CN111650631A - Method for assembling wire mesh in multi-wire proportional counter - Google Patents
Method for assembling wire mesh in multi-wire proportional counter Download PDFInfo
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- CN111650631A CN111650631A CN202010439605.6A CN202010439605A CN111650631A CN 111650631 A CN111650631 A CN 111650631A CN 202010439605 A CN202010439605 A CN 202010439605A CN 111650631 A CN111650631 A CN 111650631A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/18—Measuring radiation intensity with counting-tube arrangements, e.g. with Geiger counters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
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Abstract
The invention relates to a method for assembling a metal wire mesh in a multi-wire proportional counter. Which comprises the following steps: step 1, providing a PCB (printed Circuit Board) required in a multi-wire proportional counter; step 2, pasting a first SU8 dry film on the PCB; step 3, pressing a wire mesh on the first SU8 dry film; step 4, drying and preheating the PCB, and attaching a second SU8 dry film on the metal wire mesh; step 5, placing the PCB on a hot plate at the temperature of 95-100 ℃ for baking for 5-10 min, and standing and cooling to room temperature after baking; and 6, exposing and developing the first SU8 dry film and the second SU8 dry film on the PCB to remove the first SU8 dry film and the second SU8 dry film in required areas, and obtaining a plurality of screen supporting columns for supporting the metal screen. The invention can effectively realize the assembly of the metal wire mesh on the PCB, meets the parallelism and insulation requirements of the assembled metal wire mesh and the PCB, reduces the assembly difficulty, and is safe and reliable.
Description
Technical Field
The invention relates to a preparation method, in particular to an assembly method of a wire mesh in a multi-wire proportional counter.
Background
The multi-wire proportional counter is a novel particle detector which works in a proportional area of a gas characteristic curve and has a multi-wire structure. The multi-filament proportional counter consists of a large number of parallel filaments all lying in one plane between two cathode planes a few centimeters apart, the diameter of the anode filament being about one tenth of a millimeter and the spacing being about one or a few millimeters. Each wire will work like a proportional counter tube and can achieve a spatial accuracy of one millimeter or less. Each filament can sustain very high particle recording rates, up to several tens of thousands of times per second. Meanwhile, the structure can form various required volumes and shapes in a module mode, is easy to manufacture into a large-area detector, and is suitable for experiments with different scales and characteristics.
In the multi-wire proportional counter, the assembly requirement on the wire mesh is extremely high, the parallelism and the insulation requirement between the wire mesh and a PCB (printed circuit board) need to be ensured, the existing assembly process is complex, and the assembly requirement on the wire mesh cannot be effectively ensured.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides the method for assembling the metal wire mesh in the multi-wire proportional counter, which can effectively realize the assembly of the metal wire mesh on a PCB (printed circuit board), meets the parallelism and insulation requirements of the assembled metal wire mesh and the PCB, reduces the assembly difficulty, and is safe and reliable.
According to the technical scheme provided by the invention, the assembly method of the wire mesh in the multi-wire proportional counter comprises the following steps:
and 6, exposing and developing the first SU8 dry film and the second SU8 dry film on the PCB to remove the first SU8 dry film and the second SU8 dry film in required areas to obtain a plurality of screen support pillars for supporting the wire mesh, wherein the areas outside the joint of the wire mesh and the screen support pillars are in an exposed state.
In the step 3, the wire mesh is pressed on the first SU8 dry film by using a wire mesh frame matched with the wire mesh, and the wire mesh frame is separated from the wire mesh after the wire mesh is pressed and fixed on the first SU8 dry film.
In the step 1, when the PCB is cleaned, the PCB is wiped and cleaned by cotton swabs dipped with acetone and cotton swabs dipped with alcohol respectively.
In step 6, the method specifically comprises the following steps:
6.1, exposing the first SU8 dry film and the second SU8 dry film on the PCB by using a mask, wherein during exposure, ultraviolet light with the wavelength of 365nm is adopted, and the exposure light intensity is 20mW/cm2The exposure time is 15 min-25 min;
step 6.2, placing the PCB on a hot plate at the temperature of 65-75 ℃ for baking for 5-10 min, then baking on a hot plate at the temperature of 90-100 ℃ for 10-20 min, standing and cooling to room temperature after baking;
step 6.3, soaking the exposed first SU8 dry film and the exposed second SU8 dry film on the PCB in a PGMEA developing solution, and performing ultrasonic vibration by using an ultrasonic cleaning machine until white floccules float out;
6.4, transferring the first SU8 dry film, the second SU8 dry film and the wire mesh which are processed in the steps into an isopropanol solution, and performing ultrasonic vibration in the isopropanol solution until the first SU8 dry film and the second SU8 dry film in the required areas are removed to obtain a plurality of wire mesh supporting columns for supporting the wire mesh;
6.5, washing the PCB with deionized water, and drying the PCB with nitrogen after washing;
and 6.6, placing the PCB dried by the nitrogen on a hot plate at the temperature of 130-150 ℃ for baking for 15-20 min.
The invention has the advantages that: the SU8 dry film becomes sticky at a softening temperature, so that the concave-convex area of the PCB substrate can be covered by the first SU8 dry film 3, and the wire mesh can be effectively wrapped by the first SU8 dry film and the second SU8 dry film; the SU8 dry film has excellent chemical stability, thermodynamic stability, mechanical strength and electrical insulation after photocuring, and can meet the requirements of process conditions and subsequent tests. Utilize first SU8 dry film, good mechanical strength and insulating nature behind the solidification of second SU8 dry film are as bearing structure, avoid the direct contact of the basement electrode on wire mesh and the PCB board, make the basement electrode on wire mesh and the PCB board produce the potential difference, it is parallel with the basement electrode to guarantee wire mesh and the utmost simultaneously, it leads to discharging to avoid apart from the difference, thereby can effectively realize the wire mesh assembly on the PCB board, satisfy the depth of parallelism and the insulating requirement with the PCB board after the wire mesh assembly, reduce the assembly degree of difficulty, safety and reliability.
Drawings
FIGS. 1-5 are cross-sectional views of process steps for practicing the present invention, wherein
Fig. 1 is a cross-sectional view of a PCB board provided in the present invention.
Fig. 2 is a cross-sectional view of a first SU8 dry film attached to a PCB board according to the present invention.
Fig. 3 is a cross-sectional view of the present invention with a wire mesh pressed against a first SU8 dry film.
Fig. 4 is a cross-sectional view of a second SU8 dry film of the present invention.
Fig. 5 is a cross-sectional view of a screen support post after exposure and development according to the present invention.
Description of reference numerals: 1-PCB board, 2-substrate electrode, 3-first SU8 dry film, 4-wire mesh, 5-second SU8 dry film, and 6-wire mesh support post.
Detailed Description
The invention is further illustrated by the following specific figures and examples.
In order to effectively realize the assembly of the metal wire mesh on the PCB, meet the requirements of parallelism and insulation between the assembled metal wire mesh and the PCB 1 and reduce the assembly difficulty, the assembly method comprises the following steps:
specifically, the PCB board 1 may be a circuit board structure required in an existing multi-wire proportional counter, and the specific form of the PCB board 1 may be selected as needed as long as the requirement of the multi-wire proportional counter can be met, which is known to those skilled in the art and will not be described herein again. In the embodiment of the present invention, the PCB board 1 has the substrate electrode 2, and the cooperation between the substrate electrode 2 and the PCB board 1 is well known in the art, and is not described herein again, as shown in fig. 1. When the PCB board 1 is cleaned, the cotton swab dipped with acetone and the cotton swab dipped with alcohol are respectively used for wiping and cleaning the PCB board 1. After cleaning, the PCB board 1 is dried and preheated by a hot plate.
specifically, the first SU8 dry film 3 can be in a conventional form, and the SU8 dry film has a sandwich structure with an upper protective film and a lower protective film. When in use, a protective layer is firstly removed and is attached to the heated PCB board 1, namely, after the lower protective film is torn off, the first SU8 dry film 3 can be attached to the required position of the PCB board 1. And after the first SU8 dry film 3 is pasted, quickly rolling the first SU8 dry film 3 by using a roller to enable the other surface of the first SU8 dry film 3, which is in contact with the PCB 1, to be in a horizontal state. After roll-leveling, the upper protective film on the first SU8 dry film 3 is removed in preparation for subsequent processing, as shown in fig. 2.
as shown in fig. 3, the SU8 dry film becomes sticky at the softening temperature, so that the wire mesh 4 can be easily pressed against the first SU8 dry film 3. After pressing wire mesh 4 on first SU8 dry film 3, take off PCB board 1 from the hot plate, then natural cooling to room temperature, wire mesh 4 specifically can adopt current commonly used form, and wire mesh 4 cooperates with PCB board 1, can satisfy the needs of many proportional counters of silk, specifically is this technical field personnel known, and it is no longer repeated here.
In the embodiment of the invention, in order to meet the requirement that the wire mesh 4 is parallel to the substrate electrode 2, the phenomenon of wrinkling or bending is not easy to occur under the subsequent SU8 dry film fixation. Firstly, the wire mesh 4 is fixed on the wire mesh frame, and then the wire mesh 4 is pressed on the first SU8 dry film 3, the wire mesh frame can adopt the existing common form, the positioning of the wire mesh 4 can be mainly realized, and the boundary of the wire mesh 4 can be pressed on the first SU8 dry film 3. After taking off PCB board 1 from the hot plate, separate wire mesh 4 and silk screen frame, concrete separation mode can adopt technical means such as cut apart, specifically can select according to actual need, after wire mesh 4 and the silk screen frame separation to do not influence the integrality of wire mesh 4, and the state of parallelism between wire mesh 4 and the basement electrode 2 of PCB board 1.
as shown in fig. 4, the second SU8 dry film 5 and the first SU8 dry film 3 have the same form, and the bonding process of the second SU8 dry film 5 is the same as that of the first SU8 dry film 3. In the embodiment of the invention, the first SU8 dry film 3 and the second SU8 dry film 5 can wrap the wire mesh 4, so that the wire mesh 4 can be insulated and isolated from the PCB 1 under the condition that the wire mesh 4 is parallel to the substrate electrode 2. After the second SU8 dry film 5 is attached, the cotton swab dipped with acetone can be used to remove the dry film needed by the edge part, so as to ensure that the subsequent process steps such as testing are not affected.
in the embodiment of the invention, the PCB 1 is heated by the hot plate, and after heating and baking, the connection state of the first SU8 dry film 3 and the second SU8 dry film 5 with the PCB 1 and the wire mesh 4 can be improved by utilizing the characteristics of the SU8 dry film.
And 6, exposing and developing the first SU8 dry film 3 and the second SU8 dry film 5 on the PCB 1 to remove the first SU8 dry film 3 and the second SU8 dry film 5 in required areas to obtain a plurality of screen support pillars 6 for supporting the metal screen 4, wherein the area outside the joint of the metal screen 4 and the screen support pillars 4 is in an exposed state.
The embodiment of the invention specifically comprises the following steps:
6.1, exposing the first SU8 dry film 3 and the second SU8 dry film 5 on the PCB 1 by using a mask, wherein during exposure, ultraviolet light with the wavelength of 365nm is adopted, and the exposure light intensity is 20mW/cm2The exposure time is 15 min-25 min;
specifically, by using the properties of the first SU8 dry film 3 and the second SU8 dry film 5 and adopting a common technical means in the technical field to perform exposure, the mask plates for exposing the first SU8 dry film 3 and the second SU8 dry film 5 can be selectively designed according to requirements, so that the corresponding regions of the first SU8 dry film 3 and the second SU8 dry film 5 can be removed.
Step 6.2, placing the PCB board 1 on a hot plate at 65-75 ℃ for baking for 5-10 min, then baking on a hot plate at 90-100 ℃ for 10-20 min, standing and cooling to room temperature after baking;
specifically, the PCB 1 and the exposed first SU8 dry film 3 and second SU8 dry film 5 are heated by a hot plate.
Step 6.3, soaking the exposed first SU8 dry film 3 and the exposed second SU8 dry film 5 on the PCB 1 in a PGMEA developing solution, and performing ultrasonic vibration by using an ultrasonic cleaning machine until white floccules float out;
in the embodiment of the invention, the concentration of the PGMEA developer can be 99.5%. The frequency of the ultrasonic vibration is 50 KHz-150 KHz; of course, the working parameters of the ultrasound can be selected according to actual needs, which are well known to those skilled in the art and will not be described herein again.
6.4, transferring the first SU8 dry film 3, the second SU8 dry film 8 and the wire mesh 4 processed in the steps into an isopropanol solution, and performing ultrasonic vibration in the isopropanol solution until the first SU8 dry film 3 and the second SU8 dry film 5 in the required areas are removed, so as to obtain a plurality of wire mesh supporting columns 6 for supporting the wire mesh 4;
in the embodiment of the invention, the concentration of the isopropanol can be 99.5 percent, and the frequency of the ultrasonic vibration is 50 KHz-150 KHz. In the developing process, the above steps 6.3 and 6.4 are repeated, i.e. developing in the PGMEA developing solution for a while, then in isopropanol, then developing in PGMEA for a while, and so on. The development state was observed with a microscope until it was confirmed that the development reached the desired target, and the development process was terminated. Specifically, the developing process of the SU8 dry film on the PCB 1 is the same as the developing process of the existing 8 photoresist, which is well known to those skilled in the art and will not be described herein again.
As can be seen from the above description, the wire mesh support post 6 is formed by the remaining portions of the first SU8 dry film 3 and the second SU8 dry film 5, and the wire mesh support post 6 can support the wire mesh 4, so that the wire mesh 4 and the PCB board 1 can be insulated and isolated from each other. In the exposure and development process, the position of the wire mesh 4 is not changed, so that the parallel state between the wire mesh 4 and the substrate electrode 2 on the PCB 1 can be ensured. After the areas corresponding to the first SU8 dry film 3 and the second SU8 dry film 5 are removed, the wire mesh 4 and the substrate electrode 2 corresponding to the wire mesh 4 can be exposed, and the number, the position and the like of the obtained wire mesh supporting columns 6 can be selected and determined according to needs, which is particularly known to those skilled in the art, as long as the wire mesh supporting columns 6 can effectively support the wire mesh 4.
Step 6.5, washing the PCB 1 by using deionized water, and drying by using nitrogen after washing;
when washing with deionized water, can only wash wire mesh 4 and silk screen support column 6, minimize washes PCB board 1, weathers after washing, avoids risks such as short circuit that PCB board 1 wet the circumstances and lead to.
And 6.6, placing the PCB board 1 dried by the nitrogen on a hot plate at the temperature of 130-150 ℃ for baking for 15-20 min.
In the embodiment of the present invention, after the screen support post 6 is obtained, the metal screen 4 can be assembled, and after the metal screen 4 is assembled on the PCB board 1, the function of the multi-wire proportional counter is realized by specifically using the cooperation between the PCB board 1 and the metal screen 4, which is well known to those skilled in the art, and is not described herein again.
In summary, the SU8 dry film becomes viscous at the softening temperature, so that the first SU8 dry film 3 can cover the concave-convex area of the PCB substrate 1, and the first SU8 dry film 3 and the second SU8 dry film 5 can effectively wrap the wire mesh 4; the SU8 dry film has excellent chemical stability, thermodynamic stability, mechanical strength and electrical insulation after photocuring, and can meet the requirements of process conditions and subsequent tests. Utilize first SU8 dry film 3, good mechanical strength and insulating nature are as bearing structure behind the solidification of second SU8 dry film 5, avoid the direct contact of base electrode 2 on wire mesh 4 and the PCB board 1, make the base electrode 2 on wire mesh 4 and the PCB board 1 produce the potential difference, it is parallel with base electrode 2 to guarantee wire mesh 4 and simultaneously as far as possible, avoid the distance difference to lead to discharging, thereby can effectively realize the wire mesh assembly on the PCB board, satisfy the depth of parallelism and the insulating requirement with the PCB board after the wire mesh assembly, reduce the assembly degree of difficulty, safety and reliability.
Claims (4)
1. A method for assembling a metal wire mesh in a multi-wire proportional counter is characterized by comprising the following steps:
step 1, providing a PCB (1) required in a multi-wire proportional counter, wherein a substrate electrode (2) is arranged on the PCB (1); cleaning the PCB (1), and drying and preheating the cleaned PCB (1) to enable the temperature of the PCB (1) to be 65-75 ℃;
step 2, pasting a first SU8 dry film (3) on the PCB (1), wherein the first SU8 dry film (3) covers a substrate electrode (2) of the PCB (1); immediately and quickly rolling the first SU8 dry film (3) after the first SU8 dry film (3) is attached to the PCB (1), and removing an upper protective film on the first SU8 dry film (3) after the first SU8 dry film (3) is rolled;
step 3, pressing a metal wire mesh (4) on the first SU8 dry film (3), and naturally cooling the PCB (1) to room temperature, wherein when the metal wire mesh (4) is pressed on the first SU8 dry film (3), the metal wire mesh (4) and the substrate electrode (2) are parallel to each other;
step 4, drying and preheating the PCB (1), pasting a second SU8 dry film (5) on the metal wire mesh (4) when the temperature of the PCB (1) is 65-75 ℃, and removing an upper protective film on the second SU8 dry film (5) after rolling the pasted second SU8 dry film (5);
step 5, placing the PCB (1) on a hot plate at the temperature of 95-100 ℃ for baking for 5-10 min, and standing and cooling to room temperature after baking;
and 6, exposing and developing the first SU8 dry film (3) and the second SU8 dry film (5) on the PCB (1) to remove the first SU8 dry film (3) and the second SU8 dry film (5) in required areas, so as to obtain a plurality of screen supporting pillars (6) for supporting the wire screen (4), wherein the areas outside the joint of the wire screen (4) and the screen supporting pillars (4) are in an exposed state.
2. The method of claim 1, wherein the wire mesh of the multi-wire proportional counter is: in the step 3, the wire mesh (4) is pressed on the first SU8 dry film (3) by using a wire mesh frame matched with the wire mesh (4), and after the wire mesh (4) is pressed on the first SU8 dry film (3), the wire mesh frame is separated from the wire mesh (4).
3. The method of claim 1, wherein the wire mesh of the multi-wire proportional counter is: in the step 1, when the PCB (1) is cleaned, the PCB (1) is cleaned by cotton swabs dipped with acetone and cotton swabs dipped with alcohol respectively.
4. The method as claimed in claim 1, wherein the step 6 comprises the following steps:
6.1, exposing the first SU8 dry film (3) and the second SU8 dry film (5) on the PCB (1) by using a mask, wherein ultraviolet light with the wavelength of 365nm is adopted during exposure, and the exposure light intensity is 20mW/cm2The exposure time is 15 min-25 min;
step 6.2, placing the PCB (1) on a hot plate at 65-75 ℃ for baking for 5-10 min, then baking on a hot plate at 90-100 ℃ for 10-20 min, standing and cooling to room temperature after baking;
step 6.3, soaking the exposed first SU8 dry film (3) and the exposed second SU8 dry film (5) on the PCB (1) in a PGMEA developing solution, and performing ultrasonic vibration by using an ultrasonic cleaning machine until white floccules float out;
6.4, transferring the first SU8 dry film (3), the second SU8 dry film (8) and the metal screen (4) processed in the steps into an isopropanol solution, and performing ultrasonic vibration in the isopropanol solution until the first SU8 dry film (3) and the second SU8 dry film (5) in the required areas are removed to obtain a plurality of screen supporting columns (6) for supporting the metal screen (4);
step 6.5, washing the PCB (1) by using deionized water, and drying the PCB by using nitrogen after washing;
and 6.6, placing the PCB (1) dried by the nitrogen on a hot plate at the temperature of 130-150 ℃ for baking for 15-20 min.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010439605.6A CN111650631B (en) | 2020-05-22 | 2020-05-22 | Method for assembling wire mesh in multi-wire proportional counter |
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| CN202010439605.6A CN111650631B (en) | 2020-05-22 | 2020-05-22 | Method for assembling wire mesh in multi-wire proportional counter |
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| CN111650631B CN111650631B (en) | 2023-06-02 |
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| CN208359680U (en) * | 2018-06-28 | 2019-01-11 | 昆山万源通电子科技有限公司 | A kind of PCB screen printing forme |
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| US3911279A (en) * | 1973-05-17 | 1975-10-07 | Ball Brothers Res Corp | Position sensitive multiwire proportional counter with integral delay line |
| US4176602A (en) * | 1975-09-02 | 1979-12-04 | General Dynamics Corporation | Dry film screen stencil and method of making |
| WO2001029859A1 (en) * | 1999-10-19 | 2001-04-26 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing metal electrode |
| US20060188826A1 (en) * | 2005-02-23 | 2006-08-24 | Tsung-Yen Tseng | Method for utilizing dry film |
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|---|---|
| CN111650631B (en) | 2023-06-02 |
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