CN111673559A - Silicon chip attenuate grinding mechanism based on air pressure formula - Google Patents
Silicon chip attenuate grinding mechanism based on air pressure formula Download PDFInfo
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- CN111673559A CN111673559A CN202010405779.0A CN202010405779A CN111673559A CN 111673559 A CN111673559 A CN 111673559A CN 202010405779 A CN202010405779 A CN 202010405779A CN 111673559 A CN111673559 A CN 111673559A
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- grinding
- air flow
- sleeve
- silicon wafer
- grinding sleeve
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/226—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain in which the tool is supported by the workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of silicon wafer grinding and thinning equipment, and discloses a silicon wafer thinning and grinding mechanism based on an air flow pressure type, which comprises an installation base, wherein a grinding sleeve is fixedly installed at the top end of the installation base, a semicircular through groove is formed in one side of the middle part of the grinding sleeve, a semicircular clamping groove is formed in the other side of the middle part of the grinding sleeve, an air flow nozzle is fixedly installed in the middle part of the top end of the installation base and located in an inner cavity of the grinding sleeve, and a hydraulic driving cylinder is fixedly installed on one side of the top. This silicon chip attenuate grinding mechanism based on air current pressure formula to the setting of air current nozzle exterior structure, can form a turbulent effect to the air current that lets in, makes it can be stable upwards promote the transport to placing the silicon chip that supports the ring to avoided causing the problem that the silicon chip inclines to appear because of the unstability of air current, and then the grinding of different degrees appears in the top that leads to the silicon chip, further improved the grinding precision of this grinding equipment to the silicon chip.
Description
Technical Field
The invention relates to the technical field of silicon wafer grinding and thinning equipment, in particular to a silicon wafer thinning and grinding mechanism based on an air flow pressure type.
Background
The silicon wafer thinning process is used for grinding and removing redundant materials on the back of a manufactured silicon wafer of a semiconductor integrated circuit layer to enable the silicon wafer to reach the required thickness, can effectively reduce the packaging volume of the silicon wafer, simultaneously improves the performances of a device in the aspects of heat dissipation, machinery, electricity and the like, simultaneously avoids the problems that the ground silicon wafer is warped and the edge is damaged during scribing, and needs to cut a notch with a certain depth on the back of the silicon wafer by using mechanical or chemical methods before thinning the silicon wafer so as to enhance the breakage resistance of the silicon wafer.
However, in the technology of thinning and grinding silicon wafers by using the existing grinding machine, because the feeding amount of the grinding wheel in each working process is set in advance, and the grinding wheel can generate abrasion consumption of different degrees in the long-term working process, the thickness of the grinding wheel can generate attenuation of different degrees in each grinding process, so that the grinding amount of each group of silicon wafers in different degrees appears under the same feeding amount of the grinding wheel, the precision of grinding and thinning the silicon wafers is poor, and the stability and controllability are low.
Disclosure of Invention
Technical problem to be solved
The invention provides a silicon wafer thinning and grinding mechanism based on an air flow pressure type, which has the advantages of higher precision of silicon wafer grinding and thinning, no influence of grinding loss of a grinding sheet, and higher stability and controllability, and solves the problems that in the technology of thinning and grinding the silicon wafer by the existing grinding machine, because the feeding amount of a grinding wheel in each working process is set in advance, the grinding wheel can generate different degrees of wear consumption in the long-term working process, the thickness of the grinding wheel can generate different degrees of attenuation in each grinding process, so that each group of silicon wafers can generate different degrees of grinding amount under the same feeding amount of the grinding wheel, and the silicon wafers are poorer in grinding and thinning precision, and lower stability and controllability.
(II) technical scheme
The invention provides the following technical scheme: a silicon wafer thinning and grinding mechanism based on airflow pressure comprises an installation base, wherein a grinding sleeve is fixedly installed at the top end of the installation base, a semicircular through groove is formed in one side of the middle of the grinding sleeve, a semicircular clamping groove is formed in the other side of the middle of the grinding sleeve, an airflow nozzle is fixedly installed in the middle of the top end of the installation base and located in an inner cavity of the grinding sleeve, a hydraulic support is fixedly installed at the bottom of one side of the outer portion of the grinding sleeve and located under the semicircular through groove, a hydraulic driving cylinder is fixedly installed at one side of the top end of the hydraulic support, a support mechanism is fixedly installed on an output transmission shaft of the hydraulic driving cylinder, the outer surface of the support mechanism is in contact with the inner portion of the semicircular through groove, a motor support is fixedly installed at the other side of the outer, and the output shaft of the driving motor is in transmission connection with a grinding sheet at the top of the grinding sleeve, and a dust collecting ring groove is fixedly arranged at the top of the grinding sleeve and at the periphery of the grinding sheet.
Preferably, the bottom of the inner cavity of the grinding sleeve is of an arc-shaped curved surface structure.
Preferably, the outer part of the air flow nozzle is provided with an hourglass-shaped mechanism, six groups of vent holes communicated with an external air pressure pump are uniformly arranged at the waist part of the air flow nozzle, and the outer diameter of the top end of the air flow nozzle is 0.3-0.7 times of the inner diameter of the grinding sleeve.
Preferably, the support mechanism comprises a sealing ring, a support platform is fixedly mounted in the middle of an inner cavity of the sealing ring, the inner wall of the support platform is in contact with the outer surface of the grinding sleeve, and a supporting ring is fixedly mounted on the inner wall of the support platform.
Preferably, the sealing ring is provided with a semicircular structure at the outer part, and the inner diameter of the sealing ring is the same as the outer diameter of the grinding sleeve.
Preferably, the inner diameter of the bracket platform is equal to the inner diameter of the grinding sleeve, and a boss structure is formed between the bracket platform and the supporting ring.
Preferably, the inner cavity of the dust collecting ring groove is of an L-shaped rotary structure, and the bottom of the inner cavity of the dust collecting ring groove is provided with a discharge slot hole.
Three beneficial effects
The invention has the following beneficial effects:
1. this silicon chip attenuate grinding mechanism based on air pressure formula, through the setting of air current nozzle and gimbal mechanism, the silicon chip that the mode of utilizing the air current will need the grinding from the below carries on the grinding piece to control the degree of its grinding through the contact time of silicon chip and grinding piece, compare with current silicon chip grinding technique, can effectually ignore the wearing and tearing problem of grinding piece in grinding process, make its thickness can not cause the influence to the grinding volume of silicon chip at the in-process of continuous decay, and then the effectual machining precision that has improved the silicon chip when the grinding attenuate, stability and controllability are higher.
2. This silicon chip attenuate grinding mechanism based on air current pressure formula to the setting of air current nozzle exterior structure, can form a turbulent effect to the air current that lets in, makes it can be stable upwards promote the transport to placing the silicon chip that supports the ring to avoided causing the problem that the silicon chip inclines to appear because of the unstability of air current, and then the grinding of different degrees appears in the top that leads to the silicon chip, further improved the grinding precision of this grinding equipment to the silicon chip.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a left side cross-sectional view of a grinding sleeve of the present construction;
FIG. 3 is a right side schematic view of a grinding sleeve of the present construction;
FIG. 4 is a schematic view of the structure of the gas flow nozzle of the present invention;
fig. 5 is a schematic structural diagram of the support mechanism of the present invention.
In the figure: 1. installing a base; 2. grinding the sleeve; 3. a semicircular through groove; 4. a semicircular clamping groove; 5. an air flow nozzle; 6. a hydraulic support; 7. a hydraulic drive cylinder; 8. a support mechanism; 81. sealing the circular ring; 82. a support platform; 83. a support ring; 9. a motor bracket; 10. a drive motor; 11. grinding the slices; 12. a dust collecting ring groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, an airflow pressure based silicon wafer thinning and grinding mechanism comprises an installation base 1, a grinding sleeve 2 is fixedly installed at the top end of the installation base 1, a semicircular through groove 3 is formed in one side of the middle of the grinding sleeve 2, a semicircular clamping groove 4 is formed in the other side of the middle of the grinding sleeve 2, an airflow nozzle 5 is fixedly installed in the middle of the top end of the installation base 1 and located in an inner cavity of the grinding sleeve 2, a hydraulic support 6 is fixedly installed at the bottom of one side of the outer portion of the grinding sleeve 2 and located right below the semicircular through groove 3, a hydraulic driving cylinder 7 is fixedly installed at one side of the top end of the hydraulic support 6, a support mechanism 8 is fixedly installed on an output transmission shaft of the hydraulic driving cylinder 7, the outer surface of the support mechanism 8 is in contact with the inner portion of the semicircular through groove 3, a motor support 9 is fixedly installed at the, and the output shaft of the driving motor 10 is in transmission connection with a grinding sheet 11 at the top of the grinding sleeve 2, and a dust collecting ring groove 12 is fixedly arranged at the top of the grinding sleeve 2 and at the periphery of the grinding sheet 11.
In this technical scheme, the bottom of 2 inner chambers of grinding sleeve is established to arc curved surface structure.
In the technical scheme, the outer part of the air flow nozzle 5 is provided with an hourglass-shaped mechanism, six groups of vent holes communicated with an external air pressure pump are uniformly formed in the waist part of the air flow nozzle, and the outer diameter of the top end of the air flow nozzle 5 is 0.3-0.7 times of the inner diameter of the grinding sleeve 2.
Wherein, to the outside setting of air current nozzle 5, can form a turbulent effect to the air current that lets in, make it can be stable upwards promote placing the silicon chip at gimbal mechanism 8 to avoid causing the ascending problem of silicon chip slope because of the unstability of air current, and then improved the grinding precision of this grinding equipment to the silicon chip, stability and reliability are higher.
In this technical scheme, gimbal mechanism 8 includes sealed ring 81, and the middle part fixed mounting of sealed ring 81 inner chamber has support platform 82, and support platform 82's inner wall and grinding sleeve 2's outer surface contact, and support platform 82's inner wall fixed mounting has support ring 83.
In this technical solution, the sealing ring 81 is provided with a semicircular structure at the outside, and the inner diameter thereof is the same as the outer diameter of the grinding sleeve 2.
The arrangement of the external structure of the sealing ring 81 enables the sealing ring to be tightly attached to the outer surface of the grinding sleeve 2 and forms sealing operation on the outer surface, so that the stability of air flow in the inner cavity of the grinding sleeve 2 is further ensured, and the phenomenon of silicon slice inclination caused by air pressure leakage is avoided.
In the technical scheme, the inner diameter of the support platform 82 is equal to the inner diameter of the grinding sleeve 2, and a boss structure is formed between the support platform and the support ring 83.
Wherein, to the setting of gimbal mechanism 8, utilize the flexible action of hydraulic drive jar 7, can be automatic quick change the silicon chip that grinds well to the realization grinds the automated control of mechanism to this attenuate, and then the effectual grinding efficiency who improves this attenuate mechanism, degree of automation and controllability are higher.
In the technical scheme, the inner cavity of the dust collecting ring groove 12 is designed to be an L-shaped rotary structure, and the bottom of the inner cavity of the dust collecting ring groove 12 is provided with a discharging groove hole.
Wherein, the arrangement of the external structure of the dust collecting ring groove 12 can effectively collect the grinding powder scattered therein under the centrifugal action for processing, so that the grinding powder can not be adhered to the silicon wafer or the grinding sheet 11, and ensure that the grinding powder can not be scattered again.
The use method and the working principle of the embodiment are as follows:
firstly, the thinning grinding mechanism is fixedly arranged on an operation platform by utilizing an installation base 1 through a hexagon nut and is connected with various control pipelines and circuits, then a hydraulic driving cylinder 7 is started under the action of an output transmission shaft of the hydraulic driving cylinder to drive a sealing ring 81 and an internal structure of the sealing ring to completely extend outwards, then a chemically corroded silicon wafer is placed on a supporting ring 83 through a clamping mechanism, the hydraulic driving cylinder 7 is started again to extend the placed silicon wafer to the middle part of an inner cavity of the installation base 1 through a semicircular through groove 3, then an external air pressure pump is started through a control system to convey air flow to the inside of the installation base 1 through an air flow nozzle 5, the silicon wafer placed on the supporting ring 83 is blown to move upwards to be close to a grinding sheet 11, meanwhile, a driving motor 10 is started to drive the grinding sheet 11 to rotate at high speed, and grinding and thinning operation is carried out on the silicon wafer conveyed by the air flow, keeping the air flow to be stably conveyed for a period of time, gradually reducing the flow rate of air after the silicon wafer is ground to the required thickness, enabling the ground silicon wafer to gradually fall onto the supporting ring 83 again, automatically replacing a new silicon wafer through the hydraulic driving cylinder 7 and the clamping mechanism, repeating the steps to carry out grinding operation, and simultaneously enabling silicon wafer powder generated during grinding of the silicon wafer to scatter into the dust collecting ring groove 12 under the action of centrifugal force generated by high-speed rotation of the grinding sheet 11 and the air flow, and clearing the collected powder through the discharging groove hole therein.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a silicon chip attenuate grinding mechanism based on air pressure formula, includes installation base (1), its characterized in that: the grinding device is characterized in that a grinding sleeve (2) is fixedly mounted at the top end of an installation base (1), a semicircular through groove (3) is formed in one side of the middle portion of the grinding sleeve (2), a semicircular clamping groove (4) is formed in the other side of the middle portion of the grinding sleeve (2), an air flow nozzle (5) is fixedly mounted in the middle of the top end of the installation base (1) and located in an inner cavity of the grinding sleeve (2), a hydraulic support (6) is fixedly mounted at the bottom of one side of the outer portion of the grinding sleeve (2) and located under the semicircular through groove (3), a hydraulic driving cylinder (7) is fixedly mounted at one side of the top end of the hydraulic support (6), a support mechanism (8) is fixedly mounted on an output transmission shaft of the hydraulic driving cylinder (7), the outer surface of the support mechanism (8) is in contact with the inner portion of the semicircular through groove (3, one side threaded connection on motor support (9) top has driving motor (10), and the output shaft of driving motor (10) and the top transmission that is located grinding sleeve (2) are connected with grinding piece (11), the top of grinding sleeve (2) and the peripheral fixed mounting that is located grinding piece (11) have dust collection ring groove (12).
2. The silicon wafer thinning and grinding mechanism based on the air flow pressure type as claimed in claim 1, wherein: the bottom of the inner cavity of the grinding sleeve (2) is of an arc-shaped curved surface structure.
3. The silicon wafer thinning and grinding mechanism based on the air flow pressure type as claimed in claim 1, wherein: the outside of the air flow nozzle (5) is provided with an hourglass-shaped mechanism, six groups of vent holes communicated with an external air pressure pump are uniformly formed in the waist of the air flow nozzle, and the outer diameter of the top end of the air flow nozzle (5) is 0.3-0.7 times of the inner diameter of the grinding sleeve (2).
4. The silicon wafer thinning and grinding mechanism based on the air flow pressure type as claimed in claim 1, wherein: the support mechanism (8) comprises a sealing ring (81), a support platform (82) is fixedly mounted in the middle of an inner cavity of the sealing ring (81), the inner wall of the support platform (82) is in contact with the outer surface of the grinding sleeve (2), and a supporting ring (83) is fixedly mounted on the inner wall of the support platform (82).
5. The silicon wafer thinning and grinding mechanism based on the air flow pressure type as claimed in claim 4, wherein: the outer part of the sealing ring (81) is of a semicircular structure, and the inner diameter of the sealing ring is the same as the outer diameter of the grinding sleeve (2).
6. The silicon wafer thinning and grinding mechanism based on the air flow pressure type as claimed in claim 4, wherein: the inner diameter of the support platform (82) is equal to the inner diameter of the grinding sleeve (2), and a boss structure is formed between the support platform and the supporting ring (83).
7. The silicon wafer thinning and grinding mechanism based on the air flow pressure type as claimed in claim 1, wherein: the inner cavity of the dust collecting ring groove (12) is of an L-shaped rotary structure, and a discharging groove hole is formed in the bottom of the inner cavity of the dust collecting ring groove (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010405779.0A CN111673559B (en) | 2020-05-14 | 2020-05-14 | Silicon chip attenuate grinding mechanism based on air pressure formula |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010405779.0A CN111673559B (en) | 2020-05-14 | 2020-05-14 | Silicon chip attenuate grinding mechanism based on air pressure formula |
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| Publication Number | Publication Date |
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| CN111673559A true CN111673559A (en) | 2020-09-18 |
| CN111673559B CN111673559B (en) | 2022-07-15 |
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| CN202010405779.0A Active CN111673559B (en) | 2020-05-14 | 2020-05-14 | Silicon chip attenuate grinding mechanism based on air pressure formula |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4869779A (en) * | 1987-07-27 | 1989-09-26 | Acheson Robert E | Hydroplane polishing device and method |
| CN2139497Y (en) * | 1992-07-30 | 1993-08-04 | 湖北省公安县超硬工具厂 | Edge grinding machine for air-float glass products |
| JP2010253658A (en) * | 2009-04-28 | 2010-11-11 | Nitta Moore Co | Non-contact workpiece holding device |
| CN201732777U (en) * | 2010-05-21 | 2011-02-02 | 上海微电子装备有限公司 | Compound air flotation device and silicon wafer stage moving device with same |
| CN103286673A (en) * | 2013-05-24 | 2013-09-11 | 浙江工业大学 | Air-flotation ultra-precision grinding device and grinding method thereof |
| TWM522806U (en) * | 2015-03-31 | 2016-06-01 | De-Ning Yang | Continuous fine polishing device of ultrathin electronic glass having air floatation separation function |
| CN109927066A (en) * | 2019-04-15 | 2019-06-25 | 深圳市博视科技有限公司 | Air-flotation type pick device and pick-up method |
| CN209598923U (en) * | 2019-01-28 | 2019-11-08 | 上海合晶硅材料有限公司 | A kind of silicon wafer polishing waste material recovery device |
-
2020
- 2020-05-14 CN CN202010405779.0A patent/CN111673559B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4869779A (en) * | 1987-07-27 | 1989-09-26 | Acheson Robert E | Hydroplane polishing device and method |
| CN2139497Y (en) * | 1992-07-30 | 1993-08-04 | 湖北省公安县超硬工具厂 | Edge grinding machine for air-float glass products |
| JP2010253658A (en) * | 2009-04-28 | 2010-11-11 | Nitta Moore Co | Non-contact workpiece holding device |
| CN201732777U (en) * | 2010-05-21 | 2011-02-02 | 上海微电子装备有限公司 | Compound air flotation device and silicon wafer stage moving device with same |
| CN103286673A (en) * | 2013-05-24 | 2013-09-11 | 浙江工业大学 | Air-flotation ultra-precision grinding device and grinding method thereof |
| TWM522806U (en) * | 2015-03-31 | 2016-06-01 | De-Ning Yang | Continuous fine polishing device of ultrathin electronic glass having air floatation separation function |
| CN209598923U (en) * | 2019-01-28 | 2019-11-08 | 上海合晶硅材料有限公司 | A kind of silicon wafer polishing waste material recovery device |
| CN109927066A (en) * | 2019-04-15 | 2019-06-25 | 深圳市博视科技有限公司 | Air-flotation type pick device and pick-up method |
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| CN111673559B (en) | 2022-07-15 |
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