CN100543159C - A kind of method of pulverizing circuit board by chemical swelling strengthen machine - Google Patents
A kind of method of pulverizing circuit board by chemical swelling strengthen machine Download PDFInfo
- Publication number
- CN100543159C CN100543159C CNB2007101220047A CN200710122004A CN100543159C CN 100543159 C CN100543159 C CN 100543159C CN B2007101220047 A CNB2007101220047 A CN B2007101220047A CN 200710122004 A CN200710122004 A CN 200710122004A CN 100543159 C CN100543159 C CN 100543159C
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- Prior art keywords
- wiring board
- swelling
- nonmetal
- chemical
- chemical agent
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Processing Of Solid Wastes (AREA)
Abstract
The present invention relates to a kind of method that adopts pulverizing circuit board by chemical swelling strengthen machine, it is characterized by: with chemical agent swelling processing circuitry plate, simultaneously or use the broken wiring board of mechanical crushing appliance then.The present invention adopts the bonding force between chemical agent reduction conductive metal layer and the insulation layer, and the softening nonmetal basal body of swelling, can not need like this wiring board is crushed to below 1 millimeter, just can realize metal and nonmetal high efficiency separation, reduce the difficulty of metal and nonmetal advanced treatment, prolong the life-span of broken blade simultaneously, have tangible economy and environmental benefit.
Description
Invention field
The present invention relates to the method that a kind of wiring board is handled, be specifically related to a kind of method that adopts pulverizing circuit board by chemical swelling strengthen machine.
Background technology
Along with developing rapidly of electronic industry, electron wastes has become a fastest-rising class solid waste, the environmental problem of being brought receives publicity day by day, and because most electronic apparatuss all contain the very complicated wiring board of composition, so wiring board is again typical case's representative of electron wastes.According to statistics, the waste printed circuit board that the whole nation is discharged in the environment every year surpasses 100,000 tons, if do not handle, the copper of only taking away, gold and palladium just surpass 10,000 tons of copper, 30 tons and 5 tons respectively, also have many other heavy metals in addition.The contained a lot of materials of wiring board are not only the grand strategy resource, and enter behind the environment not only contaminated land, underground water and river, and directly threaten human health by food chain easily.
The existing technology of handling of waste printed circuit board can be divided into physics method and chemical method.Physical method is that the employing mechanical processing method is pulverized, the process of the pre-treatment electron wastes such as sorting of material, not changing its chemical form and structure forms, mainly utilize the magnetic of material in the electron wastes, electrically and the difference of density carry out sorting, with metal and nonmetally carry out initial gross separation.Chinese patent CN1786222A adopts mechanical disintegration-electrostatic separation technology separating waste, worn electronic circuit board; Chinese patent CN98105592 adopts high speed shear formula fragmentation-high speed pulverization-impact grinding-ball milling-tank to separate combination process and realizes that the printed wiring plate metal separates with nonmetal.Though this class methods flow process is fairly simple, its maximum shortcoming is that wiring board fragmentation, crushing process energy consumption height, blade life are short, and metal and nonmetallic separation rate are lower.Patent USP5683040 is crushed to wiring board the fritter less than 30mm at first at normal temperatures, adopts the hammering fragmentation then at low temperatures, then in conjunction with screening, electrostatic separation and magnetic separation, realizes that metal separates with nonmetal.The advantage of this method is that metal and nonmetal good separating effect, blade life are long, but owing to need cold operation, so energy consumption and facility investment are all than higher.
Chemical method mainly adopts pyrogenic process or hydrometallurgical technology to separate carrying out physical chemistry through solid waste such as pretreated electronic wastes, reclaims valuable component." chloroazotic acid stripping-selective precipitation-calcining " technology of Germany scientist development is from reclaiming precious metal through the electron wastes that removes organic matrix." roasting is removed organism-machinery decomposition broken circuit element-nitric acid dissolve silver-hydrochloric acid and is settled out AgCl-hydrazine hydrate reduction " integrated technology of China Kunming institute exploitation also can be realized the wiring board recycling.Though pyrogenic process technology waste water generation is smaller, the off gas treatment difficulty that contains persistent organism that process produces is big; Though conventional wet technology waste gas generation is little, can produce the waste water that contains heavy metal and acid in a large number.
In recent years, people have invented some physics-chemical association method processing circuitry plate again, have reported a kind of " Non-oxygen pyrolytic-fragmentation-magnetic separation-pneumatic separation " combination process as patent CN1899712A; Patent CN1919482A has reported a kind of " pyrolysis-fragmentation of vacuum aerobic " technology separating metal and nonmetal.These methods have solved metal and the low shortcoming of nonmetal separation rate that the conventional physical method exists substantially, but process is easy to generate the difficult degradation organic exhaust gas.It is solvent with acetone that Chinese patent CN1332048C has reported a kind of, separates through the metal in the wiring board of break process and nonmetal down overcritical.Though this method does not produce waste gas, need at first broken wiring board, and will under high temperature, high pressure, work, therefore do not solve the shortcoming that the chopping blade life is short, the treating processes energy consumption is high.
In a word, still lack a kind of effectively separating metal and nonmetal at present both at home and abroad, produce the wiring board treatment technology of " three wastes " again hardly.
Summary of the invention
Purpose of the present invention is exactly to solve the problem that metal recovery rate is low, the removal process secondary pollution is heavy that existing lining plate treatment technology exists.Adopt chemical agent reduce conducting metal in the wiring board with nonmetal between bonding force, and separate with nonmetallic with Mechanical Crushing realization metal.
A kind of method that adopts pulverizing circuit board by chemical swelling strengthen machine of the present invention, it mainly comprises two kinds of effects, the first adopts chemical agent swelling processing circuitry plate, reduces the bonding force between conductive metal layer and the insulation layer; It two is wiring boards of handling with disintegrating apparatus Mechanical Crushing swelling.
Described metal conducting layer major ingredient is copper, silver, gold, platinum or palladium.
Described wiring board insulation layer major ingredient is Resins, epoxy, resol, polyimide resin, polyphenylene oxide resin, vibrin or cyanate ester resin.
Described chemical agent is the mixture that octanol, polyether glycol, sodium hydroxide, water are made by weight 5:1:1:1, perhaps acetone, the perhaps mixture made by weight 1:1:4:4 of sodium hydroxide, water, dimethyl formamide, thanomin.
20 ℃-250 ℃ of described chemical agent processing circuitry plate temperatures, absolute pressure 1.013 * 10
5Pa-1.013 * 10
7Pa, 5 minutes-300 minutes treatment time.
It is equivalent diameter air pressure between 1 millimeter and 5 centimetres with the wiring board size decreases that Mechanical Crushing refers to adopt external force, 5 minutes-300 minutes treatment time.
It is the fragment of equivalent diameter between 1 millimeter and 5 centimetres with the wiring board size decreases that Mechanical Crushing refers to adopt external force.
In order to improve the velocity of separation of metal level and non-metallic layer, prolong blade life.Wiring board can carry out Mechanical Crushing after chemical swelling is handled, perhaps chemical swelling and Mechanical Crushing are put in the reactor and carry out simultaneously.
The invention has the advantages that: at first, adopt the bonding force between chemical agent reduction conductive metal layer and the insulation layer, and the softening nonmetal basal body of swelling, like this can be without pulverizing, just can realize metal and nonmetal high efficiency separation, and prolong the life-span of broken blade; Secondly, wiring board of the present invention is handled and need not be pulverized, and just can obtain the tinsel and the nonmetal basal body of big particle diameter, for their subsequent disposal or utilization provides convenient; In addition, chemical swelling and Mechanical Crushing are carried out in a reactor simultaneously, can promote mutually that deliquescing helps fragmentation as the swelling rear board; Conversely, broken rear board diminishes, and helps chemical agent and carries out the swelling reaction.
Embodiment
Embodiment 1:
1) gets a useless circuit card, the components and parts above removing;
2) octanol, polyether glycol, sodium hydroxide, water are configured to chemical agent by weight 5:1:1:1;
3) will remove the resulting wiring board of components and parts and put into autoclave, handle 1h down at 120 ℃ with chemical agent;
4) take out wiring board, use wiring board crusher in crushing wiring board immediately
Its result: metal and nonmetal flash liberation rate surpass 96% in the wiring board.
Embodiment 2:
1) gets a circuit card, the components and parts above removing;
2) will remove the resulting wiring board of components and parts and put into the autoclave of being with shredder assembly, handle 30min down at 100 ℃ with acetone;
Its result: metal and nonmetal flash liberation rate surpass 99% in the wiring board.
Embodiment 3:
1) gets a circuit card, the components and parts above removing;
2) sodium hydroxide, water, dimethyl formamide, thanomin are configured to chemical agent by weight 1:1:4:4;
3) will remove the resulting wiring board of components and parts and put into the autoclave that autoclave is with shredder assembly, handle 5h down at 20 ℃ with chemical agent;
4) medicament is with after wiring board separates, repeating step 3) the processing circuitry plate.
Its result: during first and second time of medicament processing circuitry plate, wherein metal and nonmetal separation rate difference 99% and 98.5%.
Claims (3)
1, a kind of method that adopts pulverizing circuit board by chemical swelling strengthen machine is characterized by:
Soak wiring board with chemical agent, reduce the bonding force between wiring board conductive metal layer and the nonmetal insulation layer; Use disintegrating apparatus Mechanical Crushing wiring board when medicament soaks or after soaking; Described chemical agent is the mixture that octanol, polyether glycol, sodium hydroxide, water are made by weight 5:1:1:1, perhaps acetone, the perhaps mixture made by weight 1:1:4:4 of sodium hydroxide, water, dimethyl formamide, thanomin; 20 ℃-250 ℃ of the soaking temperatures of described chemical agent immersion wiring board, absolute pressure 1.013 * 10
5Pa-1.013 * 10
7Pa, 5 minutes-300 minutes time; It is the fragment of equivalent diameter between 1 millimeter and 5 centimetres with the wiring board size decreases that described Mechanical Crushing refers to adopt external force.
2, according to the described a kind of method that adopts chemical swelling to strengthen the wiring board fragmentation of claim 1, its described metallic conduction layer material is copper, gold and silver, platinum or palladium.
3, according to the described a kind of method that adopts chemical swelling to strengthen the wiring board fragmentation of claim 1, its described nonmetal insulating layer material is Resins, epoxy, resol, polyimide resin, polyphenylene oxide resin, vibrin or cyanate ester resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101220047A CN100543159C (en) | 2007-09-19 | 2007-09-19 | A kind of method of pulverizing circuit board by chemical swelling strengthen machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101220047A CN100543159C (en) | 2007-09-19 | 2007-09-19 | A kind of method of pulverizing circuit board by chemical swelling strengthen machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101153356A CN101153356A (en) | 2008-04-02 |
| CN100543159C true CN100543159C (en) | 2009-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101220047A Expired - Fee Related CN100543159C (en) | 2007-09-19 | 2007-09-19 | A kind of method of pulverizing circuit board by chemical swelling strengthen machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100543159C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102825055A (en) * | 2011-06-15 | 2012-12-19 | 深圳市鼎盛达模具发展有限公司 | Injection-molding waste steel sheet and plastic recovery method |
| SG11201403228RA (en) * | 2011-12-15 | 2014-07-30 | Advanced Tech Materials | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
| CN109365487B (en) * | 2018-11-30 | 2020-07-07 | 清远市进田企业有限公司 | Efficient energy-saving cleaning process for epoxy coating in waste circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1786222A (en) * | 2004-12-08 | 2006-06-14 | 浙江丰利粉碎设备有限公司 | Grinding recovery treatment technology of waste electron wiring board and its equipment |
| CN1818100A (en) * | 2005-12-29 | 2006-08-16 | 清华大学深圳研究生院 | Supercritical separating method and system for waste printing circuit boards |
-
2007
- 2007-09-19 CN CNB2007101220047A patent/CN100543159C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1786222A (en) * | 2004-12-08 | 2006-06-14 | 浙江丰利粉碎设备有限公司 | Grinding recovery treatment technology of waste electron wiring board and its equipment |
| CN1818100A (en) * | 2005-12-29 | 2006-08-16 | 清华大学深圳研究生院 | Supercritical separating method and system for waste printing circuit boards |
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| Publication number | Publication date |
|---|---|
| CN101153356A (en) | 2008-04-02 |
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