CN111640840B - 一种led真空封装工艺及真空压制装置 - Google Patents
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Abstract
一种LED真空封装工艺,包括以下步骤:(1)在基板上固晶;(2)在真空环境下将荧光软膜的边缘压制在基板上且荧光软膜位于被压制边缘的内侧部分不被压制,基板与荧光软膜之间形成晶片安装区;(3)卸真空。采用上述技术方案,将固晶后的基板放在真空压制装置中进行荧光软膜的真空压合,荧光软膜只是外周与基板压合,中间位置的晶片安装区形成真空腔,因此将基板移出真空腔后,在外界压力的作用下,将荧光软膜紧紧压合在晶片及基板上,荧光膜均匀覆盖晶片表面,外观一致性好,可使激发光色更加均匀,也省去了原有的涂覆和点胶工序,极大的提高了生产效率。另外,本发明还提供了相应的真空压制装置。
Description
技术领域
本发明涉及LED封装技术领域,尤其是一种LED真空封装工艺及真空压制装置。
背景技术
传统LED封装技术中,采用的是固晶—涂覆—点胶的工艺,工序较多,生产效率相对较低,且可能存在荧光膜在晶片表面分布不均匀现象,影响发光效果,因此,需要改进。
发明内容
本发明目的是提供一种生产效率高、荧光膜分布均匀的LED真空封装工艺。为达到上述目的,本发明采用如下技术方案:
一种LED真空封装工艺,包括以下步骤:
(1)在基板上固晶;
(2)在真空环境下将荧光软膜的边缘压制在基板上且所述荧光软膜位于被压制边缘的内侧部分不被压制,基板与荧光软膜之间形成晶片安装区;
(3)卸真空。
进一步的,晶片倒装在基板上。
进一步的,还包括以下步骤:
(4)对荧光软膜进行烘烤固化;
(5)对基板进行分粒切割,形成单个封装LED。
本发明还提供了一种应用于上述LED真空封装工艺的真空压制装置,包括真空腔、设在真空腔内的上模以及设在真空腔内的下模,所述上模的底部设有基板固定工位,所述下模的顶部形成荧光软膜安装工位,所述下模的顶部设有在压制过程中避让基板上的晶片的下凹槽,所述下模的顶部位于下凹槽的外周部分形成将荧光软膜的边缘压制在基板上的压制部。
进一步的,所述基板固定工位为设在上模底部的上凹槽,所述基板设在上凹槽中且基板固晶的一面凸出到上凹槽的下方。
进一步的,还包括驱动所述上模下压的驱动机构,所述上模的顶部设有压杆,所述压杆的顶部伸出到真空腔的上方并与驱动机构连接。
进一步的,所述下模形成对荧光软膜加热的加热模块。
进一步的,所述下模的顶面为平面且中间位置设有所述下凹槽,所述下模的顶面位于下凹槽的外侧部分形成所述荧光软膜安装工位。
进一步的,所述下凹槽的槽壁设有泄气孔。
进一步的,所述上模具有加热功能。
采用上述技术方案,将固晶后的基板放在真空压制装置中进行荧光软膜的真空压合,荧光软膜只是外周与基板压合,中间位置的晶片安装区形成真空腔,因此将基板移出真空腔后,在外界压力的作用下,将荧光软膜紧紧压合在晶片及基板上,荧光膜均匀覆盖晶片表面,外观一致性好,可使激发光色更加均匀,也省去了原有的涂覆和点胶工序,极大的提高了生产效率。
附图说明
图1为固晶工序的示意图。
图2为晶片表面覆盖了荧光软膜后的示意图。
图3为分粒切割工序后形成单个封装LED的示意图。
图4为真空压制装置的示意图。
图5为真空压制装置处于压合状态下的示意图。
具体实施方式
下面结合附图和具体实施例,对本发明进行说明。
如图1、2、3、5所示,一种LED真空封装工艺,包括以下步骤:
(1)在基板1上固晶,晶片2倒装在基板1上;
(2)在真空环境下将荧光软膜3的边缘压制在基板1上且荧光软膜3位于被压制边缘的内侧部分不被压制,基板1与荧光软膜3之间形成晶片安装区4;
(3)卸真空;
(4)对荧光软膜3进行烘烤固化;
(5)对基板1进行分粒切割,形成单个封装LED5。
如图4所示,上述步骤(2)中所用的真空压制装置,其结构具体如下:真空压制装置包括真空腔6、设在真空腔6内的上模7、设在真空腔6内的下模8、对真空腔6抽真空的真空吸管9、设在上模7顶部的压杆10以及驱动上模7向下压合的驱动机构,压杆10的顶部伸出到真空腔6的上方并与驱动机构连接,驱动机构可以是气缸、液压缸等等。
上模7的底部设有基板1固定工位,基板1固定工位为设在上模7底部的上凹槽11,基板1设在上凹槽11中且基板1固晶的一面凸出到上凹槽11的下方。
下模8的顶面为平面且中间位置设有在压制过程中避让基板1上的晶片2的下凹槽12,下模8的顶部位于下凹槽12的外周部分形成将荧光软膜3的边缘压制在基板1上的压制部13,另外,下模8的顶面位于下凹槽12的外侧部分形成荧光软膜安装工位,下凹槽12的槽壁设有泄气孔15,抽真空时候下凹槽12内的空气从泄气孔15中抽出,下模8和上模7都具有加热功能,能对荧光软膜3进行加热。
上述真空压制装置针对荧光软膜3的压制方法如下,如图4、5所示:
(1)将固晶后的基板1装夹在上模7的上凹槽11中(此处的装夹可以有多种形式,比如从上模7的外周设置向内延伸的压紧板等,此为本领域的常规技术,也不是本发明的重点,此处不再赘述);
(2)将荧光软膜3放置在下模8的顶面;
(3)闭合真空腔;
(4)抽真空;
(5)通过驱动机构驱动上模7下压,将荧光软膜3的外周部分与基板1压合;
(6)下模8对压合中的荧光软膜3进行加热;
(7)开模;
(8)卸真空。
采用上述技术方案,将固晶后的基板1放在真空压制装置中进行荧光软膜3的真空压合,荧光软膜3只是外周与基板1压合,中间位置的晶片安装区4形成真空腔6,因此将基板1移出真空腔6后,在外界压力的作用下,将荧光软膜3紧紧压合在晶片2及基板1上,荧光膜均匀覆盖晶片2表面,外观一致性好,可使激发光色更加均匀,也省去了原有的涂覆和点胶工序,极大的提高了生产效率。
上述只是采用下模放置荧光软膜,上模装夹基板的形式,也可以上模装夹荧光软膜,下模装夹基板。
以上仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改、组合和变化。凡在本发明的精神和原理之内,所作的任何修改、等同替换、改进等,均应包含在本发明的权利要求范围之内。
Claims (9)
1.一种应用于LED真空封装工艺的真空压制装置,其特征在于:所述LED真空封装工艺包括以下步骤:
(1)在基板上固晶;
(2)在真空环境下将荧光软膜的边缘压制在基板上且所述荧光软膜位于被压制边缘的内侧部分不被压制,基板与荧光软膜之间形成晶片安装区;
(3)卸真空;
真空压制装置包括真空腔、设在真空腔内的上模以及设在真空腔内的下模,所述上模的底部设有基板固定工位,所述下模的顶部形成荧光软膜安装工位,所述下模的顶部设有在压制过程中避让基板上的晶片的下凹槽,所述下模的顶部位于下凹槽的外周部分形成将荧光软膜的边缘压制在基板上的压制部。
2.根据权利要求1所述的应用于LED真空封装工艺的真空压制装置,其特征在于:所述基板固定工位为设在上模底部的上凹槽,所述基板设在上凹槽中且基板固晶的一面凸出到上凹槽的下方。
3.根据权利要求1所述的应用于LED真空封装工艺的真空压制装置,其特征在于:还包括驱动所述上模下压的驱动机构,所述上模的顶部设有压杆,所述压杆的顶部伸出到真空腔的上方并与驱动机构连接。
4.根据权利要求1所述的应用于LED真空封装工艺的真空压制装置,其特征在于:所述下模形成对荧光软膜加热的加热模块。
5.根据权利要求1所述的应用于LED真空封装工艺的真空压制装置,其特征在于:所述下模的顶面为平面且中间位置设有所述下凹槽,所述下模的顶面位于下凹槽的外侧部分形成所述荧光软膜安装工位。
6.根据权利要求1所述的应用于LED真空封装工艺的真空压制装置,其特征在于:所述下凹槽的槽壁设有泄气孔。
7.根据权利要求1所述的应用于LED真空封装工艺的真空压制装置,其特征在于:所述上模具有加热功能。
8.根据权利要求1所述的应用于LED真空封装工艺的真空压制装置,其特征在于:晶片倒装在基板上。
9.根据权利要求1所述的应用于LED真空封装工艺的真空压制装置,其特征在于:所述LED真空封装工艺还包括以下步骤:
(4)对荧光软膜进行烘烤固化;
(5)对基板进行分粒切割,形成单个封装LED。
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