CN111696935A - Heat dissipation member for laminated packaging structure, manufacturing method thereof and packaging structure - Google Patents
Heat dissipation member for laminated packaging structure, manufacturing method thereof and packaging structure Download PDFInfo
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- CN111696935A CN111696935A CN202010575777.6A CN202010575777A CN111696935A CN 111696935 A CN111696935 A CN 111696935A CN 202010575777 A CN202010575777 A CN 202010575777A CN 111696935 A CN111696935 A CN 111696935A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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Abstract
The invention provides a heat sink for a laminated packaging structure, a manufacturing method and a packaging structure, wherein the heat sink for the laminated packaging structure comprises the following components: a thermally conductive housing; the isolation layer includes from top to bottom sets gradually first, second. The invention relates to a heat dissipation piece for a laminated packaging structure, a manufacturing method of the heat dissipation piece, and a packaging structure laminated packaging structure.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a heat dissipation piece for a laminated packaging structure, a manufacturing method of the heat dissipation piece and the packaging structure.
Background
Consumers expect electronic products to be compact in all respects, which is also a major driving force for the main electronic products to shrink increasingly. As a result, enterprises are continually shrinking the overall size of end products, which are implemented using smaller semiconductor packages. Therefore, shrinking packages is a major trend in the semiconductor packaging industry.
Pop (package on package) is a typical three-dimensional packaging solution, which can integrate a logic chip and a memory chip at the same time, and has become an important component in the market of handheld devices which continuously pursue smaller and thinner. Compared with the packaging form of chip stacking, the laminated packaging has the advantages that each device can be tested independently before assembly, higher yield is guaranteed, and the total stacking and assembling cost can be reduced to the minimum. And the selection of the combination of the devices has more freedom, and the device is a preferable assembly scheme for products such as mobile phones, digital cameras and the like.
However, the stack package generally adopts a two-layer package stack structure, and this stack in the vertical direction makes the stack package structure more complicated, the air flowability between the upper and lower package bodies is deteriorated, and the heat dissipation of the stack package mainly takes the upper package body and the bottom substrate as a main path, which results in the deterioration of the heat dissipation performance of the stack package. Especially, in the high frequency of mobile devices, the heat dissipation problem of the stack is more serious due to the increasing power consumption of the chip, which easily causes the temperature of the chip in the package to be too high to exceed the requirement of thermal specification.
Disclosure of Invention
In view of the above problems, the present invention is directed to solving the above-described problems. An object of the present invention is to provide a heat sink for a stacked package structure, a manufacturing method thereof, and a package structure, which solve the above problems, and reduce the temperature of the package structure by adding the heat sink.
A heat spreader for a package-on-package structure, comprising:
a thermally conductive housing;
the insulating layer is arranged in the heat-conducting shell and comprises a first insulating layer and a second insulating layer which are sequentially arranged from top to bottom, wherein N is a natural number and is larger than a natural number, and any one of the first insulating layer and the second insulating layer is provided with an air guide hole;
the water liquid containing cavity is arranged between the two adjacent isolating layers and is used for filling the phase-change material, and when the temperature rises, the phase-change material absorbs heat to reduce the temperature of the packaging part; and
the convex column is arranged in the water liquid containing cavity and is used for connecting and fixing two adjacent isolating layers.
Preferably, the heat sink for a package-on-package structure further comprises:
the extension parts are arranged on the top side and/or the bottom side of the heat conduction shell and are arranged in parallel.
Preferably, the heat sink for a package-on-package structure further comprises:
particulate matter, particulate matter evenly set up in water liquid holds the intracavity.
A heat sink manufacturing method, comprising:
sequentially crossing and laminating the isolation layer and the convex columns to form a multi-layer isolation structure;
punching holes on the top surface of the multilayer isolation structure to form a plurality of air guide holes;
placing the prepared multilayer isolation structure in a heat-conducting shell;
filling a phase change material into the water liquid accommodating cavity of the heat conducting shell, and absorbing heat to reduce the temperature of the packaging part when the temperature is increased;
and sealing the heat-conducting shell.
A heat-dissipating package, comprising:
a heat sink for a stacked package structure;
a substrate wrapping the heat sink for the stacked package structure;
a first chip disposed on the top side of the substrate;
the heat dissipation cover is covered on the substrate and used for packaging and heat dissipation of the substrate;
the second chip is arranged on the bottom side of the substrate;
the first welding ball is arranged at the bottom side of the substrate and fixedly connected with the substrate;
and the packaging plate is arranged at the bottom side of the second chip and is used for fixedly connecting the second chip and the first welding balls.
Preferably, the heat sink for the package-on-package structure is arranged in contact connection with the first chip.
Preferably, the substrate includes:
a copper foil layer;
the dielectric layers are staggered and stacked with the copper foil layers;
and the through holes are arranged on two sides of the substrate, penetrate through the copper foil layer and the dielectric layer and are filled with metal.
Preferably, the material of the package board is ceramic, printed wiring board or metal.
Preferably, the heat dissipation type package structure further includes:
and the second solder balls are arranged at the bottom side of the packaging plate, fixedly connected with the packaging plate and used for connecting with an external circuit board.
Preferably, the heat dissipation type package structure further includes:
and the heat conduction material is arranged between the first chip and the heat dissipation cover.
The invention relates to a heat radiation piece for a laminated packaging structure, a manufacturing method and a packaging structure, which have the following technical effects:
this heat-dissipating piece holds the chamber for the gas-liquid and interlocks with the isolation layer and sets up, and when packaging structure heaies up, the gas-liquid holds phase change material in the chamber and can follow the liquid phase and change the gaseous phase to absorb a large amount of heat, solved packaging structure heat dissipation problem effectively.
Other characteristic features and advantages of the invention will become apparent from the following description of exemplary embodiments, which is to be read in connection with the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention. In the drawings, like reference numerals are used to indicate like elements. The drawings in the following description are directed to some, but not all embodiments of the invention. For a person skilled in the art, other figures can be derived from these figures without inventive effort.
Fig. 1 schematically illustrates a construction of a heat sink embodiment 1-3 of the present invention;
fig. 2 schematically shows a structure of a heat sink embodiment 4 of the present invention;
fig. 3 schematically illustrates a heat sink embodiment 5-6 of the present invention in a block diagram;
fig. 4 exemplarily shows a heat sink manufacturing flow chart of the present invention;
fig. 5 is a view schematically showing the structure of embodiment 7 of the package structure of the present invention;
fig. 6 is a view schematically showing the structure of embodiment 8 of the package structure of the present invention;
in the figure: 10. heat conduction shell, 11, extension, 20, isolation layer, 21, air guide hole, 30, water liquid hold the chamber, 31, projection, 32, particulate matter, 100, be used for stromatolite packaging structure heat dissipation piece, 200, base plate, 201, copper foil layer, 202, dielectric layer, 203, through-hole, 300, first chip, 301, second chip, 400, heat dissipation cover, 500, first solder ball, 501, second solder ball, 600, packaging board, 700, heat conduction material.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
The invention relates to a heat sink with a laminated packaging structure, a manufacturing method thereof and a basic idea of the packaging structure, wherein the basic idea of the packaging structure is as follows: and the heat of the packaging structure is reduced through gas-liquid conversion in the heat dissipation piece.
The heat sink for a stacked package structure, the manufacturing method thereof, and the package structure are described in detail below with reference to the accompanying drawings.
One object of the present invention is: a heat spreader for a package-on-package structure is provided, as shown in fig. 1: the method can comprise the following steps:
a thermally conductive housing 10.
The isolation layer 20 is disposed inside the heat conducting casing 10, and includes a first isolation layer 20 and a second isolation layer 20 sequentially disposed from top to bottom, where N is greater than 2 natural numbers, and each of the first and second isolation layers has an air guide hole 21.
The water liquid containing cavity 30 is disposed between two adjacent isolation layers 20, and is used for filling the phase change material, and when the temperature rises, the phase change material absorbs heat to lower the temperature of the package.
And a convex column 31 disposed in the water liquid accommodating chamber 30 for connecting and fixing the two adjacent isolation layers 20.
The working principle of the invention is as follows: when the temperature of the packaging structure rises, heat is transferred into the water liquid containing cavity 30 through the heat conducting shell 10, and the phase-change material absorbs heat and changes from a liquid phase to a gas phase, so that the temperature of the packaging structure is reduced.
And, as shown in fig. 2: in order to further improve the package heat dissipation performance, the heat sink may further include:
the extension parts 11 are arranged on the top side and/or the bottom side of the heat-conducting shell 10 in parallel.
The heat is transferred through the heat dissipation shell-extension part 11, so that the heat dissipation area is increased, and the heat dissipation efficiency is improved.
Meanwhile, the application aims at further research of the water liquid containing cavity, as shown in fig. 3: the heat sink may further include:
the particles 32, the particles 32 are uniformly arranged in the water liquid containing cavity 30.
The particles 32 are made of metal, the phase-change material can gradually infiltrate the particles 32, and the evaporation surface area of the phase-change material is increased, so that the gas-liquid conversion efficiency is improved, and the heat dissipation performance of the gas-liquid conversion device is improved.
In addition, research personnel can carry out trial and error comparison on dozens of metal, organic, inorganic and combined particles aiming at the particles, and finally select a metal core-shell nano-structure, specifically a copper core-graphite shell nano-particle, wherein the copper core-graphite shell nano-particle takes metal copper nano-particles as a core, graphite as a shell, the particle diameter of the copper nano-core is 10-30nm, the number of layers of the shell is 4-12, and the metal core-shell nano-structure is prepared by a magnetron sputtering technology.
The heat absorption performance of the metal core-shell nano structure is far better than that of pure copper particles, the metal core-shell nano structure is sensitive to temperature change, heat absorption and quick heat dissipation can be achieved quickly, the particle size of the particles is small, adsorption force is strong, phase-change materials can be adsorbed on the particles, the area is further increased, and the heat dissipation efficiency of a heat dissipation piece is effectively improved.
The present application also provides a method of manufacturing a heat sink, as shown in fig. 4: the method can specifically comprise the following steps:
the isolation layer 20 and the convex columns 31 are sequentially arranged in a crossed and laminated manner to form a multi-layer isolation structure.
Holes are punched on the top surface of the multilayer isolation structure to form a plurality of air guide holes 21.
The prepared multilayer insulation structure is placed inside a thermally conductive housing 10.
The phase-change material is filled in the heat-conducting casing 10, and the phase-change material is filled in the water liquid accommodating chamber 30 for absorbing heat to lower the temperature of the package when the temperature rises.
The thermally conductive housing 10 is sealed.
And, when filling the phase change material, can add the particulate matter to heat conduction shell 10, rock simultaneously for the particulate matter evenly distributed holds the chamber 30 in aqueous liquid.
A heat dissipation package structure, as shown in fig. 5: the method can comprise the following steps:
for a package-on-package heat spreader 100.
And a substrate 200 wrapping the heat sink 100 for a stacked package structure.
A first chip 300, disposed on the top side of the substrate 200.
The heat dissipation cover 400 covers the substrate 200, and is used for packaging and dissipating heat of the substrate 200.
The second chip 301 is disposed on the bottom side of the substrate 200.
The first solder balls 500 are disposed on the bottom side of the substrate 200 and fixedly connected to the substrate 200.
And the package board 600 is disposed on the bottom side of the second chip 301 and is used for fixing the second chip 301 and the first solder balls 500.
Specifically, the heat sink 100 for a package-on-package structure is disposed in contact with the first chip 300.
One object of the present invention is: to provide a high heat dissipation performance package structure, the substrate 200 may include:
a copper foil layer 201.
And the dielectric layers 202 are stacked with the copper foil layers 201 in a staggered mode.
And the through holes 203 are formed in the two sides of the substrate 200, penetrate through the copper foil layer 201 and the dielectric layer 202, and are filled with metal.
A portion of the heat of the first chip 300 is discharged through the heat sink 100-the copper foil layer 201-the through-hole 203.
Specifically, the material of the package board 600 may be ceramic, printed wiring board, or metal.
Generally, the heat dissipation package structure may further include:
the second solder balls 501 are disposed on the bottom side of the package board 600, and are fixedly connected to the package board 600 for preparing connection with an external circuit board.
In order to improve the heat dissipation performance, the heat dissipation package structure may further include:
and a heat conductive material 700 disposed between the first chip 300 and the heat dissipation cover 400.
Example 1
A heat spreader for a package-on-package structure, comprising: the heat conducting shell 10, the isolating layer 20 in the heat conducting shell 10, the isolating layer 20 includes 8 layers, the air guide hole 21 is set on the isolating layer 20, the water liquid containing cavity 30 between the two isolating layers 20, the convex column 31.
Example 2
A heat spreader for a package-on-package structure, comprising: the heat conducting shell 10, the isolating layer 20 in the heat conducting shell 10, the isolating layer 20 includes 10 layers, the air guide hole 21 set on the isolating layer 20, the water liquid containing cavity 30 between the two isolating layers 20, the convex column 31.
Example 3
A heat spreader for a package-on-package structure, comprising: the heat conducting shell 10, the isolating layer 20 in the heat conducting shell 10, the isolating layer 20 includes 15 layers, the air guide hole 21 set on the isolating layer 20, the water liquid containing cavity 30 between the two isolating layers 20, and the convex column 31.
Example 4
A heat spreader for a package-on-package structure, comprising: the heat conduction shell 10, the isolation layer 20 in the heat conduction shell 10, this isolation layer 20 includes 8 layers, sets up the air guide hole 21 on the isolation layer 20, and aqueous liquid holding cavity 30, projection 31 between two isolation layers 20, heat conduction shell 10 top side and bottom side extension 11.
Example 5
A heat spreader for a package-on-package structure, comprising: the heat conduction shell 10, the interior barrier layer 20 of heat conduction shell 10, this barrier layer 20 includes 8 layers, sets up air guide hole 21 on barrier layer 20, and aqueous liquid holds chamber 30, projection 31, metal particulate matter between two barrier layers 20, heat conduction shell 10 top side and bottom side extension 11.
Example 6
A heat spreader for a package-on-package structure, comprising: heat conduction shell 10, the interior barrier layer 20 of heat conduction shell 10, this barrier layer 20 includes 8 layers, sets up air guide hole 21 on barrier layer 20, and water liquid holds chamber 30, projection 31, copper nuclear graphite shell nanometer particulate matter between two barrier layers 20, heat conduction shell 10 top side and bottom side extension 11.
Example 7
A heat-dissipating package, comprising: a package-on-package heat spreader 100; a substrate 200, the substrate 200 wrapping the heat sink 100 for a stacked package structure; the first chip 300 is disposed on the top side of the substrate 200 for contacting the heat sink 100 with the first chip 300, the heat sink 400 is covered on the substrate 200, the second chip 301 and the first solder balls 500 are disposed on the bottom side of the substrate 200, the package board 600 is disposed on the bottom side of the second chip 301, the second solder balls 501 are disposed on the bottom side of the package board 600, and the heat conductive material 700 is disposed between the first chip 300 and the heat sink 400.
Example 8
A heat dissipation package structure, as shown in fig. 6, includes: a package-on-package heat spreader 100; a substrate 200, the substrate 200 wrapping the heat sink 100 for a stacked package structure; the first chip 300 is disposed on the top side of the substrate 200, the extension portion 11 of the heat sink 100 with the stack package structure contacts the first chip 300, the heat sink 400 covers the substrate 200, the second chip 301 and the first solder balls 500 are disposed on the bottom side of the substrate 200, the package board 600 is disposed on the bottom side of the second chip 301, the second solder balls 501 are disposed on the bottom side of the package board 600, and the heat conductive material 700 is disposed between the first chip 300 and the heat sink 400.
The invention discloses a heat dissipation member for a laminated packaging structure, a manufacturing method and a packaging structure.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of additional like elements in the article or device comprising the element.
The above embodiments are merely to illustrate the technical solutions of the present invention and not to limit the present invention, and the present invention has been described in detail with reference to the preferred embodiments. It will be understood by those skilled in the art that various modifications and equivalent arrangements may be made without departing from the spirit and scope of the present invention and it should be understood that the present invention is to be covered by the appended claims.
Claims (10)
1. A heat sink for a package-on-package structure, comprising:
a thermally conductive housing (10);
the insulating layer (20) is arranged inside the heat-conducting shell (10) and comprises a first insulating layer and a second insulating layer which are sequentially arranged from top to bottom, wherein N is a natural number greater than 2, and any one of the layers is provided with an air guide hole (21);
the water liquid containing cavity (30) is arranged between two adjacent isolating layers (20) and is used for filling the phase-change material, and when the temperature rises, the phase-change material absorbs heat to reduce the temperature of the packaging part; and
and the convex column (31) is arranged in the water liquid accommodating cavity (30) and is used for connecting and fixing the two adjacent isolating layers (20).
2. The heat spreader for a package-on-package structure of claim 1, further comprising:
the extension parts (11) are arranged on the top side and/or the bottom side of the heat-conducting shell (10) and are arranged in parallel.
3. The heat spreader for a package-on-package structure of claim 1, further comprising:
the particles (32), the particles (32) are evenly arranged in the water liquid containing cavity (30).
4. A method of manufacturing a heat sink, comprising:
sequentially arranging the isolation layers (20) and the convex columns (31) in a crossed and laminated manner to form a multi-layer isolation structure;
punching holes on the top surface of the multilayer isolation structure to form a plurality of air guide holes (21);
placing the prepared multilayer isolation structure in a heat-conducting shell (10);
filling a phase change material into the water liquid accommodating cavity (30) of the heat conducting shell (10) for absorbing heat and reducing the temperature of the packaging part when the temperature is increased;
the heat-conducting shell (10) is sealed.
5. A heat dissipation type package structure, comprising:
for a package-on-package heat spreader (100) as recited in any one of claims 1-3;
a substrate (200) encapsulating the heat spreader for package on package structure (100);
a first chip (300) disposed on the top side of the substrate (200);
the heat dissipation cover (400) covers the substrate (200) and is used for packaging and dissipating heat of the substrate (200);
a second chip (301) disposed on a bottom side of the substrate (200);
the first welding balls (500) are arranged at the bottom side of the substrate (200) and fixedly connected with the substrate (200);
and the packaging plate (600) is arranged at the bottom side of the second chip (301) and is used for fixedly connecting the second chip (301) and the first solder balls (500).
6. The heat dissipation package structure of claim 5,
the heat sink (100) for the stacked package structure is in contact connection with the first chip (300).
7. The heat dissipation package structure of claim 5,
the substrate (200) comprises:
a copper foil layer (201);
the dielectric layer (202) is stacked with the copper foil layer (201) in a staggered mode;
and the through holes (203) are arranged on two sides of the substrate (200), penetrate through the copper foil layer (201) and the dielectric layer (202), and are filled with metal.
8. The heat dissipation package structure of claim 5,
the packaging plate (600) is made of ceramic, printed circuit board or metal.
9. The heat dissipating package of claim 5, further comprising:
and the second solder balls (501) are arranged at the bottom side of the packaging plate (600), are fixedly connected with the packaging plate (600), and are used for connecting with an external circuit board.
10. The heat dissipating package of claim 5, further comprising:
a thermally conductive material (700) disposed between the first chip (300) and the heat dissipation cover (400).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010575777.6A CN111696935B (en) | 2020-06-22 | 2020-06-22 | Laminated packaging structure with heat dissipation part |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010575777.6A CN111696935B (en) | 2020-06-22 | 2020-06-22 | Laminated packaging structure with heat dissipation part |
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| CN111696935A true CN111696935A (en) | 2020-09-22 |
| CN111696935B CN111696935B (en) | 2022-03-29 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120168936A1 (en) * | 2010-12-31 | 2012-07-05 | Siliconware Precision Industries Co., Ltd. | Multi-chip stack package structure and fabrication method thereof |
| US20150091156A1 (en) * | 2013-09-27 | 2015-04-02 | Gerald Ho Kim | Three-Dimensional Silicon Structure For Integrated Circuits And Cooling Thereof |
| CN104538372A (en) * | 2014-12-29 | 2015-04-22 | 华进半导体封装先导技术研发中心有限公司 | Radiating type packaging structure, manufacturing method thereof and radiating type packaging substrate |
| CN107027264A (en) * | 2015-06-24 | 2017-08-08 | 碁鼎科技秦皇岛有限公司 | Fin and preparation method thereof and electronic equipment |
| CN109417847A (en) * | 2016-04-27 | 2019-03-01 | At&S奥地利科技与系统技术股份公司 | The method of heat accumulation parts carrier and the production parts carrier |
| CN109564907A (en) * | 2016-08-02 | 2019-04-02 | 高通股份有限公司 | Multi-layer heat dissipation device for electronic equipment including hot storage capacity |
| CN110828398A (en) * | 2018-08-08 | 2020-02-21 | 株洲中车时代电气股份有限公司 | Integrated soaking substrate for power semiconductor module packaging and manufacturing method thereof |
-
2020
- 2020-06-22 CN CN202010575777.6A patent/CN111696935B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120168936A1 (en) * | 2010-12-31 | 2012-07-05 | Siliconware Precision Industries Co., Ltd. | Multi-chip stack package structure and fabrication method thereof |
| US20150091156A1 (en) * | 2013-09-27 | 2015-04-02 | Gerald Ho Kim | Three-Dimensional Silicon Structure For Integrated Circuits And Cooling Thereof |
| CN104538372A (en) * | 2014-12-29 | 2015-04-22 | 华进半导体封装先导技术研发中心有限公司 | Radiating type packaging structure, manufacturing method thereof and radiating type packaging substrate |
| CN107027264A (en) * | 2015-06-24 | 2017-08-08 | 碁鼎科技秦皇岛有限公司 | Fin and preparation method thereof and electronic equipment |
| CN109417847A (en) * | 2016-04-27 | 2019-03-01 | At&S奥地利科技与系统技术股份公司 | The method of heat accumulation parts carrier and the production parts carrier |
| CN109564907A (en) * | 2016-08-02 | 2019-04-02 | 高通股份有限公司 | Multi-layer heat dissipation device for electronic equipment including hot storage capacity |
| CN110828398A (en) * | 2018-08-08 | 2020-02-21 | 株洲中车时代电气股份有限公司 | Integrated soaking substrate for power semiconductor module packaging and manufacturing method thereof |
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| CN111696935B (en) | 2022-03-29 |
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