CN111660065B - Totally-enclosed immersed liquid cooling device and manufacturing method thereof - Google Patents
Totally-enclosed immersed liquid cooling device and manufacturing method thereof Download PDFInfo
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- CN111660065B CN111660065B CN202010429484.7A CN202010429484A CN111660065B CN 111660065 B CN111660065 B CN 111660065B CN 202010429484 A CN202010429484 A CN 202010429484A CN 111660065 B CN111660065 B CN 111660065B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
- B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a totally-enclosed immersed liquid cooling device and a manufacturing method thereof, wherein the totally-enclosed immersed liquid cooling device comprises a totally-enclosed groove body, the totally-enclosed groove body is hollowed, the top of the totally-enclosed groove body is provided with an opening, a heat conductor is fixed on the opening at the top of the totally-enclosed groove body, the lower part of the heat conductor is connected with a condenser, the upper part of the heat conductor is connected with a heat dissipation device, the bottom of the totally-enclosed groove body is fixed with an operation main board, the totally-enclosed groove body is filled with cooling liquid, and the cooling liquid submerges the operation main board; the totally-enclosed groove body is provided with a power supply connector which is respectively connected with the operation main board and an external power supply; the arrangement height of the power connector is higher than the height of the top surface of the cooling liquid. The totally-enclosed immersed liquid cooling device provided by the invention has good heat dissipation, and is particularly suitable for a large-computation-amount computation host.
Description
Technical Field
The invention relates to a totally-enclosed immersed liquid cooling device and a manufacturing method thereof.
Background
In the 5G era, the operation host base stations with large operation amount are extremely wide in distribution and can be particularly placed outdoors, at remote places and in places where people are rare. In a traditional air cooling base station, the heat dissipation mode is fan heat dissipation, dust accumulation can be caused while air convection, the heat dissipation capacity of a fan can be reduced due to time accumulation, and therefore the calculation capacity of the base station is reduced. A large amount of manpower and material resources must be invested for maintenance, and particularly in remote areas, the operation and maintenance difficulty is higher.
Disclosure of Invention
A first object of the present invention is to provide a totally enclosed submerged liquid cooling apparatus, which overcomes the disadvantages of the prior art.
For this reason, the above object of the present invention is achieved by the following technical solutions:
a totally-enclosed immersed liquid cooling device comprises a totally-enclosed groove body, wherein the totally-enclosed groove body is hollowed, an opening is formed in the top of the totally-enclosed groove body, a heat conductor is fixed on the opening in the top of the totally-enclosed groove body, a condenser is connected to the lower portion of the heat conductor, a heat dissipation device is connected to the upper portion of the heat conductor, an operation main board is fixed to the bottom of the totally-enclosed groove body, cooling liquid is contained in the totally-enclosed groove body, and the cooling liquid submerges the operation main board; a power supply connector is arranged on the totally-enclosed groove body and is respectively connected with the operation main board and an external power supply; the arrangement height of the power connector is higher than the height of the top surface of the cooling liquid. The boiling point of the cooling liquid is between 40 ℃ and 40 ℃, the cooling liquid is non-corrosive, environment-friendly and extremely good in compatibility with an operation mainboard.
While adopting the above technical scheme, the present invention can also adopt or combine the following further technical schemes:
as a preferred technical scheme of the invention: the condenser is a plurality of condensing pipes extending towards the direction of the condensate.
As a preferred technical scheme of the invention: the heat dissipation device is provided with a plurality of heat dissipation fins.
As a preferred technical scheme of the invention: the top surface of the cooling liquid is not higher than the bottom of the heat dissipation device.
As a preferred technical scheme of the invention: and side wall open holes are formed in the side wall of the totally-closed tank body, the height of each side wall open hole is higher than that of the top surface of the cooling liquid, and a power connector is arranged in each side wall open hole.
As a preferred technical scheme of the invention: and a liquid injection valve and an air extraction valve are also arranged in the side wall opening.
As a preferred technical scheme of the invention: the totally closed groove body is formed by hollowing the inside of the whole aluminum block.
It is a further object of the present invention to provide a method of manufacturing a totally enclosed submerged liquid cooling apparatus that addresses the deficiencies in the prior art.
For this reason, the above object of the present invention is achieved by the following technical solutions:
a method for manufacturing a totally enclosed immersed liquid cooling device, the method for manufacturing the totally enclosed immersed liquid cooling device being used for manufacturing the totally enclosed immersed liquid cooling device, comprising the following steps:
(1) selecting a whole aluminum alloy, hollowing from the top to the bottom, keeping the wall thickness of the four walls and the bottom, and opening at the top for installing a heat conductor; then, a through hole is formed in the side wall of the aluminum groove body to serve as a mounting hole position of a power connector, and finally the aluminum groove body is obtained;
(2) based on the position on the operation main board, 3-4 fixing screws are arranged at the bottom of the aluminum groove body and used for fixing the operation main board; after the testing function is completed before the operation main board is installed, the operation main board is fixed on a fixing screw at the bottom of an aluminum groove body through screws, and a certain space is reserved between the operation main board and the bottom of the groove body;
(3) selecting a copper ingot, processing the copper ingot into a heat conductor, and installing a radiating fin on the top of the heat conductor in a welding mode;
(4) selecting a solid copper cylinder, processing the solid copper cylinder into a copper bar, uniformly spraying a special copper slurry material on the surface of the copper bar by adopting a spraying process, then sending the copper bar into a vacuum oven, firing the copper bar for 4 hours at 600 ℃, and repeatedly repeating the working procedures until the thickness of the copper powder reaches 20-30 mm; welding the manufactured copper rods to the lower surface of the heat conductor in an array arrangement mode to be used as a condensation pipe;
(5) welding a heat conductor at an opening at the top of the aluminum groove body, arranging radiating fins inside and outside the aluminum groove body, and arranging a condenser pipe inside the aluminum groove body;
(6) and installing a power supply connector, a liquid injection valve and an air extraction valve at an opening on the side wall of the aluminum tank body, injecting cooling liquid with the calculated volume from the liquid injection valve, closing the liquid injection valve after the injection is finished, extracting air in the aluminum tank body from the air extraction valve by using a vacuum pump, and closing the air extraction valve after the vacuum degree reaches below 0.1 atmosphere.
While adopting the above technical solution, the present invention may also adopt or combine the following further technical solutions:
as a preferred technical scheme of the invention: the copper paste material is prepared by mixing copper powder with the particle size of 1-3 mm and a resin material, wherein the mass ratio of the copper powder is more than 70%, and the copper paste material is diluted by a diluent with the mass ratio of about 5-20%.
The invention provides a totally-enclosed immersed liquid cooling device and a manufacturing method thereof.A whole aluminum block is hollowed to form an integral sealed aluminum groove body so as to form an integral structure of the aluminum groove body, an operation main board is immersed in low-boiling-point cooling liquid, a condenser pipe, a heat conductor and a radiating fin form a good heat dissipation structure, and an air suction valve and an injection valve are arranged on the sealed aluminum groove body, so that the cooling liquid can be effectively injected into the integral aluminum groove body and air can be conveniently pumped out from the integral aluminum groove body so as to form the vacuum degree in the integral aluminum groove body. The totally-enclosed immersed liquid cooling device provided by the invention has good heat dissipation, and is particularly suitable for a large-computation-amount computation host.
Drawings
FIG. 1 is a general schematic representation of a fully enclosed submerged liquid cooling apparatus provided by the present invention;
FIG. 2 is a schematic layout of the bottom of the totally enclosed tank body provided by the invention;
FIG. 3 is a schematic representation of the arrangement of heat sinks;
FIG. 4 is a schematic view of the arrangement of the condensation duct;
FIG. 5 is a general illustration of a fully enclosed submerged liquid cooling apparatus without a power connector.
Detailed Description
The invention is described in further detail with reference to the figures and specific embodiments.
A totally-enclosed immersed liquid cooling device comprises a totally-enclosed groove body 201, wherein the totally-enclosed groove body 201 is hollowed, the top of the totally-enclosed groove body 201 is provided with an opening, a heat conductor 102 is fixed on the opening at the top of the totally-enclosed groove body 201, the lower part of the heat conductor 102 is connected with a condenser, the upper part of the heat conductor 102 is connected with a heat dissipation device, an operation main board 104 is fixed at the bottom of the totally-enclosed groove body 201, cooling liquid 106 is contained in the totally-enclosed groove body 201, and the cooling liquid 106 does not pass through the operation main board 104; a power connector 105 is arranged on the totally-enclosed tank body 201, and the power connector 105 is respectively connected with the operation main board 104 and an external power supply; the power supply connector 105 is arranged at a height higher than the top surface height of the cooling liquid 106. The boiling point of the cooling liquid 106 is between 40 ℃ and 40 ℃, the cooling liquid is non-corrosive, environment-friendly and has excellent compatibility with the operation main board 104.
In this embodiment: the condenser is a plurality of condensation tubes 101 extending in the direction of the condensate.
In this embodiment: the heat dissipation device is a plurality of heat dissipation fins 101.
In this embodiment: the top surface of the cooling fluid 106 is no higher than the bottom of the heat sink.
In this embodiment: the side wall of the totally-enclosed tank body 201 is provided with a side wall opening 203, the height of the side wall opening 203 is higher than the top surface height of the cooling liquid 106, and the power connector 105 is arranged in the side wall opening 203.
In this embodiment: a liquid injection valve 204 and a gas extraction valve 205 are also arranged in the side wall opening 203.
In this embodiment: the totally enclosed tank body 201 is formed by hollowing out the inside of a whole aluminum block.
Selecting a whole piece of aluminum alloy with 480 mm length, 320 mm width and 220 mm height, adopting a 5-shaft machining process, hollowing from top to bottom and inside, and keeping the wall thickness of four walls and the bottom to be 10 mm; the top part is reserved with a wall thickness of 10 mm and is opened at the top part, the opening is 400 mm long and 260 mm wide and is used for installing the heat conductor 102; finally, a through hole is formed in the side wall, the diameter of the through hole is 30mm, the through hole is used as an installation hole position of the through-wall power connector 105, and finally the aluminum groove body 201 is obtained;
according to the installation hole position of the operation main board 104, 3-4 fixing screws 202 are installed at the bottom of the aluminum groove body 201 and used for fixing the operation main board 104; after the test function OK before the operation main board 104 is installed, the operation main board is fixed on a fixing screw 202 at the bottom of an aluminum groove body 201 through screws, and a space of 5-10 mm is reserved between the operation main board and the groove body;
specifically, the totally-enclosed immersed liquid cooling device is realized by the following manufacturing method:
a copper ingot with the thickness of 15 mm is selected and processed into a heat conductor 102 with the length of 400 mm and the width of 260 mm, and a heat radiating fin with the length of 50 mm, the width of 50 mm and the thickness of 2 mm is installed at the top of the heat conductor in a welding mode. The required number and mounting position of the heat dissipation fins are obtained through conversion according to the power and thermodynamic formula of the operation main board 104, and the layout is performed in a 3 × 22 mode, but the layout is not limited to the arrangement mode;
selecting a solid copper column with the diameter of 20 mm, processing the solid copper column into a copper bar with the length of 100 mm, uniformly spraying a special copper paste material on the surface of the copper bar by adopting a spraying process, wherein the copper paste material is prepared by mixing copper powder with the particle size of 1-3 mm and a resin material, the mass ratio of the copper powder is more than 70%, diluting the copper powder by using a diluent with the mass ratio of about 10%, uniformly spraying the diluted copper paste material on the surface of the copper bar as a coating, then sending the copper paste material into a vacuum oven, firing the copper paste material for 4 hours at the temperature of 600 ℃, and repeatedly repeating the above steps until the thickness of the copper powder reaches 20-30 mm; the prepared copper rods were welded to the lower surface of the heat conductor 102 as the condenser tube 103 at an interval of 20 mm in a 5 × 7 arrangement.
Welding a heat conductor 102 at an opening at the top of an aluminum tank body 201, arranging a radiating fin 101 inside and outside the aluminum tank body 201, and arranging a condenser pipe 103 inside the aluminum tank body 201;
the aluminum tank body is provided with a through-wall power connector 105, a liquid injection valve 204 and an air extraction valve 205 at an opening 203 on the side wall of the tank body 201, cooling liquid 106 with a calculated volume is injected from the liquid injection valve 204, after the injection is finished, the liquid injection valve 204 is closed, air in the aluminum tank body 201 is extracted from the air extraction valve 205 by using a vacuum pump, the vacuum degree is qualified when the vacuum degree is below 0.1 atmosphere, and the air extraction valve 205 is closed after the completion.
The above-described embodiments are intended to illustrate the present invention, but not to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit of the present invention and the scope of the claims fall within the scope of the present invention.
Claims (7)
1. A method for manufacturing a totally-enclosed immersed liquid cooling device is characterized in that: the manufacturing method of the totally-enclosed immersed liquid cooling device is used for manufacturing the totally-enclosed immersed liquid cooling device, the totally-enclosed immersed liquid cooling device comprises a totally-enclosed groove body, the totally-enclosed groove body is hollowed, an opening is formed in the top of the totally-enclosed groove body, a heat conductor is fixed on the opening in the top of the totally-enclosed groove body, the lower portion of the heat conductor is connected with a condenser, the upper portion of the heat conductor is connected with a heat dissipation device, an operation main board is fixed at the bottom of the totally-enclosed groove body, cooling liquid is contained in the totally-enclosed groove body, and the cooling liquid does not pass through the operation main board; the totally-enclosed groove body is provided with a power supply connector which is respectively connected with the operation main board and an external power supply; the arrangement height of the power connector is higher than the top surface height of the cooling liquid;
a fixing screw for fixing the operation main board is arranged between the operation main board and the bottom of the totally-enclosed tank body, and a certain space is reserved between the operation main board and the bottom of the totally-enclosed tank body;
the totally-enclosed groove body is formed by hollowing the inside of a whole aluminum block;
the manufacturing method of the totally-enclosed immersed liquid cooling device comprises the following steps:
(1) selecting a whole aluminum alloy, hollowing out the whole aluminum alloy from the top to the bottom, keeping the wall thickness of the four walls and the bottom, and opening the top for installing a heat conductor; then, a through hole is formed in the side wall of the aluminum groove body to serve as an installation hole position of the power connector, and finally an aluminum groove body is obtained;
(2) based on the position on the operation main board, 3-4 fixing screws are arranged at the bottom of the aluminum groove body and used for fixing the operation main board; after the testing function is completed before the operation main board is installed, the operation main board is fixed on a fixing screw at the bottom of an aluminum groove body through screws, and a certain space is reserved between the operation main board and the bottom of the groove body;
(3) selecting a copper ingot, processing the copper ingot into a heat conductor, and installing a radiating fin on the top of the heat conductor in a welding mode;
(4) selecting a solid copper cylinder, processing the solid copper cylinder into a copper bar, uniformly spraying a special copper slurry material on the surface of the copper bar by adopting a spraying process, then sending the copper bar into a vacuum oven, firing the copper bar for 4 hours at 600 ℃, and repeatedly repeating the working procedures until the thickness of the copper powder reaches 20-30 mm; welding the manufactured copper rods to the lower surface of the heat conductor in an array arrangement mode to be used as a condensation pipe;
(5) welding a heat conductor at an opening at the top of the aluminum groove body, arranging radiating fins inside and outside the aluminum groove body, and arranging a condenser pipe inside the aluminum groove body;
(6) and installing a power supply connector, a liquid injection valve and an air extraction valve at an opening on the side wall of the aluminum tank body, injecting cooling liquid with the calculated volume from the liquid injection valve, closing the liquid injection valve after the injection is finished, extracting air in the aluminum tank body from the air extraction valve by using a vacuum pump, and closing the air extraction valve after the vacuum degree reaches below 0.1 atmosphere.
2. The method of claim 1, wherein the method further comprises: the copper paste material is prepared by mixing copper powder with the particle size of 1-3 mm and a resin material, wherein the mass ratio of the copper powder is more than 70%, and the copper paste material is diluted by a diluent with the mass ratio of 5-20%.
3. The method of claim 1, wherein the method further comprises: the condenser is a plurality of condensing pipes extending towards the direction of the condensate.
4. The method of claim 1, wherein the method further comprises: the heat dissipation device is provided with a plurality of heat dissipation fins.
5. The method of claim 1, wherein the method further comprises: the top surface of the cooling liquid is not higher than the bottom of the heat dissipation device.
6. The method of claim 1, wherein the method further comprises: and a side wall opening is formed in the side wall of the totally-closed groove body, the height of the side wall opening is higher than that of the top surface of the cooling liquid, and a power connector is arranged in the side wall opening.
7. The method of claim 6, wherein the method further comprises: and a liquid injection valve and an air extraction valve are also arranged in the side wall opening.
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| CN202010429484.7A CN111660065B (en) | 2020-05-20 | 2020-05-20 | Totally-enclosed immersed liquid cooling device and manufacturing method thereof |
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| CN202010429484.7A CN111660065B (en) | 2020-05-20 | 2020-05-20 | Totally-enclosed immersed liquid cooling device and manufacturing method thereof |
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| CN111660065B true CN111660065B (en) | 2022-08-26 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115707217A (en) * | 2021-08-12 | 2023-02-17 | 富联精密电子(天津)有限公司 | Two-phase immersed cooling device for enhancing condensation heat transfer |
| CN217183666U (en) * | 2021-11-17 | 2022-08-12 | 富联精密电子(天津)有限公司 | Two-phase immersion cooling device with movable second condenser |
| CN116156830A (en) * | 2021-11-19 | 2023-05-23 | 北京比特大陆科技有限公司 | Cooling device and electronic equipment |
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| US6021044A (en) * | 1998-08-13 | 2000-02-01 | Data General Corporation | Heatsink assembly |
| CN108844395A (en) * | 2018-04-23 | 2018-11-20 | 深圳市邦德威尔新型材料有限公司 | A kind of thermal component and its manufacture craft |
| CN208387154U (en) * | 2018-04-23 | 2019-01-15 | 深圳市邦德威尔新型材料有限公司 | Thermal component |
| CN209489061U (en) * | 2018-11-16 | 2019-10-11 | 云南朔铭电力工程有限公司 | A kind of radiator of wind-power electricity generation frequency conversion device power module |
| CN212138182U (en) * | 2020-05-20 | 2020-12-11 | 杭州浸客智能科技有限公司 | Totally-enclosed immersed liquid cooling device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578849B (en) * | 2016-03-11 | 2019-02-15 | 中国科学院光电研究院 | A kind of sealed radiator and its manufacturing method |
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- 2020-05-20 CN CN202010429484.7A patent/CN111660065B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6021044A (en) * | 1998-08-13 | 2000-02-01 | Data General Corporation | Heatsink assembly |
| CN108844395A (en) * | 2018-04-23 | 2018-11-20 | 深圳市邦德威尔新型材料有限公司 | A kind of thermal component and its manufacture craft |
| CN208387154U (en) * | 2018-04-23 | 2019-01-15 | 深圳市邦德威尔新型材料有限公司 | Thermal component |
| CN209489061U (en) * | 2018-11-16 | 2019-10-11 | 云南朔铭电力工程有限公司 | A kind of radiator of wind-power electricity generation frequency conversion device power module |
| CN212138182U (en) * | 2020-05-20 | 2020-12-11 | 杭州浸客智能科技有限公司 | Totally-enclosed immersed liquid cooling device |
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