CN111613529B - Wafer packaging technology - Google Patents
Wafer packaging technology Download PDFInfo
- Publication number
- CN111613529B CN111613529B CN202010463058.5A CN202010463058A CN111613529B CN 111613529 B CN111613529 B CN 111613529B CN 202010463058 A CN202010463058 A CN 202010463058A CN 111613529 B CN111613529 B CN 111613529B
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- Prior art keywords
- wafer
- cutting
- spacing piece
- glue
- spacing
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- 238000012536 packaging technology Methods 0.000 title description 2
- 238000005520 cutting process Methods 0.000 claims abstract description 94
- 239000003292 glue Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims abstract description 26
- 238000012858 packaging process Methods 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 238000003475 lamination Methods 0.000 claims abstract description 6
- 235000012431 wafers Nutrition 0.000 claims description 90
- 125000006850 spacer group Chemical group 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 16
- 239000002313 adhesive film Substances 0.000 claims description 12
- 238000005096 rolling process Methods 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- 230000001502 supplementing effect Effects 0.000 abstract 1
- 238000000926 separation method Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000007630 basic procedure Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention belongs to the technical field of wafer packaging, and particularly discloses a wafer packaging process, which comprises the following steps: pre-cutting the lens surface of the wafer, using glue on the substrate or the lower surface of the spacing piece, positioning and aligning the spacing piece, pressing the spacing piece, using glue on the spacing piece, positioning and aligning the wafer subjected to pre-cutting, pressing the spacing piece, and supplementing glue to the cutting channel. Forming a plurality of cutting channels by adopting spacing or interlacing pre-cutting, using glue on a spacing piece which does not correspond to the cutting channels, and when the wafer and the spacing piece are pressed, discharging redundant gas in each small module through a gap between the cutting channels and the position where the spacing piece does not use the glue, balancing the internal and external air pressure of each module, thereby being beneficial to compact structure and no deformation; after the lamination between the wafer and the spacing piece is carried out, the dispensing machine is used for carrying out supplementary dispensing on the positions, corresponding to the spacing piece, of the cutting channel without dispensing, so that the sealing is carried out, and good air tightness is ensured.
Description
Technical Field
The invention relates to the technical field of wafer packaging, in particular to a wafer packaging process.
Background
The prior wafer packaging process comprises the following basic procedures: glue rolling on the substrate, positioning and aligning and placing the spacing piece, pressing, glue rolling on the spacing piece, positioning and placing the wafer, and pressing, wherein equipment is used between the two steps: glue rolling machine, pressing jig, photoetching machine, and the technological defects are: the wafer is easy to deform; the pressure difference between the inside and the outside (the inside is large and the outside is small) causes poor air tightness during the pressing; the thickness of the packaging module is not uniform; the adhesive tape makes the whole packaged module not firm enough.
Disclosure of Invention
The invention aims to provide a wafer packaging process, which solves the technical problems of poor air tightness and easy deformation of wafers in wafer packaging.
The invention is realized by the following technical scheme:
a process for packaging a wafer, comprising the steps of:
step 5, aligning and pressing the wafer pre-cut in the step 1 with the spacing piece;
and 6, performing supplementary dispensing on the cutting path of the wafer.
A process for packaging a wafer, comprising the steps of:
step 5, aligning and pressing the wafer pre-cut in the step 1 with the spacing piece;
and 6, performing supplementary dispensing on the cutting path of the wafer.
In step 4, the adhesive layer is glued or rolled.
Further, when the dispensing mode is adopted, the step 4 specifically includes: and dispensing on the spacing piece which is not corresponding to the cutting channel on the wafer.
Further, when the glue rolling mode is adopted, the step 4 specifically includes: and (3) glue is rolled on the upper surface of the spacing piece, and the glue on the surface of the upper surface of the spacing piece corresponding to the cutting channel is removed.
Further, in step 3 and step 5, the adhesive layer is heat-cured at the time of alignment lamination.
Further, a glue film is attached to the plane of the wafer in advance before the step 1; the adhesive film is torn off after step 5 is completed.
Further, the adhesive film adopts a UV film.
In step 1, the pre-cut position corresponds to the position of the spacing sheet and the substrate at the interlacing or spacing.
Further, in step 1, the scribe line width is less than the thickness of the spacer.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention discloses a packaging process of a wafer, which is characterized in that a wafer lens surface is pre-cut, a pre-cutting mode adopts array separation or interlacing pre-cutting, so that a plurality of cutting channels can be formed, a spacer and a substrate are aligned and bonded through glue, then glue is used on the spacer which does not correspond to the cutting channels, namely the spacer is interlaced or array separation glue, when the wafer and the spacer are pressed, redundant gas in each small module can be discharged through a gap between the pre-cut cutting channels and the position of the spacer which is not used by glue, the internal and external air pressure of each module is balanced, and the structure is compact and deformation-free; after the lamination between the wafer and the spacing piece is carried out, the adhesive dispensing machine is supplemented at the corresponding position of the cutting channel without adhesive and the spacing piece so as to seal and ensure good air tightness.
Further, the dispensing mode or the glue rolling mode can be selected by using glue on the spacing piece which is not corresponding to the cutting channel on the wafer, and the glue is selected according to the process requirement.
Further, when the dispensing mode is adopted, the dispensing is directly performed on the spacing piece which does not correspond to the cutting channel, the dispensing can be precisely performed to the position where the dispensing is required on the product, the dispensing quantity can be well controlled through the replacement of the dispensing needle head model, the dispensing can be performed through the adjustment and the solidification of the dispensing programs of different types of products, and the dispensing is beneficial to the protection of the required dispensing product.
Further, when the glue rolling mode is adopted, glue is firstly rolled on the upper surface of the spacing piece, then glue on the surface of the upper surface of the spacing piece corresponding to the cutting channel is removed, so that interlacing or spacing glue for the spacing piece can be ensured, the glue uniformity and thickness can be well controlled by adopting the glue rolling method, the efficiency is high, the glue can be controlled to be thinner, and the glue layer is generally in a micron level.
Further, the wafer plane is subjected to film pasting before pre-cutting, so that the whole wafer is guaranteed to be integrated.
Furthermore, the width of the designed cutting channel is smaller than the thickness of each spacing piece, so that glue leakage can be avoided during glue repairing.
Drawings
FIG. 1 is a diagram showing the wafer scribe line positions and spacer and substrate correspondence according to the present invention;
FIG. 2 is a schematic illustration of a package between a wafer and a substrate according to the present invention;
FIG. 3 is a schematic view of a package structure of the present invention with the adhesive film removed;
wherein 1 is a wafer, 2 is a dicing channel, 3 is a spacer, 4 is a substrate, and 5 is a glue film.
Detailed Description
The invention will now be described in further detail with reference to specific examples, which are intended to illustrate, but not to limit, the invention.
Example 1
The invention discloses a wafer packaging process, which specifically comprises the following steps:
1) The lens surface of the wafer 1 is pre-cut by a cutting machine, and a pre-cutting mode adopts array or interlace pre-cutting to form a plurality of cutting channels 2;
2) Dispensing on the substrate 4;
3) Positioning, aligning and placing the spacing piece 3;
4) Aligning and pressing the spacing piece 3 and the substrate 4;
5) Dispensing on the spacer 3: dispensing on the spacing pieces 3 which do not correspond to the cutting channels 2 on the wafer 1;
6) Positioning and aligning the wafer 1 subjected to pre-cutting;
7) Pressing the wafer 1 and the spacing piece 3;
8) And (5) performing supplementary dispensing on the cutting path 2 of the wafer 1.
Example 2
The invention discloses a wafer packaging process, which specifically comprises the following steps:
1) The lens surface of the wafer 1 is pre-cut by a cutting machine, and a pre-cutting mode adopts array or interlace pre-cutting to form a plurality of cutting channels 2;
2) Dispensing on the substrate 4;
3) Positioning, aligning and placing the spacing piece 3;
4) Aligning and pressing the spacing piece 3 and the substrate 4;
5) Glue is rolled on the upper surface of the spacing piece 3, and the glue on the surface of the upper surface of the spacing piece 3 corresponding to the cutting channel 2 is removed; the thickness of the adhesive layer can be changed according to the process requirement;
6) Positioning and aligning the wafer 1 subjected to pre-cutting;
7) Pressing the wafer 1 and the spacing piece 3;
8) And (5) performing supplementary dispensing on the cutting path 2 of the wafer 1.
Example 3
The invention discloses a wafer packaging process, which specifically comprises the following steps:
1) The lens surface of the wafer 1 is pre-cut by a cutting machine, and a pre-cutting mode adopts array or interlace pre-cutting to form a plurality of cutting channels 2;
2) Glue is rolled on the lower surface of the spacing sheet 3, and the thickness of the glue layer can be changed according to the process requirement;
3) Positioning, aligning and placing the spacing piece 3;
4) Aligning and pressing the spacing piece 3 and the substrate 4;
5) Dispensing on the spacer 3: dispensing on the spacing pieces 3 which do not correspond to the cutting channels 2 on the wafer 1;
6) Positioning and aligning the wafer 1 subjected to pre-cutting;
7) Pressing the wafer 1 and the spacing piece 3;
8) And (5) performing supplementary dispensing on the cutting path 2 of the wafer 1.
Example 4
The invention discloses a wafer packaging process, which specifically comprises the following steps:
1) The lens surface of the wafer 1 is pre-cut by a cutting machine, and a pre-cutting mode adopts array or interlace pre-cutting to form a plurality of cutting channels 2;
2) Glue is rolled on the lower surface of the spacing sheet 3, and the thickness of the glue layer can be changed according to the process requirement;
3) Positioning, aligning and placing the spacing piece 3;
4) Aligning and pressing the spacing piece 3 and the substrate 4;
5) Glue is rolled on the upper surface of the spacing piece 3, and the glue on the surface of the upper surface of the spacing piece 3 corresponding to the cutting channel 2 is removed; the thickness of the adhesive layer can be changed according to the process requirement;
6) Positioning and aligning the wafer 1 subjected to pre-cutting;
7) Pressing the wafer 1 and the spacing piece 3;
8) And (5) performing supplementary dispensing on the cutting path 2 of the wafer 1.
Example 5
The invention discloses a wafer packaging process, which specifically comprises the following steps:
1) Bonding the plane of the wafer 1 with the adhesive film 5;
2) The lens surface of the wafer 1 is pre-cut by a cutting machine, and a pre-cutting mode adopts array or interlace pre-cutting to form a plurality of cutting channels 2;
3) Dispensing on the substrate 4;
4) Positioning, aligning and placing the spacing piece 3;
5) Aligning and pressing the spacing piece 3 and the substrate 4;
6) Dispensing on the spacer 3: dispensing on the spacing pieces 3 which do not correspond to the cutting channels 2 on the wafer 1;
7) Positioning and aligning the wafer 1 subjected to pre-cutting;
8) Pressing the wafer 1 and the spacing piece 3 to form a structure shown in fig. 2;
9) Tearing off the adhesive film 5;
10 The dicing streets 2 of the wafer 1 are subjected to supplementary dispensing.
The precut may be longitudinal precut (as shown in fig. 1) or transverse precut, both of which are equivalent and therefore not shown.
The spacer 3 is not limited to the square grid structure shown in fig. 1, but may be a strip-shaped space, a circular space, or the like.
The adhesive film 5 may or may not be required, and the main purpose is to ensure that the whole wafer is connected together. When the adhesive film 5 is not adhered, the wafer 1 is not cut completely when being pre-cut, and the whole wafer is still connected into a whole.
The rubberized film 5 is an adhesive film which is easy to tear, free of corrosion and adhesive residue. UV films are generally used.
More preferably, the glue layer is heated to accelerate curing during the alignment and pressing.
The pressing before tearing off the adhesive film 5 can enable the redundant gas in each small module to be discharged through the gap between the pre-cut cutting channel 2 and the position where the spacing piece 3 is not used for dispensing, so that the internal and external air pressure of each module is balanced, and the structure is compact and deformation is avoided; after the lamination between the wafer 1 and the spacer 3 is performed, as shown in fig. 3, the adhesive film 5 attached to the plane of the wafer 1 is torn off, and the positions of the dicing lines 2 without dispensing and the corresponding positions of the spacer 3 are subjected to dispensing by a dispenser for sealing.
More preferably, for all embodiments, the pre-cutting position corresponds to the interlaced or spaced positions of the spacing sheet 3 and the substrate 4, so that no glue leakage is ensured during glue repairing, and no glue dispensing is ensured on the cut product.
The width of the cutting channel 2 is smaller than the thickness of each spacing piece 3, so that glue leakage can be avoided during glue repairing.
When dispensing on the spacer 3, the position corresponding to the pre-cut channel 2 of the wafer 1 is reserved for not dispensing, and the other positions are all dispensed with a proper amount of glue by a dispenser.
In order to ensure that there is no air pressure difference between the inside and the outside of the die set in the lamination process, as shown in fig. 1, the pre-cutting position of the wafer 1 is a row-spacing or an interlaced pre-cutting position, the pre-cutting position corresponds to the interlaced (or row-spacing) position of the spacing sheet 3 and the substrate 4, the cutting start surface is one surface of the wafer 1 with a lens surface type, as shown in fig. 1, a plurality of vertical lines are cut channels 2 after cutting, and such cut channels 2 can ensure that the redundant air in each small die set is discharged, and balance the air pressure between the inside and the outside until there is no air pressure difference.
The module is a combined module which is composed of a chip, a spacing piece and a wafer and has the function of transmitting or receiving photoelectric signals.
The process has the advantages that: the packaging structure is suitable for packaging wafers 1 with all thicknesses; the dispensing quantity is sufficient, and the structure is stable; the inside and outside of the press fit basically have no air pressure difference, and the air tightness can be ensured after dispensing is supplemented; the thickness of the packaging module is uniform.
Claims (10)
1. The wafer packaging process is characterized by comprising the following steps of:
step 1, pre-cutting a lens surface of a wafer (1), wherein a pre-cutting mode adopts array or interlaced pre-cutting to form a plurality of cutting channels (2);
step 2, dispensing on the substrate (4);
step 3, aligning and pressing the spacing piece (3) and the substrate (4): bonding a plurality of spacing pieces (3) arranged in rows or columns on a substrate (4), wherein the spacing pieces (3) comprise two parts, one part corresponds to the positions of the cutting channels (2) on the wafer (1), the other part is positioned between the two cutting channels (2), and the plurality of spacing pieces (3) and the substrate (4) are aligned and pressed;
step 4, adhering an adhesive layer on the spacing piece (3) which is not corresponding to the cutting channel (2) on the wafer (1); the adhesive layer is not adhered to the spacing piece (3) corresponding to the cutting channel (2) on the wafer (1);
step 5, aligning and pressing the wafer (1) pre-cut in the step 1 and the spacing piece (3);
and 6, performing supplementary dispensing on the cutting channel (2) of the wafer (1).
2. The wafer packaging process is characterized by comprising the following steps of:
step 1, pre-cutting a lens surface of a wafer (1), wherein a pre-cutting mode adopts array or interlaced pre-cutting to form a plurality of cutting channels (2);
step 2, glue rolling is carried out on the lower surface of the spacing piece (3);
step 3, aligning and pressing the spacer (3) with the adhesive rolled on the lower surface and the substrate (4): bonding a plurality of spacing pieces (3) arranged in rows or columns on a substrate (4), wherein the spacing pieces (3) comprise two parts, one part corresponds to the positions of the cutting channels (2) on the wafer (1), the other part is positioned between the two cutting channels (2), and the plurality of spacing pieces (3) and the substrate (4) are aligned and pressed;
step 4, adhering an adhesive layer on the spacing piece (3) which is not corresponding to the cutting channel (2) on the wafer (1); the adhesive layer is not adhered to the spacing piece (3) corresponding to the cutting channel (2) on the wafer (1);
step 5, aligning and pressing the wafer (1) pre-cut in the step 1 and the spacing piece (3);
and 6, performing supplementary dispensing on the cutting channel (2) of the wafer (1).
3. The process according to claim 1 or 2, wherein in step 4, the adhesive layer is applied by dispensing or by glue rolling.
4. The process of claim 3, wherein when dispensing is performed, step 4 comprises:
dispensing on a spacer (3) which does not correspond to the dicing lane (2) on the wafer (1).
5. The wafer packaging process according to claim 3, wherein when the glue rolling manner is adopted, step 4 specifically comprises:
and (3) rolling glue on the upper surface of the spacing piece (3), and removing glue on the surface of the upper surface of the spacing piece (3) corresponding to the cutting channel (2).
6. The process of claim 1 or 2, wherein in step 3 and step 5, the glue layer is heat cured during the alignment lamination.
7. The process for packaging wafers according to claim 1 or 2, characterized in that a film of glue (5) is previously applied on the plane of the wafer (1) before step 1; after step 5 is completed, the adhesive film (5) is torn off.
8. The wafer packaging process according to claim 7, wherein the adhesive film (5) is a UV film.
9. The process of claim 1 or 2, wherein in step 1, the pre-cut position corresponds to the position of the interleaving or spacing of the spacer (3) and the substrate (4).
10. The process of packaging wafers according to claim 1 or 2, wherein in step 1 the dicing streets (2) have a width smaller than the thickness of the spacer (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010463058.5A CN111613529B (en) | 2020-05-27 | 2020-05-27 | Wafer packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010463058.5A CN111613529B (en) | 2020-05-27 | 2020-05-27 | Wafer packaging technology |
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| Publication Number | Publication Date |
|---|---|
| CN111613529A CN111613529A (en) | 2020-09-01 |
| CN111613529B true CN111613529B (en) | 2023-05-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202010463058.5A Active CN111613529B (en) | 2020-05-27 | 2020-05-27 | Wafer packaging technology |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250790A (en) * | 2006-03-15 | 2007-09-27 | Shin Etsu Polymer Co Ltd | Manufacturing method of semiconductor chip |
| CN108987294A (en) * | 2018-06-21 | 2018-12-11 | 上海飞骧电子科技有限公司 | Solve the problems, such as the passive device GaAs brush coating method of encapsulation excessive glue |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070190747A1 (en) * | 2006-01-23 | 2007-08-16 | Tessera Technologies Hungary Kft. | Wafer level packaging to lidded chips |
| JP2007250789A (en) * | 2006-03-15 | 2007-09-27 | Shin Etsu Polymer Co Ltd | Protective structure of semiconductor wafer, and grinding method of semiconductor wafer using the same |
| TWI476877B (en) * | 2012-10-15 | 2015-03-11 | Win Semiconductors Corp | Structure and method for air cavity packaging |
| JP2014138143A (en) * | 2013-01-18 | 2014-07-28 | Toyota Motor Corp | Method of manufacturing semiconductor device, semiconductor wafer, and semiconductor device |
| CN103280514A (en) * | 2013-05-29 | 2013-09-04 | 华南理工大学 | Method for automatically packaging LED module |
| JP2015175015A (en) * | 2014-03-14 | 2015-10-05 | 東京エレクトロン株式会社 | Substrate treatment method, and substrate treatment jig |
| CN104022145B (en) * | 2014-06-23 | 2017-01-25 | 深圳市华星光电技术有限公司 | Substrate packaging method and packaging structure |
| JP6310803B2 (en) * | 2014-07-29 | 2018-04-11 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
| CN111146317A (en) * | 2020-02-21 | 2020-05-12 | 盐城东山精密制造有限公司 | Cutting module in LED encapsulation |
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2020
- 2020-05-27 CN CN202010463058.5A patent/CN111613529B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250790A (en) * | 2006-03-15 | 2007-09-27 | Shin Etsu Polymer Co Ltd | Manufacturing method of semiconductor chip |
| CN108987294A (en) * | 2018-06-21 | 2018-12-11 | 上海飞骧电子科技有限公司 | Solve the problems, such as the passive device GaAs brush coating method of encapsulation excessive glue |
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| CN111613529A (en) | 2020-09-01 |
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