CN111644443A - Method for comprehensively recycling waste circuit boards - Google Patents
Method for comprehensively recycling waste circuit boards Download PDFInfo
- Publication number
- CN111644443A CN111644443A CN201911412702.XA CN201911412702A CN111644443A CN 111644443 A CN111644443 A CN 111644443A CN 201911412702 A CN201911412702 A CN 201911412702A CN 111644443 A CN111644443 A CN 111644443A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- microwave
- waste circuit
- waste
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 86
- 239000002699 waste material Substances 0.000 title claims abstract description 81
- 238000004064 recycling Methods 0.000 title claims description 14
- 230000003647 oxidation Effects 0.000 claims abstract description 39
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 39
- 230000008569 process Effects 0.000 claims abstract description 25
- 238000009854 hydrometallurgy Methods 0.000 claims abstract description 21
- 238000011084 recovery Methods 0.000 claims abstract description 21
- 238000002386 leaching Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 5
- 239000005751 Copper oxide Substances 0.000 claims description 5
- 229910000431 copper oxide Inorganic materials 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 3
- 238000005728 strengthening Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 239000007789 gas Substances 0.000 abstract description 2
- 230000036541 health Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 231100000331 toxic Toxicity 0.000 abstract description 2
- 230000002588 toxic effect Effects 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000002184 metal Substances 0.000 description 25
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- 230000008901 benefit Effects 0.000 description 8
- 239000010793 electronic waste Substances 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000011133 lead Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000009853 pyrometallurgy Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 239000002912 waste gas Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000002920 hazardous waste Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
- B09B3/80—Destroying solid waste or transforming solid waste into something useful or harmless involving an extraction step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
- C22B7/007—Wet processes by acid leaching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The invention discloses a method for comprehensively recovering waste circuit boards, which comprises the following steps: removing electronic components from the waste circuit board, and crushing the circuit board after removing the electronic components; placing the crushed waste circuit board in a microwave field for microwave oxidation treatment, and adjusting microwave parameters for microwave oxidation treatment; after the treatment is finished, taking out the microwave activated product for wet recovery, and leaching residues; the invention has the beneficial effects that: the waste circuit board can be directly subjected to microwave treatment without being crushed, so that the problems of high crushing difficulty and harm to human health caused by generated toxic and harmful gases are avoided; the method introduces microwave external field strengthening into the comprehensive recovery of the waste circuit board, and provides a new method for the technical field of comprehensive treatment of the waste circuit board; the method does not select materials, can process the circuit board containing components and the circuit board substrate from which the components are removed, and has wide applicability; the method can directly enter the hydrometallurgy leaching procedure after microwave oxidation treatment, and is naturally linked.
Description
Technical Field
The invention belongs to the technical field of waste circuit board recycling treatment, and particularly relates to a method for comprehensively recycling waste circuit boards.
Background
The printed circuit board is the foundation of the electronic industry, and along with the rapid development of the electronic industry, the updating speed of electronic products is increased, so that a large amount of electronic wastes are generated, and in addition, a large amount of leftover materials and the like are generated in the manufacturing process of the printed circuit board. If the electronic garbage is directly stacked without being treated, a large amount of space can be occupied, and harmful substances in the electronic garbage can pollute soil and cause great burden to the ecological environment. Waste printed wiring boards typically contain about 30% plastic (epoxy, polyethylene, polyester, phenolic, etc., halides, nitrogen compounds), 30% inert oxides (fiberglass, etc.) and 40% metal.
At present, the recovery of waste circuit boards mainly comprises a physical method, a pyrometallurgical method, a hydrometallurgy method and a pyrolysis method, and the problems of high crushing difficulty, high energy consumption, long flow, high pollution and the like of the waste circuit boards mainly exist. The invention introduces clean and efficient energy, namely microwave energy, to strengthen the recovery of valuable resources in the waste circuit boards. By utilizing the characteristics of microwave heating (high thermal efficiency, high temperature rise speed, obvious reaction temperature reduction, reaction time shortening and strengthening effect), the problems of high energy consumption, high pollution, low recovery rate and the like of the conventional process can be effectively avoided. The invention provides a strengthening means for the waste circuit board treatment process, and provides a possibility for comprehensive recovery of the waste circuit board.
The invention adopts microwave energy to carry out oxidation treatment on the waste circuit board, and the treated slag obtained after treatment can be directly used as a hydrometallurgy raw material to be recycled. After the strengthening treatment of the process, the organic binder in the waste circuit board is decomposed, the glass fibers and the copper foil of the waste circuit board are easy to separate, and the complete oxidation of the copper can be realized by controlling the microwave parameters and the air flow rate; the method changes the harm into the treasure, treats the hazardous waste harmlessly, realizes the comprehensive utilization of natural resources, is beneficial to relieving the pressure of the resources and the environment, and has excellent economic and ecological benefits.
The applicant discloses a method for recovering copper in waste circuit boards in a patent with the patent number of CN 201611031443.2, wherein the method comprises the steps of crushing the waste circuit boards into 0.15-0.25mm by a hammer mill, and adding the crushed waste circuit boards into a plasma arc furnace for recovery treatment. Compared with the invention, the invention can be directly put into a microwave oven for oxidation without crushing, and valuable metals and glass fibers in the waste circuit boards are recovered by adopting a conventional hydrometallurgy method after the oxidation is finished.
The applicant discloses a method for treating waste circuit boards in a patent of CN201310264822.6, which comprises the steps of heating the waste circuit boards, plasticizing plastics in vacuum or inert atmosphere, ball milling, sorting, and adding alkali for roasting and water leaching the sorted metals. Compared with the invention, the invention can be directly put into a microwave oven for oxidation without crushing, and after the oxidation is finished, valuable metals and glass fibers in the waste circuit boards are recovered by adopting a conventional hydrometallurgy method, so that the treatment is simple and the flow is short.
Disclosure of Invention
The invention aims to provide a method for comprehensively recovering waste circuit boards, wherein the waste circuit boards are subjected to oxidation treatment by microwave energy, the treated slag obtained after treatment can be directly used as a hydrometallurgy raw material for recovery, after the process is subjected to strengthening treatment, an organic binder in the waste circuit boards is decomposed, glass fibers and copper foils of the waste circuit boards are extremely easy to separate, and the microwave parameters and the air flow rate are controlled to realize complete oxidation of copper; the method changes the harm into the treasure, treats the hazardous waste harmlessly, realizes the comprehensive utilization of natural resources, is beneficial to relieving the pressure of the resources and the environment, and has excellent economic and ecological benefits.
In order to achieve the purpose, the invention provides the following technical scheme: a comprehensive recovery method of waste circuit boards comprises the following steps:
the method comprises the following steps: removing electronic components from the waste circuit board, and crushing the circuit board after removing the electronic components;
step two: placing the crushed waste circuit board in a microwave field for microwave oxidation treatment, and adjusting microwave parameters for microwave oxidation treatment;
step three: and after the treatment is finished, taking out the microwave activated product for wet recovery, and leaching residues.
As a preferable technical scheme of the invention, in the first step, the waste circuit board can be a circuit board with components and a circuit board light plate with the components removed, and the diameter of the waste circuit board is 0.1-5 cm.
As a preferable technical scheme of the invention, in the first step, the weight of the waste circuit board is 0.1-2.5Kg, and the thickness of the material layer is 0.2-150 mm.
As a preferred technical scheme of the invention, in the second step, the microwave temperature is 100-1000 ℃, the microwave power is 1.0-10Kw, and the microwave time is 10-200 min.
In the second step, the microwave oven is provided with an air inlet and an air outlet, and the air flow rate is 5.0-15 mL/s.
As a preferred technical scheme of the invention, in the third step, the crushing process of the circuit board comprehensive recovery method can be cancelled, after microwave oxidation treatment, the waste circuit board is in an extremely easy crushing state, the waste circuit board can enter a hydrometallurgy process without being crushed, and copper exists in the form of copper oxide and simple substance.
As a preferable technical scheme of the invention, the method for comprehensively recovering the circuit board can directly treat the waste circuit board without crushing.
Compared with the prior art, the invention has the beneficial effects that:
(1) the waste circuit board can be directly subjected to microwave treatment without being crushed, so that the problems of high crushing difficulty and harm to human health caused by generated toxic and harmful gases are avoided;
(2) the method introduces microwave external field strengthening into the comprehensive recovery of the waste circuit board, saves energy, reduces consumption, shortens time, is efficient and reliable, and provides a new method for the technical field of comprehensive treatment of the waste circuit board;
(3) the method does not select materials, can process the circuit board containing components and the circuit board substrate from which the components are removed, and has wide applicability;
(4) the method can directly enter a hydrometallurgy leaching procedure after microwave oxidation treatment, is natural in connection, simple in treatment and efficient in recycling of all components.
Drawings
FIG. 1 is a flow chart of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1, the present invention provides a technical solution: a method for comprehensively recovering waste circuit boards comprises the following steps:
the method comprises the following steps: removing electronic components from the waste circuit board, and crushing the circuit board after removing the electronic components, wherein the crushing diameter is 0.1cm, and the waste circuit board generally comprises the following components: 35-50% of plastic, 10-25% of copper, 5-10% of iron, 3-5% of bromide, and 10-40% of lead, tin, nickel, zinc, gold, silver, cadmium and palladium;
step two: placing the crushed waste circuit board in a microwave field for microwave oxidation treatment, and adjusting microwave parameters for microwave oxidation treatment; the diameter of the waste circuit board is 0.1cm, the weight is 0.1Kg, the thickness of a material layer is 0.2mm, the microwave temperature is 100 ℃, the microwave power is 1.0Kw, the microwave time is 200min, an air inlet and an air outlet are arranged on a microwave oven, the circulation of air in the oxidation treatment process is ensured, and the air flow rate is 15 mL/s; in the microwave oxidation treatment process, the air flow rate (oxygen concentration) is controlled to realize different oxidation targets, and only part of the circuit board copper of the organic binder is treated and recovered in a copper foil form and the complete copper oxide is recovered in an oxide form; the waste circuit board is subjected to microwave oxidation treatment, metal and glass fiber can be recycled, and the resource utilization rate is high;
step three: and (4) cooling the furnace after the treatment is finished, taking out the microwave activated product for sulfuric acid leaching, and using the leaching residue for recovering metals.
In this embodiment, preferably, in the third step, in the above method for comprehensively recovering circuit boards, the crushing process may be cancelled, and after the microwave oxidation treatment, the waste circuit boards are in an extremely easy-to-crush state, and can enter the hydrometallurgy process without being crushed again, so as to realize metal recovery.
In this embodiment, preferably, the method for comprehensively recycling the circuit boards can directly treat the waste circuit boards without crushing.
The hydrometallurgy technology mainly utilizes the characteristic that metal can be dissolved in nitric acid and sulfuric acid to remove the metal from the electronic waste and recover the metal from liquid phase, which is a method for processing the electronic waste widely applied at present, and compared with the pyrometallurgy, the hydrometallurgy has the advantages of less waste gas emission, easy processing of residues after metal extraction, remarkable economic benefit and simple process flow.
After the treatment, the recovery purpose can be achieved by the conventional hydrometallurgy technical means.
Example 2
Referring to fig. 1, the present invention provides a technical solution: a method for comprehensively recovering waste circuit boards comprises the following steps:
the method comprises the following steps: electronic components are removed from the waste circuit board, the circuit board after the electronic components are removed is crushed, the crushing diameter is 2.5cm, and the waste circuit board generally comprises the following components: 35-50% of plastic, 10-25% of copper, 5-10% of iron, 3-5% of bromide, and 10-40% of lead, tin, nickel, zinc, gold, silver, cadmium and palladium;
step two: placing the crushed waste circuit board in a microwave field for microwave oxidation treatment, and adjusting microwave parameters for microwave oxidation treatment; the diameter of the waste circuit board is 2.5cm, the weight is 1.2Kg, the thickness of a material layer is 70mm, the microwave temperature is 550 ℃, the microwave power is 5Kw, the microwave time is 105min, an air inlet and an air outlet are arranged on a microwave oven, the circulation of air in the oxidation treatment process is ensured, and the air flow rate is 8 mL/s; in the microwave oxidation treatment process, the air flow rate (oxygen concentration) is controlled to realize different oxidation targets, and only part of the circuit board copper of the organic binder is treated and recovered in a copper foil form and the complete copper oxide is recovered in an oxide form; the waste circuit board is subjected to microwave oxidation treatment, metal and glass fiber can be recycled, and the resource utilization rate is high;
step three: and (4) cooling the furnace after the treatment is finished, taking out the microwave activated product for sulfuric acid leaching, and using the leaching residue for recovering metals.
In this embodiment, preferably, in the third step, in the above method for comprehensively recovering circuit boards, the crushing process may be cancelled, and after the microwave oxidation treatment, the waste circuit boards are in an extremely easy-to-crush state, and can enter the hydrometallurgy process without being crushed again, so as to realize metal recovery.
In this embodiment, preferably, the method for comprehensively recycling the circuit boards can directly treat the waste circuit boards without crushing.
The hydrometallurgy technology mainly utilizes the characteristic that metal can be dissolved in nitric acid and sulfuric acid to remove the metal from the electronic waste and recover the metal from liquid phase, which is a method for processing the electronic waste widely applied at present, and compared with the pyrometallurgy, the hydrometallurgy has the advantages of less waste gas emission, easy processing of residues after metal extraction, remarkable economic benefit and simple process flow.
After the treatment, the recovery purpose can be achieved by the conventional hydrometallurgy technical means.
Example 3
Referring to fig. 1, the present invention provides a technical solution: a method for comprehensively recovering waste circuit boards comprises the following steps:
the method comprises the following steps: removing electronic components from the waste circuit board, and crushing the circuit board after removing the electronic components, wherein the crushing diameter is 5cm, and the waste circuit board generally comprises the following components: 35-50% of plastic, 10-25% of copper, 5-10% of iron, 3-5% of bromide, and 10-40% of lead, tin, nickel, zinc, gold, silver, cadmium and palladium;
step two: placing the crushed waste circuit board in a microwave field for microwave oxidation treatment, and adjusting microwave parameters for microwave oxidation treatment; the diameter of the waste circuit board is 5cm, the weight is 2.5Kg, the thickness of a material layer is 150mm, the microwave temperature is 1000 ℃, the microwave power is 10Kw, the microwave time is 10min, an air inlet and an air outlet are arranged on a microwave oven, the circulation of air in the oxidation treatment process is ensured, and the air flow rate is 1.0 mL/s; in the microwave oxidation treatment process, the air flow rate (oxygen concentration) is controlled to realize different oxidation targets, and only part of the circuit board copper of the organic binder is treated and recovered in a copper foil form and the complete copper oxide is recovered in an oxide form; the waste circuit board is subjected to microwave oxidation treatment, metal and glass fiber can be recycled, and the resource utilization rate is high;
step three: and (4) cooling the furnace after the treatment is finished, taking out the microwave activated product for sulfuric acid leaching, and using the leaching residue for recovering metals.
In this embodiment, preferably, in the third step, in the above method for comprehensively recovering circuit boards, the crushing process may be cancelled, and after the microwave oxidation treatment, the waste circuit boards are in an extremely easy-to-crush state, and can enter the hydrometallurgy process without being crushed again, so as to realize metal recovery.
In this embodiment, preferably, the method for comprehensively recycling the circuit boards can directly treat the waste circuit boards without crushing.
The hydrometallurgy technology mainly utilizes the characteristic that metal can be dissolved in nitric acid and sulfuric acid to remove the metal from the electronic waste and recover the metal from liquid phase, which is a method for processing the electronic waste widely applied at present, and compared with the pyrometallurgy, the hydrometallurgy has the advantages of less waste gas emission, easy processing of residues after metal extraction, remarkable economic benefit and simple process flow.
After the treatment, the recovery purpose can be achieved by the conventional hydrometallurgy technical means.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A method for comprehensively recovering waste circuit boards is characterized by comprising the following steps: the method for comprehensive recovery comprises the following steps: the method comprises the following steps: removing electronic components from the waste circuit board, and crushing the circuit board after removing the electronic components; step two: placing the crushed waste circuit board in a microwave field for microwave oxidation treatment, and adjusting microwave parameters for microwave oxidation treatment; step three: and after the treatment is finished, taking out the microwave activated product for wet recovery, and leaching residues.
2. The method for comprehensively recycling the waste circuit boards as claimed in claim 1, wherein the method comprises the following steps: in the first step, the waste circuit boards can be circuit boards with components and circuit board light boards with components removed, and the diameter of the waste circuit boards is 0.1-5 cm.
3. The method for comprehensively recycling the waste circuit boards as claimed in claim 1, wherein the method comprises the following steps: in the first step, the weight of the waste circuit board is 0.1-2.5Kg, and the thickness of the material layer is 0.2-150 mm.
4. The method for comprehensively recycling the waste circuit boards as claimed in claim 1, wherein the method comprises the following steps: in the second step, the microwave temperature is 100-.
5. The method for comprehensively recycling the waste circuit boards as claimed in claim 1, wherein the method comprises the following steps: in the second step, the adopted microwave oven is provided with an air inlet and an air outlet, and the air flow rate is 5.0-15 mL/s.
6. The method for comprehensively recycling the waste circuit boards as claimed in claim 1, wherein the method comprises the following steps: in the third step, the crushing process of the circuit board comprehensive recovery method can be cancelled, after microwave oxidation treatment, the waste circuit board is in an extremely easy crushing state, the waste circuit board can enter a hydrometallurgy process without being crushed, and copper exists in the form of copper oxide and simple substances.
7. The method for comprehensively recycling the waste circuit boards as claimed in claim 1, wherein the method comprises the following steps: the method for comprehensively recovering the circuit board can directly treat the waste circuit board without crushing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911412702.XA CN111644443A (en) | 2019-12-31 | 2019-12-31 | Method for comprehensively recycling waste circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911412702.XA CN111644443A (en) | 2019-12-31 | 2019-12-31 | Method for comprehensively recycling waste circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111644443A true CN111644443A (en) | 2020-09-11 |
Family
ID=72343772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911412702.XA Pending CN111644443A (en) | 2019-12-31 | 2019-12-31 | Method for comprehensively recycling waste circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111644443A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112391531A (en) * | 2020-10-30 | 2021-02-23 | 中南大学 | Method for recovering valuable metals by microwave pyrolysis of waste circuit boards |
| CN113477671A (en) * | 2021-07-09 | 2021-10-08 | 陕西青朗万城环保科技有限公司 | Method for treating waste circuit board based on microwave |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09225445A (en) * | 1996-02-28 | 1997-09-02 | Hitachi Ltd | Treatment of waste printed circuit board mounted with electronic parts |
| CN106345794A (en) * | 2016-11-03 | 2017-01-25 | 四川长虹电器股份有限公司 | Waste circuit board microwave anaerobic splitting treatment method |
| CN106435185A (en) * | 2016-07-18 | 2017-02-22 | 安徽得盈再生资源回收有限公司 | Method for dry process extraction of precious metals from circuit boards |
| CN107815535A (en) * | 2017-10-26 | 2018-03-20 | 中南大学 | A kind of method of microwave radiation exaraction molybdenum |
| CN108085508A (en) * | 2016-11-22 | 2018-05-29 | 重庆思比德复合材料有限公司 | The recovery method of copper in waste and old circuit board |
| CN110396596A (en) * | 2018-04-24 | 2019-11-01 | 骆尚廉 | The method of gold is recycled from discarded printed circuit boards |
-
2019
- 2019-12-31 CN CN201911412702.XA patent/CN111644443A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09225445A (en) * | 1996-02-28 | 1997-09-02 | Hitachi Ltd | Treatment of waste printed circuit board mounted with electronic parts |
| CN106435185A (en) * | 2016-07-18 | 2017-02-22 | 安徽得盈再生资源回收有限公司 | Method for dry process extraction of precious metals from circuit boards |
| CN106345794A (en) * | 2016-11-03 | 2017-01-25 | 四川长虹电器股份有限公司 | Waste circuit board microwave anaerobic splitting treatment method |
| CN108085508A (en) * | 2016-11-22 | 2018-05-29 | 重庆思比德复合材料有限公司 | The recovery method of copper in waste and old circuit board |
| CN107815535A (en) * | 2017-10-26 | 2018-03-20 | 中南大学 | A kind of method of microwave radiation exaraction molybdenum |
| CN110396596A (en) * | 2018-04-24 | 2019-11-01 | 骆尚廉 | The method of gold is recycled from discarded printed circuit boards |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112391531A (en) * | 2020-10-30 | 2021-02-23 | 中南大学 | Method for recovering valuable metals by microwave pyrolysis of waste circuit boards |
| CN112391531B (en) * | 2020-10-30 | 2021-12-17 | 中南大学 | Method for recovering valuable metals by microwave pyrolysis of waste circuit boards |
| CN113477671A (en) * | 2021-07-09 | 2021-10-08 | 陕西青朗万城环保科技有限公司 | Method for treating waste circuit board based on microwave |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| He et al. | A critical review of current technologies for the liberation of electrode materials from foils in the recycling process of spent lithium-ion batteries | |
| Li et al. | Overview of the recycling technology for copper-containing cables | |
| Liu et al. | Facile and cost-effective approach for copper recovery from waste printed circuit boards via a sequential mechanochemical/leaching/recrystallization process | |
| CN102441553B (en) | Method and device for recovering precious metals from precious metal electronic scraps | |
| CN105755289B (en) | Method for comprehensively recycling valuable metals of waste circuit board | |
| CN111644443A (en) | Method for comprehensively recycling waste circuit boards | |
| CN102218439A (en) | Method for pyrolysis separation of valuable components from substrates of waste printed circuit boards | |
| CN101007313A (en) | Recovery method of discarded printed circuit boards | |
| CN105543486A (en) | Method for recovering valuable metals in waste circuit boards | |
| CN103614556A (en) | Method for treating waste mobile phone circuit board and recovering precious metals | |
| CN104878210B (en) | A kind of method of silver separating residue of copper anode slime wet-leaching lead | |
| CN104624598A (en) | Harmless disassembly treatment method of liquid crystal display (LCD) | |
| CN113410534A (en) | Method for recovering graphite and copper foil in anode of waste lithium ion battery through microwave radiation | |
| CN100518969C (en) | Low-temperature vacuum themal dissociation waste printed wiring board preprocessing method | |
| Yedrissov et al. | New composite material for biodegradable electronics | |
| CN104694759A (en) | Recycling method of metal-containing powder in waste printed circuit board | |
| US20120274008A1 (en) | Oxygen torch reclamation of metals with nitric acid recovery | |
| CN106365439A (en) | Method for harmless and resourceful treatment of metallurgical hazardous waste | |
| KR102658327B1 (en) | Methods, devices and systems for processing complex waste sources | |
| CN103372563A (en) | Waste treatment method | |
| CN111014229B (en) | Pyrolysis recovery device utilizing waste heat of fuel cell and working method | |
| CN102219922B (en) | Comprehensive recycling method of resin component in discarded circuit board waste | |
| CN113174488B (en) | Method for extracting tin metal from waste circuit board by using sulfamic acid | |
| CN100543159C (en) | A kind of method of pulverizing circuit board by chemical swelling strengthen machine | |
| KR101902541B1 (en) | Method for recovering valuable metal from electronic scrap |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200911 |