CN111650631B - Method for assembling wire mesh in multi-wire proportional counter - Google Patents
Method for assembling wire mesh in multi-wire proportional counter Download PDFInfo
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- CN111650631B CN111650631B CN202010439605.6A CN202010439605A CN111650631B CN 111650631 B CN111650631 B CN 111650631B CN 202010439605 A CN202010439605 A CN 202010439605A CN 111650631 B CN111650631 B CN 111650631B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/18—Measuring radiation intensity with counting-tube arrangements, e.g. with Geiger counters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
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Abstract
The invention relates to a method for assembling a wire mesh in a multi-wire proportional counter. The method comprises the following steps: step 1, providing a PCB required in a multi-wire proportional counter; step 2, attaching a first SU8 dry film on the PCB; step 3, pressing a wire mesh on the first SU8 dry film; step 4, drying and preheating the PCB, and sticking a second SU8 dry film on the metal wire mesh; step 5, placing the PCB on a hot plate at 95-100 ℃ for baking for 5-10 min, and standing and cooling to room temperature after baking; and 6, exposing and developing the first SU8 dry film and the second SU8 dry film on the PCB to remove the first SU8 dry film and the second SU8 dry film in the required area, so as to obtain a plurality of wire mesh support columns for supporting the wire mesh. The invention can effectively realize that the metal wire mesh is assembled on the PCB, meets the parallelism and insulation requirements of the assembled metal wire mesh and the PCB, reduces the assembly difficulty, and is safe and reliable.
Description
Technical Field
The invention relates to a preparation method, in particular to a method for assembling a wire mesh in a multi-wire proportional counter.
Background
The multi-wire proportional counter is a novel particle detector which works in a proportional area of a gas characteristic curve and has a multi-wire structure. The multi-filament proportional counter consists of a large number of parallel filaments, all of which lie in a plane between two cathode planes spaced apart by a few centimeters, the diameter of the anode filaments being about one tenth of a millimeter and the pitch being about one or a few millimeters. Each wire will behave like a proportional counter tube and can achieve a spatial accuracy of one millimeter or less. Each filament can afford extremely high particle recording rates, up to hundreds of thousands of times per second. Meanwhile, the structure can form various needed volumes and shapes in a modular mode, is easy to manufacture into a large-area detector, and is suitable for experiments with different scales and characteristics.
In the multi-wire proportional counter, the assembly requirement on the wire mesh is extremely high, the parallelism and the insulation requirement between the wire mesh and the PCB are required to be ensured, the existing assembly process is complex, and the assembly requirement on the wire mesh cannot be effectively ensured.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a method for assembling a metal wire mesh in a multi-wire proportional counter, which can effectively realize that the metal wire mesh is assembled on a PCB, meets the parallelism and insulation requirements of the assembled metal wire mesh and the PCB, reduces the assembly difficulty, and is safe and reliable.
According to the technical scheme provided by the invention, the assembling method of the wire mesh in the multi-wire proportional counter comprises the following steps of:
and 6, exposing and developing the first SU8 dry film and the second SU8 dry film on the PCB to remove the first SU8 dry film and the second SU8 dry film in the required area, so as to obtain a plurality of wire mesh support columns for supporting the wire mesh, wherein the area outside the joint of the wire mesh and the wire mesh support columns is in a bare state.
In step 3, the wire mesh is pressed on the first SU8 dry film by using a wire mesh frame matched with the wire mesh, and the wire mesh frame is separated from the wire mesh after the wire mesh is pressed on the first SU8 dry film.
In the step 1, when the PCB is cleaned, the cotton swabs dipped with acetone and alcohol are used for wiping and cleaning the PCB respectively.
The step 6 specifically comprises the following steps:
step 6.1, exposing a first SU8 dry film and a second SU8 dry film on a PCB by using a mask, wherein during exposure, ultraviolet light with the wavelength of 365nm is adopted, and the exposure light intensity is 20mW/cm 2 The exposure time is 15 min-25 min;
step 6.2, placing the PCB on a hot plate at 65-75 ℃ for baking for 5-10 min, then baking on the hot plate at 90-100 ℃ for 10-20 min, standing and cooling to room temperature after baking;
step 6.3, soaking the exposed first SU8 dry film and second SU8 dry film on the PCB in PGMEA developing solution, and performing ultrasonic vibration by using an ultrasonic cleaner until white floccules fly out;
step 6.4, transferring the first SU8 dry film, the second SU8 dry film and the wire mesh which are treated by the steps into an isopropanol solution, and performing ultrasonic vibration in the isopropanol solution until the first SU8 dry film and the second SU8 dry film in the required area are removed, so as to obtain a plurality of wire mesh support columns for supporting the wire mesh;
step 6.5, washing the PCB with deionized water, and drying with nitrogen after washing;
and 6.6, placing the PCB dried by the nitrogen gas on a hot plate at 130-150 ℃ for baking for 15-20 min.
The invention has the advantages that: the SU8 dry film becomes sticky at softening temperature, so that the concave-convex area of the PCB substrate can be covered by the first SU8 dry film 3, and the metal wire mesh can be effectively wrapped by the first SU8 dry film and the second SU8 dry film; the SU8 dry film has excellent chemical stability, thermodynamic stability, mechanical strength and electrical insulation after photo-curing, and can meet the process conditions and the subsequent test requirements. The first SU8 dry film and the second SU8 dry film are used as supporting structures, good mechanical strength and insulativity after being cured are used as supporting structures, direct contact of the metal wire mesh and the substrate electrode on the PCB is avoided, potential difference is generated between the metal wire mesh and the substrate electrode on the PCB, meanwhile, the metal wire mesh and the substrate electrode are ensured to be parallel as much as possible, discharge caused by the distance difference is avoided, accordingly, the metal wire mesh can be effectively assembled on the PCB, the parallelism and insulation requirements of the assembled metal wire mesh and the PCB are met, the assembly difficulty is reduced, and the device is safe and reliable.
Drawings
FIGS. 1-5 are cross-sectional views of process steps embodying the present invention, wherein
Fig. 1 is a cross-sectional view of a PCB board provided by the present invention.
Fig. 2 is a cross-sectional view of the present invention with a first SU8 dry film applied to a PCB board.
Fig. 3 is a cross-sectional view of the invention pressing a wire mesh against a first SU8 dry film.
Fig. 4 is a cross-sectional view of the present invention after a second SU8 dry film has been applied.
Fig. 5 is a cross-sectional view of the present invention after exposure development to obtain a screen support post.
Reference numerals illustrate: 1-PCB board, 2-substrate electrode, 3-first SU8 dry film, 4-wire mesh, 5-second SU8 dry film and 6-silk screen support column.
Detailed Description
The invention will be further described with reference to the following specific drawings and examples.
In order to effectively realize that the metal wire mesh is assembled on the PCB, and meet the parallelism and insulation requirements of the assembled metal wire mesh and the PCB 1, the assembly difficulty is reduced, and the assembly method comprises the following steps:
specifically, the PCB board 1 may be a circuit board structure required in the existing multi-wire proportional counter, and the specific form of the PCB board 1 may be selected according to the need, so long as the need of the multi-wire proportional counter can be satisfied, which is well known to those skilled in the art, and will not be described herein. In the embodiment of the present invention, the PCB board 1 has a base electrode 2, and the cooperation between the base electrode 2 and the PCB board 1 is well known in the art, and is not described herein again, as shown in fig. 1. When the PCB 1 is cleaned, the cotton swabs dipped with acetone and alcohol are used for wiping and cleaning the PCB 1. And after cleaning, drying and preheating the PCB 1 by using a hot plate.
specifically, the first SU8 dry film 3 may take a conventional form, and the SU8 dry film has a sandwich structure and an upper protective film and a lower protective film. When in use, the protective layer is firstly removed and stuck on the heated PCB 1, namely, after the protective film at the lower layer is torn off, the first SU8 dry film 3 can be stuck at the required position of the PCB 1. After the first SU8 dry film 3 is attached, the first SU8 dry film 3 is quickly rolled by a roller, so that the other surface of the first SU8 dry film 3, which is in contact with the PCB 1, is in a horizontal state. After the roll-off, the upper protective film on the first SU8 dry film 3 is removed in preparation for the subsequent process, as shown in fig. 2.
as shown in fig. 3, the SU8 dry film becomes viscous at softening temperature, thereby facilitating the pressing of the wire mesh 4 against the first SU8 dry film 3. After the wire mesh 4 is pressed on the first SU8 dry film 3, the PCB board 1 is removed from the hot plate, and then naturally cooled to room temperature, the wire mesh 4 can be specifically in a conventional form, the wire mesh 4 is matched with the PCB board 1, so that the requirement of the multi-wire proportional counter can be met, which is well known to those skilled in the art, and is not repeated here.
In the embodiment of the invention, in order to meet the requirement that the wire mesh 4 is parallel to the substrate electrode 2, the phenomenon of wrinkling or bending is not easy to occur under the subsequent fixation of the SU8 dry film. The wire mesh 4 is fixed on a wire mesh frame, and then the wire mesh 4 is pressed on the first SU8 dry film 3, the wire mesh frame can be in the existing common mode, positioning of the wire mesh 4 can be mainly achieved, and the wire mesh 4 can be ensured to be pressed on the first SU8 dry film 3 in a boundary mode. When the PCB board 1 is removed from the hot plate, the wire mesh 4 is separated from the wire mesh frame by a cutting method, and the specific separation method can be selected according to actual needs, and after the wire mesh 4 is separated from the wire mesh frame, the integrity of the wire mesh 4 and the parallel state between the wire mesh 4 and the base electrode 2 of the PCB board 1 are not affected.
as shown in fig. 4, the second SU8 dry film 5 has the same form as the first SU8 dry film 3, and the attaching process of the second SU8 dry film 5 is consistent with that of the first SU8 dry film 3, and specific reference may be made to the above description, and details are not repeated here. In the embodiment of the invention, the first SU8 dry film 3 and the second SU8 dry film 5 can be used for wrapping the metal wire mesh 4, and the metal wire mesh 4 can be insulated and isolated from the PCB 1 under the condition that the metal wire mesh 4 is parallel to the substrate electrode 2. After the second SU8 dry film 5 is attached, a cotton swab dipped with acetone can be used to remove the dry film required by the edge part, so as to ensure that the subsequent process steps such as testing are not affected.
in the embodiment of the invention, the PCB 1 is heated by the hot plate, and after heating and baking, the connection state of the first SU8 dry film 3, the second SU8 dry film 5, the PCB 1 and the wire mesh 4 can be improved by utilizing the characteristic of the SU8 dry film.
And 6, exposing and developing the first SU8 dry film 3 and the second SU8 dry film 5 on the PCB 1 to remove the first SU8 dry film 3 and the second SU8 dry film 5 in the required area to obtain a plurality of wire mesh support columns 6 for supporting the wire mesh 4, wherein the area outside the joint of the wire mesh 4 and the wire mesh support columns 4 is in a bare state.
The embodiment of the invention specifically comprises the following steps:
step 6.1, exposing the first SU8 dry film 3 and the second SU8 dry film 5 on the PCB 1 by using a mask, wherein during exposure, ultraviolet light with the wavelength of 365nm is adopted, and the exposure light intensity is 20mW/cm 2 The exposure time is 15 min-25 min;
specifically, by utilizing the properties of the first SU8 dry film 3 and the second SU8 dry film 5, exposure is performed by adopting a technical means commonly used in the technical field, and a mask for exposing the first SU8 dry film 3 and the second SU8 dry film 5 can be selected and designed according to the needs, so that corresponding areas of the first SU8 dry film 3 and the second SU8 dry film 5 can be removed.
Step 6.2, placing the PCB 1 on a hot plate at 65-75 ℃ for baking for 5-10 min, then baking on the hot plate at 90-100 ℃ for 10-20 min, standing and cooling to room temperature after baking;
specifically, the PCB board 1 and the exposed first SU8 dry film 3 and second SU8 dry film 5 are heated by a hot plate.
Step 6.3, soaking the exposed first SU8 dry film 3 and second SU8 dry film 5 on the PCB 1 in PGMEA developer, and performing ultrasonic vibration by using an ultrasonic cleaner until white floccules fly out;
in the embodiment of the invention, the concentration of the PGMEA developing solution can be selected to be 99.5%. The frequency of ultrasonic vibration is 50 KHz-150 KHz; of course, the working parameters of the ultrasound may be selected according to actual needs, which are well known to those skilled in the art, and will not be described herein.
Step 6.4, transferring the first SU8 dry film 3, the second SU8 dry film 8 and the wire mesh 4 which are treated by the steps into an isopropanol solution, and performing ultrasonic vibration in the isopropanol solution until the first SU8 dry film 3 and the second SU8 dry film 5 in the required area are removed, so as to obtain a plurality of wire mesh support columns 6 for supporting the wire mesh 4;
in the embodiment of the invention, the concentration of the isopropanol can be selected to be 99.5 percent, and the frequency of ultrasonic vibration is 50 KHz-150 KHz. In the development process, the above steps 6.3 and 6.4 are repeated, i.e. development is performed for a while in PGMEA developer, then in isopropanol, and then in PGMEA, and the above steps are repeated. The development state is observed by a microscope until it is confirmed that the development reaches a desired target, and the development process is ended. The developing process of the SU8 dry film on the PCB board 1 is consistent with the developing process of the existing 8 photoresist, and is well known to those skilled in the art, and will not be repeated here.
As is clear from the above description, the wire mesh support column 6 is formed by the portion reserved by the first SU8 dry film 3 and the second SU8 dry film 5, and the wire mesh 4 can be supported by the wire mesh support column 6, so that insulation and isolation between the wire mesh 4 and the PCB board 1 can be also achieved. In the exposure and development process, the position of the wire mesh 4 is not changed, so that the parallel state between the wire mesh 4 and the substrate electrode 2 on the PCB 1 can be ensured. After removing the corresponding areas of the first SU8 dry film 3 and the second SU8 dry film 5, the metal wire mesh 4 and the substrate electrode 2 corresponding to the metal wire mesh 4 can be exposed, and the number, the positions and the like of the obtained wire mesh support columns 6 can be selected and determined according to the needs, which is well known to those skilled in the art, so long as the wire mesh support columns 6 can effectively support the metal wire mesh 4.
Step 6.5, washing the PCB 1 by deionized water, and drying by nitrogen after washing;
when the washing is carried out by deionized water, the washing can be carried out only on the metal wire mesh 4 and the wire mesh support column 6, so that the washing to the PCB 1 is reduced as much as possible, and the risk of short circuit and the like caused by the conditions of wetting and the like of the PCB 1 is avoided after washing and drying.
And 6.6, placing the PCB 1 dried by nitrogen on a hot plate at 130-150 ℃ for baking for 15-20 min.
In the embodiment of the present invention, after the wire mesh support column 6 is obtained, the assembly of the wire mesh 4 can be realized, and after the wire mesh 4 is assembled on the PCB board 1, the PCB board 1 is specifically utilized to cooperate with the wire mesh 4 to realize that the function of the multi-wire proportional counter is consistent with that of the prior art, which is well known to those skilled in the art, and will not be repeated here.
In summary, the SU8 dry film becomes sticky at the softening temperature, so that the concave-convex area of the PCB substrate 1 can be covered by the first SU8 dry film 3, and the wire mesh 4 can be effectively wrapped by the first SU8 dry film 3 and the second SU8 dry film 5; the SU8 dry film has excellent chemical stability, thermodynamic stability, mechanical strength and electrical insulation after photo-curing, and can meet the process conditions and the subsequent test requirements. The first SU8 dry film 3 and the second SU8 dry film 5 are used as supporting structures with good mechanical strength and insulativity after being cured, direct contact of the metal wire mesh 4 and the substrate electrode 2 on the PCB 1 is avoided, potential difference is generated between the metal wire mesh 4 and the substrate electrode 2 on the PCB 1, meanwhile, the metal wire mesh 4 and the substrate electrode 2 are ensured to be parallel as much as possible, discharge caused by distance difference is avoided, accordingly, the metal wire mesh can be effectively assembled on the PCB, the parallelism and insulation requirements of the assembled metal wire mesh and the PCB are met, the assembly difficulty is reduced, and safety and reliability are realized.
Claims (4)
1. A method of assembling a wire mesh in a multi-wire proportional counter, the method comprising the steps of:
step 1, providing a PCB (1) required in a multi-wire proportional counter, wherein the PCB (1) is provided with a base electrode (2); cleaning the PCB (1), and drying and preheating the cleaned PCB (1) to enable the temperature of the PCB (1) to be 65-75 ℃;
step 2, a first SU8 dry film (3) is stuck on the PCB (1), and the first SU8 dry film (3) covers the substrate electrode (2) of the PCB (1); immediately and rapidly rolling the first SU8 dry film (3) after the first SU8 dry film (3) is attached to the PCB (1), and removing an upper protective film on the first SU8 dry film (3) after the first SU8 dry film (3) is rolled and flattened;
step 3, pressing a wire mesh (4) on the first SU8 dry film (3), and naturally cooling the PCB (1) to room temperature, wherein when the wire mesh (4) is pressed on the first SU8 dry film (3), the wire mesh (4) and the substrate electrode (2) are parallel to each other;
step 4, drying and preheating the PCB (1), attaching a second SU8 dry film (5) on the wire mesh (4) when the temperature of the PCB (1) is 65-75 ℃, and removing an upper protective film on the second SU8 dry film (5) after the attached second SU8 dry film (5) is flattened;
step 5, placing the PCB (1) on a hot plate at 95-100 ℃ for baking for 5-10 min, and standing and cooling to room temperature after baking;
and 6, exposing and developing the first SU8 dry film (3) and the second SU8 dry film (5) on the PCB (1) to remove the first SU8 dry film (3) and the second SU8 dry film (5) in a preset area to obtain a plurality of wire mesh support columns (6) for supporting the wire mesh (4), wherein the area outside the joint of the wire mesh (4) and the wire mesh support columns (6) is in a bare state.
2. The method of assembling a wire mesh in a multi-wire proportional counter of claim 1, wherein: in step 3, the wire mesh (4) is pressed on the first SU8 dry film (3) by using a wire mesh frame matched with the wire mesh (4), and the wire mesh frame is separated from the wire mesh (4) after the wire mesh (4) is pressed on the first SU8 dry film (3).
3. The method of assembling a wire mesh in a multi-wire proportional counter of claim 1, wherein: in the step 1, when the PCB (1) is cleaned, the cotton swabs dipped with acetone and the cotton swabs dipped with alcohol are used for cleaning the PCB (1) in a wiping way.
4. The method of assembling a wire mesh in a multi-wire proportional counter of claim 1, wherein step 6 comprises the steps of:
step 6.1, exposing the first SU8 dry film (3) and the second SU8 dry film (5) on the PCB (1) by using a mask, wherein during exposure, ultraviolet light with the wavelength of 365nm is adopted, and the exposure light intensity is 20mW/cm 2 The exposure time is 15-25 min;
step 6.2, placing the PCB (1) on a hot plate at 65-75 ℃ for baking for 5-10 min, then baking on the hot plate at 90-100 ℃ for 10-20 min, and standing and cooling to room temperature after baking;
step 6.3, soaking the exposed first SU8 dry film (3) and second SU8 dry film (5) on the PCB (1) in PGMEA developing solution, and performing ultrasonic vibration by using an ultrasonic cleaner until white floccules fly out;
step 6.4, transferring the first SU8 dry film (3), the second SU8 dry film (8) and the wire mesh (4) which are treated by the steps into an isopropanol solution, and performing ultrasonic vibration in the isopropanol solution until the first SU8 dry film (3) and the second SU8 dry film (5) in a required area are removed, so as to obtain a plurality of wire mesh support columns (6) for supporting the wire mesh (4);
step 6.5, washing the PCB (1) by deionized water, and drying by nitrogen after washing;
and 6.6, placing the PCB (1) dried by the nitrogen gas on a hot plate at 130-150 ℃ for baking for 15-20 min.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010439605.6A CN111650631B (en) | 2020-05-22 | 2020-05-22 | Method for assembling wire mesh in multi-wire proportional counter |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010439605.6A CN111650631B (en) | 2020-05-22 | 2020-05-22 | Method for assembling wire mesh in multi-wire proportional counter |
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| CN111650631B true CN111650631B (en) | 2023-06-02 |
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Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3911279A (en) * | 1973-05-17 | 1975-10-07 | Ball Brothers Res Corp | Position sensitive multiwire proportional counter with integral delay line |
| US4176602A (en) * | 1975-09-02 | 1979-12-04 | General Dynamics Corporation | Dry film screen stencil and method of making |
| WO2001029859A1 (en) * | 1999-10-19 | 2001-04-26 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing metal electrode |
| TWI310579B (en) * | 2005-02-23 | 2009-06-01 | Advanced Semiconductor Eng | Method for utilizing a dry film |
| US8456856B2 (en) * | 2009-03-30 | 2013-06-04 | Megica Corporation | Integrated circuit chip using top post-passivation technology and bottom structure technology |
| CN102147569B (en) * | 2010-12-02 | 2012-10-10 | 天津海鸥表业集团有限公司 | Processing method of micro-component in multi-layer structure and solidified SU-8 photoresist sheet |
| CN103645492B (en) * | 2013-12-06 | 2015-11-18 | 深圳市盛喜路科技有限公司 | A kind of Low-cost multi-wire proportional counter electrode array and preparation method thereof |
| CN104030234B (en) * | 2014-06-04 | 2016-01-13 | 江苏艾伦摩尔微电子科技有限公司 | The MEMS infrared sensor preparation method of based thin film bulk acoustic wave resonator |
| CN208359680U (en) * | 2018-06-28 | 2019-01-11 | 昆山万源通电子科技有限公司 | A kind of PCB screen printing forme |
| CN109041440B (en) * | 2018-08-22 | 2020-08-11 | 安徽四创电子股份有限公司 | Manufacturing method of wet film full-coverage PCB gold-plated board |
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