CN111705285A - Tinning device and tinning method for circular solder strip - Google Patents
Tinning device and tinning method for circular solder strip Download PDFInfo
- Publication number
- CN111705285A CN111705285A CN202010704118.8A CN202010704118A CN111705285A CN 111705285 A CN111705285 A CN 111705285A CN 202010704118 A CN202010704118 A CN 202010704118A CN 111705285 A CN111705285 A CN 111705285A
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- sizing
- fixing plate
- tin
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004513 sizing Methods 0.000 claims abstract description 82
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 49
- 238000003825 pressing Methods 0.000 claims abstract description 33
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 238000007747 plating Methods 0.000 claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 6
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 210000003205 muscle Anatomy 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/40—Plates; Strips
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
Abstract
The invention provides a tinning device for a circular welding strip, which comprises a die support fixing plate and a sizing die, wherein the die support fixing plate is fixed on the die support fixing plate; a tin liquid pool is arranged below the die support fixing plate, a die support and a lower wire pressing wheel are sequentially arranged on the die support fixing plate from top to bottom, the die support comprises a horizontal baffle, and a first through hole is formed in the middle of the horizontal baffle; a vertical tangent line of one side of the lower wire pressing wheel, which is close to the die support, penetrates through the first through hole; the diameter of the sizing die is larger than that of the first through hole, an axial second through hole is formed in the center of the sizing die, a plurality of axial convex ribs are uniformly distributed on the inner wall of the second through hole, and the diameter of a circle formed by the tops of the plurality of convex ribs is larger than that of the welding strip; the average density of the sizing die is less than that of the liquid tin liquid; the invention also provides a tinning method. The tin plating device for the circular solder strip has the advantages of simple structure, less human participation and small error rate, and the solder strip produced by the tin plating method has uniform plating thickness and high finished product quality.
Description
Technical Field
The invention relates to the field of solder strip manufacturing, in particular to a tinning device and a tinning method for a round solder strip.
Background
In the photovoltaic industry, two main production modes of photovoltaic solder strips on the market are provided, wherein one mode is electroplating; another is hot dip plating. The electroplating cost is high, the market share in the photovoltaic industry is low, the mainstream hot dip plating cost in the market is low, and the electroplating method has absolute advantages in the photovoltaic industry. One of the core processes in hot dip coating is tin plating. The tin plating process influences important indexes of the photovoltaic solder strip product, such as coating thickness, finished product size, product surface quality and the like. At present, in the production of hot dip coating photovoltaic solder strips, the tin plating mode is mainly an air knife method, namely gas wiping. The thickness and the surface quality of the coating on the surface of the photovoltaic solder strip are mainly determined by the size of the installation position of the air knife, the installation angle, the air pressure and the flow of compressed air and the like. Different production speeds of the equipment all need to adjust different positions to ensure the stability of the product quality. The air knife method has higher requirements on the technical level of production staff, and the product has insufficient surface quality stability and higher rejection rate.
Disclosure of Invention
In order to solve the technical problems, the invention mainly aims to provide a tinning device and a tinning method for a circular solder strip, which can accurately control the thickness of a plating layer and enable the thickness of the plating layer to be uniform.
In order to achieve the above object, the present invention adopts the following technical solutions.
In a first aspect, a tinning device for a circular solder strip comprises a die support fixing plate and a sizing die; a tin liquor pool is arranged below the die support fixing plate, a die support and a lower wire pressing wheel are sequentially arranged on the die support fixing plate from top to bottom, the die support comprises a horizontal baffle, and a first through hole is formed in the middle of the horizontal baffle; the outer peripheral surface of the lower wire pressing wheel is provided with an annular groove concentric with the lower wire pressing wheel; a vertical tangent line of one side of the lower wire pressing wheel, which is close to the die support, penetrates through the first through hole; the sizing die is cylindrical, the diameter of the sizing die is larger than that of the first through hole, an axial second through hole is formed in the center of the sizing die, a plurality of axial convex ribs are uniformly distributed on the inner wall of the second through hole, and the diameter of a circle formed by the tops of the convex ribs is larger than that of the welding strip; the average density of the sizing die is less than the density of the liquid tin liquor.
Furthermore, the sizing die comprises a circular die core fixing plate, a third through hole is formed in the middle of the die core fixing plate, a sizing die core is arranged in the third through hole, the second through hole is formed in the sizing die core, and the convex rib is located on the inner wall of the second through hole.
Furthermore, the die core fixing plate is made of titanium alloy, and the sizing die core is made of polycrystalline diamond.
Furthermore, the height of the sizing die core is smaller than that of the die core fixing plate, the sizing die core is arranged in the middle of the die core fixing plate, the upper end of the third through hole is in a horn shape with an upper opening, and the lower end of the third through hole is in a horn shape with a lower opening.
Furthermore, the number of the horizontal baffles is three, the number of the sizing dies is three, and the distance between the horizontal baffles is larger than the height of the sizing dies.
Further, still include the fixing base, be provided with the triaxial linear displacement platform on the fixing base, die holder fixed plate fixed connection is on the triaxial linear displacement platform.
Furthermore, the number of the convex ribs is three, four, five or six.
Furthermore, an upper wire pressing wheel is arranged above the fixing plate of the die support, and a vertical tangent line of one side, close to the die support, of the upper wire pressing wheel and a vertical tangent line of one side, close to the die support, of the lower wire pressing wheel are collinear.
In a second aspect, a method for plating a circular solder strip, based on the above apparatus for plating a circular solder strip, the method for plating a circular solder strip includes the steps of:
placing a tin-lead alloy in a tin liquid pool, and heating to 200-235 ℃ to prepare tin liquid;
secondly, the copper wire bypasses the lower wire pressing wheel to penetrate through the second through hole of the sizing die core and vertically upwards penetrate out of the first through hole of the horizontal baffle;
and step three, starting the winding mechanism to wind wires, moving the die support fixing plate into the tin liquid pool, and enabling the sizing die to be partially immersed under the liquid level of the tin liquid.
The tinning device for the circular solder strip has the advantages of simple structure, less human participation and small error rate, and the solder strip produced by the tinning method has uniform plating thickness and high finished product quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic view of a tin plating process of a tin plating apparatus for a round solder strip according to the present invention;
FIG. 2 is a perspective view of a tinning assembly of a circular solder strip of the present invention;
FIG. 3 is a cross-sectional view of one embodiment of a sizing die;
FIG. 4 is a top view of a first embodiment of a sizing die;
FIG. 5 is a top view of a second embodiment of a sizing die;
FIG. 6 is a top view of a third embodiment of a sizing die.
In the above figures:
1, fixing a die bracket; 2, sizing a die; 201 ribs; 202, a die core fixing plate; 203 sizing the mold core; 204 a second via hole; 3, a tin liquid pool; 4, a mould bracket; 401 horizontal baffles; 5, pressing the wire wheel; 6, a three-axis linear displacement table; 7, an upper wire pressing wheel; 8, copper wires; 9 fixing seats.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, specific details are set forth in order to provide a thorough understanding of the present invention. The invention can be implemented in a number of ways different from those described herein and similar generalizations can be made by those skilled in the art without departing from the spirit of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
Referring to fig. 1, 2 and 3, the tin plating device for the circular solder strip comprises a die support fixing plate 1 and a sizing die 2; a tin liquor pool 3 is arranged below the die support fixing plate 1, a die support 4 and a lower wire pressing wheel 5 are sequentially arranged on the die support fixing plate 1 from top to bottom, the die support 4 comprises a horizontal baffle 401, and a first through hole 402 is formed in the middle of the horizontal baffle 401; the outer peripheral surface of the lower wire pressing wheel 5 is provided with an annular groove concentric with the lower wire pressing wheel 5; a vertical tangent line of one side of the lower pressing wheel 5 close to the die support 4 penetrates through the first through hole 402; the sizing die 2 is cylindrical, the diameter of the sizing die 2 is larger than that of the first through hole 402, an axial second through hole 204 is formed in the center of the sizing die 2, a plurality of axial convex ribs 201 are uniformly distributed on the inner wall of the second through hole 204, and the diameter of a circle formed by the tops of the convex ribs 201 is larger than that of the welding strip; the average density of the sizing die 2 is less than the density of the liquid tin liquid.
In the production of the welding strip, the raw material is copper wire 8, and a tin layer needs to be plated on the surface of the copper wire 8 uniformly. During production, the copper wire 8 firstly bypasses the lower wire pressing wheel 5, then passes through the second through hole 204 of the sizing die 2, then passes through the first through hole 402 of the die support 4 and then is vertically pulled upwards, so that the sizing die 2 is positioned below the horizontal baffle 401. After tin liquid is heated to a preset temperature, the die support 4 is integrally moved into the tin liquid pool 3, and because the average density of the sizing die 2 is smaller than that of the tin liquid, the upper surface of the sizing die 2 is tightly attached to the lower surface of the horizontal baffle 401 under the buoyancy effect of the sizing die 2, and the sizing die 2 can freely move back and forth. The copper wire 8 is vertically and upwards drawn after penetrating out of the molten tin, and the thickness of the molten tin adhered to the copper wire 8 is larger than the required thickness of the plating layer. The diameter of the second through hole 204 of the sizing die 2 is the set weld bead diameter. Because the inner wall of the second through hole 204 is uniformly provided with the plurality of convex ribs 201, the copper wire 8 is limited to pass through the center of the second through hole 204 in the process of passing through the second through hole 204, and the tin liquid on the surface of the copper wire 8 can be uniformly scraped. Due to the existence of the convex ribs 201, grooves can be formed at the positions, blocked by the convex ribs 201, of the surfaces of the copper wires 8, and the grooves can be filled and leveled up by the tin liquid on the two sides under the surface tension of the liquid, so that the thickness of a plating layer of the welding strip is uniform finally.
Further, referring to fig. 2, the sizing die 2 includes a circular die core fixing plate 202, a third through hole is disposed in the middle of the die core fixing plate 202, a sizing die core 203 is disposed in the third through hole, the second through hole 204 is located on the sizing die core 203, and the rib 201 is located on the inner wall of the second through hole 204. The die core fixing plate 202 is made of titanium alloy, and the sizing die core 203 is made of polycrystalline diamond.
In production, in order to enable the welding strip to be stressed uniformly in the plating layer forming process, the copper wire 8 needs to be pulled vertically upwards after passing through the lower reel, errors can be avoided due to manufacturing of equipment, if the sizing die 2 is fixed, the stress is inevitably uneven, and therefore the sizing die 2 does not need to be limited in the horizontal direction. In the present embodiment, since the molten tin is a tin-lead alloy, a titanium alloy having a density lower than that of the tin-lead alloy is preferable as the material of the sizing die 2. Further, because the production is in a high-temperature environment, the copper wire 8 has friction at the position of the second through hole 204 penetrating through the sizing die 2, and in order to prolong the service life of the sizing die 2, the sizing die 2 is divided into a die core fixing plate 202 and a sizing die core 203. The sizing die 203 is embedded in the center of the die fixing plate 202, and the second through hole 204 is disposed on the sizing die 203. The die core fixing plate 202 is made of titanium alloy, and the sizing die core 203 is made of polycrystalline diamond. The average density of the die core fixing plate 202 and the sizing die core 203 is ensured to be smaller than that of the tin-lead alloy, and the sizing die 2 can be attached to the lower surface of the horizontal baffle 401 under the action of buoyancy.
Further, referring to fig. 3, the height of the sizing die 203 is smaller than the height of the die fixing plate 202, the sizing die 203 is centrally disposed in the middle of the die fixing plate 202, the upper end of the third through hole is in a horn shape with an upper opening, and the lower end of the third through hole is in a horn shape with a lower opening.
In the above embodiment, when the copper wire 8 with the tin liquid passes through the second through hole 204, the lower end of the third through hole is provided with the horn-shaped lower opening, so that the excessive tin liquid can be smoothly scraped off, and the quality of the plating layer is improved.
Further, the number of the horizontal baffles 401 is three, the number of the sizing dies 2 is three, and the distance between the horizontal baffles 401 is larger than the height of the sizing dies 2.
In the above embodiment, preferably, the number of the horizontal baffles 401 is three, correspondingly, the number of the sizing dies 2 is three, and a plurality of sizing dies 2 are provided, so that the tin liquor on the copper wire 8 can be repaired, and the plating omission is avoided.
Further, still include fixing base 9, be provided with triaxial linear displacement platform 6 on the fixing base 9, mould support fixed plate 1 fixed connection in on the triaxial linear displacement platform 6.
In the above embodiment, since the production of the solder strip belongs to high-precision production, the adjustment of the position of the mold support 4 immersed in the molten tin bath 3 is very fine, so that the mold support fixing plate 1 is connected to the three-axis linear displacement table 6, and then the three-axis linear displacement table 6 is fixed to the fixing base 9, and the three-axis linear displacement table 6 can accurately realize the accurate adjustment in the direction X, Y, Z, so that the position of the mold support 4 in the molten tin bath 3 can be accurately adjusted through the three-axis linear displacement table 6.
Further, referring to fig. 3, 4, 5 and 6, the number of the ribs 201 is three, four, five or six. No matter the number of the convex ribs 201 is several, the convex ribs are required to be uniformly distributed on the inner surface of the second through hole 204, and the copper wire can be ensured to pass through the center of the second through hole 204 of the sizing die.
Further, an upper wire pressing wheel 7 is arranged above the die support fixing plate 1, and a vertical tangent line of one side, close to the die support 4, of the upper wire pressing wheel 7 is collinear with a vertical tangent line of one side, close to the die support 4, of the lower wire pressing wheel 5.
In the above embodiment, in order to ensure that the copper wire 8 passing through the lower reel can be pulled vertically upward, the upper wire pressing wheel 7 is generally arranged above the lower wire pressing wheel 5, so that the vertical tangent of one side of the upper wire pressing wheel 7 close to the die holder 4 and the vertical tangent of one side of the lower wire pressing wheel 5 close to the die holder 4 are collinear, and the copper wire 8 can be pulled vertically upward.
The tin plating method of the circular solder strip is based on the tin plating device of the circular solder strip, and comprises the following steps:
step one, placing a tin-lead alloy in a tin liquid pool 3, and heating to 200-235 ℃ to prepare tin liquid;
step two, the copper wire 8 bypasses the lower wire pressing wheel 5, passes through the second through hole 204 of the sizing die core 203 and vertically upwards passes through the first through hole 402 of the horizontal baffle 401;
and step three, starting the winding mechanism to wind wires, adjusting the three-axis linear displacement table 6, and moving the die support fixing plate 1 into the tin liquid pool 3 to enable half of the uppermost sizing die core 203 to be positioned below the liquid level of the tin liquid.
Because the average density of the die core fixing plate 202 and the sizing die core 203 is less than the density of molten tin, the sizing die 2 can float on the molten tin, the sizing die 2 is restrained below the horizontal baffle 401 due to the blockage of the horizontal baffle 401, and the sizing die 2 can automatically adapt to the condition that the copper wire 8 passes through the center of the second through hole 204 due to the fact that the sizing die 2 is not restrained.
Although the present invention has been described in detail in this specification with reference to specific embodiments and illustrative embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made thereto based on the present invention. Accordingly, such modifications and improvements are intended to be within the scope of this invention as claimed.
Claims (9)
1. A tinning device for a circular solder strip is characterized by comprising a die support fixing plate (1) and a sizing die (2); a tin liquor pool (3) is arranged below the die support fixing plate (1), a die support (4) and a lower wire pressing wheel (5) are sequentially arranged on the die support fixing plate (1) from top to bottom, the die support (4) comprises a horizontal baffle (401), and a first through hole (402) is formed in the middle of the horizontal baffle (401); the outer peripheral surface of the lower wire pressing wheel (5) is provided with an annular groove concentric with the lower wire pressing wheel (5); a vertical tangent line of one side, close to the die support (4), of the lower wire pressing wheel (5) penetrates through the first through hole (402); the sizing die (2) is cylindrical, the diameter of the sizing die (2) is larger than that of the first through hole (402), an axial second through hole (204) is formed in the center of the sizing die (2), a plurality of axial convex ribs (201) are uniformly distributed on the inner wall of the second through hole (204), and the diameter of a circle formed by the tops of the convex ribs (201) is larger than that of a welding strip; the average density of the sizing die (2) is smaller than that of the liquid tin liquid.
2. The tinning device of circular solder strip of claim 1, characterized in that sizing mould (2) contains circular mould benevolence fixed plate (202), the middle part of mould benevolence fixed plate (202) is provided with the third through-hole, be provided with sizing mould benevolence (203) in the third through-hole, second through-hole (204) are located on sizing mould benevolence (203), protruding muscle (201) are located on the inner wall of second through-hole (204).
3. The tinning device for the circular solder strip according to claim 2, wherein the die core fixing plate (202) is made of titanium alloy, and the sizing die core (203) is made of polycrystalline diamond.
4. The tinning device of circular solder strip of claim 2, characterized in that, the height of sizing mould benevolence (203) is less than the height of mould benevolence fixed plate (202), sizing mould benevolence (203) set up in the middle part of mould benevolence fixed plate (202) in the middle of, the upper end of third through-hole is the trumpet shape of open-ended, and the lower extreme of third through-hole is the trumpet shape of open-ended.
5. The tin plating apparatus for the circular solder fillet as set forth in claim 1, wherein the number of the horizontal baffle plates (401) is three, the number of the sizing dies (2) is three, and the pitch of the horizontal baffle plates (401) is larger than the height of the sizing dies (2).
6. The tinning device for the circular solder strip according to claim 5, characterized in that the tinning device further comprises a fixed seat (9), a three-axis linear displacement table (6) is arranged on the fixed seat (9), and the die holder fixing plate (1) is fixedly connected to the three-axis linear displacement table (6).
7. The tin plating apparatus for round solder strips as set forth in claim 1, wherein the number of the ribs (201) is three, four, five or six.
8. The tinning device for the circular solder strip according to claim 1, characterized in that an upper wire pressing wheel (7) is arranged above the die holder fixing plate (1), and a vertical tangent of one side, close to the die holder (4), of the upper wire pressing wheel (7) is collinear with a vertical tangent of one side, close to the die holder (4), of the lower wire pressing wheel (5).
9. A method for tinning a round solder ribbon, which is characterized in that the tinning apparatus is based on the round solder ribbon of claim 2, and the tinning method comprises the following steps:
step one, placing a tin-lead alloy in a tin liquid pool (3) and heating to 200-235 ℃ to prepare tin liquid;
secondly, the copper wire (8) bypasses the lower wire pressing wheel (5), penetrates through the second through hole (204) of the sizing die core (203), and vertically penetrates out of the first through hole (402) of the horizontal baffle (401) upwards;
and step three, starting the winding mechanism to wind, moving the die support fixing plate (1) into the tin liquid pool (3), and enabling the sizing die (2) to be partially immersed under the liquid level of the tin liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010704118.8A CN111705285A (en) | 2020-07-21 | 2020-07-21 | Tinning device and tinning method for circular solder strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010704118.8A CN111705285A (en) | 2020-07-21 | 2020-07-21 | Tinning device and tinning method for circular solder strip |
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| Publication Number | Publication Date |
|---|---|
| CN111705285A true CN111705285A (en) | 2020-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010704118.8A Pending CN111705285A (en) | 2020-07-21 | 2020-07-21 | Tinning device and tinning method for circular solder strip |
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| CN (1) | CN111705285A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112501534A (en) * | 2020-11-30 | 2021-03-16 | 西安泰力松新材料股份有限公司 | Tin plating mould of double-deck photovoltaic dysmorphism solder strip |
| CN114130603A (en) * | 2021-12-07 | 2022-03-04 | 江苏泰力松新材料有限公司 | Single-side coating device and coating method thereof |
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| GB1335544A (en) * | 1969-11-13 | 1973-10-31 | Siemens Ag | Method of applying a layer of tin or tin alloy to a copper or copper alloy wire by hot dipping |
| JPH0539555A (en) * | 1991-08-06 | 1993-02-19 | Furukawa Electric Co Ltd:The | Hot dipping method for wire lod |
| CN2148613Y (en) * | 1992-11-30 | 1993-12-08 | 天津市预应力钢丝一厂 | Irregular bull block |
| CN2230632Y (en) * | 1995-12-12 | 1996-07-10 | 谢志峰 | Drawing mould |
| CN207483826U (en) * | 2017-08-08 | 2018-06-12 | 深圳市精劲科技有限公司 | Copper wire soldering machine |
| CN212451589U (en) * | 2020-07-21 | 2021-02-02 | 西安泰力松新材料股份有限公司 | Tinning stack of circular solder strip |
-
2020
- 2020-07-21 CN CN202010704118.8A patent/CN111705285A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1335544A (en) * | 1969-11-13 | 1973-10-31 | Siemens Ag | Method of applying a layer of tin or tin alloy to a copper or copper alloy wire by hot dipping |
| JPH0539555A (en) * | 1991-08-06 | 1993-02-19 | Furukawa Electric Co Ltd:The | Hot dipping method for wire lod |
| CN2148613Y (en) * | 1992-11-30 | 1993-12-08 | 天津市预应力钢丝一厂 | Irregular bull block |
| CN2230632Y (en) * | 1995-12-12 | 1996-07-10 | 谢志峰 | Drawing mould |
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| CN212451589U (en) * | 2020-07-21 | 2021-02-02 | 西安泰力松新材料股份有限公司 | Tinning stack of circular solder strip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112501534A (en) * | 2020-11-30 | 2021-03-16 | 西安泰力松新材料股份有限公司 | Tin plating mould of double-deck photovoltaic dysmorphism solder strip |
| CN112501534B (en) * | 2020-11-30 | 2022-12-20 | 西安泰力松新材料股份有限公司 | Tin-plating mould of double-deck photovoltaic dysmorphism solder strip |
| CN114130603A (en) * | 2021-12-07 | 2022-03-04 | 江苏泰力松新材料有限公司 | Single-side coating device and coating method thereof |
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