CN111670614A

CN111670614A - Component mounting device, component mounting system, and component mounting method

Info

Publication number: CN111670614A
Application number: CN201880088192.2A
Authority: CN
Inventors: 寺胁佳秀
Original assignee: Yamaha Motor Co Ltd
Current assignee: Yamaha Motor Co Ltd
Priority date: 2018-03-09
Filing date: 2018-03-09
Publication date: 2020-09-15
Anticipated expiration: 2038-03-09
Also published as: WO2019171564A1; JP6864153B2; JPWO2019171564A1; DE112018006413T5; CN111670614B

Abstract

The component mounting device (100) mounts a component (E) on a horizontal mounting surface (P2a) of an object to be mounted in a first mounting region (1) provided on a carrying path (5a) for carrying the object to be mounted (P2), and mounts the component on a mounting surface (P2b) of the object other than the horizontal mounting surface in a second mounting region (2) different from the first mounting region.

Description

Component mounting device, component mounting system, and component mounting method

Technical Field

The present invention relates to a component mounting device, a component mounting system, and a component mounting method, and more particularly to a component mounting device, a component mounting system, and a component mounting method for mounting a component on a mounting target having a horizontal mounting surface and a mounting surface other than the horizontal mounting surface.

Background

Conventionally, there has been known a component mounting apparatus for mounting a component on an object to be mounted having a horizontal mounting surface and a mounting surface other than the horizontal mounting surface. Such a component mounting apparatus is disclosed in japanese patent application laid-open No. 2012-119643.

Japanese patent application laid-open No. 2012-119643 discloses an electronic circuit component mounting apparatus (component mounting apparatus) for mounting an electronic circuit component on a three-dimensional substrate (object to be mounted). The three-dimensional substrate has an upper surface as a horizontal mounting surface, and four side surfaces inclined with respect to the upper surface as mounting surfaces other than the horizontal mounting surface. The electronic circuit component mounting apparatus is configured to mount components on all of a horizontal mounting surface (upper surface) of a three-dimensional substrate and mounting surfaces (four side surfaces) other than the horizontal mounting surface in a single mounting area.

Documents of the prior art

Patent document 1: japanese patent laid-open publication No. 2012-119643

Disclosure of Invention

Problems to be solved by the invention

However, in the electronic circuit component mounting device described in japanese patent application laid-open No. 2012-119643, components can be mounted on all of the horizontal mounting surface and the mounting surfaces other than the horizontal mounting surface of the object to be mounted, in a single mounting area, and on the other hand, there are problems such as: it is impossible to mount components on a horizontal mounting surface and a mounting surface other than the horizontal mounting surface of an object to be mounted in different mounting regions from each other. In this case, the following problems are considered to exist: since the degree of freedom of mounting to the object is small, it may be impossible to efficiently mount components to the object.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a component mounting device, a component mounting system, and a component mounting method capable of efficiently mounting a component on a mounted object having a horizontal mounting surface and a mounting surface other than the horizontal mounting surface.

Means for solving the problems

A component mounting apparatus according to a first aspect of the present invention includes: a head unit for mounting a component on an object to be mounted, the object to be mounted having a mounting surface that is horizontal in a conveyance path and a mounting surface other than the horizontal mounting surface; and a control unit for controlling the head unit as follows: the component is mounted on a horizontal mounting surface of an object to be mounted in a first mounting area provided on a conveying path for conveying the object to be mounted, and the component is mounted on a mounting surface of the object to be mounted other than the horizontal mounting surface in a second mounting area different from the first mounting area.

In the component mounting apparatus according to the first aspect of the present invention, by configuring as described above, it is possible to mount components on a horizontal mounting surface of an object that can be mounted in a state of being arranged on a conveyance path in a first mounting region provided on the conveyance path, and mount components on a mounting surface other than the horizontal mounting surface of the object that cannot be mounted in a state of being arranged on the conveyance path in a second mounting region different from the first mounting region. As a result, the component can be mounted on the horizontal mounting surface of the object to be mounted and the mounting surfaces other than the horizontal mounting surface in different regions. This can increase the degree of freedom in mounting an object to be mounted having a horizontal mounting surface and a mounting surface other than the horizontal mounting surface. As a result, it is possible to provide the component mounting device capable of efficiently mounting the component on the object to be mounted having the horizontal mounting surface and the mounting surface other than the horizontal mounting surface.

In the component mounting apparatus according to the first aspect, the first mounting region is preferably a region where components are mounted on the substrate having a flat plate shape by the head unit. With this configuration, the component can be mounted on the horizontal mounting surface of the object by using the mounting region for the substrate having a flat plate shape. As a result, it is not necessary to provide a mounting region for a horizontal mounting surface of the object to be mounted separately from a mounting region for a substrate having a flat plate shape. Thus, the number of components can be reduced and the structure can be simplified as compared with a case where a mounting region for a horizontal mounting surface of an object to be mounted is separately provided for a mounting region for a substrate having a flat plate shape.

In the component mounting apparatus according to the first aspect, the control unit is preferably configured to control the head unit as follows: in the first mounting region, components are sequentially mounted on horizontal mounting surfaces of the plurality of objects to be mounted. With this configuration, the components can be mounted on the horizontal mounting surfaces of the plurality of objects at once in the first mounting region. As a result, the component can be mounted more efficiently on the horizontal mounting surface of each of the plurality of mounted objects, as compared with the case where the component is mounted on the horizontal mounting surface of each of the plurality of mounted objects individually for each of the mounted objects in the second mounting region.

In the component mounting apparatus according to the first aspect, the control unit is preferably configured to control the head unit as follows: after the component is mounted on the mounting surface of the object other than the horizontal mounting surface in the second mounting region, the component is mounted on the horizontal mounting surface of the object in the first mounting region. With this configuration, the component can be mounted on the object efficiently and easily in the case where the component is mounted on the horizontal mounting surface of the object in the first mounting region after the component is mounted on the mounting surface of the object other than the horizontal mounting surface in the second mounting region.

In the component mounting apparatus according to the first aspect, the control unit is preferably configured to control the head unit as follows: the mounting of the components is performed only on a part of the horizontal mounting surface of the object to be mounted in the first mounting region, and after the components are mounted on the mounting surface of the object other than the horizontal mounting surface in the second mounting region, the components are mounted on the horizontal mounting surface of the object to be mounted in the first mounting region. With this configuration, when the first mounting region mounts only a part of the components on the horizontal mounting surface of the object, and the second mounting region mounts the components on the mounting surface of the object other than the horizontal mounting surface, the component can be efficiently and easily mounted on the object in the case where the component is mounted on the horizontal mounting surface of the object in the first mounting region after the component is mounted on the horizontal mounting surface of the object in the second mounting region.

In the component mounting apparatus according to the first aspect, the control unit is preferably configured to control the head unit as follows: after the component is mounted on the horizontal mounting surface of the mounted object in the first mounting region, the component is mounted on the mounting surface of the mounted object other than the horizontal mounting surface in the second mounting region. With this configuration, the component can be efficiently mounted on the object to be mounted, for example, in the case where the component is mounted on the horizontal mounting surface of the object to be mounted in the first mounting region and then the component is mounted on the mounting surface of the object to be mounted other than the horizontal mounting surface in the second mounting region, which is higher in production efficiency.

In the above-described configuration in which the second mounting region mounts the component on the mounting surface of the object other than the horizontal mounting surface, and then the component is mounted on the horizontal mounting surface of the object in the first mounting region, the control unit is preferably configured to control the head unit as follows: the object is transferred to a second mounting area as a transfer destination or a return position returned from the second mounting area while maintaining the horizontal mounting surface of the object. With this configuration, the head unit can hold the horizontal mounting surface of the mounted object in a state where the mounting of the component is not completed. As a result, the holding position of the head unit can be easily secured on the horizontal mounting surface of the mounted object.

In the component mounting apparatus according to the first aspect, the control unit is preferably configured to control the head unit as follows: the mounting of the component on the horizontal mounting surface of the mounted object in the first mounting region and the mounting of the component on the mounting surface other than the horizontal mounting surface of the mounted object in the second mounting region are performed in an order determined based on at least one of information on interference between the head unit and the component on the mounted object when the mounted object is transferred and production efficiency information. With this configuration, when the components are mounted in the order determined based on the information on the interference between the head unit and the components on the mounted object when the mounted object is transferred, the components can be mounted so as to avoid the interference (collision) between the head unit and the components on the mounted object when the mounted object is transferred. As a result, it is possible to prevent the size of the mounted object and the component from being restricted in order to avoid interference (collision) between the head unit and the component on the mounted object when the mounted object is transferred. In addition, when the components are mounted in the order determined based on the production efficiency information, the components can be efficiently mounted on the mounting object.

In the component mounting apparatus according to the first aspect, the control unit is preferably configured to control the plurality of head units as follows: the mounting of the component on the horizontal mounting surface of the object to be mounted in the first mounting region and the mounting of the component on the mounting surface other than the horizontal mounting surface of the other object to be mounted in the second mounting region are performed in parallel. With this configuration, the mounting of the component on the horizontal mounting surface of the object to be mounted in the first mounting region and the mounting of the component on the mounting surface other than the horizontal mounting surface of the other object to be mounted in the second mounting region can be performed in parallel, and therefore, the time required for mounting the component can be shortened.

In the component mounting apparatus according to the first aspect, the second mounting region is preferably provided outside the conveyance path. With this configuration, the second mounting region can be provided outside the conveyance path in which the first mounting region is provided, and therefore a space for providing the second mounting region can be easily secured. In addition, since the empty space in the conveyance path can be increased by the amount of the second mounting region not provided in the conveyance path, the space for disposing the first mounting region in the conveyance path can be easily secured.

A component mounting system according to a second aspect of the present invention includes: a first component mounting device including a first head unit for mounting a component on an object to be mounted, the object to be mounted having a mounting surface that is horizontal in a conveyance path and a mounting surface other than the horizontal mounting surface, the first component mounting device controlling the first head unit as follows: mounting a component on a horizontal mounting surface of an object to be mounted in a first mounting region provided on a conveying path for conveying the object to be mounted; and a second component mounting device including a second head unit for mounting a component on the object to be mounted, the second component mounting device controlling the second head unit as follows: the component is mounted on a mounting surface of the object other than the horizontal mounting surface in a second mounting region different from the first mounting region.

In the component mounting system according to the second aspect of the present invention, by configuring as described above, it is possible to provide a component mounting system capable of efficiently mounting a component on an object to be mounted having a horizontal mounting surface and a mounting surface other than the horizontal mounting surface, similarly to the component mounting device according to the first aspect.

A component mounting method according to a third aspect of the present invention is a component mounting method for mounting a component on a mounted object having a horizontal mounting surface and a mounting surface other than the horizontal mounting surface on a conveyance path, wherein the component is mounted on the horizontal mounting surface of the mounted object in a first mounting region provided on the conveyance path for conveying the mounted object, and the component is mounted on the mounting surface other than the horizontal mounting surface of the mounted object in a second mounting region different from the first mounting region.

In the component mounting method according to the third aspect of the present invention, by configuring as described above, it is possible to provide a component mounting method capable of efficiently mounting a component on a mounted object having a horizontal mounting surface and a mounting surface other than the horizontal mounting surface, as in the component mounting device according to the first aspect.

Effects of the invention

According to the present invention, as described above, it is possible to provide a component mounting device, a component mounting system, and a component mounting method capable of efficiently mounting a component on a mounted object having a horizontal mounting surface and a mounting surface other than the horizontal mounting surface.

Drawings

Fig. 1 is a diagram showing the overall structure of a component mounting apparatus of a first embodiment.

Fig. 2 is a perspective view showing a substrate of the first embodiment.

Fig. 3 is a perspective view showing the mounted object and a mounting member on which the mounted object of the first embodiment is mounted.

Fig. 4 is a perspective view showing the mounted object, the mounting member, and the conveying member on which the mounting member is mounted according to the first embodiment.

Fig. 5 is a diagram for explaining an operation of the head unit of the first embodiment for holding a placement member and transferring an object to be mounted.

Fig. 6 is a diagram for explaining an operation of the head unit of the first embodiment for holding a horizontal mounting surface of an object to be mounted and transferring the object to be mounted.

Fig. 7 is a side view showing the substrate holding portion of the first embodiment.

Fig. 8 is a side view showing the mounted object holding portion of the first embodiment.

Fig. 9 is a diagram for explaining interference between a component on a horizontal mounting surface of an object to be mounted and a head unit in a case where the head unit of the first embodiment holds a placement member and transfers the object to be mounted.

Fig. 10 is a flowchart for explaining a mounting procedure determining process performed by the component mounting apparatus according to the first embodiment.

Fig. 11 is a flow chart subsequent to the flow chart of fig. 10.

Fig. 12 is a flowchart for explaining a first example of the mounting process performed by the component mounting apparatus according to the first embodiment.

Fig. 13 is a flowchart for explaining a second example of the mounting process performed by the component mounting apparatus of the first embodiment.

Fig. 14 is a flowchart for explaining a third example of the mounting process performed by the component mounting apparatus of the first embodiment.

Fig. 15 is a diagram showing the overall structure of the component mounting apparatus of the second embodiment.

Fig. 16 is a diagram showing the overall structure of the component mounting system of the third embodiment.

Detailed Description

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings. In the following description, a direction along the conveyance direction of the mounted object P2 is referred to as an X direction, a direction orthogonal to the X direction in a horizontal plane is referred to as a Y direction, and an up-down direction orthogonal to the X direction and the Y direction is referred to as a Z direction.

[ first embodiment ]

(Structure of component mounting apparatus)

The structure of a component mounting apparatus 100 according to a first embodiment of the present invention will be described with reference to fig. 1 to 9.

As shown in fig. 1, the component mounting apparatus 100 is an apparatus for mounting an element E (surface mount device) such as an IC, a transistor, a capacitor, or a resistor on a substrate P1 (see fig. 2) having a flat plate shape or an object P2 (workpiece) (see fig. 3 and 4) having a three-dimensional shape with respect to a substrate P1. The component mounting apparatus 100 includes: a first mounting region 1 for mounting a component E on a substrate P1 by a head unit 6 described later; and a second mounting region 2 for mounting the component E to the object P2 by the head unit 6. That is, the component mounting apparatus 100 is an apparatus capable of mounting the component E on both the substrate P1 and the object P2.

The first mounting region 1 and the second mounting region 2 are disposed at different positions from each other. The first mounting region 1 and the second mounting region 2 are arranged at positions not overlapping each other in a plan view (when viewed from the Z direction). The first mounting area 1 is provided on the conveyance path 5 a. The second mounting region 2 is provided outside the conveyance path 5 a.

As shown in fig. 2, the board P1 is a single-sided mounted object having only one mounted surface P1a, for example. For example, the board P1 is a double-sided mounted object having two mounted surfaces P1a, i.e., one mounted surface P1a and a mounted surface P1a disposed on the opposite side of the one mounted surface P1 a.

As shown in fig. 3, the mounted object P2 has, for example, a horizontal mounting surface P2a and a mounting surface P2b other than the horizontal mounting surface P2 a. The horizontal mounting surface P2a is a horizontal mounting surface in a state where the mounted object P2 is disposed on the conveyance path 5 a. The mounting surface P2b other than the horizontal mounting surface is a mounting surface inclined with respect to the horizontal mounting surface P2a, and is inclined with respect to the horizontal in a state where the object to be mounted P2 is disposed on the conveyance path 5 a. The object P2 may have a shape other than the shape shown in fig. 3. For example, the object P2 may be an object having a hemispherical shape.

As shown in fig. 3 and 4, the mounted object P2 is carried into the apparatus and conveyed while being disposed on the conveying member 91. Specifically, the mounted object P2 is carried into the apparatus and conveyed in a state of being mounted on the mounting member 92, and the mounting member 92 is detachably mounted on the conveying member 91. The object P2 is held and fixed to the mounting member 92 by, for example, a screw member, a clamping member, an adhesive tape, or the like. A plurality of (six in fig. 4) mounting members 92 are placed on the conveying member 91, and a mounted object P2 is placed on each of the plurality of mounting members 92. This enables a plurality of (six in fig. 4) objects P2 to be loaded into the component mounting apparatus 100 at a time.

The mounting member 92 includes a mounting portion 92a on which the mounted object P2 is mounted, and a held portion 92b provided below the mounting portion 92a and held by a mounted object holding portion 4 described later. As shown in fig. 5, the mounted object P2 is transferred by the head unit 6 in a state where the mounting member 92 is held (attracted). Alternatively, as shown in fig. 6, the mounted object P2 is transferred from the head unit 6 in a state where the horizontal mounting surface P2a of the mounted object P2 is held. When the horizontal mounting surface P2a of the object P2 is held and transferred, the number of the placement members 92 on the conveyance member 91 can be increased because the placement member 92 can be reduced in size. As a result, the number of objects P2 to be mounted on the conveying member 91 can be increased, and therefore, the production efficiency can be improved.

As shown in fig. 1, the component mounting apparatus 100 includes: a substrate holding unit 3, a mounted object holding unit 4, a conveying unit 5, a head unit 6, a head horizontal movement mechanism unit 7, a component imaging unit 8, a mark imaging unit 9, and a control unit 10. The first mounting region 1 is a region where the substrate holding portion 3 is arranged, and the second mounting region 2 is a region where the mounted object holding portion 4 is arranged.

The substrate holding unit 3 is disposed in the first mounting region 1, and holds the substrate P1 when the first mounting region 1 mounts the element E on the substrate P1. As shown in fig. 7, the substrate holding portion 3 includes a substrate fixing portion 31 and a substrate supporting portion 32.

The substrate fixing portion 31 is a clamping mechanism for fixing the substrate P1 when the component E is mounted on the substrate P1 in the first mounting region 1. The substrate fixing portion 31 has a pair of clamping portions 31a arranged at positions separated from each other in the Y direction. The substrate fixing portion 31 fixes both ends of the substrate P1 in the Y direction by the pair of clamping portions 31 a. The pair of grippers 31a are configured to be movable between a retracted position where the substrate P1 is not fixed and a fixed position where the substrate P1 is fixed. The pair of holding portions 31a are located at the retracted positions when the substrate P1 or the mounted object P2 is conveyed. The pair of clamping portions 31a are located at fixed positions when the substrate P1 is fixed.

The substrate support portion 32 is a support unit that supports the substrate P1 from the lower side (the Z2 direction side) when the component E is mounted on the substrate P1 in the first mounting region 1. The substrate support portion 32 has a plurality of support pins 32a and a support pin arrangement portion 32b in which the plurality of support pins 32a are arranged. The substrate support part 32 supports the lower surface of the substrate P1 from below by a plurality of support pins 32 a. The plurality of support pins 32a and the support pin arrangement portion 32b are configured to be movable in the vertical direction (Z direction) between a retracted position where the substrate P1 is not supported and a support position where the substrate P1 is supported. The support pins 32a and the support pin arrangement portions 32b are located at the retracted positions when the substrate P1 or the mounted object P2 is conveyed. The support pins 32a and the support pin arrangement portions 32b are located at support positions when supporting the substrate P1.

As shown in fig. 1, when the second mounting region 2 mounts the component E to the mounted object P2, the mounted object holding section 4 holds the mounted object P2 via the mounting member 92. The mounted object holding unit 4 is configured to be able to move, rotate, or tilt the held mounted object P2 in the vertical direction (Z direction).

Specifically, as shown in fig. 8, the mounted object holding portion 4 includes: an elevation mechanism part 41, a tilt mechanism part 42, a rotation mechanism part 43, and a holding part 44. In the mounted object holding portion 4, the holding portion 44 is attached to the rotating mechanism portion 43, the rotating mechanism portion 43 is attached to the tilting mechanism portion 42, and the tilting mechanism portion 42 is attached to the elevating mechanism portion 41.

The lifting mechanism 41 includes a drive motor 41a, and moves the mounted object P2 held by the holding portion 44 via the mounting member 92 in the vertical direction (Z direction) by the driving force of the drive motor 41 a. The tilt mechanism unit 42 includes a drive motor 42a, and rotates the mounted object P2 held by the holding unit 44 via the mounting member 92 around a rotation axis a1 extending in the horizontal direction by the drive force of the drive motor 42 a. Thereby, the tilting mechanism 42 tilts the mounted object P2 held by the holding portion 44 via the mounting member 92. The rotation mechanism 43 includes a drive motor 43a, and rotates the mounted object P2 held by the holding portion 44 via the mounting member 92 about a rotation axis a2 extending in a direction substantially orthogonal to the rotation axis a1 by the driving force of the drive motor 43 a. The holding portion 44 holds the held portion 92b of the mounting member 92. Thus, the holding portion 44 holds the mounted object P2 from the lower side (the Z2 direction side) via the mounting member 92. The holding portion 44 has a plurality of claw portions 44a, and the held portion 92b of the placement member 92 is fixedly held by the plurality of claw portions 44 a.

As shown in fig. 1, the conveying unit 5 constitutes a single conveying path 5a for carrying in, conveying, and carrying out the substrate P1 or the mounted object P2. The conveying unit 5 includes a pair of conveying belts 51 disposed at positions separated from each other in the Y direction. The conveying unit 5 supports both ends of the object to be conveyed (the conveying member 91 on which the substrate P1 or the object P2 is mounted) in the Y direction from the lower side (the Z2 direction side) by the pair of conveying belts 51, and conveys the object to be conveyed along the conveying path 5a extending in the X direction.

The head unit 6 is a head unit for surface mounting in which the element E is mounted on the substrate P1 or the object P2. The head unit 6 includes a plurality of (six) heads 61 (mounting heads). The head 61 is connected to a vacuum generating device (not shown). The head 61 is configured to be capable of sucking and holding (being capable of sucking) the component E to a suction nozzle 61a attached to the tip thereof by negative pressure supplied from a vacuum generating device (see fig. 5 and 6). The head 61 is configured to be able to mount the element E on the substrate P1 or the object P2 by releasing the holding (suction) of the element E. The head 61 is configured to be movable in the vertical direction by a vertical movement mechanism (not shown) such as a ball screw shaft mechanism.

In the component mounting apparatus 100, the component supply apparatuses 100a that supply the components E mounted on the substrate P1 or the object P2 are arranged on both sides (the Y1 side and the Y2 side) in the Y direction. The component supply device 100a is, for example, a tape feeder that supplies the components E by feeding a component supply tape that holds the components E. The component supply device 100a may be a tray feeder that supplies components E by supplying a tray holding the components E. The head 61 of the head unit 6 holds (sucks) the component E supplied from the component supply device 100a to the suction nozzle 61 a.

The head horizontal movement mechanism 7 is configured to move the head unit 6 in the horizontal direction (XY direction) above the substrate P1 or the mounted object P2 (Z1 direction side). The head horizontal movement mechanism 7 includes an X-axis movement mechanism 71 and a Y-axis movement mechanism 72.

The X-axis movement mechanism 71 is configured to move the head unit 6 in the conveyance direction (X direction). The head unit 6 is attached to the X-axis movement mechanism portion 71. The X-axis movement mechanism 71 includes a ball screw shaft mechanism 71a to which the head unit 6 is attached, and a drive motor 71b that rotates the ball screw shaft of the ball screw shaft mechanism 71 a. The Y-axis movement mechanism 72 is configured to move the X-axis movement mechanism 71 in the Y direction together with the head unit 6. The X-axis movement mechanism 71 is attached to the Y-axis movement mechanism 72. The Y-axis movement mechanism 72 includes a ball screw shaft mechanism 72a to which the X-axis movement mechanism 71 is attached, and a drive motor 72b that rotates the ball screw shaft of the ball screw shaft mechanism 72 a. The head unit 6 is configured to be movable between the component supply device 100a and the first mounting region 1 or between the component supply device 100a and the second mounting region 2 by the head horizontal movement mechanism 7.

The component pickup unit 8 is a camera for component recognition. The component imaging section 8 images the component E held (sucked) by the suction nozzle 61a of the head 61 before mounting the component E. The component imaging unit 8 is fixed to the upper surface of the base of the component mounting device 100, and images the component E held (sucked) by the suction nozzle 61a of the head 61 from the lower side (the Z2 direction side) of the component E. The control unit 10 acquires (recognizes) the holding state (the rotational posture and the holding position of the nozzle 61a with respect to the head 61) of the component E based on the imaging result of the component E by the component imaging unit 8.

The mark capturing unit 9 is a camera for recognizing a mark. The mark imaging unit 9 images a position recognition mark (not shown) attached to the board P1 or the object P2 before the mounting operation of the component E. The position recognition mark is a mark for recognizing the position of the substrate P1 or the mounted object P2. The controller 10 is configured to acquire (recognize) the accurate position and posture of the board P1 or the mounted object P2 based on the imaging result of the position recognition mark of the mark imaging unit 9. The mark imaging unit 9 is attached to the head unit 6, and is configured to be movable in the horizontal direction (XY direction) together with the head unit 6 above the board P1 or the object P2 (Z2 direction side).

The control unit 10 is a control circuit that controls the operation of the component mounting apparatus 100. The control unit 10 includes: a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. The controller 10 is configured to control the substrate holder 3, the mounted object holder 4, the carrier 5, the head unit 6, the head horizontal movement mechanism 7, the component imaging unit 8, and the mark imaging unit 9 in accordance with the production program, thereby mounting the component E on the substrate P1 or the mounted object P2.

Here, in the first embodiment, the control unit 10 controls the head unit 6 as follows: in the first mounting region 1, the component E is mounted on the horizontal mounting surface P2a of the object P2, and in the second mounting region 2, the component E is mounted on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2 a. The control section 10 controls the head unit 6 as follows: in the first mounting region 1, the components E are successively mounted on the horizontal mounting surfaces P2a of the plurality of objects P2. This allows the same components E to be successively mounted, and therefore, the replacement of the nozzles 61a of the head 61 can be reduced and the suction rate can be improved. Further, the control section 10 controls the head unit 6 as follows: transfer of the mounted object P2 from the conveying member 91 to the second mounting region 2 (mounted object holding unit 4), mounting of the component E to the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2a, and transfer of the mounted object P2 from the second mounting region 2 (mounted object holding unit 4) to the conveying member 91 are performed for each mounted object P2.

In the present embodiment, when the horizontal mounting surface P2a of the mounted object P2 can be held and transferred, the controller 10 controls the head unit 6 as follows (see fig. 6): the object P2 is transferred to the second mounting area 2 as a transfer destination or a return position (a predetermined position on the conveyance member 91) to be returned from the second mounting area 2 in a state where the horizontal mounting surface P2a of the object P2 is held (sucked) by the suction nozzles 61a of the head 61. When the horizontal mounting surface P2a of the mounted object P2 cannot be held and transferred, the controller 10 controls the head unit 6 as follows (see fig. 5): in a state where the upper surface of the placement member 92 is held (sucked) by the suction nozzle 61a of the head 61, the mounted object P2 is transferred to the second mounting area 2 as a transfer destination or a return position (a predetermined position on the conveyance member 91) returned from the second mounting area 2.

The control unit 10 controls the head unit 6, for example, as follows: the mounting of the component E to the horizontal mounting surface P2a of the object P2 is not performed in the first mounting region 1, and after the mounting to the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2, the mounting of the component E to the horizontal mounting surface P2a of the object P2 is completed in the first mounting region 1. Further, for example, the control section 10 controls the head unit 6 as follows: only a part of the components E are mounted on the horizontal mounting surface P2a of the object P2 in the first mounting region 1, and after the mounting of the components E on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2, the mounting of the components E on the horizontal mounting surface P2a of the object P2 is completed in the first mounting region 1. Further, for example, the control section 10 controls the head unit 6 as follows: after the first mounting region 1 completes the mounting of the component E to the horizontal mounting surface P2a of the mounted object P2, the mounting to the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2. Further, for example, the control section 10 controls the head unit 6 as follows: in the second mounting region 2, while the posture of the predetermined mounted object P2 is changed, mounting of the component E to the horizontal mounting surface P2a of the mounted object P2 other than the predetermined mounted object P2 is performed in the first mounting region 1. In addition, "mounting of a component on a mounting surface is completed" means that mounting of a component on a mounting surface in the present machine (component mounting apparatus 100) is completed. That is, the term "mounting of the component on the mounting surface" means mounting of the component on the mounting surface defined by the mounting machine. That is, the phrase "mounting the component on the mounting surface is completed" includes not only a case where the mounting of the component on the mounting surface is completed in a state where the components are mounted on all the mounting positions of the mounting surface, but also a case where the mounting of the component on the mounting surface is completed in a state where the mounting of the component on a part of the mounting surface is not completed. In the latter case, for example, the component is mounted further on a mounting surface on which mounting of the component to a part of the mounting positions is not completed by a component mounting device disposed on the downstream side of the mounting device.

In the present embodiment, the control unit 10 controls the head unit 6 as follows: the mounting of the component E in the first mounting area 1 to the horizontal mounting surface P2a of the mounted object P2 and the mounting of the component E in the second mounting area 2 to the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2a are performed in an order determined based on information on interference between the head unit 6 and the component E on the horizontal mounting surface P2a of the mounted object P2 at the time of transferring the mounted object P2 and the production efficiency information. As shown in fig. 9, the information on the interference is information indicating whether or not interference (collision) occurs between the suction nozzle 61a of the head 61 of the head unit 6 and the component E on the horizontal mounting surface P2a of the object P2 when the object P2 is transferred. The information on the disturbance can be acquired based on, for example, the shape information of the mounted object P2, the shape information of the head unit 6, and the shape information of the component E on the horizontal mounting surface P2a of the mounted object P2. The production efficiency information indicates in which order the mounting of the component E in the first mounting region 1 on the horizontal mounting surface P2a of the object P2 and the mounting of the component E in the second mounting region 2 on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a are performed, the efficiency is high. The production efficiency information can be obtained by simulation (beat simulation).

The control section 10 controls the head unit 6 as follows: the mounting of the component E in the first mounting area 1 to the horizontal mounting surface P2a of the mounted object P2 and the mounting of the component E in the second mounting area 2 to the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2a are performed in an order determined so as to avoid interference (collision) of the head unit 6 with the component E on the horizontal mounting surface P2a of the mounted object P2 when the mounted object P2 is transferred based on the information relating to interference. The controller 10 controls the head unit 6 to mount the components E in the first mounting region 1 on the horizontal mounting surface P2a of the object P2 and to mount the components E in the second mounting region 2 on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a in an order determined so that the production efficiency becomes high (so that the production time is shortened) based on the production efficiency information.

(mounting order determining Process)

Next, a mounting procedure determining process performed by the component mounting apparatus 100 will be described based on a flowchart with reference to fig. 10 and 11. The mounting order determination processing is performed before the production of the mounted object P2 is started. The mounting order determination process may be performed by the component mounting apparatus 100 or by an external apparatus such as a management apparatus.

As shown in fig. 10, first, it is determined in step S1 whether or not the mounting of the component E on the horizontal mounting surface P2a of the object P2 can be performed in the first mounting region 1. If it is determined that the mounting cannot be performed (for example, if the object P2 has a hemispherical shape, and the horizontal mounting surface P2a does not exist originally), the process proceeds to step S2.

Then, in step S2, it is determined that the mounting of the component E to all the mounting surfaces of the object P2 is completed in the second mounting region 2. Then, the mounting order decision processing ends.

If it is determined in step S1 that the mounting is possible, the process proceeds to step S3.

In step S3, it is determined whether or not the horizontal mounting surface P2a of the mounted object P2 can be held and transferred. If it is determined that the transfer is possible, the process proceeds to step S4. When it is determined that transfer is possible, a horizontal mounting surface P2a on which the mounted object P2 is held (sucked) by the suction nozzle 61a of the head 61 is determined, and the mounted object P2 is transferred (see fig. 6).

Further, in step S4, it is determined based on the production efficiency information whether or not the mounting of the component E in the first mounting region 1 on the horizontal mounting surface P2a of the mounted object P2 is distributed to the front and rear efficiency of the mounting of the component E in the second mounting region 2 on the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2 a. If it is determined that the efficiency is not high, the process proceeds to step S5.

In step S5, the mounting order is determined as follows: the mounting of the component E to the horizontal mounting surface P2a of the object P2 is not performed in the first mounting region 1, and after the mounting to the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2, the mounting of the component E to the horizontal mounting surface P2a of the object P2 is completed in the first mounting region 1. Then, the mounting order decision processing ends.

If it is determined in step S4 that the efficiency is high, the process proceeds to step S9 (see fig. 11).

In step S9, the mounting order is determined as follows: only a part of the components E are mounted on the horizontal mounting surface P2a of the object P2 in the first mounting region 1, and after the mounting of the components E on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2, the mounting of the components E on the horizontal mounting surface P2a of the object P2 is completed in the first mounting region 1. Then, the mounting order decision processing ends.

If it is determined in step S3 that transfer cannot be performed, the process proceeds to step S6. When it is determined that the transfer cannot be performed, it is determined that the upper surface of the mounting member 92 is held (sucked) by the suction nozzle 61a of the head 61 and the mounted object P2 (see fig. 5) is transferred.

Then, in step S6, it is determined based on the information on interference whether or not the head unit 6 interferes with (collides with) the component E on the horizontal mounting surface P2a of the object P2 when the object P2 is transferred. If it is determined that the head unit 6 interferes with (collides with) the element E, the process proceeds to step S5.

Then, in step S5, the mounting order is determined as follows: the mounting of the component E to the horizontal mounting surface P2a of the mounted object P2 is not performed in the first mounting region 1, and after the mounting to the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2, the mounting of the component E to the horizontal mounting surface P2a of the mounted object P2 is completed in the first mounting region 1. Then, the mounting order decision processing ends.

If it is determined in step S6 that the head unit 6 does not interfere with (collide with) the element E, the process proceeds to step S7.

As shown in fig. 11, it is determined in step S7 based on the production efficiency information whether or not the mounting of the component E to the horizontal mounting surface P2a of the object P2 is performed in the first mounting region 1 with higher efficiency. If it is determined that the efficiency is not high, the process proceeds to step S2.

If it is determined in step S7 that the efficiency is high, the process proceeds to step S8.

Further, it is determined in step S8 based on the production efficiency information whether or not the mounting of the component E in the first mounting region 1 to the horizontal mounting surface P2a of the mounted object P2 is more efficient before and after the mounting of the component E allocated in the second mounting region 2 to the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2 a. If it is determined that the efficiency is high, the process proceeds to step S9.

Then, in step S9, the mounting order is determined as follows: in the first mounting region 1, only a part of the components E are mounted on the horizontal mounting surface P2a of the object P2, and after the mounting of the components E on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2, the mounting of the components E on the horizontal mounting surface P2a of the object P2 is completed in the first mounting region 1. Then, the mounting order decision processing ends.

If it is determined in step S8 that the efficiency is not high, the process proceeds to step S10.

Further, it is determined in step S10 based on the production efficiency information whether the efficiency of the scheme of mounting the components E in the first mounting region 1 on the horizontal mounting surface P2a of the mounted object P2 is higher before the mounting of the components E in the second mounting region 2 on the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2 a. If it is determined that the efficiency is high, the process proceeds to step S11.

Then, in step S11, the mounting order is determined as follows: after the mounting of the component E to the horizontal mounting surface P2a of the mounted object P2 is completed in the first mounting region 1, the mounting to the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2. Then, the mounting order decision processing ends.

If it is determined in step S10 that the efficiency is not high, the process proceeds to step S5.

Then, in step S5, the mounting order is determined as follows: the mounting of the component E to the horizontal mounting surface P2a of the object P2 is not performed in the first mounting region 1, and after the mounting to the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2, the mounting of the component E to the horizontal mounting surface P2a of the object P2 is completed in the first mounting region 1. Then, the mounting order decision processing ends. Then, the mounting (production) of the mounted object P2 is performed in the mounting order determined as described above.

(first example of mounting Process)

Next, a first example of the mounting process performed by the component mounting apparatus 100 will be described based on a flowchart with reference to fig. 12. In the first example, the description will be given of an example in which the mounting of the component E to the horizontal mounting surface P2a of the object P2 is not performed in the first mounting region 1, and the mounting of the component E to the horizontal mounting surface P2a of the object P2 is completed in the first mounting region 1 after the mounting of the component E to the mounting surface P2b other than the horizontal mounting surface P2a of the object P2 is completed in the second mounting region 2. Each process in the flowchart is performed by the control unit 10.

As shown in fig. 12, first, in step S21, a plurality of objects P2 mounted on the conveying member 91 and the mounting member 92 are carried in by the conveying unit 5.

Then, in step S22, one mounted object P2 of the plurality of mounted objects P2 that have been carried in is transferred from the conveying member 91 to the second mounting area 2 (mounted object holding unit 4) by the head unit 6. In step S22, the mounted object P2 is transferred by the transfer method determined in the mounting order determination process. That is, the object P2 is transferred by the head unit 6 in a state where the horizontal mounting surface P2a of the object P2 is held (sucked) by the nozzles 61a of the head 61, or the object P2 is transferred by the head unit 6 in a state where the upper surface of the mounting member 92 is held (sucked) by the nozzles 61a of the head 61.

Further, in step S23, the mounting of the component E in the second mounting region 2 to the mounting surface P2b of the mounted object P2 held by the mounted object holding portion 4 other than the horizontal mounting surface P2a is performed and completed by the head unit 6. In step S23, the component E is mounted on the mounting surface P2b of the object P2 held by the object holding portion 4 by the head unit 6 in a state where the object holding portion 4 is controlled so that the mounting surface P2b of the object P2 is horizontal.

Then, in step S24, the object P2 is transferred from the second mounting area 2 (object holder 4) to the conveying member 91 by the head unit 6. In step S24, in the same manner as in step S22, the mounted object P2 is transferred by the transfer method determined in the mounting order determination process.

Then, in step S25, it is determined whether or not all of the plurality of mounted objects P2 have been transferred (all of the mounting surfaces P2b other than the horizontal mounting surface P2a are mounted on each of the plurality of mounted objects P2). If it is determined that any one of the plurality of objects P2, P2, has not been transferred, the process proceeds to step S22. The processing of steps S22 to S24 is executed for the mounted object P2 that has not been transferred yet.

If it is determined in step S25 that all of the objects P2 have been transferred, the process proceeds to step S26.

Then, in step S26, the mounting of the component E in the first mounting region 1 to the horizontal mounting surface P2a of the object P2 on the conveyance member 91 is performed and completed by the head unit 6. In step S26, the head unit 6 sequentially mounts the component E on the horizontal mounting surface P2a of each of the plurality of objects P2 on the conveying member 91.

In step S27, the plurality of mounted objects P2 on which the mounting of the component E to the horizontal mounting surface P2a and the mounting surface P2b other than the horizontal mounting surface P2a is completed are carried out by the carrier 5. Then, the mounting process ends.

(second example of mounting Process)

Next, a second example of the mounting process performed by the component mounting apparatus 100 will be described based on a flowchart with reference to fig. 13. In the second example, an example will be described in which only a part of the components E are mounted on the horizontal mounting surface P2a of the object P2 in the first mounting region 1, and after the mounting of the components E on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2, the mounting of the components E on the horizontal mounting surface P2a of the object P2 is completed in the first mounting region 1. Each process in the flowchart is performed by the control unit 10. Note that the same processing as in the first example of the mounting processing is denoted by the same reference numerals in the drawings, and detailed description thereof is omitted.

As shown in fig. 13, first, in step S21, a plurality of objects P2 mounted on the conveying member 91 and the mounting member 92 are carried in by the conveying unit 5.

In step S31, the head unit 6 mounts only some of the components E in the first mounting region 1 on the horizontal mounting surface P2a of the object P2 on the conveying member 91. In step S31, the head unit 6 sequentially mounts the component E on a part of the horizontal mounting surface P2a of each of the plurality of objects P2 on the transport member 91.

The processing of steps S22 to S25 is performed in the same manner as the first example of the mounting processing.

In step S26a, the mounting of the component E in the first mounting region 1 to the horizontal mounting surface P2a of the object P2 on the transport member 91 is performed and completed by the head unit 6. In step S26a, the head unit 6 sequentially mounts the component E to the horizontal mounting surface P2a of each of the plurality of objects P2 on the transport member 91, the part not mounted in step S31.

(third example of mounting Process)

Next, a third example of the mounting process performed by the component mounting apparatus 100 will be described based on a flowchart with reference to fig. 14. In the third example, an example will be described in which, after the mounting of the component E on the horizontal mounting surface P2a of the object P2 is completed in the first mounting region 1, the mounting on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a is completed in the second mounting region 2. Each process in the flowchart is performed by the control unit 10. Note that the same processing as in the first example of the mounting processing is denoted by the same reference numerals in the drawings, and detailed description thereof is omitted.

As shown in fig. 14, first, in step S21, a plurality of objects P2 placed on the conveying member 91 and the placing member 92 are loaded by the conveying unit 5.

In step S41, the mounting of the component E in the first mounting region 1 to the horizontal mounting surface P2a of the object P2 on the transport member 91 is performed and completed by the head unit 6. In step S41, the head unit 6 sequentially mounts the component E on the horizontal mounting surface P2a of each of the plurality of objects P2 on the transport member 91.

In step S27, a plurality of mounted objects P2 on which the mounting of the component E on the horizontal mounting surface P2a and the mounting surface P2b other than the horizontal mounting surface P2a is completed are carried out by the carrier 5. Then, the mounting process ends.

(Effect of the first embodiment)

In the first embodiment, the following effects can be obtained.

In the first embodiment, as described above, the control unit 10 is configured to control the head unit 6 as follows: the component E is mounted on the horizontal mounting surface P2a of the object P2 in the first mounting area 1 provided on the conveyance path 5a for conveying the object P2, and the component E is mounted on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a in the second mounting area 2 different from the first mounting area 1. Thus, the component E can be mounted on the horizontal mounting surface P2a of the object P2 that can be mounted in the state of being arranged on the conveyance path 5a in the first mounting region 1 provided on the conveyance path 5a, and the component E can be mounted on the mounting surface P2b other than the horizontal mounting surface P2a of the object P2 that cannot be mounted in the state of being arranged on the conveyance path 5a in the second mounting region 2 different from the first mounting region 1. As a result, the component E can be mounted on the horizontal mounting surface P2a of the mounted object P2 and the mounting surface P2b other than the horizontal mounting surface P2a in different regions. This can increase the degree of freedom in mounting the object P2 having the horizontal mounting surface P2a and the mounting surface P2b other than the horizontal mounting surface P2 a. As a result, the component mounting apparatus 100 capable of efficiently mounting the component E to the object P2 to be mounted having the horizontal mounting surface P2a and the mounting surface P2b other than the horizontal mounting surface P2a can be provided.

In the first embodiment, as described above, the first mounting region 1 is configured as a region where the head unit 6 mounts the element E on the substrate P1 having a flat plate shape. Thus, the component E can be mounted on the horizontal mounting surface P2a of the object P2 by using the mounting region for the substrate P1 having a flat plate shape. As a result, it is not necessary to provide a mounting region for the horizontal mounting surface P2a of the object P2 separately from the mounting region for the substrate P1 having a flat plate shape. Thus, the number of components E can be reduced and the structure can be simplified, compared to a case where a mounting region for the horizontal mounting surface P2a of the object P2 is separately provided for a mounting region for the substrate P1 having a flat plate shape.

In the first embodiment, as described above, the control unit 10 is configured to control the head unit 6 as follows: the components E are sequentially mounted on the horizontal mounting surfaces P2a of the objects P2 in the first mounting region 1. This allows the components E to be mounted on the horizontal mounting surfaces P2a of the plurality of objects P2 collectively in the first mounting region 1. As a result, the mounting of the component E to the horizontal mounting surface P2a of each of the plurality of objects P2 can be efficiently performed, compared to the case where the mounting of the component E to the horizontal mounting surface P2a of each of the plurality of objects P2 is performed individually for each of the objects P2 in the second mounting region 2.

In the first embodiment, as described above, the control unit 10 is configured to control the head unit 6 as follows: after the mounting of the component E to the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a is performed in the second mounting region 2, the mounting of the component E to the horizontal mounting surface P2a of the object P2 is performed in the first mounting region 1. Thus, when the production efficiency is higher in mounting the component E on the horizontal mounting surface P2a of the mounted object P2 in the first mounting area 1 after the component E is mounted on the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2a in the second mounting area 2, the component E can be mounted on the mounted object P2 efficiently and easily, for example, when the transfer of the mounted object P2 is convenient.

In the first embodiment, as described above, the control unit 10 is configured to control the head unit 6 as follows: only a part of the components E are mounted on the horizontal mounting surface P2a of the object P2 in the first mounting region 1, and after the components E are mounted on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a in the second mounting region 2, the components E are mounted on the horizontal mounting surface P2a of the object P2 in the first mounting region 1. Thus, when the efficiency of mounting the component E on the horizontal mounting surface P2a of the mounted object P2 in the first mounting region 1 is higher after the component E is mounted on the horizontal mounting surface P2a of the mounted object P2 only in a part of the first mounting region 1 and the component E is mounted on the mounting surface P2b other than the horizontal mounting surface P2a of the mounted object P2 in the second mounting region 2, the component E can be mounted on the mounted object P2 efficiently and easily, for example, when the transfer of the mounted object P2 is facilitated.

In the first embodiment, as described above, the control unit 10 is configured to control the head unit 6 as follows: after the mounting of the component E to the horizontal mounting surface P2a of the mounted object P2 is performed in the first mounting region 1, the mounting of the component E to the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2a is performed in the second mounting region 2. Thus, the component E can be efficiently mounted on the object P2, for example, when the production efficiency is higher when the component E is mounted on the horizontal mounting surface P2a of the object P2 in the first mounting region 1 and then the component E is mounted on the mounting surface P2b other than the horizontal mounting surface P2a of the object P2 in the second mounting region 2.

In the first embodiment, as described above, the control unit 10 is configured to control the head unit 6 as follows: the mounted object P2 is transferred to the second mounting area 2 as a transfer destination or a return position to be returned from the second mounting area 2 while holding the horizontal mounting surface P2a of the mounted object P2. This enables the head unit 6 to hold the horizontal mounting surface P2a of the object P2 in a state where the mounting of the component E is not completed. As a result, the holding position of the head unit 6 can be easily secured on the horizontal mounting surface P2a of the object P2.

In the first embodiment, as described above, the control unit 10 is configured to control the head unit 6 as follows: the mounting of the components E in the first mounting area 1 to the horizontal mounting surface P2a of the mounted object P2 and the mounting of the components E in the second mounting area 2 to the mounting surface P2b of the mounted object P2 other than the horizontal mounting surface P2a are performed in an order determined based on information on interference between the head unit 6 and the components E on the mounted object P2 when the mounted object P2 is transferred and the production efficiency information. Thus, when the components E are mounted in the order determined based on the information on the interference between the head unit 6 and the components E on the object P2 when the object P2 is transferred, the components E can be mounted so as to avoid the interference (collision) between the head unit 6 and the components E on the object P2 when the object P2 is transferred. As a result, the following can be suppressed: in order to avoid interference (collision) between the head unit 6 and the component E on the object P2 when the object P2 is transferred, the sizes of the objects P2 and the component E are limited. In addition, when the components E are mounted in the order determined based on the production efficiency information, the components E can be efficiently mounted on the mounted object P2.

In the first embodiment, as described above, the second mounting region 2 is provided outside the conveyance path 5 a. This makes it possible to provide the second mounting region 2 outside the conveyance path 5a in which the first mounting region 1 is provided, and thus it is possible to easily secure a space for providing the second mounting region 2. Further, since the empty space in the conveyance path 5a can be increased by the amount that the second mounting region 2 is not provided in the conveyance path 5a, the space in which the first mounting region 1 is disposed in the conveyance path 5a can be easily secured.

[ second embodiment ]

Next, a second embodiment will be described with reference to fig. 15. Unlike the first embodiment described above in which the component mounting apparatus includes a single head unit, the second embodiment describes an example in which the component mounting apparatus includes a plurality of head units. Note that the same components as those of the first embodiment are denoted by the same reference numerals in the drawings, and the description thereof is omitted.

(Structure of component mounting apparatus)

As shown in fig. 15, a component mounting apparatus 200 according to a second embodiment of the present invention is different from the component mounting apparatus 100 according to the first embodiment in that it includes a plurality of (two) head units 6 and a control unit 110. The plurality of head units 6 are configured to be movable independently of each other.

In the second embodiment, the control unit 110 controls the plurality of head units 6 as follows, as in the first embodiment: in the first mounting region 1, the component E is mounted on the horizontal mounting surface P2a of the object P2, and in the second mounting region 2, the component E is mounted on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2 a. Specifically, the control unit 110 controls the plurality of head units 6 as follows: mounting of the component E in the first mounting region 1 to the horizontal mounting surface P2a of the mounted object P2 (predetermined mounted object P2) and mounting of the component E in the second mounting region 2 to the mounting surface P2b other than the horizontal mounting surface P2a of the other mounted object P2 (mounted object P2 different from predetermined mounted object P2) are performed in parallel. More specifically, the control section 110 controls the plurality of head units 6 as follows: the sequential mounting of the components E in the first mounting region 1 to the horizontal mounting surface P2a of each of the plurality of mounted objects P2 and the mounting of the components E in the second mounting region 2 to the mounting surfaces P2b of the other mounted objects P2 other than the horizontal mounting surface P2a are performed in parallel.

The other structure of the second embodiment is the same as that of the first embodiment.

(Effect of the second embodiment)

In the second embodiment, the following effects can be obtained.

In the second embodiment, as described above, the control unit 110 is configured to control the plurality of head units 6 as follows: the mounting of the component E in the first mounting region 1 to the horizontal mounting surface P2a of the mounted object P2 and the mounting of the component E in the second mounting region 2 to the mounting surface P2b of the other mounted object P2 other than the horizontal mounting surface P2a are performed in parallel. Thus, the mounting of the component E in the first mounting region 1 to the horizontal mounting surface P2a of the object P2 and the mounting of the component E in the second mounting region 2 to the mounting surface P2b other than the horizontal mounting surface P2a of the other object P2 can be performed in parallel, and hence the time required for mounting the component E can be shortened.

Other effects of the second embodiment are similar to those of the first embodiment.

[ third embodiment ]

Next, a third embodiment will be described with reference to fig. 16. In the third embodiment, an example of a component mounting system including a plurality of component mounting apparatuses will be described, which is different from the first and second embodiments. Note that the same components as those of the first embodiment are denoted by the same reference numerals in the drawings, and the description thereof is omitted.

(Structure of component mounting System)

As shown in fig. 16, the component mounting system 300 according to the third embodiment of the present invention includes a plurality of (three)

component mounting apparatuses

400, 500, and 600. The

component mounting apparatuses

400, 500, and 600 are arranged in this order from the upstream side (X2 direction side) to the downstream side (X1 direction side) in the conveyance direction of the mounted object P2.

The component mounting apparatus 400(600) includes a mounting region 401(601) provided in the conveyance path 5a and mounting the component E on the substrate P1 by the head unit 6. On the other hand, the component mounting apparatus 400(600) does not have a mounting region for mounting the component E on the object P2 by the head unit 6. The component mounting apparatus 400(600) is an apparatus capable of mounting only the component E on the substrate P1. The component mounting apparatus 400(600) includes: the substrate holding unit 3, the carrying unit 5, the head unit 6, the head horizontal movement mechanism unit 7, the device imaging unit 8, the mark imaging unit 9, and the control unit 410 (610). The control unit 410(610) is a control circuit for controlling the operation of the component mounting apparatus 400 (600). The control unit 410(610) includes a CPU, a ROM, a RAM, and the like. Further, the component mounting device 400(600) is an example of the "first component mounting device" in the claims. The mounting region 401(601) is an example of the "first mounting region" in the claims. The head unit 6 of the component mounting apparatus 400(600) is an example of the "first head unit" in the claims. The component mounting apparatus 400(600) may further include a mounting region for mounting the component E on the object P2 by the head unit 6.

The component mounting apparatus 500 has the same configuration as the component mounting apparatus 100 of the first embodiment. The component mounting apparatus 500 includes: a first mounting area 1, a second mounting area 2, a substrate holding unit 3, a mounted object holding unit 4, a conveying unit 5, a head unit 6, a head horizontal movement mechanism unit 7, a component imaging unit 8, a mark imaging unit 9, and a control unit 510. The control unit 510 is a control circuit that controls the operation of the component mounting apparatus 500. The control unit 510 includes a CPU, a ROM, a RAM, and the like. The component mounting apparatus 500 is an example of the "second component mounting apparatus" in the claims. The head unit 6 of the component mounting apparatus 500 is an example of the "second head unit" in the claims. The component mounting apparatus 500 may not include the first mounting region 1.

In the third embodiment, the controller 410(610) of the component mounting apparatus 400(600) controls the head unit 6 so that the component E is mounted on the horizontal mounting surface P2a of the object P2 in the mounting region 401(601) of the head unit. At this time, the controller 410(610) of the component mounting device 400(600) controls the head unit 6 thereof so that the components E are sequentially mounted on the horizontal mounting surfaces P2a of the plurality of objects P2 in the mounting region 401(601) thereof. The controller 510 of the component mounting apparatus 500 controls the head unit 6 so that the component E is mounted on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a in the second mounting region 2 of the head unit. Further, when the horizontal mounting surface P2a of the mounted object P2 can be held and transferred, the controller 510 of the component mounting apparatus 500 controls the head unit 6 as follows: in a state where the horizontal mounting surface P2a of the mounted object P2 is held (sucked) by the suction nozzle 61a of the head 61, the mounted object P2 is transferred to the second mounting area 2 as a transfer destination or a return position (a predetermined position on the conveying member 91) returned from the second mounting area 2. Further, when the horizontal mounting surface P2a of the mounted object P2 cannot be held and transferred, the controller 510 of the component mounting apparatus 500 controls the head unit 6 as follows: the mounted object P2 is transferred to the second mounting area 2 as a transfer destination or a return position (a predetermined position on the conveyance member 91) to be returned from the second mounting area 2 in a state where the upper surface of the mounting member 92 is held (sucked) by the suction nozzles 61a of the head 61.

For example, the component mounting system 300 operates as follows. That is, first, the control unit 410 of the upstream component mounting device 400 controls the head unit 6 thereof so as to mount the component E on the horizontal mounting surface P2a of the object P2 in the mounting region 401 thereof. Then, the controller 510 of the component mounting apparatus 500 controls the head unit 6 of the apparatus so that the component E is mounted on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a in the second mounting region 2 of the apparatus. Then, the controller 610 of the downstream component mounter 600 controls the head unit 6 thereof so as to mount the component E on the horizontal mounting surface P2a of the mounted object P2 in the mounting area 601 thereof.

In the case where the component mounting system 300 does not include the upstream component mounting device 400, the component mounting system 300 operates as follows, for example. That is, first, the controller 510 of the component mounting apparatus 500 controls the head unit 6 of the apparatus so that the component E is mounted on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a in the second mounting region 2 of the apparatus. Then, the controller 610 of the downstream component mounter 600 controls the head unit 6 thereof so as to mount the component E on the horizontal mounting surface P2a of the mounted object P2 in the mounting area 601 thereof.

In the case where the component mounting system 300 does not include the downstream component mounting device 600, the component mounting system 300 operates as follows, for example. That is, first, the control unit 410 of the upstream component mounting device 400 controls the head unit 6 thereof so as to mount the component E on the horizontal mounting surface P2a of the object P2 in the mounting region 401 thereof. Then, the controller 510 of the component mounting apparatus 500 controls the head unit 6 of the apparatus so that the component E is mounted on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a in the second mounting region 2 of the apparatus.

The other structure of the third embodiment is the same as that of the first embodiment.

(Effect of the third embodiment)

In the third embodiment, the following effects can be obtained.

In the third embodiment, as described above, the component mounting system 300 is configured to include the component mounting apparatus 400(600) and the component mounting apparatus 500, the component mounting apparatus 400(600) controls the head unit 6 of the apparatus to mount the component E on the horizontal mounting surface P2a of the object P2 in the mounting area 401(601) provided in the conveyance path 5a for conveying the object P2, and the component mounting apparatus 500 controls the head unit 6 of the apparatus to mount the component E on the mounting surface P2b of the object P2 other than the horizontal mounting surface P2a in the second mounting area 2 different from the mounting area 401 (601). Thus, the component mounting system 300 can be provided which can efficiently mount the component E to the object P2 to be mounted having the horizontal mounting surface P2a and the mounting surface P2b other than the horizontal mounting surface P2a, similarly to the component mounting device 100 of the first embodiment.

Other effects of the third embodiment are similar to those of the first embodiment.

[ modified examples ]

The embodiments disclosed herein are not intended to be limiting in all respects, but rather are illustrative. The scope of the present invention is defined by the claims rather than the description of the above embodiments, and includes all modifications (variations) within the meaning and range equivalent to the scope of the claims.

For example, although the first to third embodiments described above have shown the example in which the head unit is a head unit for surface mounting, the present invention is not limited to this. In the present invention, the head unit may be an insertion element head unit for inserting an insertion element (guide element or the like) inserted into a through hole formed in an object to be mounted into the object to be mounted.

In the first to third embodiments, the first mounting region is a region where components are mounted on the substrate by the head unit, but the present invention is not limited to this. For example, the first mounting region may be a dedicated region for mounting a component on a horizontal mounting surface of the object by the head unit.

In the first to third embodiments, the second mounting region is provided outside the conveyance path, but the present invention is not limited to this. For example, the second mounting region may be provided in the conveyance path.

In the first to third embodiments, the example in which the mounted object is carried while being placed on the carrying member (placing member) is shown, but the present invention is not limited to this. For example, the mounted object itself may be directly conveyed without being placed on the conveying member (placement member).

In the first to third embodiments, the example in which a plurality of objects to be mounted are carried in at a time is shown, but the present invention is not limited to this. For example, only a single object to be mounted may be carried in at a time.

In addition, in the first and second embodiments, the example in which the mounting order is determined based on the information on the disturbance and the production efficiency information is shown, but the present invention is not limited to this. In the present invention, the mounting order may be determined based on only one of the information on the interference and the production efficiency information. In addition, the mounting order may be determined based on information other than the information related to the interference and the production efficiency information.

In the first embodiment, for convenience of explanation, the process operation is described using a flow-driven flowchart in which processes are sequentially performed along the process flow, but the present invention is not limited to this. In the present invention, the processing operation may be performed by an event-driven type (event-driven type) process in which the process is executed in event units. In this case, the event may be performed by a complete event-driven type, or may be performed by combining event-driven and flow-driven types.

Description of the reference numerals

1 first mounting area

2 second mounting area

5a conveying path

6 head unit (first head unit, second head unit)

100. 200 element mounting device

300 element mounting system

400. 600 parts mounting device (first parts mounting device)

401. 601 installation zone (first installation zone)

500 parts mounting device (second parts mounting device)

E element

P1 substrate

P2 mounted object

P2a horizontal mounting surface

P2b mounting surface other than the horizontal mounting surface.

Claims

1. A component mounting apparatus includes:

a head unit that mounts a component on an object to be mounted, the object to be mounted having a mounting surface that is horizontal in a conveyance path and a mounting surface other than the horizontal mounting surface; and

a control unit that controls the head unit as follows: the component is mounted on the horizontal mounting surface of the mounted object in a first mounting area provided on the conveying path for conveying the mounted object, and the component is mounted on the mounting surface of the mounted object except for the horizontal mounting surface in a second mounting area different from the first mounting area.

2. The component mounting apparatus according to claim 1,

the first mounting region is a region where the mounting of the component is performed by the head unit on a substrate having a flat plate shape.

3. The component mounting apparatus according to claim 1 or 2,

the control unit is configured to control the head unit as follows: in the first mounting region, the components are sequentially mounted on the horizontal mounting surfaces of the respective mounted objects.

4. A component mounting apparatus according to any one of claims 1 to 3,

the control unit is configured to control the head unit as follows: after the component is mounted on the mounting surface of the object other than the horizontal mounting surface in the second mounting region, the component is mounted on the horizontal mounting surface of the object in the first mounting region.

5. A component mounting apparatus according to any one of claims 1 to 4,

the control unit is configured to control the head unit as follows: the component is mounted only partially on the horizontal mounting surface of the object in the first mounting region, and after the component is mounted on the mounting surface of the object other than the horizontal mounting surface in the second mounting region, the component is mounted on the horizontal mounting surface of the object in the first mounting region.

6. A component mounting apparatus according to any one of claims 1 to 5,

the control unit is configured to control the head unit as follows: after the component is mounted on the horizontal mounting surface of the mounted object in the first mounting region, the component is mounted on the mounting surface of the mounted object other than the horizontal mounting surface in the second mounting region.

7. The component mounting apparatus according to claim 5 or 6,

the control unit is configured to control the head unit so as to transfer the mounted object to the second mounting area as a transfer destination or to a return position returned from the second mounting area while maintaining the horizontal mounting surface of the mounted object.

8. A component mounting apparatus according to any one of claims 1 to 7,

the control unit is configured to control the head unit as follows: the mounting of the component on the horizontal mounting surface of the mounted object in the first mounting region and the mounting of the component on the mounting surface other than the horizontal mounting surface of the mounted object in the second mounting region are performed in an order determined based on at least one of information on interference between the head unit and the component on the mounted object when the mounted object is transferred and production efficiency information.

9. A component mounting apparatus according to any one of claims 1 to 8,

the control unit is configured to control the plurality of head units as follows: the component mounting on the horizontal mounting surface of the object to be mounted in the first mounting region and the component mounting on the mounting surface other than the horizontal mounting surface of the other object to be mounted in the second mounting region are performed in parallel.

10. A component mounting apparatus according to any one of claims 1 to 9,

the second mounting region is provided on the outer side of the conveyance path.

11. A component mounting system is provided with:

a first component mounting device including a first head unit for mounting a component on an object to be mounted, the object to be mounted having a mounting surface that is horizontal in a conveyance path and a mounting surface other than the horizontal mounting surface, the first component mounting device controlling the first head unit as follows: mounting the component on the horizontal mounting surface of the mounted object in a first mounting region provided on the conveyance path for conveying the mounted object; and

a second component mounting device including a second head unit for mounting the component on the object, the second component mounting device controlling the second head unit as follows: and mounting the component on a mounting surface of the object other than the horizontal mounting surface in a second mounting region different from the first mounting region.

12. A component mounting method for mounting a component on a mounting object having a mounting surface horizontal in a conveyance path and a mounting surface other than the horizontal mounting surface,

mounting the component to the horizontal mounting surface of the object to be mounted in a first mounting region provided on the conveyance path for conveying the object to be mounted,

and mounting the component on a mounting surface of the object other than the horizontal mounting surface in a second mounting region different from the first mounting region.