CN111698407A

CN111698407A - Camera assembly and electronic equipment

Info

Publication number: CN111698407A
Application number: CN202010554397.4A
Authority: CN
Inventors: 秦勇
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-06-17
Filing date: 2020-06-17
Publication date: 2020-09-22
Anticipated expiration: 2040-06-17
Also published as: CN111698407B

Abstract

The application provides a camera assembly, this camera assembly includes: a lens, a bracket and a filter; the bracket is provided with a light through hole which is opposite to the lens; the optical filter is arranged on one side of the light through hole close to the lens, and covers the light through hole; the optical filter comprises an optical filter part and a fixing part arranged along the edge of the optical filter part; the fixing part is used for fixing the optical filter, and at least part of the optical filter is accommodated in the light through hole. The camera assembly that this application embodiment provided, through hold the light filtering part with the light filter in logical unthreaded hole, can dodge the space for sinking of camera lens provides, guarantee that the camera lens can make furthest sink, and then can reduce camera assembly's whole thickness.

Description

Camera assembly and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a camera assembly and electronic equipment.

Background

The design direction of electronic devices (e.g. mobile phones, tablet computers) gradually tends to high integration and miniaturization. To meet the requirement of high integration, more and more electronic components need to be integrated on the camera assembly. With the increase of integrated electronic components, the size of the camera assembly is difficult to meet the requirement of miniaturization. Meanwhile, under the influence of the trend of thinning mobile phones, the requirement for thinning of camera components is increasingly strong, and a new thinning scheme of the camera components is urgently needed to be provided.

Disclosure of Invention

The technical problem to be solved by the application is to provide a camera assembly and an electronic device, so as to solve the defects existing in the camera assembly of the electronic device.

One aspect of the embodiments of the present application provides a camera assembly, a lens; the bracket is provided with a light through hole which is opposite to the lens; the optical filter is arranged on one side, close to the lens, of the light through hole and covers the light through hole; the optical filter comprises an optical filter part and a fixing part arranged along the edge of the optical filter part; the fixing part is used for fixing the optical filter, and at least part of the optical filter is accommodated in the light through hole.

Another aspect of the embodiments of the present application further provides an electronic device, which includes a housing and the camera assembly of the above embodiments, wherein the camera assembly is accommodated in the housing.

The camera assembly and the electronic equipment provided by the embodiment of the application can provide an avoiding space for the sinking of the lens by accommodating the light filtering part of the light filter in the light through hole, ensure that the lens can sink to the maximum extent, and further reduce the whole thickness of the camera assembly.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a camera assembly according to some embodiments of the present application;

FIG. 2 is a schematic exploded view of a camera assembly according to some embodiments of the present application;

FIG. 3 is a schematic cross-sectional view of the camera head assembly of FIG. 1 taken along direction A-A;

FIG. 4 is a schematic view of a partial cross-sectional configuration of a camera assembly according to further embodiments of the present application;

FIG. 5 is a schematic view of a partial cross-sectional configuration of a camera assembly according to further embodiments of the present application;

FIG. 6 is a schematic view of a partial cross-sectional configuration of a camera head assembly according to some embodiments of the present application;

FIG. 7 is a schematic cross-sectional view of a camera assembly according to further embodiments of the present application;

FIG. 8 is a schematic diagram of an optical filter according to another embodiment of the present application;

FIG. 9 is a schematic view of a partial cross-sectional configuration of a camera assembly according to further embodiments of the present application;

FIG. 10 is a schematic view of a partial cross-sectional configuration of a camera assembly according to further embodiments of the present application;

FIG. 11 is a schematic diagram of an optical filter according to another embodiment of the present application;

FIG. 12 is a schematic view of a partial cross-sectional configuration of a camera head assembly according to further embodiments of the present application;

FIG. 13 is a schematic diagram of an electronic device in some embodiments of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Some embodiments of the present application provide a camera assembly that may be used in an electronic device. The electronic device may be a mobile phone, a tablet computer, an IPAD, or other electronic device with a camera assembly. Specifically, referring to fig. 1 and fig. 2 in combination, fig. 1 is a schematic structural diagram of a camera head assembly 100 according to some embodiments of the present disclosure, and fig. 2 is a schematic structural diagram of a camera head assembly 100 according to some embodiments of the present disclosure, where the camera head assembly 100 may generally include a circuit board 10, an electronic component 20, a support 30, and a photo sensor chip 40. The electronic component 20 is disposed on the circuit board 10 and electrically connected to the circuit board 10. The supporting member 30 is disposed on the circuit board 10. The photosensitive chip 40 is disposed on the supporting member 30, spaced apart from the circuit board 10, and electrically connected to the circuit board 10. The electronic component 20 is located between the photosensitive chip 40 and the circuit board 10.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present application are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

Further, referring to fig. 3, fig. 3 is a schematic cross-sectional structure of the camera head assembly 100 along the direction a-a in the embodiment of fig. 1. Specifically, the electronic component 20 is disposed on the circuit board 10, the photosensitive chip 40 is disposed above the electronic component 20 in a vertical direction Z (i.e., a direction substantially perpendicular to the circuit board 10), and the circuit board 10 is provided with a support 30 to support the photosensitive chip 40.

In some embodiments, the height of the supporting member 30 in a direction substantially perpendicular to the circuit board 10 may be greater than the height of the electronic component 20 in a direction substantially perpendicular to the circuit board 10, so that the photosensitive chip 40 is fixed on the supporting member 30 and can keep a certain distance from the electronic component 20, thereby preventing the photosensitive chip 40 from directly contacting the electronic component 20 to cause poor electrical properties.

It is understood that, in other embodiments, of course, the height of the supporting member 30 in the direction substantially perpendicular to the circuit board 10 may also be equal to the height of the electronic component 20 in the direction substantially perpendicular to the circuit board 10, and an insulating layer may be disposed on a side of the photosensitive chip 40 close to the electronic component 20 (i.e., a side contacting with the supporting member 30), so that when the photosensitive chip 40 is fixedly disposed on the supporting member 30, the photosensitive chip 40 does not directly contact with the electronic component 20, thereby avoiding poor electrical contact.

Further, it should be understood that the use of the term "substantially" herein in terms of a numerical quantity or other quantifiable relationship (e.g., perpendicularity or parallelism) is to be understood as indicating a quantity of ± 10%, unless otherwise defined with respect to a particular context. Thus, for example, lines that are substantially perpendicular to each other may be at an angle of between 81 ° and 99 ° to each other.

The camera assembly 100 provided in the embodiment of the present application, by changing the layout of the electronic components 20 and the photosensitive chips 40 in the circuit board 10, the electronic components 20 are arranged below the photosensitive chips 40 in the vertical direction Z, and the electronic components 20 and the photosensitive chips 40 are arranged in layers, so that the layout space of the electronic components 20 and the photosensitive chips 40 in the circuit board 10 is saved. Therefore, the camera assembly 100 can satisfy the size miniaturization requirement while satisfying the high integration. In some embodiments, the size of camera head assembly 100 in the horizontal direction (XY direction as shown in fig. 1) may be reduced by more than 0.5 mm.

It can be understood that the camera assembly provided by the embodiment of the application can be applied to electronic components including a front camera structure, a rear camera structure and other similar camera packaging structures, so that the electronic components with the structure can meet the requirement of size miniaturization while meeting high integration level.

In the embodiment of the present application, the electronic component 20 includes, but is not limited to, a capacitor, a resistor, a charged Erasable Programmable Read-Only Memory (EEPROM), and the like. The electronic component 20 may be soldered to the circuit board 10 by means of soldering, for example, solder paste, to electrically connect the electronic component 20 to the circuit board 10. Of course, in other embodiments, the electronic component 20 may be electrically connected to the circuit board 10 by other means, such as by bonding with a conductive adhesive.

In some embodiments of the present application, the supporting member 30 may be an insulating member, i.e., made of an insulating material. Further, the supporting member 30 may be made of Polyethylene terephthalate (PET), foam, or rubber. When the supporting member 30 is made of PET, foam, or rubber, the supporting member 30 may be attached to the circuit board 10 by, for example, glue, double-sided tape, or the like. Of course, in other embodiments, the supporting member 30 may be fixed on the circuit board 10 by other means, such as a snap fit, a screw connection, or the like.

In some embodiments of the present application, the support 30 has a substantially ring-shaped structure, and the electronic component 20 is located in an area surrounded by the ring-shaped structure. It will be appreciated that the loop structure may be a loop structure having straight sides, such as a rectangular frame structure, a diamond frame structure, a trapezoidal frame structure, or the like. Of course, the ring structure may also be a ring structure with curved edges, such as a circular ring frame structure, an oval frame structure, etc. In the embodiment of the present application, the supporting member 30 is a rectangular frame structure, and is formed by surrounding four sides end to end.

In some embodiments of the present disclosure, the photosensitive chip 40 may be attached to the supporting member 30 by glue (e.g., resin glue, back glue), double-sided glue, etc., so that the photosensitive chip 40 is fixed on the supporting member 30.

It should be noted that the terms "first" and "second" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

In some embodiments of the present application, please refer to fig. 4 and fig. 5, fig. 4 is a schematic partial sectional structure view of a camera assembly 100 in other embodiments of the present application, fig. 5 is a schematic partial sectional structure view of the camera assembly 100 in other embodiments of the present application, a receiving slot 11 may be further formed in the circuit board 10, and the electronic component 20 and the supporting member 30 are both received in the receiving slot 11. The photosensitive chip 40 is disposed on the supporting member 30, and the photosensitive chip 40 may be accommodated in the accommodating groove 11 or not be accommodated in the accommodating groove 11.

In some embodiments, as shown in fig. 4, the photo sensor chip 40 may be disposed on the supporting member 30 and accommodated in the accommodating slot 11 of the circuit board 10, and an end of the photo sensor chip 40 may abut against an inner sidewall of the accommodating slot 11.

In other embodiments, as shown in fig. 5, the photo sensor chip 40 may be disposed on the circuit board 10 and located outside the receiving slot 11, that is, the photo sensor chip 40 is not received in the receiving slot 11 of the circuit board 10.

The camera assembly provided by the embodiment of the application has the advantages that the accommodating groove 11 is formed in the circuit board 10, and the electronic element 20 and the supporting piece 30 are both accommodated in the accommodating groove 11, so that the space occupied by the electronic element 20 in the vertical direction Z can be reduced, and the camera assembly 100 can meet the miniaturization requirement while meeting the requirement of high integration level. Generally speaking, the depth of the receiving slot is generally above 0.1mm according to the structural requirements of the circuit board 10, that is, the thickness of the camera assembly 100 in the Z direction can be reduced by at least 0.1mm by the embodiments of the present application.

Referring to fig. 1 to 3 again, the camera head assembly 100 according to the present embodiment may further include a lens 60, a bracket 70, and an optical filter 80. The holder 70 is disposed between the circuit board 10 and the lens 60, and a receiving space 701 is defined between the holder 70 and the circuit board 10. The photosensitive chip 40, the supporting member 30 and the electronic component 20 are all accommodated in the accommodating space 701. The filter 80 may be fixed on the support 70 and spaced apart from the photosensitive chip 40.

Specifically, the lens 60, the holder 70, and the circuit board 10 may be sequentially disposed in the vertical direction Z. The holder 70 is used for supporting and fixing the lens 60 and the optical filter 80, and is fixedly connected with the lens 60, the circuit board 10 and the optical filter 80, respectively, to form the camera assembly 100 meeting the requirement of size miniaturization. The bracket 70 may be connected to the circuit board 10 and/or the lens 60 by gluing, welding, or screwing, and the bracket 70 may also be connected to the optical filter 80 by gluing or fastening.

In some embodiments of the present application, the support 70 is a frame-like structure defined by four sides that are joined end-to-end. The four sides of the bracket 70 are disposed on the circuit board 10, and form an accommodating space 701 with the circuit board 10 for accommodating the photosensitive chip 40, the supporting member 30 and the electronic component 20.

Further, referring to fig. 6 in combination, fig. 6 is a schematic partial sectional view of a camera head assembly 100 according to some embodiments of the present application, and the bracket 70 may include a main body portion 72 and a supporting portion 73. The main body 72 is connected to the circuit board 10 and the lens 60, and the supporting portion 73 is disposed on an end of the main body 72 close to the lens 60 and connected to the main body 72 and the filter 80. The supporting portion 73 is used for fixing and supporting the filter 80, and the supporting portion 73 encloses and forms a light passing hole 702.

Specifically, the end of the main body portion 72 near the lens 60 extends in a direction substantially perpendicular to the main body portion 72 to form a support portion 73. The support portion 73 extends toward the inner space of the housing space 701. In the embodiment of the present application, the supporting portion 73 has a substantially annular structure, and each annular side of the supporting portion 73 is substantially perpendicular to the corresponding side of the bracket 70.

Further, one end of the main body portion 72 near the lens 60 has a connection portion 721 for connection with the lens. Wherein the connection part 721 is connected with the support part 73 to form a stepped structure, so that the fixed lens 60 and the filter 80 can be supported, respectively. The optical filter 80 is supported on the step structure and can be fixed to the supporting portion 73 by glue or double-sided adhesive. In some embodiments, the filter 80 may be made of a blue glass filter and may be used to filter at least some of the infrared light to improve photographic image quality.

The embodiment of the present application provides that when the camera assembly is used for taking/recording images, light is incident from the lens 60 and reaches the optical filter 80 through the light-passing hole 702. The light filtered by the filter 80 reaches the photo sensor chip 40. The light sensing chip 40 converts the light image on the light sensing surface into an electrical signal in a corresponding proportional relationship with the light image and transmits the electrical signal to the circuit board 10, thereby realizing the photographing/video recording function. The photosensitive chip 40 may include a photosensitive region and a binding region, the photosensitive region has photosensitive pixels, and the binding region has a pad connected to the photosensitive pixels.

The embodiment of the application provides camera subassembly and arranges electronic component in sensitization chip below to arrange with sensitization chip layering. The electronic component can be electrically connected with the circuit board by means of solder paste welding or conductive adhesive bonding and the like. The space occupied by the electronic element in the XY direction can be saved by the mode that the supporting element lifts the electronic element or the supporting element covers the electronic element. The photosensitive chip can be attached to the supporting member by glue (e.g., resin adhesive, back glue), double-sided adhesive, etc. so that the photosensitive chip is fixed on the supporting member.

It can be understood that the camera head assembly provided by the embodiment of the present application has the first thickness H1 in the vertical direction (the Z direction shown in fig. 3), and the first thickness H1 plays a key role in the electronic device thinning scheme. In general, the first thickness H1 may be 4.49 mm.

In the continuing research, the applicant finds that, in the camera assembly provided in the above embodiment, the space occupied by the electronic components is mainly saved from the XY direction, so that the camera assembly can meet the miniaturization requirement while meeting the requirement of high integration. The applicant further researches and discovers that the whole thickness of the camera assembly is also a thinned space, and a new thought is further provided for a whole machine thinning scheme of the electronic equipment.

In view of this, in other embodiments of the present application, please refer to fig. 7, and fig. 7 is a schematic cross-sectional structure diagram of a camera head assembly 200 in other embodiments of the present application. Specifically, the camera head assembly 200 provided in the embodiment of the present application is different from the camera head assemblies in the foregoing embodiments in that: the structure of the filter 280 in the present embodiment is different from that of the filter 80 in the previous embodiment. While embodiments of the present application provide that the camera head assembly 200 may generally include the lens 260, the bracket 270, and the filter 280, it is understood that reference may be made to the camera head assembly 100 of the previous embodiments with respect to other structures of the camera head assembly 200, and the description of the embodiments of the present application will not be repeated.

Further, the holder 270 is provided with a light hole 271 facing the lens 260, and reference may be made to the light hole 702 in the foregoing embodiment for the structure of the light hole 271. The optical filter 280 is disposed at one side of the light-passing hole 271 close to the lens 260, and the optical filter 280 covers the light-passing hole 271, so that the light entering the lens 260 is filtered by the optical filter 280 and then enters the photosensitive chip from the light-passing hole 271, thereby preventing the unfiltered light from entering the photosensitive chip.

Specifically, referring to fig. 8, fig. 8 is a schematic structural diagram of a filter 280 according to another embodiment of the present disclosure, in which the filter 280 generally includes a light filtering portion 281 and a fixing portion 282, and the fixing portion 282 is disposed along an edge of the light filtering portion 281. In other words, the optical filter 280 may generally include a light-filtering portion 281 and a fixing portion 282 disposed along an edge of the light-filtering portion 281. The fixing portion 282 is used for fixing the filter 280, that is, the fixing portion 282 is fixedly connected to the supporting portion of the bracket, so as to fix the filter 280 on the side of the light-passing hole 271 close to the lens 260.

It is understood that the fixing portion 282 and the supporting portion of the bracket 270 may be fixedly connected by adhesion, and of course, the fixing portion 282 and the supporting portion of the bracket 270 may be fixedly connected by means of, for example, a snap. Further, the fixing portion 282 is fixedly connected to the supporting portion of the bracket 270, referring to the structure manner of fixedly connecting the filter 80 and the bracket 70 in the foregoing embodiment.

Further, the filter portion 281 is at least partially accommodated in the light transmitting hole 271 to serve as a space for sinking the lens 260, so that the lens 260 can be sunk to the maximum extent while the minimum safety distance between the filter portion 281 of the filter 280 and the lens 260 is ensured, thereby reducing the overall thickness of the camera assembly 200.

In some embodiments of the present disclosure, the lens 260 may include a light incident surface 261 and a light emitting surface 262 oppositely disposed, and the external light enters from the light incident surface 261, and then exits through the light emitting surface 262 and irradiates the filter 280. That is, the light incident surface 261 is disposed away from the filter 280, and the light emitting surface 262 is disposed close to the filter 280.

The camera assembly that this application embodiment provided, through hold the light filtering part with the light filter in logical unthreaded hole, can sink for the camera lens and provide and dodge the space, guarantee that the camera lens can make furthest's sinking, and then can reduce camera assembly's whole thickness.

It is understood that in the field of camera lenses, the lens is generally a convex lens structure, so that light rays are imaged on a photosensitive chip after passing through the lens. In the embodiment of the present application, the light emitting surface 262 is a curved surface.

Accordingly, the optical filter portion 281 may be formed in a curved surface, that is, the optical filter portion 281 is formed to be curved along the fixing portion 282 toward the light passing hole 271. In order to better sink the lens 260 to reduce the overall thickness of the camera assembly 200, the shape of the filter 281 may be adapted to the shape of the light exit surface 262. For example, the shape of the light filter 281 may be substantially the same as the shape of the light exit surface 262, that is, the concave portion of the light exit surface 262 corresponds to the concave portion of the light filter 281, and the convex portion of the light exit surface 262 corresponds to the convex portion of the light filter 281.

Preferably, the filter portion 281 is disposed in parallel with the light emitting surface 262, so that the filter portion 281 serves as an avoiding space for the light emitting surface 262. That is, the shape of the light filter 281 is the same as that of the light exit surface 262, and the distance from each point on the light exit surface 262 to the point on the light filter 281 is the same in the vertical direction (the Z direction shown in fig. 7), so that the light filter 281 can better avoid the light exit surface 262 when the lens 260 is lowered, thereby reducing the overall thickness of the camera assembly 200 to the maximum.

Of course, in other embodiments, please refer to fig. 9, fig. 9 is a schematic partial cross-sectional view of the camera assembly 200 according to other embodiments of the present application, and the light filter 281 is disposed in an arc shape and is partially accommodated in the light hole 271. In the vertical direction (Z direction shown in fig. 9), the filter portion 281 is formed to be curved and extended along the fixing portion 282 toward a direction away from the light exit surface 262. In other words, the arc-shaped surface of the filter 281 is disposed to protrude toward the light-passing hole 271, and is partially accommodated in the light-passing hole 271. The embodiment of the application sets the light-filtering portion 281 as an arc-shaped surface structure, and the arc-shaped surface structure forms an avoiding space when the lens 260 sinks, so that the light-emitting surface 262 of the lens 260 and the light-filtering portion 281 of the optical filter 280 can sink the lens 260 to a certain extent under the condition of keeping the minimum safe distance, thereby reducing the overall thickness of the camera assembly 200.

In other embodiments of the present application, please refer to fig. 10 and 11, in which fig. 10 is a schematic partial sectional structure diagram of a camera head assembly 200 according to other embodiments of the present application, and fig. 11 is a schematic structural diagram of an optical filter 280 according to other embodiments of the present application. The optical filter 280 may generally include a light filtering portion 281 and a fixing portion 282 disposed along an edge of the light filtering portion 281, wherein the light filtering portion 281 and the fixing portion 282 are bent and connected. Specifically, the filter portion 281 generally includes a connection portion 2811 and a filter portion 2812 connected in a bending manner, and the connection portion 2811 is disposed between the fixing portion 282 and the filter portion 2812 for connecting the fixing portion 282 and the filter portion 2812. Furthermore, the connector 2811 is connected with the fixing portion 282 in a bending manner, that is, the connector 281 is formed along the end portion of the fixing portion 282 close to the light-transmitting hole 271 and extends into the light-transmitting hole 271, so that the end portion of the connector 281 far from the fixing portion 282 extends into the light-transmitting hole 271, and further, an escape space is formed when the lens 260 sinks, and the lens 260 can sink to a certain extent, thereby reducing the overall thickness of the camera head assembly 200.

It should be noted that, in order to avoid the connector 2811 affecting the sinking space of the lens 260, an angle α between a plane of the connector 2811 and an extension line of the filter 2812 cannot be too small, that is, if α is 0 °, the connector 2811 is flush with the filter 2812, and the filter 280 is in a planar structure, so that no space can be provided for the lens 260 to sink. Based on this, in the embodiment of the present application, the included angle α is generally 45 to 90 °, and may be, for example, 45 °, 60 °, 75 °, 90 °, and the like.

Further, in the embodiment of the present invention, the connecting sub-portion 2811 and the filter sub-portion 2812 are disposed in a bending connection, so that the whole filter sub-portion 2812 can move in a direction away from the light emitting surface 262, and a whole avoiding space is provided for the lens 260 to sink. On the other hand, the filter portion 2812 is configured to be a planar structure, so that the molding process of the filter 280 is relatively simple, and the production efficiency is improved. In other words, the filter portion 2812 is parallel to the plane of the end surface of the light passing hole 271, that is, the plane of the filter portion 2812 is substantially perpendicular to the vertical direction (the Z direction shown in fig. 10).

It is understood that the connector portion 2811 mainly functions as a connecting portion 2812 and the fixing portion 282, and the connector portion 2811 may be disposed in a plane (as shown in fig. 10), or the connector portion 2811 may be disposed in an arc-shaped plane (as shown in fig. 11).

Referring to fig. 12, fig. 12 is a partial cross-sectional structure diagram of the camera head assembly 200 according to another embodiment of the present invention, when the connector portion 2811 is disposed in a plane, the connector portion 2811 can be vertically bent and connected with the filter portion 2812, that is, the connector portion 2811 and the filter portion 2812 are bent at 90 °. In this case, the upper side of the filter portion 2812 can be used as a space for avoiding the lens 260 when it is lowered, so as to raise the lowering stroke of the lens 260 to the maximum.

Further, in the above embodiment, at least a part of the light-filtering portion 281 of the light-filtering sheet 280 is not in the same plane as the fixing portion 282, so that an escape space is formed when the lens 260 is lowered. That is, in the direction parallel to the axis of the light passing hole 271 (i.e., the Z direction), the end point of the light filtering portion 281 far away from the fixing portion 282 is disposed at a certain distance from the fixing portion 282 to provide a space for the lens 260 to sink. In some embodiments of the present application, the distance between the end point of the light filtering portion 281 far from the fixing portion 282 and the fixing portion 282 in the Z direction is 0.1-0.3mm, for example, may be equal to 0.1mm, 0.2mm, 0.3 mm.

The camera assembly provided by the embodiment of the application can sink the lens to a certain extent under the condition that the minimum safe distance is kept between the light-emitting surface of the lens and the light filtering part of the optical filter by arranging the avoiding space when the lens sinks on the optical filter, so that the overall thickness of the camera assembly is reduced.

The applicant has found in research that the thickness of the camera head assembly 200 in the vertical direction (the Z direction shown in fig. 7) can be reduced by using the above-described filter 280 structure according to the embodiment of the present application. For example, the foregoing embodiments provide a camera head assembly 100 having a first thickness H1 in the vertical direction, the first thickness H1 being approximately 4.49 mm. The camera head assembly 200 provided by the embodiment of the present application has a second thickness H2 in the vertical direction (as shown in fig. 7), and the second thickness H2 is found to be approximately 4.29mm through experiments. I.e., the overall thickness of the camera assembly 200 can be reduced by about 0.2mm, it is obvious that great convenience can be provided for the thinning scheme of the electronic device.

Referring to fig. 13, fig. 13 is a schematic structural diagram of an electronic device 1000 according to some embodiments of the present application, where the electronic device 1000 may be any device having communication and storage functions, for example: the system comprises intelligent equipment with a network function, such as a tablet Computer, a mobile phone, an electronic reader, a remote controller, a Personal Computer (PC), a notebook Computer, vehicle-mounted equipment, a network television, wearable equipment and the like.

The electronic device 1000 according to the embodiment of the present disclosure includes a camera assembly 300 and a housing 400, the camera assembly 300 is accommodated in the housing 400, and the camera assembly 300 may be the camera assembly described in any of the embodiments above.

It is noted that the terms "comprises" and "comprising," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A camera head assembly, comprising:

a lens;

the bracket is provided with a light through hole which is opposite to the lens;

the optical filter is arranged on one side, close to the lens, of the light through hole and covers the light through hole;

the optical filter comprises an optical filter part and a fixing part arranged along the edge of the optical filter part; the fixing part is used for fixing the optical filter, and at least part of the optical filter is accommodated in the light through hole.

2. The camera head assembly according to claim 1, wherein the optical filter portion is provided in a curved surface, and the optical filter portion is formed to be curved and extended along the fixing portion toward the light passing hole.

3. The camera assembly according to claim 2, wherein the lens includes a light incident surface and a light emitting surface which are oppositely disposed, the light emitting surface is disposed near the optical filter, and the light emitting surface is disposed in a curved surface; the shape of the light filtering part is matched with that of the light emergent surface.

4. A camera assembly according to claim 3, wherein the optical filter portion is arranged parallel to the light exit surface so that the optical filter portion serves as an escape space for the light exit surface.

5. The camera head assembly according to claim 1, wherein the optical filter portion includes a connector portion and an optical filter portion, the connector portion is disposed between the fixing portion and the optical filter portion for connecting the fixing portion and the optical filter portion; wherein, the connecting sub-part is connected with the fixing part in a bending way.

6. The camera head assembly of claim 5, wherein an end of the connector portion away from the fixing portion extends into the light-passing hole, and the filter portion is parallel to a plane of an end surface of the light-passing hole.

7. The camera head assembly of claim 6, wherein the connector portion is disposed in a plane, and the connector portion is vertically bent and connected to the filter portion.

8. The camera assembly of claim 6, wherein said connector portion is provided in an arcuate plane.

9. The camera assembly according to claim 1, wherein the holder includes a main body portion connected to the lens, and a support portion disposed at an end of the main body portion adjacent to the lens and connected to the fixing portion of the filter; wherein, the supporting part encloses to form the light through hole.

10. The camera assembly according to claim 9, further comprising a circuit board and a photosensitive chip, wherein an accommodating space is defined between the bracket and the circuit board, the photosensitive chip is accommodated in the accommodating space, and the optical filter and the photosensitive chip are spaced apart from each other.

11. The camera assembly of claim 10, further comprising electronics disposed on the circuit board and a support, the electronics being located between the circuit board and the photo-sensing die; the photosensitive chip is arranged on the supporting piece and is arranged at intervals with the circuit board.

12. A camera assembly according to any of claims 2 to 11, wherein the distance between the end of the filter portion remote from the fixing portion and the fixing portion in a direction parallel to the axis of the clear aperture is from 0.1 to 0.3 mm.

13. An electronic device comprising a housing and a camera assembly according to any of claims 1-12, the camera assembly being housed within the housing.