with a support for supporting the cleaning tank and a mounting hole through which the lifting member passes, and a plurality of inner side walls protruding upward from each of the mounting holes to be in contact with one of the support and the lifting member,
wherein the inner sidewall is formed to be lower than the height of the supporter.
2. The wafer cleaning apparatus according to claim 1, wherein the tray is provided such that a drain disposed in a drain hole of the external water tank protrudes downward.
3. The wafer cleaning apparatus according to claim 2, wherein the tray is provided with an outer sidewall protruding upward from a circumferential portion in contact with an inner surface of the outer tub, the outer sidewall being formed to be lower than a height of the support.
4. The wafer cleaning apparatus of claim 2, wherein the tray is configured to slope downward toward the drain.
5. The wafer cleaning apparatus according to claim 1, further comprising a first guide portion provided between an inner surface of the external water tank and the tray, and guiding the cleaning solution dropped on the inner surface of the external water tank to the tray.
6. The wafer cleaning apparatus of claim 5, wherein the first guide portion is bolted to an inner surface of a lower portion of the external water tank.
7. The wafer cleaning apparatus according to claim 5, wherein the first guide portion is configured in a rod shape having an inclined surface for guiding the cleaning solution to flow downward.
8. The wafer cleaning apparatus of claim 5, wherein the first guide portion is made of a non-metallic material.
9. The wafer cleaning apparatus according to claim 1, further comprising a second guide portion provided between a circumferential surface of the lifting member and the tray, and guiding the cleaning solution dropped on the circumferential surface of the lifting member to the tray.
10. The wafer cleaning apparatus according to claim 9, wherein the second guide portion is bolted to a circumferential surface of a lower portion of the lifting member.
11. The wafer cleaning apparatus of claim 9, wherein the second guide portion is configured in a cylindrical shape having an inclined surface surrounding a lower portion of the lifting member and guides the cleaning solution to flow downward.
12. The wafer cleaning apparatus of claim 9, wherein the second guide portion is made of a non-metallic material.
13. The wafer cleaning apparatus of any one of claims 1 to 12, wherein the tray is made of a non-metallic material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180069784A KR102185097B1 (en) | 2018-06-18 | 2018-06-18 | Wafer washing apparatus |
| KR10-2018-0069784 | 2018-06-18 | ||
| PCT/KR2019/002813 WO2019245129A1 (en) | 2018-06-18 | 2019-03-11 | Wafer cleaning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111712909A CN111712909A (en) | 2020-09-25 |
| CN111712909B true CN111712909B (en) | 2023-08-22 |
Family
ID=68984155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980013114.0A Active CN111712909B (en) | 2018-06-18 | 2019-03-11 | Wafer cleaning device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20210035822A1 (en) |
| JP (1) | JP7007491B2 (en) |
| KR (1) | KR102185097B1 (en) |
| CN (1) | CN111712909B (en) |
| WO (1) | WO2019245129A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114721231B (en) * | 2022-04-17 | 2023-04-11 | 江苏晟驰微电子有限公司 | Tool clamp for cleaning photoetching plate |
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| JPH11168077A (en) * | 1997-12-04 | 1999-06-22 | Sony Corp | Substrate cleaning equipment |
| KR19990039059U (en) * | 1998-04-03 | 1999-11-05 | 김영환 | HQDIAL Beth's Pure Cooling System for Semiconductor Wafer Cleaning |
| KR20030008448A (en) * | 2001-07-18 | 2003-01-29 | 삼성전자 주식회사 | Bath unit having subsidy sink receptacle |
| KR20180060059A (en) * | 2016-11-28 | 2018-06-07 | 에스케이실트론 주식회사 | Apparatus for wafer cleaning |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62213257A (en) * | 1986-03-14 | 1987-09-19 | Mitsubishi Electric Corp | Wet type processing bath |
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| JP3003017B2 (en) * | 1993-05-26 | 2000-01-24 | 東京エレクトロン株式会社 | Cleaning equipment |
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- 2019-03-11 CN CN201980013114.0A patent/CN111712909B/en active Active
- 2019-03-11 JP JP2020543530A patent/JP7007491B2/en active Active
- 2019-03-11 WO PCT/KR2019/002813 patent/WO2019245129A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111712909A (en) | 2020-09-25 |
| JP7007491B2 (en) | 2022-01-24 |
| US20210035822A1 (en) | 2021-02-04 |
| JP2021514542A (en) | 2021-06-10 |
| KR102185097B1 (en) | 2020-12-01 |
| KR20190142619A (en) | 2019-12-27 |
| WO2019245129A1 (en) | 2019-12-26 |
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