CN204497210U - A kind of silicon chip vacuum clamping device - Google Patents
A kind of silicon chip vacuum clamping device Download PDFInfo
- Publication number
- CN204497210U CN204497210U CN201520201894.0U CN201520201894U CN204497210U CN 204497210 U CN204497210 U CN 204497210U CN 201520201894 U CN201520201894 U CN 201520201894U CN 204497210 U CN204497210 U CN 204497210U
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- Prior art keywords
- sucker
- silicon chip
- pipeline
- clamping device
- bleeding
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Abstract
The utility model discloses a kind of silicon chip vacuum clamping device, it is characterized in that: comprise silicon chip, to bleed pipeline, sucker, vent valve and vacuum pump, silicon chip is arranged on sucker, vacuum pump is connected to sucker by pipeline of bleeding, bleed and be provided with the vent valve of the clamping air pressure regulating sucker in the middle part of pipeline, sucker adopts single suction mouth many supporting planes sucker, chuck surface opens some roads concentric grooves, by a few road, centre radiation straight trough, each circular groove is connected, sucker air entry is connected with pipeline sealed tube engagement thread of bleeding, pipeline of bleeding directly is connected on the air entry of vacuum pump by the seal nipple with chamfering, vacuum pump adopts sliding vane rotary pump.Gripping means grips of the present utility model is reliable, it is little, stable to be out of shape, and can realize silicon wafer damage-free and the clamping without oil pollution.
Description
Technical field
The utility model relates to miniature, nano-device production equipment device arts, especially relates to a kind of silicon chip vacuum clamping device.
Background technology
Relating in the modern forward position scientific research of miniature, nano-device, activity in production, silicon chip is modal substrate material.For realizing the predetermined function of device, need by various method, the film of different materials, different-thickness is progressively coated on silicon be substrate substrate on, and be etched into various labyrinth figure.In the manufacture, testing process of device, inevitably relate to the clamping problem of silicon chip.Due to silicon wafer thickness only 1mm, poor rigidity and crisp, yieldingly under general clamping device even ruptures, thus causes fatal damage to the micro-structural of device, performance.
Utility model content
Technical problem to be solved in the utility model is for above-mentioned deficiency of the prior art, a kind of silicon chip vacuum clamping device is provided, gripping means grips of the present utility model is reliable, it is little, stable to be out of shape, and can realize silicon wafer damage-free and the clamping without oil pollution.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of silicon chip vacuum clamping device, it is characterized in that: comprise silicon chip, pipeline of bleeding, sucker, vent valve and vacuum pump, described silicon chip is arranged on sucker, described vacuum pump is connected to sucker by pipeline of bleeding, described in bleed and be provided with the vent valve of the clamping air pressure regulating sucker in the middle part of pipeline.
Above-mentioned a kind of silicon chip vacuum clamping device, is characterized in that: described sucker adopts single suction mouth many supporting planes sucker.
Above-mentioned a kind of silicon chip vacuum clamping device, is characterized in that: described chuck surface opens some roads concentric grooves, by a few road, centre radiation straight trough, each circular groove is connected.
Above-mentioned a kind of silicon chip vacuum clamping device, is characterized in that: described round groove width is decided to be 4mm, dark 2mm, and be provided with sucker air entry in the middle of described round groove, sucker air entry diameter is 15mm.
Above-mentioned a kind of silicon chip vacuum clamping device, is characterized in that: described sucker with stainless steel manufacture, surface roughness R3.2, precision 6 grades, overall height 10mm.
Above-mentioned a kind of silicon chip vacuum clamping device, is characterized in that: described sucker air entry is connected with pipeline sealed tube engagement thread of bleeding.
Above-mentioned a kind of silicon chip vacuum clamping device, is characterized in that: described in bleed pipeline by being directly connected on the air entry of vacuum pump with the seal nipple of chamfering.
Above-mentioned a kind of silicon chip vacuum clamping device, is characterized in that: described vacuum pump adopts sliding vane rotary pump.
The utility model compared with prior art has the following advantages:
Gripping means grips of the present utility model is reliable, it is little, stable to be out of shape, and can realize silicon wafer damage-free and the clamping without oil pollution.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Accompanying drawing explanation
Fig. 1 is silicon chip vacuum clamping device structural representation of the present utility model;
Fig. 2 is sucker of the present utility model and silicon chip concrete structure schematic diagram;
Fig. 3 is miniature blade vacuum pump structure schematic diagram of the present utility model.
Embodiment
As shown in Figure 1, a kind of silicon chip vacuum clamping device, it is characterized in that: comprise silicon chip 1, pipeline 2 of bleeding, sucker 3, vent valve 4 and vacuum pump 5, described silicon chip 1 is arranged on sucker 3, described vacuum pump 5 is connected to sucker 3 by pipeline 2 of bleeding, described in bleed and be provided with the vent valve 4 of the clamping air pressure regulating sucker 3 in the middle part of pipeline 2.
As shown in Figure 2, sucker is the vitals of this covering device, and the distortion of height on silicon chip that be whether reasonable, machining accuracy of its structure plays very important impact; Sucker also directly determines the size of pump rate of air sucked in required and pump.Be surfacing to the basic demand of sucker, precision is high, reliable clamping.Because silicon chip is crisp and thickness is thin, excessive distortion can not be born, consider such Some features, determine to adopt single suction mouth many supporting planes sucker form.Different depending on silicon chip diameter, according to concrete sucker size, plane sucker diameter is corresponding to change.Bleed unobstructed for strengthening supporting guarantee simultaneously, open some roads concentric grooves in chuck surface, by a few road, centre radiation straight trough, each circular groove is connected, such per pass groove can provide suction after finding time.When design size, circular groove width is decided to be 4mm, dark 2mm, middle air entry diameter is then decided to be 15mm.Sucker with stainless steel manufacture, surface roughness R3.2, precision 6 grades, overall height 10mm.
The volume that whole grasping system volume to be found time empties volume and connecting hose primarily of chuck determines.Chuck empties silicon chip estimation (not considering that part is not emptied in centre) that volume is empirically commonly used, and is about 0.08L.Connecting hose is in internal diameter 10mm, long 2m, and volume of finding time is 0.16L, and total pump down volume is about 0.24L.
Consider the factor impacts such as sucker size variation, gas leakage, pump is actual in pumping speed 0.3L/s design.Obviously this parameter has all stopped nargin, therefore can ensure that system still can reliably working when using larger sucker.The connection of jig and workbench is completed by the screw of 4 M5.The connection sealed tube screw thread of sucker air entry and pipeline of bleeding, pipeline of bleeding directly is connected on vacuum pump air entry by the seal nipple with chamfering.
As shown in Figure 3, analyze and the parameter such as work pumping speed of primary election according to above, more each rough vacuum pump, considers from aspects such as volume, performance, reliability and economy, determines the vacuum pump adopting sliding vane rotary pump as native system.The structural design of vacuum pump with reference to 2XZ type oil seal type direct connection blade pump structure, and has done some to external and internal compositions and simplify.Operationally will have certain friction between blade and pump wall, therefore blade adopts self-lubricating material (PFET), and pump chamber inwall will have high light cleanliness (R3.2) to reduce friction (coefficient of kinetic friction about 0.05).Use Low speed electric motor, the selection of motor wants cube little, and rotating speed is moderate simultaneously.Select YFK12040/4 type motor in design, power 40W, rotating speed is 800r/min.The structure of rotor is rotor disc type, and the rotor disk cross recessed countersunk head sscrew of 6 M2.5 is fixed, and save space, form blade groove between two rotor blocks, blade material expansion coefficient is about 2 times of rotor material, reserves 0.05mm gap between blade and blade groove.
The above; it is only preferred embodiment of the present utility model; not the utility model is imposed any restrictions; every above embodiment is done according to the utility model technical spirit any simple modification, change and equivalent structure change, all still belong in the protection range of technical solutions of the utility model.
Claims (8)
1. a silicon chip vacuum clamping device, it is characterized in that: comprise silicon chip (1), pipeline of bleeding (2), sucker (3), vent valve (4) and vacuum pump (5), described silicon chip (1) is arranged on sucker (3), described vacuum pump (5) is connected to sucker (3) by pipeline of bleeding (2), described in pipeline (2) middle part of bleeding be provided with the vent valve (4) of clamping air pressure regulating sucker (3).
2. according to a kind of silicon chip vacuum clamping device according to claim 1, it is characterized in that: described sucker (3) adopts single suction mouth many supporting planes sucker.
3. according to a kind of silicon chip vacuum clamping device according to claim 1, it is characterized in that: some roads concentric grooves is opened on described sucker (3) surface, by a few road, centre radiation straight trough, each circular groove is connected.
4. according to a kind of silicon chip vacuum clamping device according to claim 3, it is characterized in that: described round groove width is decided to be 4mm, dark 2mm, be provided with sucker air entry in the middle of described round groove, sucker air entry diameter is 15mm.
5., according to a kind of silicon chip vacuum clamping device according to claim 1, it is characterized in that: described sucker (3) with stainless steel manufacture, surface roughness R3.2, precision 6 grades, overall height 10mm.
6. according to a kind of silicon chip vacuum clamping device according to claim 4, it is characterized in that: described sucker air entry is connected by sealed tube engagement thread with pipeline of bleeding (2).
7., according to a kind of silicon chip vacuum clamping device according to claim 1, it is characterized in that: described in bleed pipeline (2) by being directly connected on the air entry of vacuum pump (5) with the seal nipple of chamfering.
8. according to a kind of silicon chip vacuum clamping device according to claim 1, it is characterized in that: described vacuum pump (5) adopts sliding vane rotary pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520201894.0U CN204497210U (en) | 2015-04-05 | 2015-04-05 | A kind of silicon chip vacuum clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520201894.0U CN204497210U (en) | 2015-04-05 | 2015-04-05 | A kind of silicon chip vacuum clamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204497210U true CN204497210U (en) | 2015-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520201894.0U Expired - Fee Related CN204497210U (en) | 2015-04-05 | 2015-04-05 | A kind of silicon chip vacuum clamping device |
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| CN (1) | CN204497210U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106637138A (en) * | 2015-10-28 | 2017-05-10 | 沈阳拓荆科技有限公司 | Wafer film deposition reaction table with multiple gas exhaust channels therein |
-
2015
- 2015-04-05 CN CN201520201894.0U patent/CN204497210U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106637138A (en) * | 2015-10-28 | 2017-05-10 | 沈阳拓荆科技有限公司 | Wafer film deposition reaction table with multiple gas exhaust channels therein |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150722 Termination date: 20160405 |
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| CF01 | Termination of patent right due to non-payment of annual fee |