CN111655500A

CN111655500A - Method for printing on a wire-shaped component and wire saw

Info

Publication number: CN111655500A
Application number: CN201980010586.0A
Authority: CN
Inventors: 光田健洋; 丹尼尔·M·伦茨; 詹姆士·N·多布斯; 越智荣辅; 岩泽优; 安达美规; 苅谷润; 笠井纪宏
Original assignee: 3M Innovative Properties Co
Current assignee: 3M Innovative Properties Co
Priority date: 2018-01-29
Filing date: 2019-01-28
Publication date: 2020-09-11
Anticipated expiration: 2039-01-28
Also published as: JP2021003806A; WO2019145925A1; TW201945212A; CN111655500B

Abstract

The present invention provides a method of printing on a linear member, the method comprising: providing a nip between a backing roll and a printing roll having a patterned resilient surface; applying ink to the printing roller and smoothing the ink; feeding the linear member through the nip; and curing the ink remaining on the linear member.

Description

Method for printing on a wire-shaped component and wire saw

Technical Field

The invention relates to a method of printing on a wire-like member and a wire saw.

Background

Conventionally, as disclosed in patent document 1, a structure in which abrasive grains are attached to the surface of a linear member is known. Patent document 1 describes a configuration of a wire saw having abrasive grains attached to a wire-shaped member.

Patent document

Patent document 1: JP 2011-

Disclosure of Invention

In the prior art, there is a need to further enhance the performance of wire saws. Furthermore, there is a need to use simple methods for manufacturing these wire saws. Therefore, there is a need to enhance wire saw performance using a simple method.

Solution to the problem

According to one aspect of the invention, a method of printing on a linear member comprises: a pressing part is arranged between the supporting roller and the printing roller with the elastic surface with patterns; applying ink to the printing roller and smoothing the ink; feeding the linear member through the nip; and curing the ink remaining on the linear member.

Advantageous effects of the invention

The present invention can provide a method of printing on a wire member and a wire saw that can enhance the performance of the wire saw using a simple method.

Drawings

Fig. 1A is a schematic side view of a printing apparatus in which a gravure roll is used, and fig. 1B is a schematic side view of a printing portion in which a relief printing roll is used.

Fig. 2A is a schematic side view showing a detailed configuration of a printing portion in which a gravure roll is used, and fig. 2B is a schematic side view showing a detailed configuration of a printing portion in which a letterpress roll is used.

Fig. 3 is a view of the printing roller viewed from the upper side.

Fig. 4A is an enlarged view of a printing area viewed from an upper side, fig. 4B is a sectional view of a gravure roll taken along line IVb-IVb of fig. 4A, and fig. 4C is a sectional view of a relief printing roll taken along line IVb-IVb of fig. 4A.

Fig. 5 is a process diagram showing a process for the wire printing method.

Fig. 6A is a diagram showing a state of the wire rod viewed from the side, and fig. 6B is a sectional view taken along the line VIb-VIb shown in fig. 6A.

Fig. 7A is a diagram showing a state of the wire saw viewed from the side, fig. 7B is a sectional view taken along the line VIb-VIb shown in fig. 7A, and fig. 7C is a sectional view taken along the line VIIc-VIIc shown in fig. 7A.

Fig. 8A is a photograph showing a wire saw according to an embodiment of example 1, and fig. 8B is a photograph showing a wire saw according to an embodiment of example 2.

Fig. 9 is a photograph of a wire to which a letterpress printing and plating process was performed according to the embodiment of example 3.

Fig. 10 is a table showing the test results of example 1 and comparative example 1.

Fig. 11 is a table showing the test results of example 2 and comparative example 2.

Detailed Description

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that in the following description, the same reference numerals are used for the components that are the same as or equivalent to each other, and redundant description of these components will be omitted.

A method of printing on a wire member and an apparatus for manufacturing a wire saw according to an embodiment of the present invention will be described with reference to fig. 1. Fig. 1A is a schematic side view of a printing apparatus in which a gravure roll is used. The manufacturing apparatus 1 for manufacturing a wire saw includes a printing apparatus 100 and a plating apparatus 200 shown in fig. 1A. As shown in fig. 1A, the printing apparatus 100 includes a wire feeding portion 10, a printing portion 11, a curing portion 12, and a winding portion 13. Fig. 1B shows a printing section 11 in which a relief printing roll is used.

The wire feeding portion 10 feeds a plurality of wires 20. The wires 20 are fed by the wire feeding portion 10 in a mutually independent state or in a state in which each strand is aligned in a direction orthogonal to the feeding direction (for example, refer to fig. 3 and 4A and 4B). In the present embodiment, the wire 20 is fed, printed, cured, and wound in a state aligned in the horizontal direction. The wire feeding portion 10 has at least a sending-out bobbin 21. The feeding spool 21 is a member that winds the plurality of wire materials 20 into a roll. The feeding spool 21 feeds out the wire material 20 in a wound state by rotation. Note that the wire feeding portion 10 may have a regulating wheel (dancer pulley) that stabilizes the tension of the wire 20 by moving in the horizontal direction. The wire 20 fed from the wire feeding portion 10 is supplied to the printing portion 11.

The material of the wire 20 is selected from the group consisting of metal, resin, glass fiber, and rubber. The metal may be a material such as steel wire, copper wire, or the like. The resin is selected from materials such as nylon, PET, and the like. Glass fibers are materials such as quartz glass, alkali-free glass, and the like. Rubber is a material such as latex, silicone rubber, or the like.

The printing unit 11 prints on the wire 20. The printing section 11 prints on the plurality of aligned wires 20 simultaneously. Fig. 2 is a schematic side view showing a detailed configuration of the printing portion 11. As shown in fig. 2A, the printing portion 11 in which the gravure roll is used includes a gravure roll 25, a backup roll 26, an ink supply portion 27, and

doctor blades

28, 29. As shown in fig. 2B, the printing portion 11 in which the relief printing roller is used includes a relief printing roller 33, a backup roller 26, an ink supply portion 27, and

doctor blades

280, 29.

The

printing rollers

25, 33 each perform printing by supplying ink 90 to the outer peripheral surface of the wire 20. The

printing rollers

25, 33 are each placed such that the rotation axis extends in the horizontal direction. The

printing rollers

25, 33 each have an

elastic layer

31, 310 made of an elastic member on the outer peripheral side. The outer

peripheral surfaces

25a and 33a of the

printing rollers

25 and 33 each have an outer peripheral surface serving as the elastic layer 31. The

elastic layer

31, 310 may be made of, for example, rubber, resin, or the like. A description of the details of the gravure roll 25 and the letterpress roll 33 is provided below.

The backup roll 26 presses the wire 20 against the

printing roll

25 or 33 and presses the wire 20 against the

printing roll

25 or 33. The backup roller 26 is disposed at a position where the backup roller 26 is opposed to the

printing roller

25 or 33 in the vertical direction. The support roller 26 is placed such that the rotation axis extends in the horizontal direction.

A pressing portion 30 for pressing the wire 20 is formed between the outer

peripheral surface

25a or 33a of the

printing roller

25 or 33 and the outer peripheral surface 26a of the backup roller 26. A nip portion 30 is formed between the

surface

25a or 33a on the upper end side of the

printing roller

25 or 33 and the surface 26a on the lower end side of the backup roller 26. In the pressing section 30, the surface 25a of the printing roller 25 and the surface 26a of the backup roller 26 may be separated from or in contact with each other. The

printing roller

25 or 33 and the backup roller 26 rotate to feed the wire 20 pressed by the pressing portion 30 in the longitudinal direction. The pressing portion 30 simultaneously feeds at least two wires 20. In fig. 2A and 2B, the

printing rollers

25, 33 rotate in the clockwise direction. The backup roll 26 rotates in a counterclockwise direction, which is the opposite direction to the printing rolls 25, 33.

Intaglio printing

The ink supply portion 27 supplies ink 90 to the gravure roll 25. The ink supply portion 27 includes an ink supply tray 27a, a pump 27b, and an ink tank 27 c. The ink supply tray 27a holds ink 90, and a portion of the gravure roll 25 on the lower end side is immersed in the ink 90. Thus, the ink supply tray 27a may adhere the ink 90 to the surface 25a of the gravure roll 25 in conjunction with the rotation of the gravure roll 25. The ink tank 27c stores ink 90. The pump 27b supplies the ink 90 in the ink tank 27c to the ink supply tray 27 a.

The doctor blade 28 removes the excess ink 90 that has adhered to the surface 25a of the gravure roll 25. The tip end portion of the doctor blade 28 is disposed at a position in contact with the surface 25a of the gravure roll 25 or close to the surface 25 a. The doctor blade 29 removes the ink 90 that has adhered to the surface 26a of the backup roller 26. The tip end portion of the doctor blade 29 is disposed at a position in contact with the surface 26a of the backup roller 26 or close to the surface 26 a.

Relief printing

The ink supply portion 27 supplies ink 90 to the relief printing roller 33. The ink supply portion 27 includes an ink supply tray 27a, a pump 27b, and an ink tank 27 c. Ink 90 is stored in the ink supply tray 27a, and a portion of the anilox roller 32 on the lower end side is immersed in the ink 90. Thus, the ink supply tray 27a may adhere ink 90 to the surface 32a of the anilox roller in conjunction with the rotation of the anilox roller 32. The ink tank 27c stores ink 90. The pump 27b supplies the ink 90 in the ink tank 27c to the ink supply tray 27 a.

The doctor blade 280 removes the remaining ink 90 that has adhered to the surface 32a of the anilox roller 32. The tip end portion of the doctor blade 280 is disposed in contact with or close to the surface 32a of the anilox roller 32. Printing on the surface of the wire is performed by transferring ink adhering to the anilox roller 32 onto the projecting portion of the relief printing roller 33 and transferring the ink on the projecting portion onto the surface of the wire.

The doctor blade 29 removes the ink 90 that has adhered to the surface 26a of the backup roller 26. The tip end portion of the doctor blade 29 is disposed at a position in contact with the surface 26a of the backup roller 26 or close to the surface 26 a.

The ink 90 is a resist for plating. Further, the ink 90 is a curable material. For example, the ink 90 may be a photo-curable material. The ink 90 is a 100% solid component. The 100% solid component means that only the solid component is contained, and a solvent (organic solvent or water) is not contained. The ink 90 may be, for example, an acrylic monomer. Further, the ink 90 may be a thermosetting material such as epoxy resin, for example.

Next, a detailed configuration of the

printing rollers

25, 33 will be described with reference to fig. 3 and fig. 4A to 4C. Fig. 3 is a view of the

printing roller

25 or 33 as viewed from the upper side. In fig. 3, the support roller 26 is omitted. Fig. 4A to 4C are enlarged views of a printing area E1 of the

printing roller

25 or 33. Fig. 4A is an enlarged view of the printing region E1 viewed from the upper side. Fig. 4B is a sectional view taken along line IVb-IVb of fig. 4A in the case where the printing roller is a gravure roller. Fig. 4C is a sectional view along the line IVb-IVb of fig. 4A in the case where the printing roller is a relief printing roller. As described above, the

printing rollers

25 and 33 have the

elastic layers

31 and 310 on the outer peripheral sides, respectively.

Thus, the

printing rollers

25 and 33 have

elastic surfaces

25a and 33a, respectively. Note that the hardness of the

surfaces

25a, 33a (i.e., the hardness of the elastic layers 31 and 310) may be set in a range of 10 degrees to 90 degrees of the durometer hardness a based on the JIS standard (JIS K6253-1997 type a durometer). A print area E1 in which printing is performed on the wire 20 is formed on each of the

surfaces

25a, 33 a. The printing region E1 is formed at the central portion in the axial direction of the surface 25 a. The wires 20 are fed in a state where two or more wires are aligned in the axial direction and in a state where they are in contact with the printing area E1. A predetermined pattern for printing is formed on the printing area E1. Therefore, the ink 90 adheres to the surface of the wire 20 according to the pattern of the printing area E1. Note that each of the

surfaces

25a, 33a having elasticity may be formed at least in the printing region E1, and the surface of the region other than the printing region E1 may not have elasticity.

As shown in fig. 4A, a plurality of grooves 60 or a plurality of projections 61 are formed on the

surfaces

25a, 33a of the printing region E1. The grooves 60 or the projections 61 are formed at a constant interval with a gap therebetween. The groove 60 or the projection 61 is inclined with respect to the axial direction. The inclination angle θ 1 of the groove 60 or the protruding portion 61 with respect to the axial direction may be 0 ° or more and less than 90 °, and more preferably more than 0 ° and 80 ° or less. In the present embodiment, the inclination angle θ 1 is set to 45 °.

As shown in fig. 4B, in the case where the printing roll is a gravure roll, the grooves 60 have a shape having a rectangular cross section. The width of the groove 60 may be set to 0.01mm to 10 mm. The depth of the groove 60 may be set to 0.001mm to 1 mm. The gap between the grooves 60 may be set to 0.01mm to 10 mm. The grooves 60 may be approximately equally spaced or may not be equally spaced. The interior of the recess 60 holds ink 90. Thus, the wire 20 is in contact with the surface 25a while being fed, and is in contact with the ink 90 in the groove 60. This causes the ink 90 to adhere to the surface of the wire 20. The ink 90 is held on the surface of the wire 20 in a position and shape corresponding to the pattern of the grooves 60. Note that the ink 90 does not adhere to a part of the surface of the wire 20 in the circumferential direction. That is, the ink 90 does not adhere to the region of the surface of the line 20a that faces the gravure roll 25 (see fig. 6B).

As shown in fig. 4C, in the case where the printing roller is a relief printing roller, the protruding portion 61 has a shape having a rectangular cross section. The width of the protruding portion 61 may be set to 0.01mm to 10 mm. The height of the protruding portion 61 may be set to 0.001mm to 1 mm. The gap between the protruding portions 61 may be set to 0.01mm to 10 mm. The projections 61 may be approximately equally spaced or may be unequally spaced. The ink 90 is held on the projection 61. Thus, the wire 20 is in contact with the surface 33a while being fed, and is in contact with the ink 90 on the protruding portion 61. This causes the ink 90 to adhere to the surface of the wire 20. The ink 90 is held on the surface of the wire 20 in a position and shape corresponding to the pattern of the protruding portions 61. Note that the ink 90 does not adhere to a part of the surface of the wire 20 in the circumferential direction. That is, the ink 90 does not adhere to the area of the surface of the line 20 opposite to the relief printing roller 33 (refer to fig. 6B).

Returning to fig. 1, the curing section 12 cures the ink 90 held by the wire 20. The curing section 12 hardens the ink 90 in the internal space while allowing the wire 20 to pass through the internal space. In the case where the ink 90 is a photo-curing material, the curing portion 12 has a light source in the internal space. The light source may be, for example, an LED that irradiates ultraviolet rays. The curing part 12 may have light sources at a plurality of positions in the circumferential direction with respect to the fed wire 20. For example, the curing part 12 may have three light sources around the wire 20, and may irradiate light to the wire 20 from three directions. Thus, the cured portion 12 may irradiate light to the wire 20 along the entire circumference. As described above, the ink 90 adheres to a part of the wire 20 in the circumferential direction. However, due to the influence of the distortion of the wire 20 or the like, the position in the circumferential direction of the portion to which the ink 90 has been attached may change between the printing time and the curing time. In this case as well, the curing portion 12 can irradiate light to the ink 90 regardless of the position of the ink 90 in the circumferential direction. Note that, in the case where the ink 90 is a thermosetting material, the curing portion 12 has a heater.

The winding unit 13 winds the line material 20 on the downstream side of the printing unit 11 and the curing unit 12. The plurality of wires 20 are wound around the post-printing winding portion 13. The winding portion 13 has at least one winding spool 44. The winding spool 44 is a member that winds the wire 20 in a state where the wire is aligned in a direction orthogonal to the longitudinal direction. The winding spool 44 winds the wire material 20 in a wound state by rotating. The winding section 13 may have an adjustment wheel and a capstan wheel (capstan wheel) that adjusts the feeding speed of the wire 20 by friction on the surface.

The plating apparatus 200 performs plating on the surface of the wire 20. As described above, the ink 90 is a resist material for plating. Therefore, plating is performed on the surface of the wire 20 except for the area where the ink 90 is held. The plating apparatus 200 includes a feeding section 51, a winding section 52, and a plurality of tanks 53.

The plating device 200 has a plurality of grooves 53, and the plurality of grooves 53 are arranged in order in the longitudinal direction of the wire rod 20 between the feeding section 51 and the winding section 52. The feeding portion 51 feeds out the wire 20 in the transverse direction, and the winding portion 52 winds the wire 20 fed in the transverse direction. The wire 20 fed in the transverse direction moves downward, straddling the relay roller 54A above the slot 53. The wire 20 is immersed in the liquid in the tank 53 and moves upward, straddling the relay roller 54B in the tank 53. The wire 20 is removed from the liquid in the tank 53 and then moved in the transverse direction over the tank 53 across the relay roller 54C.

The plating apparatus 200 includes at least a tank 53 serving as a plating tank. The plating tank forms a plating layer on a portion of the wire rod 20 not covered with the resist (ink 90). The plating tank contains a slurry containing abrasive particles. In other words, the slurry containing the abrasive grains is stored as the plating liquid in the tank 53 corresponding to the plating tank. Therefore, the wire 20 can be polished in a portion not covered with the resist (ink 90). The abrasive grains are, for example, grains of silicon carbide, diamond, or the like. Substantially all of the abrasive particles have a size of 10 μm or less, or 7 μm or less. Note that this size is the size of the portion of the abrasive particle having the largest width. Note that the phrase "substantially all abrasive particles" means that abrasive particles outside the numerical range are allowed to exist within the range of manufacturing error, but other abrasive particles are within the numerical range described above. For example, "90% or more of all abrasive particles" can be considered "substantially all abrasive particles. The plating liquid may contain a pH adjuster/leveler, etc., in addition to the abrasive grains.

Further, the plating device 200 has a tank 53, and before plating is performed, the tank 53 stores therein a chemical substance for removing the coating on the surface of the wire rod 20. Further, the plating device 200 has a tank 53 for cleaning chemicals and plating liquid.

Next, a printing method for the wire 20 is described with reference to fig. 5. Fig. 5 is a process diagram showing a processing procedure of the printing method for the wire 20.

First, a preparation process for preparing the

printing roller

25 or 33 and the backup roller 26 is performed (step S10). The preparation process S10 is a process of providing the nip 30 between the backup roller 26 and the

printing roller

25 or 33 having the

elastic surface

25a or 33a on which the pattern is formed (refer to fig. 2A and 2B). In the preparation process S10, the pressure or the like of pressing the wire 20 in the pressing portion 30 is adjusted.

Next, an ink application process for applying the ink 90 to the

printing roller

25 or 33 is performed (step S20). The ink application process S20 is a process of applying the ink 90 to the

printing roller

25 or 33 and smoothing the ink. In the ink applying process S20, the ink supply portion 27 applies the ink 90 to the

surface

25a or 33a of the

printing roller

25 or 33. When this occurs, in gravure roll 25, ink 90 enters grooves 60 of print zone E1. Further, the doctor blade 28 smoothes the ink 90 on the surface 25a of the gravure roll 25. Thus, the ink 90 on the surface 25a is removed by the doctor blade 28, and the ink 90 in the groove 60 remains. Ink 90 is retained in grooves 60 of print area E1. On the other hand, in the relief printing roller 33, the ink 90 on the surface 32a of the anilox roller 32 is applied to the protruding portion 61 of the relief printing roller 33 and smoothed by wetting and spreading, and the ink 90 is retained on the protruding portion 61 of the relief printing roller 33.

Next, a printing process of printing on the surface of the wire 20 is performed (step S30). The printing process S30 is a process of feeding the wire 20 through the nip 30. Thereby, the ink 90 applied to the

surface

25a or 33a of the

printing roller

25 or 33 in the ink application process S20 adheres to the wire 20. The printing process S30 is a process in which at least two wires 20 are simultaneously fed through the nip 30.

Fig. 6A and 6B are diagrams illustrating the state of the wire rod 20 after printing. Fig. 6A is a diagram illustrating a state of the wire 20 viewed from the side. Fig. 6B is a cross-sectional view taken along VIb-VIb shown in fig. 6A. As shown in fig. 6B, the ink 90 applies a partial spiral pattern 70 to the wire 20 so that a region that can be polished has a slanted shape (refer to fig. 7A to be described later). In the partial spiral pattern 70 of the ink 90, the ink 90 is formed only on a part of the circumferential direction of the wire 20, and a patterned portion extending in the circumferential direction so as to be inclined with respect to the axial direction of the wire 20 is formed. When describing the "partial spiral" pattern in detail with reference to fig. 6A and 6B, a pattern formed by winding a tape on the surface of the wire 20 in a spiral shape is assumed. In the case where the tape belonging to the area of the first portion P1 is eliminated and the tape belonging to the second portion P2 is left outside the spiral pattern, a pattern similar to that shown in fig. 6A and 6B is formed. The pattern that retains a portion of the spiral shape corresponds to a pattern having a "partial spiral shape".

As shown in fig. 6B, a part of the surface 20a of the wire 20 is covered with the pattern 70 of the ink 90 in the circumferential direction, and another part is exposed from the pattern 70. In the case where the entire circumference of the wire 20 is 360 °, θ 2 may be set to 10 ° to 300 °, for example. Note that, since the

surface

25a or 33a of the

printing roller

25 or 33 has elasticity and the wire 20 sinks with respect to the

surface

25a or 33a, the angle θ 2 of the pattern 70 of the ink 90 becomes larger than 180 °.

An end 70a in the circumferential direction of the pattern 70 of the ink 90 extends along the axial direction of the wire 20. In fig. 6B, the end 70a is formed parallel to the axial direction, but may be any shape resulting from printing. The end 70b in the axial direction of the pattern 70 is inclined with respect to the axial direction. Note that the inclination angle of the end portion 70b with respect to the axial direction is determined in accordance with the inclination angle θ 1 (refer to fig. 4A to 4C) of the groove 60 or the protruding portion 61 of the

surface

25a or 33a of the

printing roller

25 or 33. The pattern 70 is placed apart from the other patterns 70 in the axial direction of the wire 20. The space between one pattern 70 and the other pattern 70 is a portion exposed from the ink 90 over the entire circumference. As shown in fig. 6B, the portion of the surface 20a exposed over the entire circumference between the pair of patterns 70 and the portion of the surface 20a of the wire 20 exposed from the pattern 70 of the ink 90 are connected to each other.

Of the regions in the circumferential direction of the wire 20, the region where the pattern 70 is formed is referred to as a first portion P1, and the region where the pattern 70 is not formed is referred to as a second portion P2. When this occurs, the surface 20a exposed from the ink 90 is connected in the first portion P1 in the axial direction. The pattern 70 of the ink 90 is intermittently formed in the second portion P2, and the surface 20a exposed from the ink 90 is intermittently formed.

Next, a curing process is performed, which cures the ink 90 stored in the wire 20 (step S40). The pattern 70 of ink 90 for the wire 20 is cured in the curing process S40.

Next, a plating process of plating the wire rod 20 is performed (step S50). The plating process S50 is a process of passing the wire 20 through the tank 53 as a plating bath so that a portion of the wire 20 is not covered with the resist-plated pattern 70.

The plating process S50 is described in detail below, and the plating process S50 is a process when a piano wire is used as the wire 20. First, the plating device 200 removes oil from the surface of the wire rod 20. When this occurs, the wire 20 passes through the slot 53, and the slot 53 stores the chemical liquid for deoiling. Note that the wire 20 is then cleaned. Next, the plating device 200 removes the brass plating layer formed on the surface of the wire rod 20. In this process, the brass plating is removed from the areas of the wire 20 where the pattern 70 of the ink 90 is not formed. When this occurs, wire 20 passes through slot 53 and slot 53 stores the chemical that removes the brass plating. Note that the wire 20 is then cleaned. Next, the plating device 200 removes the oxide layer from the surface of the wire rod 20. When this occurs, the wire 20 passes through the slot 53, and the slot 53 stores a chemical for removing the oxide layer. Then, the plating device 200 plates the area of the wire 20 where the pattern 70 of the ink 90 is not formed. When this occurs, the wire 20 passes through the tank 53 that stores the plating liquid.

Fig. 7A to 7C are diagrams illustrating the plated wire 20, or in other words, the wire saw 80. Fig. 7A is a diagram showing the wire saw 80 viewed from the side. Fig. 7B is a sectional view taken along line VIIb-VIIb shown in fig. 7A. FIG. 7B is a cross-sectional view taken along line VIIc-Viic shown in FIG. 7A. As shown in fig. 7A, wire saw 80 has a wire body 82. The linear body 82 has a plating layer 81 containing abrasive grains in a portion of the wire rod 20 not covered with the pattern 70 of the resist, i.e., the ink 90. The linear body 82 has a resist material for plating provided with a partial spiral pattern 70. The linear body 82 has a polishing material (in other words, a plating layer 81) on a portion of the linear body 82 which is not covered with the resist material. The plating layer 81 serves as a polishing portion that can polish an object using the above-described configuration. The pattern 70 serves as a discharge groove for discharging debris.

As shown in fig. 7B, the plating layer 81 is not formed on the portion of the wire 20 on which the pattern 70 of the ink 90 is formed, and the plating layer 81 is formed on the portion of the wire 20 on which the pattern 70 is not formed. As shown in fig. 7C, the plating layer 81 is formed on the entire circumference of the wire rod 20 with respect to the portion where the pattern 70 is not formed around the entire circumference of the wire rod 20. The linear body 82 has a plating layer 81 that can be polished continuously in the axial direction with respect to the first portion P1, and has a plating layer 81 that can be polished intermittently in the axial direction with respect to the second portion P2 with the pattern 70 interposed therebetween.

Next, the printing method on the wire member and the function and effect of the wire saw 80 according to the present embodiment will be described.

The printing method on the wire (linear member) 20 includes: providing a nip 30 between a backup roll 26 and a

printing roll

25 or 33 having an

elastic surface

25a or 33a on which a pattern is formed, applying and smoothing ink 90 on the

printing roll

25 or 33, feeding the wire 20 through the nip 30, and curing the ink 90 remaining on the wire 20.

In this printing method, the wire 20 is fed through the nip 30 between the printing

roller

25 or 33 to which the ink 90 is applied and the backing roller 26. Thereby, the ink 90 on the

printing roller

25 or 33 is held on the wire 20. When the wire 20 passes through the pressing section 30, the wire 20 is pressed against the

printing roller

25 or 33 by the backup roller 26. The

printing roller

25 or 33 has an

elastic surface

25a or 33a and has a pattern formed. Since the wire 20 sinks into the

surface

25a or 33a of the

printing roller

25 or 33, the wire 20 can come into contact with the

surface

25a or 33a of the

printing roller

25 or 33 over a wide range in the circumferential direction. In other words, the ink 90 may be applied to the wire 20 under conditions that may sufficiently reflect the pattern of the

printing roller

25 or 33. By curing the ink 90 remaining on the wire rod 20 in this state, printing of a pattern that sufficiently reflects the

printing roller

25 or 33 can be performed on the wire rod 20. Thus, the

printing roller

25 or 33 may apply a pattern to the wire 20, which may improve the performance of the wire saw. Further, such printing is performed through a simple process in which the wire 20 passes through the pressing portion 30. As mentioned above, this simple method can be used to improve wire saw performance.

In the printing method, the ink 90 may be resist against plating. In this case, plating may be performed on a portion of the surface of the wire that is not printed with the ink 90.

In the printing process, the ink 90 may be 100% solids. In this case, the drying process for evaporating the solvent may be omitted. The thickness during printing can be more easily controlled.

In the printing method, at least two wires 20 may be fed through the nip 30 simultaneously. The printing may be performed with respect to at least two wires 20 at the same time. This can improve printing efficiency.

In the printing method, the material of the wire 20 may be selected from the group consisting of metal, resin, glass fiber, and rubber.

The printing method may include an additional process of passing the wire 20 through a plating bath so that portions of the wire 20 not covered with the resist are plated. Thus, plating can be performed on the portion of the wire 20 that is not printed with the ink 90.

In the printing method, the plating bath may have a slurry containing abrasive grains, thereby bringing the portions of the wires 20 not covered with the resist into a state in which they can be polished. In this case, a wire saw can be manufactured in which a portion not covered with resist or in other words not printed with the ink 90 is made into a polished portion. Further, the

printing roller

25 or 33 may apply a resist pattern on the wire 20, so that a polished portion having a shape that can improve the performance of the wire saw can be provided.

In the printing method, the ink 90 may be applied with a partial spiral pattern so that the region that may be polished has a slanted shape. When this occurs, a wire saw having an alternating pattern of polished portions and ink 90 can be provided. Therefore, the wire saw can easily cut the object. The area between the inclined buff portions (the area not printed with the ink 90) serves as a passage for flushing the buff chips generated at the time of cutting. This improves the performance of the wire saw.

The maximum width portion of the abrasive particles is 0.50 or less, preferably 0.30 or less, in size relative to the diameter of the threadlike member. A size larger than 0.50 causes frequent falling off of abrasive grains from the threadlike member and causes poor durability. Further, the abrasive grains tend to agglomerate during plating, and show poor workability.

By making the abrasive grains smaller, the roughness of the cut surface can be made finer. However, when the abrasive grains are made smaller, the cutting performance is lowered. Therefore, by making the density of the abrasive grains high dense, the reduction in cutting performance can be controlled. However, when abrasive grains are made to have a high density, performance degradation caused by clogging of polishing debris may more easily occur. In contrast, the wire saw provided by the printing method according to the present embodiment has a passage for flushing polishing debris due to the pattern of the ink 90. Thus, the wire saw can make the abrasive particles smaller and have a high density while controlling clogging. Since the wire saw spreads the abrasive grains over a plurality of layers in the plating layer, new abrasive grains can be exposed (autogenous) even in the case where the polishing surface is worn away by repeated polishing.

The wire saw is a wire saw having a wire body having a resist material for plating applied with a partial spiral pattern, a portion of the wire body not covered with the resist material having a polishing material (i.e., a plating layer 81) containing abrasive grains in a binder, and in order to make a cut surface very fine, for example, for a semiconductor substrate or the like, a size of a maximum width portion of substantially all the abrasive grains is 10 μm or less. As these abrasive grains, for example, materials such as diamond and alumina can be used.

Since abrasive grains of 10 μm or less are used, the wire saw can reduce the roughness of the opening during dicing. The linear body is applied with a partial spiral pattern by a resist material. The patterned portion has no polishing material. The patterned portion may discharge debris when cutting. Thus, clogging of the polishing material at the cut portion can be controlled. As described above, the cutting speed of the wire saw can be increased, and the roughness of the opening can be reduced.

Substantially all of the abrasive particles can be 7 μm or less in practice with respect to the wire saw. In this case, the cutting performance can be improved.

Meanwhile, in the case of polishing a material having a high hardness such as sapphire, basically, abrasive grains of 15 μm or more may be used. This is because, in the case of polishing a material having high hardness, if the abrasive grains are small, the abrasive grains are worn away in a short time and cannot be used. The use of abrasive grains having a large grain size reduces machining stress because chip discharge efficiency is improved by the pattern due to printing, penetration of machining liquid is promoted, and machining heat is discharged.

The linear member may be selected from the group consisting of metal, resin, glass fiber, and rubber.

The present invention is not limited to the above-described embodiments.

For example, the pattern of the

printing rollers

25, 33 is not limited to an array of slanted grooves. For example, patterns such as dots and grids may be used. In other words, the pattern formed by the polishing material and the resist material of the wire saw is also not limited to the above-described embodiment. For example, the pattern may be a conventional pattern.

The structure of the apparatus for performing the printing method is also not limited to the above-described embodiment, and any apparatus structure may be applied as long as the apparatus is within a range that does not deviate from the purpose.

For example, the ink 90 applied to the

printing rollers

25, 33 may include abrasive particles. When doing so, the

printing rollers

25, 33 may directly print the pattern of the polished portion on the wire 20.

Examples

Example 1

A piano wire was prepared as a wire rod. The wire had a Cu-Zn plating layer on the surface and had a diameter of 100 μm. A printing apparatus having the configuration shown in fig. 1 was prepared. The photo-curable ink 90 is prepared as the ink 90 applied to the gravure roll. The ink 90 contains a material having an acrylic monomer as a main component. The gravure roll had a groove pitch of 300 μm, a groove width of 100 μm, and a groove depth of 50 μm. The inclination angle of the groove is 45 °. The diameter of the gravure roll was 102 mm. The hardness of the rubber constituting the surface of the gravure roll was 81. 3 UV-LEDs (λ 365nm) are provided at 120 ° intervals around the wire in the curing section. The solidified part was kept at room temperature by water cooling. N2 was purged in the curing section. The line speed in the printing unit was 6 mpm. The UV input was 130.4V/0.36A. N2 was purged at 15L/min. Note that printing was performed under the condition that 130 wires were arranged. Printing is performed on a wire using this type of printing apparatus. The size of the ink 90 pattern in the axial direction was 130 μm. The size of the space between the patterns (the portion on which the polishable plating layer is formed) is 150 μm.

A plating apparatus having the configuration shown in fig. 1 was prepared. The plating apparatus performs degreasing, cleaning, brass removal, cleaning, oxide layer removal, and Ni plating. A metal cleaner 373(NaOH solution + Na) obtained from atomic technologies of Japan (Atotech Japan) was used₂SiO₃Solution, pH 12.35, 40 ℃ to remove oil. The washing was performed at room temperature. Brass removal was performed using Melstrip Cu3940 (ammonia and copper complex, pH9, 40 ℃). The oxide layer was removed using 2% HCl (25 ℃). The line speed of the electroplating apparatus was 0.15 mpm. The slurry in the plating tank contains

The diamond particles of (1) were used as abrasive grains (the size/wire diameter of the maximum width portion of the abrasive grains was 0.09). The thickness of the Ni plating layer was 15 μm. The wire saw shown in fig. 8A is provided in this manner. The wire sawExample 1 was used.

Example 2

Manufacturing was performed in the same manner as in example 1 except that the diameter of the wire rod was changed to 180 μm, diamond having a size of the maximum width portion of the abrasive grains of 20 μm was used as the abrasive grains, and the linear velocity used for the plating apparatus was changed to 9mpm (the size/linear diameter of the maximum width portion of the abrasive grains was 0.11). The wire saw shown in fig. 8B is provided in this manner.

Example 3

A piano wire was prepared as a wire rod. The wire had a Cu-Zn plating layer on the surface and had a diameter of 180 μm. A relief printing apparatus having the configuration shown in fig. 1B is prepared. A photo-curable ink 90 is prepared as the ink 90 applied to the printing roller. The ink 90 contains a material having an acrylic monomer as a main component. The relief printing roll had a groove pitch of 800 μm, a groove width of 600 μm, and a groove depth of 500 μm. The inclination angle of the groove is 45 °. The diameter of the relief printing roll was 102 mm. The recess volume of the anilox roller supplying ink to the relief printing roller was 18cc/m 2. The hardness of the rubber constituting the surface of the relief printing roller was 81. 3 UV-LEDs (λ 365nm) are provided at 120 ° intervals around the wire in the curing section. The solidified part was kept at room temperature by water cooling. N2 was purged in the curing section. The line speed in the printing unit was 8 mpm. The UV input was 130.4V/0.36A. N2 was purged at 15L/min. Note that printing was performed under the condition that 130 wires were arranged. Printing is performed on a wire using this type of printing apparatus. The pattern of the ink 90 has a dimension of 500 μm in the axial direction. The size of the space between the patterns (the portion on which the polishable plating layer is formed) is 800 μm. Then, a plating process was performed in the same manner as in example 1 except that plating was performed without abrasive grains, and a wire rod on which a letterpress printing and plating process was performed as shown in fig. 9 was obtained.

Comparative example 1

As a comparative example with respect to example 1, a Ni-plated wire saw was prepared so that diamond abrasive grains of about 30 μm were applied to the wire surface. The wire saw of comparative example 1 had no pattern, and abrasive grains were formed on the entire surface of the wire rod.

Comparative example 2

A wire saw as a comparative example with respect to example 2 was prepared by applying diamond abrasive grains of about 30 μm to the surface of a wire rod having a diameter of 180 μm by Ni plating the surface to a thickness of about 10 μm. The wire saw of comparative example 2 has no pattern, and abrasive grains are formed on the entire surface of the wire rod.

Cutting test 1

The cutting test was performed for the above example 1 and comparative example 1. In the cutting test, the wire saw was cut by feeding the wire saw between the sending-out roller and the winding roller, and placing a test piece between each roller. The wire saw tension was 12N, the wire speed was 4.7mpm, and the wire length was 5.3 m. Sapphire was used as a test piece. 50 cuts were repeated on the test bodies using example 1 and comparative example 1. The cutting depth related to the number of cuts is determined, and the average cutting depth of 1 to 20 times is used as the first average value. The first average is the cutting ability of the wire saw at the beginning of use. The average of the cutting depths from 30 times to 50 times is the second average. The second average is the cutting ability of the wire saw under multiple use conditions. As shown in fig. 9, "(second average/first average) × 100" is calculated as the cutting ability retention rate, which is a ratio of the second average to the first average, and is a value representing a degree of reduction in cutting ability when the wire saw is changed from a new state to a state in which it is used a plurality of times. As shown in fig. 9, example 1 had a higher retention ratio of cutting ability than comparative example 1, in other words, the decrease in ability was controlled.

Visual inspection

Conditions when cutting was performed using example 1 and comparative example 1 and a cut surface immediately after cutting were observed. The appearance of the cutting tool when cutting was performed using comparative example 1 was observed. In comparative example 1, almost no adhesion of the refrigerant was observed on the flat plate placed on the lower side of the cut surface. Many polishing chips and falling abrasive grains were observed on the cut surface of comparative example 1. On the other hand, adhesion of the refrigerant falling from the wire saw was observed on the flat plate below the cut surface of example 1. Further, the polishing chips and abrasive grains remaining on the cut surface were less than those of comparative example 1. Polishing chips and abrasive grains other than the refrigerant are washed from the groove portion of the wire saw.

Cutting test 2

The cutting test was performed for the above example 2 and comparative example 2. Sapphire used as a test piece was cut with a wire saw of each of example 2 and comparative example 2 by using a multi-wire saw MWS612-DD obtained from highbird corporation (takatori corporation) ((

Inches, 60mm long, plane direction C), a cut test was performed. The average value of the surface roughness and the average value of the wafer thickness are shown in the table of fig. 11. The surface roughness was measured by a contact scanning measuring device according to JIS B0601. The maximum diameters of the abrasive grains contained before the processing of example 2 and comparative example 2 were about 240 μm and 245 μm, respectively, the wire saws were arranged at a pitch of 840 μm, and the test piece processing was performed. In example 2, the chip discharge efficiency was improved by the partially spiral grooves formed on the surface, the penetration of the machining liquid was promoted, the discharge efficiency of the machining heat was improved, and the machining stability was improved. Thus, example 2 provides a wafer having even less surface roughness and greater thickness.

List of reference marks

20 line (Linear component)

25 intaglio printing roller

26 support roller

30 pressing part

70 pattern

80 wire saw

82 line body

Claims

1. A method of printing on a linear member, comprising:

providing a nip between a backing roll and a printing roll having a patterned resilient surface;

applying ink to the printing roller and smoothing the ink;

feeding a linear member through the nip; and

solidifying the ink remaining on the linear member.

2. A method of printing on a linear member according to claim 1, wherein the printing roll is a gravure printing roll.

3. A method of printing on a linear member according to claim 1, wherein the printing roll is a relief printing roll.

4. A method of printing on a linear member according to any one of claims 1 to 3, wherein the ink is a resist for plating.

5. A method of printing on a linear member according to any one of claims 1 to 4, wherein the ink is 100% solids component.

6. A method of printing on a linear member according to any one of claims 1 to 5, wherein at least two linear members are fed simultaneously through the nip.

7. A method of printing on a linear member according to any one of claims 1 to 6, wherein the material of the linear member is selected from the group consisting of metal, resin, glass fibre and rubber.

8. The method of printing on a linear member according to any one of claims 1 to 7, further comprising: feeding the linear member through a plating tank so that a portion of the linear member not covered with the resist is plated.

9. A method of printing on a linear member according to claim 8, wherein the plating tank contains slurry containing abrasive particles so that a portion of the linear member not covered with the resist becomes a state in which the portion can be polished.

10. A method of printing on a linear member according to claim 9, wherein the ink is provided in a partial spiral pattern so that the area capable of being polished has a slanted shape.

11. A wire saw comprises a wire-shaped body,

the linear body includes a linear member having a linear shape,

a plated resist material for providing in a partial spiral pattern; and

a polishing material on a portion of the linear body not covered by the resist material; wherein

The polishing material comprises abrasive particles in a binder; and is

The maximum width portion of the abrasive particles has a size of 0.50 or less with respect to the diameter of the thread-like member.

12. The wire saw of claim 11, wherein substantially all of the abrasive particles have a maximum width portion dimension of 10 μm or less.

13. The wire saw according to claim 11 or 12, wherein the wire-like member is selected from the group consisting of metal, resin, glass fiber, and rubber.