CN212451589U - Tinning stack of circular solder strip - Google Patents
Tinning stack of circular solder strip Download PDFInfo
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- CN212451589U CN212451589U CN202021442861.2U CN202021442861U CN212451589U CN 212451589 U CN212451589 U CN 212451589U CN 202021442861 U CN202021442861 U CN 202021442861U CN 212451589 U CN212451589 U CN 212451589U
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Abstract
The utility model provides a tinning device of a circular welding strip, which comprises a die bracket fixing plate and a sizing die; a tin liquid pool is arranged below the die support fixing plate, a die support and a lower wire pressing wheel are sequentially arranged on the die support fixing plate from top to bottom, the die support comprises a horizontal baffle, and a first through hole is formed in the middle of the horizontal baffle; a vertical tangent line of one side of the lower wire pressing wheel, which is close to the die support, penetrates through the first through hole; the diameter of the sizing die is larger than that of the first through hole, an axial second through hole is formed in the center of the sizing die, a plurality of axial convex ribs are uniformly distributed on the inner wall of the second through hole, and the diameter of a circle formed by the tops of the plurality of convex ribs is larger than that of the welding strip; the average density of the sizing die is less than that of the liquid tin liquid; the utility model discloses a circular tin-plating bath that welds area simple structure, artificial participation is few, and the error rate is little, adopts the utility model discloses a tin-plating bath cladding material thickness that welds that tin-plating bath produced is even, and the finished product quality is high.
Description
Technical Field
The utility model relates to a weld and take the manufacturing field, concretely relates to circular tin-plating apparatus who welds area.
Background
In the photovoltaic industry, two main production modes of photovoltaic solder strips on the market are provided, wherein one mode is electroplating; another is hot dip plating. The electroplating cost is high, the market share in the photovoltaic industry is low, the mainstream hot dip plating cost in the market is low, and the electroplating method has absolute advantages in the photovoltaic industry. One of the core processes in hot dip coating is tin plating. The tin plating process influences important indexes of the photovoltaic solder strip product, such as coating thickness, finished product size, product surface quality and the like. At present, in the production of hot dip coating photovoltaic solder strips, the tin plating mode is mainly an air knife method, namely gas wiping. The thickness and the surface quality of the coating on the surface of the photovoltaic solder strip are mainly determined by the size of the installation position of the air knife, the installation angle, the air pressure and the flow of compressed air and the like. Different production speeds of the equipment all need to adjust different positions to ensure the stability of the product quality. The air knife method has higher requirements on the technical level of production staff, and the product has insufficient surface quality stability and higher rejection rate.
Disclosure of Invention
For solving the technical problem, the main object of the utility model is to provide a tinning stack of circular solder strip can accurate control cladding material thickness, makes cladding material thickness even.
In order to achieve the above purpose, the present invention adopts the following technical solution.
A tinning device for a circular solder strip comprises a die support fixing plate and a sizing die; a tin liquor pool is arranged below the die support fixing plate, a die support and a lower wire pressing wheel are sequentially arranged on the die support fixing plate from top to bottom, the die support comprises a horizontal baffle, and a first through hole is formed in the middle of the horizontal baffle; the outer peripheral surface of the lower wire pressing wheel is provided with an annular groove concentric with the lower wire pressing wheel; a vertical tangent line of one side of the lower wire pressing wheel, which is close to the die support, penetrates through the first through hole; the sizing die is cylindrical, the diameter of the sizing die is larger than that of the first through hole, an axial second through hole is formed in the center of the sizing die, a plurality of axial convex ribs are uniformly distributed on the inner wall of the second through hole, and the diameter of a circle formed by the tops of the convex ribs is larger than that of the welding strip; the average density of the sizing die is less than the density of the liquid tin liquor.
Furthermore, the sizing die comprises a circular die core fixing plate, a third through hole is formed in the middle of the die core fixing plate, a sizing die core is arranged in the third through hole, the second through hole is formed in the sizing die core, and the convex rib is located on the inner wall of the second through hole.
Furthermore, the die core fixing plate is made of titanium alloy, and the sizing die core is made of polycrystalline diamond.
Furthermore, the height of the sizing die core is smaller than that of the die core fixing plate, the sizing die core is arranged in the middle of the die core fixing plate, the upper end of the third through hole is in a horn shape with an upper opening, and the lower end of the third through hole is in a horn shape with a lower opening.
Furthermore, the number of the horizontal baffles is three, the number of the sizing dies is three, and the distance between the horizontal baffles is larger than the height of the sizing dies.
Further, still include the fixing base, be provided with the triaxial linear displacement platform on the fixing base, die holder fixed plate fixed connection is on the triaxial linear displacement platform.
Furthermore, the number of the convex ribs is three, four, five or six.
Furthermore, an upper wire pressing wheel is arranged above the fixing plate of the die support, and a vertical tangent line of one side, close to the die support, of the upper wire pressing wheel and a vertical tangent line of one side, close to the die support, of the lower wire pressing wheel are collinear.
The utility model discloses technical scheme's circular tin plating bath that welds area simple structure, artificial participation is few, and the error rate is little, and the welding that this tin plating bath produced takes cladding material thickness evenly, and the finished product quality is high.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic view of a tin plating process of a tin plating apparatus for a circular solder strip according to the present invention;
FIG. 2 is a schematic perspective view of a tin plating apparatus for a circular solder strip of the present invention;
FIG. 3 is a cross-sectional view of one embodiment of a sizing die;
FIG. 4 is a top view of a first embodiment of a sizing die;
FIG. 5 is a top view of a second embodiment of a sizing die;
FIG. 6 is a top view of a third embodiment of a sizing die.
In the above figures:
1, fixing a die bracket; 2, sizing a die; 201 ribs; 202, a die core fixing plate; 203 sizing the mold core; 204 a second via hole; 3, a tin liquid pool; 4, a mould bracket; 401 horizontal baffles; 5, pressing the wire wheel; 6, a three-axis linear displacement table; 7, an upper wire pressing wheel; 8, copper wires; 9 fixing seats.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, specific details are set forth in order to provide a thorough understanding of the present invention. The invention can be implemented in a number of other ways than those described herein, and those skilled in the art will be able to make similar generalizations without departing from the spirit of the invention. The invention is therefore not limited to the specific embodiments disclosed below.
Referring to fig. 1, 2 and 3, a tin plating apparatus for a circular solder strip includes a die holder fixing plate 1 and a sizing die 2; a tin liquor pool 3 is arranged below the die support fixing plate 1, a die support 4 and a lower wire pressing wheel 5 are sequentially arranged on the die support fixing plate 1 from top to bottom, the die support 4 comprises a horizontal baffle 401, and a first through hole 402 is formed in the middle of the horizontal baffle 401; the outer peripheral surface of the lower wire pressing wheel 5 is provided with an annular groove concentric with the lower wire pressing wheel 5; a vertical tangent line of one side of the lower pressing wheel 5 close to the die support 4 penetrates through the first through hole 402; the sizing die 2 is cylindrical, the diameter of the sizing die 2 is larger than that of the first through hole 402, an axial second through hole 204 is formed in the center of the sizing die 2, a plurality of axial convex ribs 201 are uniformly distributed on the inner wall of the second through hole 204, and the diameter of a circle formed by the tops of the convex ribs 201 is larger than that of the welding strip; the average density of the sizing die 2 is less than the density of the liquid tin liquid.
In the production of the welding strip, the raw material is copper wire 8, and a tin layer needs to be plated on the surface of the copper wire 8 uniformly. During production, the copper wire 8 firstly bypasses the lower wire pressing wheel 5, then passes through the second through hole 204 of the sizing die 2, then passes through the first through hole 402 of the die support 4 and then is vertically pulled upwards, so that the sizing die 2 is positioned below the horizontal baffle 401. After tin liquid is heated to a preset temperature, the die support 4 is integrally moved into the tin liquid pool 3, and because the average density of the sizing die 2 is smaller than that of the tin liquid, the upper surface of the sizing die 2 is tightly attached to the lower surface of the horizontal baffle 401 under the buoyancy effect of the sizing die 2, and the sizing die 2 can freely move back and forth. The copper wire 8 is vertically and upwards drawn after penetrating out of the molten tin, and the thickness of the molten tin adhered to the copper wire 8 is larger than the required thickness of the plating layer. The diameter of the second through hole 204 of the sizing die 2 is the set weld bead diameter. Because the inner wall of the second through hole 204 is uniformly provided with the plurality of convex ribs 201, the copper wire 8 is limited to pass through the center of the second through hole 204 in the process of passing through the second through hole 204, and the tin liquid on the surface of the copper wire 8 can be uniformly scraped. Due to the existence of the convex ribs 201, grooves can be formed at the positions, blocked by the convex ribs 201, of the surfaces of the copper wires 8, and the grooves can be filled and leveled up by the tin liquid on the two sides under the surface tension of the liquid, so that the thickness of a plating layer of the welding strip is uniform finally.
Further, referring to fig. 2, the sizing die 2 includes a circular die core fixing plate 202, a third through hole is disposed in the middle of the die core fixing plate 202, a sizing die core 203 is disposed in the third through hole, the second through hole 204 is located on the sizing die core 203, and the rib 201 is located on the inner wall of the second through hole 204. The die core fixing plate 202 is made of titanium alloy, and the sizing die core 203 is made of polycrystalline diamond.
In production, in order to enable the welding strip to be stressed uniformly in the plating layer forming process, the copper wire 8 needs to be pulled vertically upwards after passing through the lower reel, errors can be avoided due to manufacturing of equipment, if the sizing die 2 is fixed, the stress is inevitably uneven, and therefore the sizing die 2 does not need to be limited in the horizontal direction. In the present embodiment, since the molten tin is a tin-lead alloy, a titanium alloy having a density lower than that of the tin-lead alloy is preferable as the material of the sizing die 2. Further, because the production is in a high-temperature environment, the copper wire 8 has friction at the position of the second through hole 204 penetrating through the sizing die 2, and in order to prolong the service life of the sizing die 2, the sizing die 2 is divided into a die core fixing plate 202 and a sizing die core 203. The sizing die 203 is embedded in the center of the die fixing plate 202, and the second through hole 204 is disposed on the sizing die 203. The die core fixing plate 202 is made of titanium alloy, and the sizing die core 203 is made of polycrystalline diamond. The average density of the die core fixing plate 202 and the sizing die core 203 is ensured to be smaller than that of the tin-lead alloy, and the sizing die 2 can be attached to the lower surface of the horizontal baffle 401 under the action of buoyancy.
Further, referring to fig. 3, the height of the sizing die 203 is smaller than the height of the die fixing plate 202, the sizing die 203 is centrally disposed in the middle of the die fixing plate 202, the upper end of the third through hole is in a horn shape with an upper opening, and the lower end of the third through hole is in a horn shape with a lower opening.
In the above embodiment, when the copper wire 8 with the tin liquid passes through the second through hole 204, the lower end of the third through hole is provided with the horn-shaped lower opening, so that the excessive tin liquid can be smoothly scraped off, and the quality of the plating layer is improved.
Further, the number of the horizontal baffles 401 is three, the number of the sizing dies 2 is three, and the distance between the horizontal baffles 401 is larger than the height of the sizing dies 2.
In the above embodiment, preferably, the number of the horizontal baffles 401 is three, correspondingly, the number of the sizing dies 2 is three, and a plurality of sizing dies 2 are provided, so that the tin liquor on the copper wire 8 can be repaired, and the plating omission is avoided.
Further, still include fixing base 9, be provided with triaxial linear displacement platform 6 on the fixing base 9, mould support fixed plate 1 fixed connection in on the triaxial linear displacement platform 6.
In the above embodiment, since the production of the solder strip belongs to high-precision production, the adjustment of the position of the mold support 4 immersed in the molten tin bath 3 is very fine, so that the mold support fixing plate 1 is connected to the three-axis linear displacement table 6, and then the three-axis linear displacement table 6 is fixed to the fixing base 9, and the three-axis linear displacement table 6 can accurately realize the accurate adjustment in the direction X, Y, Z, so that the position of the mold support 4 in the molten tin bath 3 can be accurately adjusted through the three-axis linear displacement table 6.
Further, referring to fig. 3, 4, 5 and 6, the number of the ribs 201 is three, four, five or six. No matter the number of the convex ribs 201 is several, the convex ribs are required to be uniformly distributed on the inner surface of the second through hole 204, and the copper wire can be ensured to pass through the center of the second through hole 204 of the sizing die.
Further, an upper wire pressing wheel 7 is arranged above the die support fixing plate 1, and a vertical tangent line of one side, close to the die support 4, of the upper wire pressing wheel 7 is collinear with a vertical tangent line of one side, close to the die support 4, of the lower wire pressing wheel 5.
In the above embodiment, in order to ensure that the copper wire 8 passing through the lower reel can be pulled vertically upward, the upper wire pressing wheel 7 is generally arranged above the lower wire pressing wheel 5, so that the vertical tangent of one side of the upper wire pressing wheel 7 close to the die holder 4 and the vertical tangent of one side of the lower wire pressing wheel 5 close to the die holder 4 are collinear, and the copper wire 8 can be pulled vertically upward.
In an exemplary tinning apparatus based on the above circular solder strip, a method for tinning a circular solder strip includes the steps of:
step one, placing a tin-lead alloy in a tin liquid pool 3, and heating to 200-235 ℃ to prepare tin liquid;
step two, the copper wire 8 bypasses the lower wire pressing wheel 5, passes through the second through hole 204 of the sizing die core 203 and vertically upwards passes through the first through hole 402 of the horizontal baffle 401;
and step three, starting the winding mechanism to wind wires, adjusting the three-axis linear displacement table 6, and moving the die support fixing plate 1 into the tin liquid pool 3 to enable half of the uppermost sizing die core 203 to be positioned below the liquid level of the tin liquid.
Because the average density of the die core fixing plate 202 and the sizing die core 203 is less than the density of molten tin, the sizing die 2 can float on the molten tin, the sizing die 2 is restrained below the horizontal baffle 401 due to the blockage of the horizontal baffle 401, and the sizing die 2 can automatically adapt to the condition that the copper wire 8 passes through the center of the second through hole 204 due to the fact that the sizing die 2 is not restrained.
Although the invention has been described in detail in this specification with reference to specific embodiments and illustrative embodiments, it will be apparent to those skilled in the art that certain changes and modifications can be made therein without departing from the scope of the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (8)
1. A tinning device for a circular solder strip is characterized by comprising a die support fixing plate (1) and a sizing die (2); a tin liquor pool (3) is arranged below the die support fixing plate (1), a die support (4) and a lower wire pressing wheel (5) are sequentially arranged on the die support fixing plate (1) from top to bottom, the die support (4) comprises a horizontal baffle (401), and a first through hole (402) is formed in the middle of the horizontal baffle (401); the outer peripheral surface of the lower wire pressing wheel (5) is provided with an annular groove concentric with the lower wire pressing wheel (5); a vertical tangent line of one side, close to the die support (4), of the lower wire pressing wheel (5) penetrates through the first through hole (402); the sizing die (2) is cylindrical, the diameter of the sizing die (2) is larger than that of the first through hole (402), an axial second through hole (204) is formed in the center of the sizing die (2), a plurality of axial convex ribs (201) are uniformly distributed on the inner wall of the second through hole (204), and the diameter of a circle formed by the tops of the convex ribs (201) is larger than that of a welding strip; the average density of the sizing die (2) is smaller than that of the liquid tin liquid.
2. The tinning device of circular solder strip of claim 1, characterized in that sizing mould (2) contains circular mould benevolence fixed plate (202), the middle part of mould benevolence fixed plate (202) is provided with the third through-hole, be provided with sizing mould benevolence (203) in the third through-hole, second through-hole (204) are located on sizing mould benevolence (203), protruding muscle (201) are located on the inner wall of second through-hole (204).
3. The tinning device for the circular solder strip according to claim 2, wherein the die core fixing plate (202) is made of titanium alloy, and the sizing die core (203) is made of polycrystalline diamond.
4. The tinning device of circular solder strip of claim 2, characterized in that, the height of sizing mould benevolence (203) is less than the height of mould benevolence fixed plate (202), sizing mould benevolence (203) set up in the middle part of mould benevolence fixed plate (202) in the middle of, the upper end of third through-hole is the trumpet shape of open-ended, and the lower extreme of third through-hole is the trumpet shape of open-ended.
5. The tin plating apparatus for the circular solder fillet as set forth in claim 1, wherein the number of the horizontal baffle plates (401) is three, the number of the sizing dies (2) is three, and the pitch of the horizontal baffle plates (401) is larger than the height of the sizing dies (2).
6. The tinning device for the circular solder strip according to claim 5, characterized in that the tinning device further comprises a fixed seat (9), a three-axis linear displacement table (6) is arranged on the fixed seat (9), and the die holder fixing plate (1) is fixedly connected to the three-axis linear displacement table (6).
7. The tin plating apparatus for round solder strips as set forth in claim 1, wherein the number of the ribs (201) is three, four, five or six.
8. The tinning device for the circular solder strip according to claim 1, characterized in that an upper wire pressing wheel (7) is arranged above the die holder fixing plate (1), and a vertical tangent of one side, close to the die holder (4), of the upper wire pressing wheel (7) is collinear with a vertical tangent of one side, close to the die holder (4), of the lower wire pressing wheel (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021442861.2U CN212451589U (en) | 2020-07-21 | 2020-07-21 | Tinning stack of circular solder strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021442861.2U CN212451589U (en) | 2020-07-21 | 2020-07-21 | Tinning stack of circular solder strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212451589U true CN212451589U (en) | 2021-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021442861.2U Active CN212451589U (en) | 2020-07-21 | 2020-07-21 | Tinning stack of circular solder strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212451589U (en) |
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- 2020-07-21 CN CN202021442861.2U patent/CN212451589U/en active Active
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