CN112501534A - Tin plating mould of double-deck photovoltaic dysmorphism solder strip - Google Patents

Tin plating mould of double-deck photovoltaic dysmorphism solder strip Download PDF

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Publication number
CN112501534A
CN112501534A CN202011376698.9A CN202011376698A CN112501534A CN 112501534 A CN112501534 A CN 112501534A CN 202011376698 A CN202011376698 A CN 202011376698A CN 112501534 A CN112501534 A CN 112501534A
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China
Prior art keywords
tin
scraping
mold
double
core
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CN202011376698.9A
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CN112501534B (en
Inventor
孙海雁
常天福
乔晓龙
常鹏雄
李进
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Xi'an Telison New Materials Co ltd
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Xi'an Telison New Materials Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003—Apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/22—Removing excess of molten coatings; Controlling or regulating the coating thickness by rubbing, e.g. using knives, e.g. rubbing solids

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention discloses a tinning die for a double-layer photovoltaic special-shaped welding strip, which comprises a first annular die sleeve, a first die core, a second annular die sleeve and a second die core, wherein the first die core is arranged in the first annular die sleeve, the second die core is arranged in the second annular die sleeve, the first die sleeve is positioned below the second die sleeve, the first annular die sleeve and the second annular die sleeve are fixedly connected through a plurality of connecting blocks uniformly distributed along the circumferential direction, a lateral flow tin port is formed between every two adjacent connecting blocks, a scraping hole is formed in the center of the first die core, a sizing hole matched with the scraping hole in size and shape is formed in the center of the second die core, and the first die core is inwards sunken on the bottom end surface to form a cone-shaped scraping area. The tin liquid is discharged from the tin flowing channel and the side flow tin port, and the sizing port of the second mold core can better control the size consistency and stability of the tin coating of the welding strip.

Description

Tin plating mould of double-deck photovoltaic dysmorphism solder strip
Technical Field
The invention relates to the technical field of photovoltaic solder strip processing, in particular to a tinning die of a double-layer photovoltaic special-shaped solder strip.
Background
With the development of the photovoltaic industry, in order to improve the power of the components and optimize various performances, component manufacturers continuously develop new components and technologies, such as shingles, half-pieces, split pieces and the like, and the appearance of new component packaging technologies also causes the appearance of novel solder strips, such as fillet solder strips, sectional fillet solder strips and other special-shaped solder strips; the tin plating process of the photovoltaic solder strip influences important indexes of the photovoltaic solder strip product, such as tin layer thickness, product surface quality and the like.
In the photovoltaic industry, there are two major types of tin plating processes for photovoltaic solder strips in the market: one is electroplating; another is hot dip plating. The electroplating cost is high, the market share in the photovoltaic industry is low, the mainstream hot dip plating cost in the market is low, and the electroplating method has absolute advantages in the photovoltaic industry. The tin plating mode in the hot dip plating mainly comprises air knife tin plating and mould tin plating: air knife tinning is commonly used for processing a special-shaped solder strip, but the method has a plurality of process difficulties and problems, for example, the coating thickness and the surface quality of the surface of the photovoltaic solder strip are mainly determined by the size of the installation position of an air knife, the installation angle, the air pressure and the flow of compressed air and the like, and when the air knife tinning is used, the triangular side surface of the triangular solder strip is arc-shaped, the surface coating is uneven, and the surface is not smooth; the influence of the die on the coating of the solder strip in the tin plating mode of the die is great, and the uniformity, the surface smoothness and the like of the coating are mainly influenced.
The MBB circular welding strip popular in the market at present has the defects that a plating layer is not uniform when a mould is tinned, a mould is easily blocked by molten tin, the service cycle and the service life of the mould are seriously influenced, and meanwhile, great resistance is caused to the production of the welding strip.
Disclosure of Invention
The invention aims to solve the technical problems that a tin plating mould causes uneven plating of a welding strip, molten tin blocks the mould and the like.
The invention provides a tinning die for a double-layer photovoltaic special-shaped welding strip, which comprises a first annular die sleeve, a first die core, a second annular die sleeve and a second die core;
the first mold core is arranged in the first annular mold sleeve, and the second mold core is arranged in the second annular mold sleeve;
the first die sleeve is positioned below the second die sleeve;
the first annular die sleeve and the second annular die sleeve are fixedly connected through a plurality of connecting blocks which are uniformly distributed along the circumferential direction, and a side flow tin port is formed between every two adjacent connecting blocks;
the center of the first mold core is provided with a scraping hole, and the center of the second mold core is provided with a sizing hole matched with the scraping hole in size and shape;
the first mold core is inwards sunken at the end surface of the bottom part so as to form a conical scraping area.
Furthermore, still set up on the first mold core with scrape the hole communicating and along the radial a plurality of tin passageways that flow that set up of first mold core, a plurality of tin passageways evenly distributed that flow scrape unnecessary tin liquid on the welding area, flow the tin passageway with scrape the hole and communicate with each other and can more in time, conveniently discharge tin liquid.
Further, the scraping hole is circular;
the plurality of tin flowing channels extend to the inner annular wall of the first annular die sleeve along the radial direction, so that the tin liquid is effectively prevented from being accumulated and the die is blocked, and the scraping hole is circular and matched with the welding strip for the welding strip with a circular cross section.
Further, the scraping holes are triangular;
the tin passageway that flows is three, and sets up respectively strike off three apex angle department in hole, to the cross section for triangle-shaped's triangle-shaped welds the area, the benefit that the tin passageway that flows set up like this is, and the volume of taking tin when increasing the three apex angle tin-plating of triangle-shaped solder strip guarantees the shaping effect that the triangle-shaped solder strip.
Further, the inner wall evenly distributed who strikes off the hole has many protruding muscle, many the profile that constitutes at the top of protruding muscle is as treating the passageway that strikes off of tin-plated solder strip, strike off the part on the hole except that strike off the passageway and be flowing the tin passageway, weld the area when passing and strike off the hole, because the existence of protruding muscle, weld and take the surface to be stopped the department and can form the recess by protruding muscle, under the surface tension of liquid, the molten tin of both sides can fill the recess, and it is even to make the solder strip finally reach cladding material thickness.
Further, the scraping channel is circular and is suitable for a circular welding strip.
Furthermore, the scraping channel is triangular and is suitable for triangular welding strips.
Furthermore, both ends of the second mold core are inwards recessed to form a conical inlet area and a conical outlet area, and the inlet area at the lower end can enable the redundant tin liquid to be smoothly scraped off, so that the quality of a coating is improved.
Further, the top end surface of the first mold core is recessed inwards.
The invention provides a tinning die for a double-layer photovoltaic special-shaped welding strip, which has the following beneficial effects compared with the prior art:
(1) according to the invention, the tin liquid scraped by the scraping hole of the first mold core by the welding belt is discharged through the tin flowing channel, and the redundant tin liquid is discharged through the lateral flow tin port when passing through the second mold core, so that the tin flowing channel and the lateral flow tin port can prevent the residual accumulation of soldering flux, and the mold blocking condition is prevented.
(2) The tin plating device comprises a first mold core and a second mold core, wherein the first mold core plays a role in scraping tin liquid, and a sizing opening of the second mold core can better control the size consistency and stability of a tin plating layer of a welding strip, and meanwhile, the effects of preventing mold blockage and ensuring the service cycle of a mold can be achieved.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of the first embodiment;
FIG. 3 is a cross-sectional side view of a first embodiment;
FIG. 4 is an enlarged view of a portion of FIG. 3;
FIG. 5 is an enlarged view of a portion of a scraping hole of the first mold core according to the first embodiment;
FIG. 6 is an enlarged partial view of the scraping holes of the first mold core according to the second embodiment;
fig. 7 is a partially enlarged view of the scraping holes of the first mold core according to the third embodiment.
Detailed Description
The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited to the specific embodiments.
Example one
Referring to fig. 1-5, the tin plating mold for the double-layer photovoltaic special-shaped solder strip comprises a first annular mold sleeve 11, a first mold core 1, a second annular mold sleeve 21 and a second mold core 2, wherein the first mold core 1 is arranged in the first annular mold sleeve 11, the second mold core 2 is arranged in the second annular mold sleeve 21, the first mold sleeve 11 is positioned below the second mold sleeve 21, the first annular mold sleeve 11 and the second annular mold sleeve 21 are fixedly connected through four connecting blocks 3 uniformly distributed along the circumferential direction, a lateral flow tin port 31 is arranged between every two adjacent connecting blocks 3, a circular scraping hole 12 and four radial tin flow channels 14 are formed in the center of the first mold core 1, the four tin flow channels 14 are uniformly distributed and communicated along the circumferential direction of the scraping hole 12, a sizing hole 22 matched with the shape and the size of the scraping hole 12 is formed in the center of the second mold core 2, the first mold core 1 is inwards sunken on the bottom end surface to form a conical scraping area 13, the tin flowing channels 14 all extend to the inner annular wall of the first annular die sleeve 11 in the radial direction, and the embodiment is suitable for tin plating of circular solder strips.
Wherein the second mold core 2 is recessed inwardly at both end faces to form a cone-shaped inlet zone 23 and outlet zone 24, and the first mold core 1 is recessed inwardly at the top end face.
Example two
Referring to fig. 5, the present embodiment has substantially the same structure as the embodiment, and the difference between the present embodiment is: the scraping holes 12 are triangular, the number of the tin flowing channels 14 is three, and the three tin flowing channels are respectively arranged at three top corners of the scraping holes 12.
EXAMPLE III
Referring to fig. 1 and 6, the tin plating mold for the double-layer photovoltaic special-shaped solder strip comprises a first annular mold sleeve 11, a first mold core 1, a second annular mold sleeve 21 and a second mold core 2, wherein the first mold core 1 is arranged in the first annular mold sleeve 11, the second mold core 2 is arranged in the second annular mold sleeve 21, the first mold sleeve 11 is positioned below the second mold sleeve 21, the first annular mold sleeve 11 and the second annular mold sleeve 21 are fixedly connected through four connecting blocks 3 uniformly distributed along the circumferential direction, a lateral flow tin port 31 is arranged between the adjacent connecting blocks 3, the first mold core 1 is inwards sunken on the bottom end surface to form a conical scraping area 13, a scraping hole 12 is formed in the center of the first mold core 1, six convex ribs 121 are uniformly distributed on the inner wall of the scraping hole 12, the outline formed by the tops of the six convex ribs 121 is used as a scraping channel 122 of the solder strip to be plated, the part of the scraping channel 12 except the scraping channel 122 is a tin flow channel 14, the scraping channel 122 is regular triangle, the center of the second mold core 2 is provided with a sizing hole 22 matched with the scraping hole 12 in shape and size, and the embodiment is suitable for tin plating of the triangular solder strip.
Wherein, the second mold core 2 is recessed at both end surfaces inwards to form an inlet area 23 and an outlet area 24 which are cone-shaped, and the top end surface of the first mold core 1 is recessed inwards.
Example four
The present embodiment is basically the same as the third embodiment, and the difference of the present embodiment is: the scraping channel 122 is circular and this embodiment is suitable for tin plating of circular solder strips.
The working principle is as follows: adopt the mould tin plating, the solder strip from down up passes scraping hole 12 and the fixed diameter mouth 22 of second mold core 2 of scraping of first mold core 1 in proper order, when passing scraping hole 12 from scraping district 13, scrape the unnecessary tin liquid on the solder strip, the tin liquid discharges through flowing through tin passageway 14, wearing out from scraping hole 12 and passing through entrance district 23, when getting into fixed diameter hole 2, all the other unnecessary tin liquids are discharged from side flow tin mouth 31, further carry out size correction to the tin coating of solder strip when the fixed diameter hole 2 of solder strip second mold core 21 passes, make solder strip tin coating more even stable.
The above disclosure is only for the specific embodiment of the present invention, but the embodiment of the present invention is not limited thereto, and any variations that can be made by those skilled in the art should fall within the scope of the present invention.

Claims (9)

1. The utility model provides a tin-plating mould of double-deck photovoltaic dysmorphism solder strip which characterized in that: comprises a first annular die sleeve (11), a first die core (1), a second annular die sleeve (21) and a second die core (2);
the first mold core (1) is arranged in the first annular mold sleeve (11), and the second mold core (2) is arranged in the second annular mold sleeve (21);
the first die set (11) is positioned below the second die set (21);
the first annular die sleeve (11) and the second annular die sleeve (21) are fixedly connected through a plurality of connecting blocks (3) which are uniformly distributed along the circumferential direction, and side flow tin openings (31) are formed between the adjacent connecting blocks (3);
a scraping hole (12) is formed in the center of the first mold core (1), and a sizing hole (22) matched with the scraping hole (12) in size and shape is formed in the center of the second mold core (2);
the first mold core (1) is recessed inwards on the end face of the bottom part to form a conical scraping area (13).
2. The tin plating mold for the double-layer photovoltaic special-shaped solder strip according to claim 1, characterized in that: the first mold core (1) is further provided with a plurality of tin flowing channels (14) which are communicated with the scraping holes (12) and are formed along the radial direction of the first mold core (1), and the tin flowing channels (14) are uniformly distributed.
3. The tin plating mold for the double-layer photovoltaic special-shaped solder strip according to claim 2, characterized in that: the scraping hole (12) is circular;
the plurality of tin flowing channels (14) all extend to the inner annular wall of the first annular die sleeve (11) in the radial direction.
4. The tin plating mold for the double-layer photovoltaic special-shaped solder strip according to claim 2, characterized in that: the scraping holes (12) are triangular;
the number of the tin flowing channels (14) is three, and the tin flowing channels are respectively arranged at three top corners of the scraping hole (12).
5. The tin plating mold for the double-layer photovoltaic special-shaped solder strip according to claim 1, characterized in that: the inner wall of the scraping hole (12) is uniformly distributed with a plurality of convex ribs (121), the outline formed by the tops of the convex ribs (121) is used as a scraping channel (122) of a to-be-tinned welding strip, and the part of the scraping hole (12) except the scraping channel (122) is a tin flowing channel (14).
6. The tin plating mold for the double-layer photovoltaic special-shaped solder strip according to claim 5, characterized in that: the scraping channel (122) is circular.
7. The tin plating mold for the double-layer photovoltaic special-shaped solder strip according to claim 5, characterized in that: the scraping channel (122) is triangular.
8. A tin plating mold for a double-layer photovoltaic special-shaped solder strip according to any one of claims 1 to 7, characterized in that: the second mould core (2) is recessed at both ends facing inwards to form a cone-shaped inlet area (23) and outlet area (24).
9. A tin plating mold for a photovoltaic double-layer special-shaped solder strip according to claim 8, characterized in that: the top end surface of the first mold core (1) is inwards sunken.
CN202011376698.9A 2020-11-30 2020-11-30 Tin-plating mould of double-deck photovoltaic dysmorphism solder strip Active CN112501534B (en)

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Application Number Priority Date Filing Date Title
CN202011376698.9A CN112501534B (en) 2020-11-30 2020-11-30 Tin-plating mould of double-deck photovoltaic dysmorphism solder strip

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CN112501534B CN112501534B (en) 2022-12-20

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202688408U (en) * 2012-07-19 2013-01-23 河北斯卓光伏科技有限责任公司 Tin coating device for flat copper wire of photovoltaic welding strip
CN205576254U (en) * 2016-01-26 2016-09-14 西安泰力松新材料股份有限公司 Photovoltaic solder strip tinning stack
CN107723643A (en) * 2017-11-10 2018-02-23 常州九天新能源科技有限公司 A kind of circular air knife
JP2018140623A (en) * 2017-02-28 2018-09-13 株式会社テクノクラーツ Undercut processing mechanism, molding die and molded product
CN111705285A (en) * 2020-07-21 2020-09-25 西安泰力松新材料股份有限公司 Tinning device and tinning method for circular solder strip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202688408U (en) * 2012-07-19 2013-01-23 河北斯卓光伏科技有限责任公司 Tin coating device for flat copper wire of photovoltaic welding strip
CN205576254U (en) * 2016-01-26 2016-09-14 西安泰力松新材料股份有限公司 Photovoltaic solder strip tinning stack
JP2018140623A (en) * 2017-02-28 2018-09-13 株式会社テクノクラーツ Undercut processing mechanism, molding die and molded product
CN107723643A (en) * 2017-11-10 2018-02-23 常州九天新能源科技有限公司 A kind of circular air knife
CN111705285A (en) * 2020-07-21 2020-09-25 西安泰力松新材料股份有限公司 Tinning device and tinning method for circular solder strip

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