CN111678957A - Crack detection device and method and electronic equipment - Google Patents

Crack detection device and method and electronic equipment Download PDF

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Publication number
CN111678957A
CN111678957A CN202010496007.2A CN202010496007A CN111678957A CN 111678957 A CN111678957 A CN 111678957A CN 202010496007 A CN202010496007 A CN 202010496007A CN 111678957 A CN111678957 A CN 111678957A
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detection
ito
value
circuit
capacitor
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郑发耀
李美炉
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Fuzhou Rockchip Electronics Co Ltd
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Fuzhou Rockchip Electronics Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/226—Construction of measuring vessels; Electrodes therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/24—Investigating the presence of flaws

Abstract

The invention provides a crack detection device and method and electronic equipment. The crack detection device is used for checking whether cracks exist in a region to be detected of a glass element, and comprises: an ITO capacitor; the detection line is connected with the ITO capacitor to form an ITO circuit; the detection line is attached to the area to be detected and is broken when cracks appear in the area to be detected, so that the capacitance value of the ITO circuit is changed; the detection value acquisition module is connected with the ITO capacitor and used for acquiring a detection value of a detection parameter; the reference value acquisition module is connected with the ITO capacitor and used for acquiring the reference value of the detection parameter; and the detection control module is connected with the detection value acquisition module and the reference value acquisition module and used for controlling the crack detection device and judging whether cracks exist in the area to be detected according to the detection value and the reference value. The crack detection device can realize crack detection based on the capacitance value.

Description

Crack detection device and method and electronic equipment
Technical Field
The invention belongs to the field of flaw and defect testing, relates to a crack detection device, and particularly relates to a crack detection device, a crack detection method and electronic equipment.
Background
Many of conventional electronic devices include glass Elements such as glass substrates, DOE (Diffractive Optical Elements), Optical waveguides, and the like. However, these glass elements are prone to edge chipping and cracking during testing or use, which can adversely affect the performance and life of the touch screen, and it is necessary to detect cracks in the glass elements. The detection of the cracks of the glass element is mostly realized based on the resistance value, however, the inventor finds that the detection of the cracks of the glass element can also be carried out based on the capacitance value in practical application, and the crack detection scheme based on the capacitance value is not available in the prior art.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a crack detection device, a crack detection method and an electronic apparatus, which are used for solving the problem that crack detection of a glass element is not performed based on a capacitance value in the prior art.
To achieve the above and other related objects, a first aspect of the present invention provides a crack detection apparatus for detecting a crack in a region to be measured of a glass member, the crack detection apparatus comprising: an ITO capacitor; the detection line is connected with the ITO capacitor to form an ITO circuit; the detection line is attached to the area to be detected and is broken when cracks appear in the area to be detected, so that the capacitance value of the ITO circuit is changed; the detection value acquisition module is connected with the ITO capacitor through the detection line and is used for acquiring a detection value of a detection parameter; the detection parameter is related to the capacitance value of the ITO circuit; the reference value acquisition module is connected with the ITO capacitor and used for acquiring the reference value of the detection parameter; the reference value of the detection parameter is related to the theoretical capacitance value of the ITO circuit; and the detection control module is connected with the detection value acquisition module and the reference value acquisition module and used for controlling the crack detection device and judging whether cracks exist in the area to be detected according to the detection value and the reference value.
In an embodiment of the first aspect, the ITO capacitor includes: the first ITO polar plate is connected with the detection line; the dielectric layer is arranged on one side of the first ITO polar plate; and the second ITO polar plate is arranged on one side of the dielectric layer far away from the first ITO polar plate.
In an embodiment of the first aspect, the first ITO pad is disposed on a side of the glass element close to the region to be measured; the detection lines are arranged around the first ITO polar plate in a surrounding mode.
In an embodiment of the first aspect, the detection value obtaining module includes: the charging circuit is connected with the ITO capacitor through the detection line to form an RC series circuit, is connected with the detection control module and is used for charging the ITO capacitor under the control of the detection control module so as to charge the ITO capacitor from an initial state to a target state; the timer is connected with the detection control module and used for acquiring the charging time of the ITO capacitor from the initial state to the target state; the charging time is the detection value of the detection parameter.
In an embodiment of the first aspect, the detection value obtaining module further includes: and the discharge circuit is connected with the ITO capacitor and the detection control module and is used for discharging the ITO capacitor under the control of the detection control module so as to enable the ITO capacitor to be in the initial state.
In an embodiment of the first aspect, the detection value obtaining module further includes: the input and output circuit is respectively connected with the charging circuit, the ITO capacitor and the detection control module; when the input/output circuit is in a high-resistance input state, the charging circuit charges the ITO capacitor; when the input-output circuit is in a low-resistance input state, the ITO capacitor is discharged through the input-output circuit.
In an embodiment of the first aspect, the reference value obtaining module includes: the resistance value acquisition unit is connected with the RC series circuit and used for acquiring the resistance value of the RC series circuit; the capacitance parameter acquisition unit is connected with the ITO capacitor and used for acquiring capacitance parameters of the ITO capacitor; the reference value calculating unit is connected with the resistance value acquiring unit and the capacitance parameter acquiring unit and used for acquiring theoretical charging time of the ITO capacitor from the initial state to the target state according to the resistance value of the RC series circuit and the capacitance parameter of the ITO capacitor; the theoretical charging time is the reference value of the detection parameter.
In an embodiment of the first aspect, the detection value obtaining module obtains a capacitance value of the ITO line as a detection value of the detection parameter; and the reference value acquisition module acquires the theoretical capacitance value of the ITO circuit as the reference value of the detection parameter.
A second aspect of the present invention provides an electronic device; the electronic device includes: a glass element; an ITO capacitor; the detection line is connected with the ITO capacitor to form an ITO circuit; the detection line is attached to a to-be-detected area of the glass element and is broken when cracks appear in the to-be-detected area, so that the capacitance value of the ITO circuit is changed; the control chip circuit is connected with the ITO capacitor and is used for acquiring a detection value and a reference value of a detection parameter and judging whether cracks exist in the area to be detected or not according to the detection value and the reference value; wherein the detection parameter is related to a capacitance value of the ITO line; the reference value of the detection parameter is related to the theoretical capacitance value of the ITO circuit.
A third aspect of the present invention provides a crack detection method applied to the crack detection apparatus of the first aspect; the crack detection method comprises the following steps: acquiring a detection value of a detection parameter; the detection parameter is related to the capacitance value of the ITO circuit; acquiring a reference value of the detection parameter according to the theoretical capacitance value of the ITO circuit; and judging whether the region to be detected has cracks or not according to the detection value and the reference value.
As described above, the crack detection apparatus, method and electronic device according to the present invention have the following advantages:
the crack detection device comprises a detection value acquisition module and a reference value acquisition module which are respectively used for acquiring a detection value and a reference value of a detection parameter; the detection parameter is related to the capacitance value of the ITO circuit, and the reference value of the detection parameter is related to the theoretical capacitance value of the ITO circuit. And a detection control module in the crack detection device can judge whether cracks exist in the region to be detected according to the detection value and the reference value. Therefore, the crack detection device can realize the crack detection of the glass element according to the capacitance value of the ITO circuit.
Drawings
Fig. 1A is a schematic structural diagram of a crack detection device according to an embodiment of the invention.
Fig. 1B is a schematic structural diagram of an ITO capacitor in an embodiment of the crack detection device of the present invention.
Fig. 1C is a schematic structural diagram of a first ITO plate in an embodiment of the crack detection device of the invention.
Fig. 1D is a schematic structural diagram of a first ITO plate in an embodiment of the crack detection device of the present invention.
Fig. 2A is a schematic structural diagram of a first ITO plate in an embodiment of the crack detection device of the invention.
Fig. 2B is a schematic structural diagram of a second ITO plate in an embodiment of the crack detection device of the present invention.
Fig. 2C is a schematic structural diagram of an ITO capacitor in an embodiment of the crack detection device of the invention.
Fig. 3 is a schematic structural diagram of a key module of the crack detection device according to an embodiment of the invention.
Fig. 4A is a schematic structural diagram of a key module of the crack detection device according to an embodiment of the invention.
Fig. 4B is a key module equivalent circuit diagram of the crack detection device in an embodiment of the invention.
Fig. 4C is an equivalent circuit diagram of a critical module of the crack detection device according to an embodiment of the invention.
Fig. 5 is a circuit diagram of a key module of the crack detection device according to an embodiment of the invention.
Fig. 6 is a flowchart illustrating crack detection performed by the crack detection apparatus according to an embodiment of the invention.
FIG. 7 is a flow chart illustrating a crack detection method according to an embodiment of the invention.
Description of the element reference numerals
1 crack detection device
11 ITO capacitor
111 first ITO plate
112 second ITO plate
113 dielectric layer
12 detection line
13 detection value acquisition module
131 charging circuit
132 timer
133 discharge circuit
134 input/output circuit
135I/O circuit
14 reference value acquisition module
15 detection control module
2 ITO circuit
3 glass element
31 area to be measured
32 cracks
S61-S67
S71-S73
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
Glass elements are widely used in existing electronic devices, however, edge crack and crack are easily generated in the process of testing, transporting, using and the like of the glass elements, and in the prior art, the crack detection of the glass elements is mostly realized by adopting a scheme based on a resistance value. However, the inventor finds out through research that the crack detection of the glass element can be carried out based on the capacitance value, and the crack detection scheme based on the capacitance value is not available in the prior art. In order to solve the problem, the invention provides a crack detection device, which comprises a detection value acquisition module and a reference value acquisition module, wherein the detection value acquisition module and the reference value acquisition module are respectively used for acquiring a detection value and a reference value of a detection parameter; the detection parameter is related to the capacitance value of the ITO circuit, and the reference value of the detection parameter is related to the theoretical capacitance value of the ITO circuit. And a detection control module in the crack detection device can judge whether cracks exist in the region to be detected according to the detection value and the reference value. Therefore, the crack detection device can realize the crack detection of the glass element according to the capacitance value of the ITO circuit.
Referring to fig. 1A, in an embodiment of the invention, the crack detection apparatus 1 includes:
an ITO capacitor 11. Referring to fig. 1B, the ITO capacitor 11 includes a first ITO plate 111 and a second ITO plate 112. In addition, the ITO capacitor 11 further includes a dielectric layer 113, where the dielectric layer 113 is located between the first ITO plate 111 and the second ITO plate 112, and may be air, silicon dioxide, or the like.
The wires 12 are detected. Referring to fig. 1C and fig. 1D, the detection line 12 is a conductive line, is attached to the area to be detected 31, and is connected to the ITO capacitor 11 to form an ITO line 2. Because the detection line 12 is attached to the region to be detected 31, when the region to be detected 31 has a crack 32, the detection line 12 will break, and at this time, the ITO line 2 is open-circuited, thereby causing the capacitance value of the ITO line 2 to change. Specifically, the method comprises the following steps: when the detection line 12 is not broken, the capacitance value of the ITO line 2 is related to not only the capacitance value of the ITO capacitor 11 but also the capacitance values of other capacitors in the crack detection device 1; the other capacitance refers to a capacitance existing in the crack detection device 1 except the ITO capacitor 11, for example, a parasitic capacitance generated by a PCB wiring, a chip pin, and the like. When the detection line 12 is broken, the capacitance value of the ITO line 2 is only related to the capacitance values of the other capacitors.
And the detection value acquisition module 13 is connected with the ITO capacitor 11 through the detection line 12 and is used for acquiring a detection value of a detection parameter. Wherein the detection parameter is related to the capacitance value of the ITO line 2; the detection value of the detection parameter is a value obtained according to the actual capacitance value of the ITO line 2, and the actual capacitance value of the ITO line 2 depends on the actual capacitance value of the ITO capacitor 11 and the capacitance values of the other capacitors.
A reference value obtaining module 14, connected to the ITO capacitor 11, for obtaining a reference value of the detection parameter; the reference value of the detection parameter is a value calculated according to a theoretical capacitance value of the ITO line 2 when the ITO line 2 is in a pass state. The theoretical capacitance value of the ITO line 2 depends on the theoretical capacitance value of the ITO capacitor 11 and the capacitance values of the other capacitors.
And the detection control module 15 is connected with the detection value acquisition module 13 and the reference value acquisition module 14, and is used for controlling the crack detection device 1 and judging whether cracks exist in the region to be detected according to the detection value and the reference value.
Specifically, when the detection line 12 is not broken, since the actual capacitance value of the ITO capacitor 11 is not much different from the theoretical capacitance value thereof, the detection value of the detection parameter is approximately equal to the reference value of the detection parameter. When the detection line 12 is broken, the capacitance value of the ITO line 2 is only related to the capacitance values of the other capacitors, so that the difference between the detection value of the detection parameter and the reference value of the detection parameter is large. Therefore, the detection control module 15 can determine whether the detection line 12 is broken by comparing the detection value with the reference value, and further obtain the crack condition of the region to be detected. Preferably, the capacitance value of the ITO capacitor 11 is much larger than that of the other capacitors, so that the detection control module 15 can clearly distinguish the detection value from the reference value.
In this embodiment, the crack detection device 1 is used for inspecting the crack condition of the glass element 3, and includes an ITO line 2, and the capacitance value of the ITO line 2 is related to whether the detection line 12 is broken or not. In this embodiment, a detection parameter related to the capacitance value of the ITO line is designed, and the crack condition of the region to be detected is obtained according to the relationship between the detection value of the detection parameter and the reference value thereof, so that crack detection based on the capacitance value can be realized.
In an embodiment of the present invention, the ITO capacitor includes: the first ITO polar plate is connected with the detection line; the dielectric layer is arranged on one side of the first ITO polar plate; and the second ITO polar plate is arranged on one side of the dielectric layer far away from the first ITO polar plate. Preferably, the first ITO plate is disposed around the glass element. In this embodiment, the ITO capacitor may be regarded as a flat capacitor, and two plates of the flat capacitor are the first ITO plate and the second ITO plate, respectively.
As shown in fig. 1B, in an embodiment of the present invention, the ITO capacitor 11 includes: the first ITO polar plate 111 is arranged on one side, close to the area to be detected, of the glass element 3 and is connected with the detection line 12; the dielectric layer 113 is arranged on one side, far away from the glass element 3, of the first ITO polar plate 111; and the second ITO electrode plate 112 is arranged on one side of the dielectric layer 113 far away from the first ITO electrode plate 111. Preferably, the first ITO plate 111 is attached to the glass element 3.
Referring to fig. 2A, fig. 2B and fig. 2C, in an embodiment of the invention, the first ITO plate 111 is disposed on a side of the glass element 3 close to the region to be detected, and the detection lines 12 are disposed around the first ITO plate 111 so as to cover the region to be detected surrounding the first ITO plate 111. Fig. 2A is an exemplary diagram of the first ITO plate 111, fig. 2B is an exemplary diagram of the second ITO plate 112, and fig. 2C is a diagram of a finished product of the ITO capacitor 11 formed by combining the first ITO plate 111 and the second ITO plate 112. In a specific application, the detected value obtaining module 13, the reference value obtaining module 14, and the like in the crack detecting apparatus 1 may be connected to the first ITO plate 111 or the second ITO plate 112 of the ITO capacitor 11 through corresponding pads. In this embodiment, the inspection lines 12 are arranged around the first ITO plate 111, and in this case, the crack detection device 1 can detect cracks within a range of one circle near the first ITO plate 111, that is: the area to be detected 31 is arranged around the first ITO electrode plate 111, and the detection lines 12 are arranged around the area to be detected 31.
Referring to fig. 3, in an embodiment of the present invention, the detection value obtaining module 13 includes a charging circuit 131 and a timer 132, and both the charging circuit 131 and the timer 132 are connected to the detection control module 15. The charging circuit 131 includes a power source and a resistor element, and is connected to the ITO capacitor 11 through the detection line 12 to form an RC series circuit. The power supply can charge the ITO capacitor 11 under the control of the detection control module 15.
Specifically, at time t1, the ITO capacitor 11 is in an initial state, and at this time, the detection control module 15 controls the power supply to charge the ITO capacitor through the RC series circuit by the control signal CS, and controls the timer to record the time t1 of starting charging. When the ITO capacitor 11 is charged to a target state, the detection control module 15 controls the timer to record a time t2 at this time through the control signal CS. Therefore, the charging time for charging the ITO capacitor 11 from the initial state to the target state, which is the reference value of the detection parameter, can be obtained according to the difference between the time t2 and the time t 1. The initial state is, for example, an initial voltage value, and the target state is, for example, a target voltage value. The initial voltage value and the target voltage value are both voltage values across the ITO capacitor 11. Preferably, the initial voltage value is approximately 0V.
The detection control module 15 can adjust the output voltage of the power supply by the control signal CS, so that the charging circuit 131 starts to charge the ITO capacitor 11 from time t 1; specifically, before time t1, the detection control module 15 controls the power output voltage to be 0 or low, and adjusts the output voltage to be high from time t 1. The detection control module 15 may also control the on-off state of the charging circuit, so that the charging circuit 131 starts to charge the ITO capacitor 11 from time t 1; specifically, before the time t1, the detection control module 15 controls the charging circuit 131 to be turned off, and controls the charging circuit 131 to be turned on from the time t 1. The above description only exemplifies two charging control manners, but the control of the charging circuit by the detection control module in this embodiment is not limited to the above two manners.
In an embodiment of the invention, the detection value obtaining module 13 further includes a discharging circuit 133. The discharge circuit 133 is connected to the ITO capacitor 11 and the detection control module 15, and is configured to discharge the ITO capacitor 11 under the control of the detection control module 15, so that the ITO capacitor 11 is in the initial state. The discharge circuit 133 is, for example, a low-resistance circuit, and before the time t1, the ITO capacitor 11 is continuously discharged through the discharge circuit 133, so that the amount of charge on the plate thereof is continuously decreased, and finally reaches the initial state.
In some embodiments, the detection parameter is an analog quantity such as a capacitance value or a resistance value. In specific application, the detection control module is usually implemented by a System-on-a-Chip (SoC), and a CPU in the SoC can only process digital quantities, and at this time, the SoC must have an analog-to-digital conversion function to convert the analog quantities into digital quantities, so that the CPU completes crack detection according to the digital quantities. Therefore, in these embodiments, in order to implement crack detection, the SoC must have an analog-to-digital conversion function, which not only increases the requirement for SoC performance and thus increases the cost, but also increases the CPU resource consumption by performing the analog-to-digital conversion.
To address this problem, please refer to fig. 4A, in an embodiment of the present invention, the detection value obtaining module 13 further includes: and an input/output circuit 134 connected to the charging circuit 131 and the detection control module 15, and connected to the ITO capacitor 11 through the detection line 12. The detection control module 15 can adjust the input resistance of the input/output circuit 134 through the control signal CS, so that the input/output circuit 134 is in a high-resistance input state or a low-resistance input state. Those skilled in the art will appreciate that the high impedance input state means that the input resistance of the input-output circuit 134 is large enough that the input-output circuit 134 can be considered approximately as an open circuit; at this time, the equivalent circuit diagram for the RC series circuit is shown in fig. 4B. The low resistance input state means that the input resistance of the input-output circuit 134 is small enough that the input-output circuit 134 can be approximately treated as a short circuit; at this time, the equivalent circuit diagram for the RC series circuit is shown in fig. 4C.
Specifically, before time t1, the detection control module 15 controls the input/output circuit to be in a low-resistance input state, and at this time, the ITO capacitor 11 is discharged through the input/output circuit 134 until the ITO capacitor 11 is in the initial state. After time t1, the detection control module 15 controls the input/output circuit 134 to be in a high-impedance input state, and at this time, the power supply E charges the ITO capacitor 11 until the ITO capacitor 11 is in the target state. Therefore, in this embodiment, the detection control module 15 can realize the charging and discharging control of the ITO capacitor 11 by adjusting the input resistance of the input/output circuit 134.
In this embodiment, when the detection control module 15 is implemented by SoC, the I/O circuit of the SoC itself may be used as the input/output circuit 134, and the counter of the SoC itself may be used as the timer 132. Therefore, the crack detection device of the embodiment does not need the SoC to have a digital-to-analog conversion function, reduces the requirements on the SoC performance, and is beneficial to reducing the cost and reducing the resource consumption of the CPU.
In an embodiment of the invention, the reference value obtaining module includes a resistance value obtaining unit, a capacitance parameter obtaining unit, and a reference value calculating unit. The resistance value acquisition unit is connected with the RC series circuit and the detection control module and is used for acquiring a resistance value R of the RC series circuit; the obtaining of the resistance value R may be implemented by using an existing resistance measurement circuit or resistance measurement equipment, and details are not repeated here.
And the capacitance parameter acquisition unit is connected with the ITO capacitor and the reference value calculation unit and is used for acquiring the capacitance parameter of the ITO capacitor. Wherein the capacitance parameters include an effective area S of the ITO capacitor, a relative permittivity of an inter-electrode medium, and a thickness d of the ITO capacitor.
The reference value calculating unit can calculate the theoretical capacitance value of the ITO capacitor according to the capacitance parameter, and calculate the theoretical capacitance value C of the ITO circuit according to the theoretical capacitance value and the capacitance values of the other capacitors. Further, the reference value calculating unit can calculate theoretical charging time of the ITO capacitor from the initial state to the target state according to a theoretical capacitance value C of the ITO line and a resistance value R of the RC series circuit; the theoretical charging time is the reference value of the detection parameter.
For example, if the voltage across the ITO capacitor in the initial state is 0, and the voltage across the ITO capacitor in the target state is Vt, then the theoretical charging time t is calculated by the following formula:
Figure BDA0002522873260000091
wherein E is the power supply voltage of the RC series circuit.
In an embodiment of the present invention, the detection value obtaining module obtains a capacitance value of the ITO line as the detection value of the detection parameter; and the reference value acquisition module acquires the theoretical capacitance value of the ITO circuit as the reference value of the detection parameter. The detection control module can judge whether the detection line is broken or not by comparing the capacitance value of the ITO circuit with the theoretical capacitance value of the ITO circuit, and further can acquire the crack state of the area to be detected. The capacitance value of the ITO circuit can be realized by using the existing capacitance measurement scheme or measurement equipment, and the theoretical capacitance value of the ITO circuit can be calculated according to the capacitance parameter of the ITO capacitor, the capacitance values of the other capacitors and the circuit connection mode.
Referring to fig. 5, in an embodiment of the invention, the crack detection apparatus includes:
an ITO capacitor 11 including a first ITO plate 111 and a second ITO plate 112; the first ITO polar plate 111 is attached to one side, close to the area to be detected, of the glass element;
the detection line 12 is connected with the first ITO polar plate 111 and is attached to a region to be detected of the glass element; when the region to be detected has cracks, the detection line 12 is broken;
a charging circuit 131 connected to the ITO capacitor 11 through the detection line 12 to form an RC series circuit;
and the SoC is connected with the charging circuit 131 through the self-contained I/O circuit 135 thereof and is connected with the ITO capacitor 111 through the self-contained I/O circuit 135 thereof and the detection line 12 thereof, and is used for controlling the crack detection device 1 and acquiring the crack state of the area to be detected.
Referring to fig. 6, the implementation method for controlling the crack detection device 1 and acquiring the crack state of the region to be detected by the SoC includes:
s61, setting the I/O circuit 135 to a low resistance input state to discharge the ITO capacitor 11 through the I/O circuit 135.
S62, when the output of the I/O circuit 135 is "0", it starts its own time counter. At this time, the voltage across the ITO capacitor 11 is approximately 0V.
S63, setting the I/O circuit 135 to a high impedance input state to cause the charging circuit 131 to charge the ITO capacitor 11; the value of the counter N1 is recorded.
S64, setting the threshold voltage of the I/O circuit 135 to VtAt this time, when the voltage of the PAD of the I/O circuit 135 increases to the threshold voltage VtThe input-output circuit generates an INT interrupt signal.
S65, waiting for INT interrupt signal, and judging whether overtime exists according to the value of the counter; if yes, it is indicated that the ITO line has a short-circuit fault, and this detection is ended, otherwise, step S66 is executed.
S66, when the SoC receives the INT interrupt signal, recording the value of the counter N2, and calculating the difference value of N2-N1 as the time difference.
S67, comparing the time difference with a preset value: if the time difference is smaller than the preset value, the detection line 12 is broken, and at the moment, cracks exist in the area to be detected; if the time difference is greater than or equal to the preset value, it is indicated that the detection line 12 is not broken, and at this time, no crack exists in the region to be detected.
Further, after the step S62 and before the step S63, the method may further include the steps of: a time t0 is delayed to further discharge the capacitor 11 to ensure as much as possible a voltage of 0V across it. the value of t0 can be set according to actual requirements, and the longer the time is, the more complete the discharge of the ITO capacitor is, and the closer the voltage at the two ends of the ITO capacitor is to 0V.
In an embodiment of the invention, the reference value obtaining module calculates an effective area S of the ITO capacitor to be 3mm according to the image of the ITO capacitor2And the relative permittivity of the dielectric silicon dioxide between electrodes of the ITO capacitor is approximately equal to 4.3, the thickness d of the ITO capacitor is 340nm, and at the moment, the theoretical capacitance value of the ITO capacitor is
Figure BDA0002522873260000101
In addition, the capacitance value of the other capacitors acquired by the reference value acquisition module is about 5-20 pF, and the resistance value R of the RC series circuit is 100 Kohm. The other capacitances include parasitic capacitances such as I/O, PCB wiring capacitance. In addition, the SoC converts the threshold voltage V of the input/output circuittSet to E/2. At this time, the reference value of the detection signal calculated by the reference value acquisition module is 23.7-24.7 μ s. When the detection line 12 is broken, the detection value of the detection signal obtained by the detection value acquisition module is 0.35-1.39 mus. By contrast, in the present embodiment, the difference between the detection value and the reference value is about 20 times, so the CPU can clearly and accurately distinguish the detection value from the reference value.
According to the above description of the crack detection device, the invention also provides an electronic device. The electronic equipment comprises a glass element, an ITO capacitor, a detection line and a control chip circuit. The detection line is connected with the ITO capacitor to form an ITO circuit; the detection line is attached to a to-be-detected area of the glass element and is broken when cracks appear in the to-be-detected area, so that the capacitance value of the ITO circuit is changed; the control chip circuit is connected with the ITO capacitor and is used for acquiring a detection value and a reference value of a detection parameter and judging whether cracks exist in the area to be detected or not according to the detection value and the reference value; wherein the detection parameter is related to a capacitance value of the ITO line; the reference value of the detection parameter is related to the theoretical capacitance value of the ITO circuit. Preferably, the ITO capacitor is attached to one side of the glass element.
Specifically, the control chip circuit comprises a charging circuit and an SoC chip. The charging circuit is connected with the ITO capacitor through the detection line to form an RC series circuit, and is used for charging the ITO capacitor under the control of the SoC chip so as to charge the ITO capacitor from an initial state to a target state. The SoC chip is connected to the charging circuit through its own I/O circuit, and is connected to the ITO capacitor 111 through its own I/O circuit and the detection line, for controlling the crack detection device 1 and obtaining the crack state of the region to be detected. The structures and functions of the ITO capacitor, the detection line and the control chip circuit in the electronic equipment are the same as those of the crack detection device, and are not repeated herein for saving the description space.
According to the above description of the crack detection apparatus, the present invention also provides a crack detection method; the crack detection method is applied to the crack detection device. Referring to fig. 7, in an embodiment of the invention, the crack detection method includes:
s71, acquiring a detection value of a detection parameter; the detection parameter is related to the capacitance value of the ITO circuit; wherein the detection parameter is related to the capacitance value of the ITO line 2; the detection value of the detection parameter is a value obtained according to the actual capacitance value of the ITO line 2, and the actual capacitance value of the ITO line 2 depends on the actual capacitance value of the ITO capacitor 11 and the capacitance values of the other capacitors.
S72, acquiring a reference value of the detection parameter according to the theoretical capacitance value of the ITO circuit; the reference value of the detection parameter is a value calculated according to a theoretical capacitance value of the ITO line 2 under the assumption that the ITO line 2 is in a pass state. In addition, the theoretical capacitance value of the ITO line 2 depends on the theoretical capacitance value of the ITO capacitor 11 and the capacitance values of the other capacitors.
And S73, judging whether the area to be detected has cracks or not according to the detection value and the reference value.
Specifically, when the detection line 12 is not broken, the capacitance value of the ITO line 2 is related to not only the capacitance value of the ITO capacitor 11 but also the capacitance values of other capacitors in the crack detection device 1; since the actual capacitance value of the ITO capacitor 11 does not differ much from the theoretical capacitance value thereof, the detection value of the detection parameter is approximately equal to the reference value of the detection parameter.
When the detection line 12 is broken, the capacitance value of the ITO line 2 is only related to the capacitance values of the other capacitors, so that the difference between the detection value of the detection parameter and the reference value of the detection parameter is large. Therefore, the detection control module 15 can determine whether the detection line 12 is broken by comparing the detection value with the reference value, and further obtain the crack condition of the region to be detected. Preferably, the capacitance value of the ITO capacitor 11 is much larger than that of the other capacitors, so that the CPU can clearly distinguish the detection value from the reference value.
The protection scope of the crack detection method of the present invention is not limited to the execution sequence of the steps listed in this embodiment, and all the solutions implemented by the steps addition, subtraction, and step replacement in the prior art according to the principles of the present invention are included in the protection scope of the present invention.
The crack detection device comprises a detection value acquisition module and a reference value acquisition module which are respectively used for acquiring a detection value and a reference value of a detection parameter; the detection parameter is related to the capacitance value of the ITO circuit, and the reference value of the detection parameter is related to the theoretical capacitance value of the ITO circuit. And a detection control module in the crack detection device can judge whether cracks exist in the region to be detected according to the detection value and the reference value. Therefore, the crack detection device can realize the crack detection of the glass element according to the capacitance value of the ITO circuit.
The crack detection device may set a charging time of the ITO capacitor as a detection value of the detection parameter, and set a theoretical charging time as a reference value of the detection parameter. At this time, the crack detection device may use an I/O circuit of the SoC itself to control charging and discharging of the ITO capacitor, and use a counter of the SoC itself to obtain the charging time. Therefore, digital-to-analog conversion is not needed in the crack detection process, and the SoC does not need to have the digital-to-analog conversion function. Therefore, the crack detection device has relatively low requirements on SoC, and is beneficial to reducing the cost and improving the utilization rate of a CPU.
In conclusion, the present invention effectively overcomes various disadvantages of the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (10)

1. A crack detection device for detecting cracks in a region of a glass element to be tested, the crack detection device comprising:
an ITO capacitor;
the detection line is connected with the ITO capacitor to form an ITO circuit; the detection line is attached to the area to be detected and is broken when cracks appear in the area to be detected, so that the capacitance value of the ITO circuit is changed;
the detection value acquisition module is connected with the ITO capacitor through the detection line and is used for acquiring a detection value of a detection parameter; the detection parameter is related to the capacitance value of the ITO circuit;
the reference value acquisition module is connected with the ITO capacitor and used for acquiring the reference value of the detection parameter; the reference value of the detection parameter is related to the theoretical capacitance value of the ITO circuit;
and the detection control module is connected with the detection value acquisition module and the reference value acquisition module and used for controlling the crack detection device and judging whether cracks exist in the area to be detected according to the detection value and the reference value.
2. The crack detection device of claim 1, wherein the ITO capacitor comprises:
the first ITO polar plate is connected with the detection line;
the dielectric layer is arranged on one side of the first ITO polar plate;
and the second ITO polar plate is arranged on one side of the dielectric layer far away from the first ITO polar plate.
3. The crack detection device according to claim 2, wherein: the first ITO polar plate is arranged on one side, close to the area to be detected, of the glass element; the detection lines are arranged around the first ITO polar plate in a surrounding mode.
4. The crack detection device according to claim 1, wherein the detection value acquisition module includes:
the charging circuit is connected with the ITO capacitor through the detection line to form an RC series circuit, is connected with the detection control module and is used for charging the ITO capacitor under the control of the detection control module so as to charge the ITO capacitor from an initial state to a target state;
the timer is connected with the detection control module and used for acquiring the charging time of the ITO capacitor from the initial state to the target state; the charging time is the detection value of the detection parameter.
5. The crack detection device according to claim 4, wherein the detection value acquisition module further includes:
and the discharge circuit is connected with the ITO capacitor and the detection control module and is used for discharging the ITO capacitor under the control of the detection control module so as to enable the ITO capacitor to be in the initial state.
6. The crack detection device according to claim 4, wherein the detection value acquisition module further includes:
the input and output circuit is respectively connected with the charging circuit, the ITO capacitor and the detection control module; when the input/output circuit is in a high-resistance input state, the charging circuit charges the ITO capacitor; when the input-output circuit is in a low-resistance input state, the ITO capacitor is discharged through the input-output circuit.
7. The crack detection device of claim 4, wherein the reference value acquisition module comprises:
the resistance value acquisition unit is connected with the RC series circuit and used for acquiring the resistance value of the RC series circuit;
the capacitance parameter acquisition unit is connected with the ITO capacitor and used for acquiring capacitance parameters of the ITO capacitor;
the reference value calculating unit is connected with the resistance value acquiring unit and the capacitance parameter acquiring unit and used for acquiring theoretical charging time of the ITO capacitor from the initial state to the target state according to the resistance value of the RC series circuit and the capacitance parameter of the ITO capacitor; the theoretical charging time is the reference value of the detection parameter.
8. The crack detection device according to claim 1, wherein: the detection value acquisition module acquires the capacitance value of the ITO circuit as the detection value of the detection parameter; and the reference value acquisition module acquires the theoretical capacitance value of the ITO circuit as the reference value of the detection parameter.
9. An electronic device, characterized in that the electronic device comprises:
a glass element;
an ITO capacitor;
the detection line is connected with the ITO capacitor to form an ITO circuit; the detection line is attached to a to-be-detected area of the glass element and is broken when cracks appear in the to-be-detected area, so that the capacitance value of the ITO circuit is changed;
the control chip circuit is connected with the ITO capacitor and is used for acquiring a detection value and a reference value of a detection parameter and judging whether cracks exist in the area to be detected or not according to the detection value and the reference value; wherein the detection parameter is related to a capacitance value of the ITO line; the reference value of the detection parameter is related to the theoretical capacitance value of the ITO circuit.
10. A crack detection method for use in the crack detection apparatus as claimed in any one of claims 1 to 8, the crack detection method comprising:
acquiring a detection value of a detection parameter; the detection parameter is related to the capacitance value of the ITO circuit;
acquiring a reference value of the detection parameter according to the theoretical capacitance value of the ITO circuit;
and judging whether the region to be detected has cracks or not according to the detection value and the reference value.
CN202010496007.2A 2020-06-03 2020-06-03 Crack detection device and method and electronic equipment Pending CN111678957A (en)

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