CN111613529A - Wafer packaging process - Google Patents
Wafer packaging process Download PDFInfo
- Publication number
- CN111613529A CN111613529A CN202010463058.5A CN202010463058A CN111613529A CN 111613529 A CN111613529 A CN 111613529A CN 202010463058 A CN202010463058 A CN 202010463058A CN 111613529 A CN111613529 A CN 111613529A
- Authority
- CN
- China
- Prior art keywords
- wafer
- cutting
- glue
- dispensing
- spacing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012858 packaging process Methods 0.000 title claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 84
- 239000003292 glue Substances 0.000 claims abstract description 63
- 238000003825 pressing Methods 0.000 claims abstract description 28
- 125000006850 spacer group Chemical group 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 15
- 238000005096 rolling process Methods 0.000 claims description 15
- 239000002313 adhesive film Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 70
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention belongs to the technical field of wafer packaging, and particularly discloses a wafer packaging process, which comprises the following steps: pre-cutting the lens surface of the wafer → using glue on the substrate or the lower surface of the spacer → positioning and aligning and placing the spacer → pressing → using glue on the spacer → positioning and aligning and placing the pre-cut wafer → pressing → performing supplementary dispensing on the cutting path. The wafer is pressed with the spacing piece, so that redundant gas in each small module can be discharged through a gap between the cutting channel and the position of the spacing piece without using glue, the internal and external air pressure of each module is balanced, and the structure is compact and is free from deformation; after the wafer and the spacing piece are pressed, the cutting channel without glue dispensing and the corresponding position of the spacing piece are supplemented with glue dispensing by a glue dispenser, so that the sealing is facilitated, and the good air tightness is ensured.
Description
Technical Field
The invention relates to the technical field of wafer packaging, in particular to a packaging process of a wafer.
Background
The existing wafer packaging process comprises the following basic processes: glue on the substrate → positioning alignment and placing spacers → pressing → glue on the spacers → positioning and placing wafers → pressing, with equipment used in between: glue rolling machine, pressing fixture and photoetching machine, and has the process defects that: the wafer is easy to deform; poor air tightness caused by the difference between the internal pressure and the external pressure (large inside and small outside) during pressing; the thickness of the packaging module is not uniform; the glue rolling bonding makes the whole packaged module not firm enough.
Disclosure of Invention
The invention aims to provide a packaging process of a wafer, which solves the technical problems of poor air tightness and easy deformation of the wafer in wafer packaging.
The invention is realized by the following technical scheme:
a packaging process of a wafer comprises the following steps:
step 5, aligning and pressing the wafer pre-cut in the step 1 with the spacing piece;
and 6, performing supplementary dispensing on the cutting channels of the wafer.
A packaging process of a wafer comprises the following steps:
step 5, aligning and pressing the wafer pre-cut in the step 1 with the spacing piece;
and 6, performing supplementary dispensing on the cutting channels of the wafer.
Further, in step 4, the adhesive layer is dispensed or rolled.
Further, when a dispensing manner is adopted, the step 4 specifically comprises: and dispensing on the spacer which does not correspond to the cutting channels on the wafer.
Further, when a glue rolling mode is adopted, the step 4 specifically comprises the following steps: and (4) rolling glue on the upper surface of the spacing piece, and removing the glue on the surface of the upper surface of the spacing piece corresponding to the cutting channel.
Further, in step 3 and step 5, the glue layer is heated and cured while being aligned and pressed.
Further, before step 1, gluing a glue film on the plane of the wafer in advance; the glue film is torn off after step 5 is completed.
Further, the adhesive film is a UV film.
Further, in step 1, the precut position corresponds to the position of the spacer and the substrate in alternate lines or alternate rows.
Further, in step 1, the width of the cutting street is smaller than the thickness of the spacing piece.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention discloses a packaging process of a wafer, wherein a lens surface of the wafer is precut, and the precut mode adopts spaced or interlaced precut, so that a plurality of cutting channels can be formed, a spacer and a substrate are aligned and bonded through glue, then the spacer which does not correspond to the cutting channels is glued, namely the spacer is glued in the spaced or spaced mode, when the wafer and the spacer are pressed, redundant gas in each small module can be discharged through a gap between the precut cutting channel and the position where the spacer is not glued, the internal and external air pressure of each module is balanced, and the structure is compact and is free from deformation; after the wafer and the spacing piece are pressed, the cutting channel without glue and the corresponding position of the spacing piece are supplemented and glued by a glue dispenser, so that the sealing is facilitated, and the good air tightness is ensured.
Furthermore, the glue is applied to the spacing pieces not corresponding to the cutting channels on the wafer, so that the glue dispensing mode or the glue rolling mode can be selected, and the glue dispensing mode and the glue rolling mode are selected according to the process requirements.
Furthermore, when the dispensing mode is adopted, the dispensing is directly performed on the spacing piece which does not correspond to the cutting channel, the dispensing position on the product which needs dispensing can be accurately dispensed, the dispensing amount can be well controlled through the replacement of the dispensing needle head model, the dispensing can be performed by one-key dispensing through the adjustment and solidification of the dispensing program of different products, and the dispensing is beneficial to the protection of the product which needs dispensing.
Furthermore, when the glue rolling mode is adopted, firstly the glue is rolled on the upper surface of the spacing piece, and then the glue on the surface of the upper surface of the spacing piece corresponding to the cutting channel is removed, so that the glue can be used for the spacing piece in an interlaced or spaced mode, the glue uniformity and thickness can be well controlled by adopting the glue rolling method, the efficiency is high, the thinner glue can be controlled, and the glue layer is generally in a micron-scale.
Further, before pre-cutting, the wafer plane is pasted with a film, so that the whole wafer is integrated.
Furthermore, the width of the cutting path is designed to be smaller than the thickness of each spacer, so that glue leakage can be avoided during glue filling.
Drawings
FIG. 1 is a diagram of the wafer scribe line location and spacer and substrate mapping of the present invention;
FIG. 2 is a schematic view of a package between a wafer and a substrate according to the present invention;
FIG. 3 is a schematic view of the package structure of the present invention with the adhesive film removed;
wherein, 1 is a wafer, 2 is a cutting channel, 3 is a spacing piece, 4 is a substrate, and 5 is a glue film.
Detailed Description
The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.
Example 1
The invention discloses a packaging process of a wafer, which specifically comprises the following steps:
1) pre-cutting the lens surface of the wafer 1 by using a cutting machine, wherein the pre-cutting mode adopts spaced or interlaced pre-cutting to form a plurality of cutting channels 2;
2) dispensing on the substrate 4;
3) positioning, aligning and placing the spacing piece 3;
4) aligning and pressing the spacing sheet 3 and the substrate 4;
5) dispensing on the spacer 3: dispensing on the spacing pieces 3 which do not correspond to the cutting channels 2 on the wafer 1;
6) positioning, aligning and placing the pre-cut wafer 1;
7) pressing the wafer 1 and the spacing sheet 3;
8) and performing supplementary dispensing on the cutting channels 2 of the wafer 1.
Example 2
The invention discloses a packaging process of a wafer, which specifically comprises the following steps:
1) pre-cutting the lens surface of the wafer 1 by using a cutting machine, wherein the pre-cutting mode adopts spaced or interlaced pre-cutting to form a plurality of cutting channels 2;
2) dispensing on the substrate 4;
3) positioning, aligning and placing the spacing piece 3;
4) aligning and pressing the spacing sheet 3 and the substrate 4;
5) rolling glue on the upper surface of the spacing piece 3, and removing the glue on the surface of the upper surface of the spacing piece 3 corresponding to the cutting channel 2; the thickness of the glue layer can be changed according to the process requirement;
6) positioning, aligning and placing the pre-cut wafer 1;
7) pressing the wafer 1 and the spacing sheet 3;
8) and performing supplementary dispensing on the cutting channels 2 of the wafer 1.
Example 3
The invention discloses a packaging process of a wafer, which specifically comprises the following steps:
1) pre-cutting the lens surface of the wafer 1 by using a cutting machine, wherein the pre-cutting mode adopts spaced or interlaced pre-cutting to form a plurality of cutting channels 2;
2) the lower surface of the spacing sheet 3 is glued, and the thickness of the glue layer can be changed according to the process requirement;
3) positioning, aligning and placing the spacing piece 3;
4) aligning and pressing the spacing sheet 3 and the substrate 4;
5) dispensing on the spacer 3: dispensing on the spacing pieces 3 which do not correspond to the cutting channels 2 on the wafer 1;
6) positioning, aligning and placing the pre-cut wafer 1;
7) pressing the wafer 1 and the spacing sheet 3;
8) and performing supplementary dispensing on the cutting channels 2 of the wafer 1.
Example 4
The invention discloses a packaging process of a wafer, which specifically comprises the following steps:
1) pre-cutting the lens surface of the wafer 1 by using a cutting machine, wherein the pre-cutting mode adopts spaced or interlaced pre-cutting to form a plurality of cutting channels 2;
2) the lower surface of the spacing sheet 3 is glued, and the thickness of the glue layer can be changed according to the process requirement;
3) positioning, aligning and placing the spacing piece 3;
4) aligning and pressing the spacing sheet 3 and the substrate 4;
5) rolling glue on the upper surface of the spacing piece 3, and removing the glue on the surface of the upper surface of the spacing piece 3 corresponding to the cutting channel 2; the thickness of the glue layer can be changed according to the process requirement;
6) positioning, aligning and placing the pre-cut wafer 1;
7) pressing the wafer 1 and the spacing sheet 3;
8) and performing supplementary dispensing on the cutting channels 2 of the wafer 1.
Example 5
The invention discloses a packaging process of a wafer, which specifically comprises the following steps:
1) bonding the plane of the wafer 1 with the adhesive film 5;
2) pre-cutting the lens surface of the wafer 1 by using a cutting machine, wherein the pre-cutting mode adopts spaced or interlaced pre-cutting to form a plurality of cutting channels 2;
3) dispensing on the substrate 4;
4) positioning, aligning and placing the spacing piece 3;
5) aligning and pressing the spacing sheet 3 and the substrate 4;
6) dispensing on the spacer 3: dispensing on the spacing pieces 3 which do not correspond to the cutting channels 2 on the wafer 1;
7) positioning, aligning and placing the pre-cut wafer 1;
8) pressing the wafer 1 and the spacing sheet 3 to form the structure shown in FIG. 2;
9) tearing off the adhesive film 5;
10) and performing supplementary dispensing on the cutting channels 2 of the wafer 1.
The pre-cut may be longitudinal (as shown in fig. 1) or transverse, both equivalent and therefore not shown.
The spacer 3 is not limited to the square lattice structure shown in fig. 1, but may be only one of them, and may be a stripe-shaped interval or a circular interval.
The adhesive film 5 may or may not be required, and the main purpose is to ensure that the whole wafer is connected together. When the adhesive film 5 is not pasted, the wafer 1 is not cut completely when being precut, and the whole wafer is connected into a whole with a little left on two sides.
The adhesive film 5 is an adhesive film which is easy to tear, free of corrosion and free of residual adhesive. UV films are generally used.
Preferably, the adhesive layer is heated to accelerate curing during aligning and pressing.
The press fit before the adhesive film 5 is torn off can discharge the redundant gas in each small module through the gap between the pre-cut cutting channel 2 and the position of the spacing piece 3 without adhesive dispensing, balance the internal and external air pressure of each module, and facilitate the compact structure without deformation; after the wafer 1 and the spacer 3 are pressed together, as shown in fig. 3, the adhesive film 5 attached to the plane of the wafer 1 is torn off, and the adhesive dispensing is performed on the positions corresponding to the cutting streets 2 and the spacer 3 without adhesive dispensing by using a dispenser for sealing.
Preferably, for all embodiments, the precut position corresponds to the interlaced or spaced position of the spacing piece 3 and the substrate 4, so that no glue leakage is ensured during glue filling, and no glue dispensing is ensured on a cut product.
The width of the cutting channel 2 is less than the thickness of each spacer 3, so that glue leakage can be avoided during glue filling.
When dispensing is carried out on the spacing pieces 3, the positions corresponding to the pre-cutting channels 2 of the wafer 1 are reserved and no dispensing is carried out, and the other places are dispensed with a proper amount of glue by a glue dispenser.
In order to ensure that no air pressure difference exists between the inside and the outside of the module in the pressing process, as shown in fig. 1, the precut position of the wafer 1 is spaced or interlaced precut, the precut position corresponds to the spaced (or spaced) position of the spacer 3 and the substrate 4, the cutting starting surface is the surface of the wafer 1 with the lens surface, as shown in fig. 1, a plurality of vertical lines are cutting channels 2 after cutting, and the cutting channels 2 can ensure that redundant air in each small module is discharged, and balance the inside and outside air pressure until no air pressure difference exists.
The module is a combined module which consists of a chip, a spacer and a wafer and has a photoelectric signal transmitting or receiving function.
The process of the invention has the advantages that: the method is suitable for packaging wafers 1 with all thicknesses; the glue dispensing amount is sufficient, and the structure is stable; when in pressing, no air pressure difference exists between the inside and the outside basically, and the air tightness can be ensured after the glue is supplemented and dispensed; the thickness of the package module is uniform.
Claims (10)
1. A packaging process of a wafer is characterized by comprising the following steps:
step 1, pre-cutting a lens surface of a wafer (1), wherein the pre-cutting mode adopts spaced or interlaced pre-cutting to form a plurality of cutting channels (2);
step 2, dispensing on the substrate (4);
step 3, aligning and pressing the spacing sheet (3) and the substrate (4);
step 4, gluing a glue layer on the spacing pieces (3) which do not correspond to the cutting channels (2) on the wafer (1);
step 5, aligning and pressing the wafer (1) pre-cut in the step 1 with the spacing piece (3);
and 6, performing supplementary dispensing on the cutting channels (2) of the wafer (1).
2. A packaging process of a wafer is characterized by comprising the following steps:
step 1, pre-cutting a lens surface of a wafer (1), wherein the pre-cutting mode adopts spaced or interlaced pre-cutting to form a plurality of cutting channels (2);
step 2, rolling glue on the lower surface of the spacing sheet (3);
step 3, aligning and pressing the spacing sheet (3) with the lower surface being glued with the substrate (4);
step 4, gluing a glue layer on the spacing pieces (3) which do not correspond to the cutting channels (2) on the wafer (1);
step 5, aligning and pressing the wafer (1) pre-cut in the step 1 with the spacing piece (3);
and 6, performing supplementary dispensing on the cutting channels (2) of the wafer (1).
3. The process for packaging a wafer according to claim 1 or 2, wherein in the step 4, the adhesive layer is dispensed or rolled.
4. The wafer packaging process of claim 3, wherein when the dispensing manner is adopted, the step 4 specifically comprises:
dispensing on the spacing pieces (3) which do not correspond to the cutting channels (2) on the wafer (1).
5. The wafer packaging process according to claim 3, wherein when the glue rolling manner is adopted, the step 4 specifically comprises:
and (3) rolling glue on the upper surface of the spacing piece (3), and removing the glue on the surface of the upper surface of the spacing piece (3) corresponding to the cutting channel (2).
6. The process for packaging the wafer as claimed in claim 1 or 2, wherein in step 3 and step 5, the adhesive layer is heated and cured during the alignment and pressing.
7. The packaging process of the wafer according to claim 1 or 2, characterized in that an adhesive film (5) is previously attached to the plane of the wafer (1) before step 1; the glue film (5) is torn off after step 5 is completed.
8. The packaging process of the wafer according to claim 7, wherein the adhesive film (5) is a UV film.
9. The process for packaging a wafer according to claim 1 or 2, wherein the precut position in step 1 corresponds to a position where the spacers (3) and the substrate (4) are interlaced or spaced.
10. The process for packaging a wafer according to claim 1 or 2, wherein in step 1, the width of the scribe line (2) is smaller than the thickness of the spacer (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010463058.5A CN111613529B (en) | 2020-05-27 | 2020-05-27 | Wafer packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010463058.5A CN111613529B (en) | 2020-05-27 | 2020-05-27 | Wafer packaging technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111613529A true CN111613529A (en) | 2020-09-01 |
| CN111613529B CN111613529B (en) | 2023-05-23 |
Family
ID=72203148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010463058.5A Active CN111613529B (en) | 2020-05-27 | 2020-05-27 | Wafer packaging technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111613529B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070190747A1 (en) * | 2006-01-23 | 2007-08-16 | Tessera Technologies Hungary Kft. | Wafer level packaging to lidded chips |
| JP2007250789A (en) * | 2006-03-15 | 2007-09-27 | Shin Etsu Polymer Co Ltd | Protective structure of semiconductor wafer, and grinding method of semiconductor wafer using the same |
| JP2007250790A (en) * | 2006-03-15 | 2007-09-27 | Shin Etsu Polymer Co Ltd | Manufacturing method of semiconductor chip |
| CN103280514A (en) * | 2013-05-29 | 2013-09-04 | 华南理工大学 | Method for automatically packaging LED module |
| TW201415584A (en) * | 2012-10-15 | 2014-04-16 | Win Semiconductors Corp | Structure and method for air cavity packaging |
| US20140203411A1 (en) * | 2013-01-18 | 2014-07-24 | Toyota Jidosha Kabushiki Kaisha | Production method of semiconductor device, semiconductor wafer, and semiconductor device |
| CN104022145A (en) * | 2014-06-23 | 2014-09-03 | 深圳市华星光电技术有限公司 | Substrate packaging method and packaging structure |
| JP2015175015A (en) * | 2014-03-14 | 2015-10-05 | 東京エレクトロン株式会社 | Substrate treatment method, and substrate treatment jig |
| US20160035787A1 (en) * | 2014-07-29 | 2016-02-04 | Renesas Electronics Corporation | Method of manufacturing semiconductor device |
| CN108987294A (en) * | 2018-06-21 | 2018-12-11 | 上海飞骧电子科技有限公司 | Solve the problems, such as the passive device GaAs brush coating method of encapsulation excessive glue |
| CN111146317A (en) * | 2020-02-21 | 2020-05-12 | 盐城东山精密制造有限公司 | Cutting module in LED encapsulation |
-
2020
- 2020-05-27 CN CN202010463058.5A patent/CN111613529B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070190747A1 (en) * | 2006-01-23 | 2007-08-16 | Tessera Technologies Hungary Kft. | Wafer level packaging to lidded chips |
| TW200737431A (en) * | 2006-01-23 | 2007-10-01 | Tessera Tech Hungary Kft | Wafer level packaging to lidded chips |
| JP2007250789A (en) * | 2006-03-15 | 2007-09-27 | Shin Etsu Polymer Co Ltd | Protective structure of semiconductor wafer, and grinding method of semiconductor wafer using the same |
| JP2007250790A (en) * | 2006-03-15 | 2007-09-27 | Shin Etsu Polymer Co Ltd | Manufacturing method of semiconductor chip |
| TW201415584A (en) * | 2012-10-15 | 2014-04-16 | Win Semiconductors Corp | Structure and method for air cavity packaging |
| US20140203411A1 (en) * | 2013-01-18 | 2014-07-24 | Toyota Jidosha Kabushiki Kaisha | Production method of semiconductor device, semiconductor wafer, and semiconductor device |
| CN103280514A (en) * | 2013-05-29 | 2013-09-04 | 华南理工大学 | Method for automatically packaging LED module |
| JP2015175015A (en) * | 2014-03-14 | 2015-10-05 | 東京エレクトロン株式会社 | Substrate treatment method, and substrate treatment jig |
| CN104022145A (en) * | 2014-06-23 | 2014-09-03 | 深圳市华星光电技术有限公司 | Substrate packaging method and packaging structure |
| US20160035787A1 (en) * | 2014-07-29 | 2016-02-04 | Renesas Electronics Corporation | Method of manufacturing semiconductor device |
| CN108987294A (en) * | 2018-06-21 | 2018-12-11 | 上海飞骧电子科技有限公司 | Solve the problems, such as the passive device GaAs brush coating method of encapsulation excessive glue |
| CN111146317A (en) * | 2020-02-21 | 2020-05-12 | 盐城东山精密制造有限公司 | Cutting module in LED encapsulation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111613529B (en) | 2023-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108447387B (en) | Display module full-lamination process with outer frame | |
| AU2003258943A1 (en) | Method for sealing a microcavity and package comprising at least one microcavity | |
| CN104779322B (en) | A kind of method for packing of dual-glass solar cell assembly | |
| CN106686896A (en) | Preparation method of ladder board and ladder board obtained through method | |
| CN105957911A (en) | Solar component adhesive tape edge sealing laminating technology and adhesive tape edge sealing tool thereof | |
| CN207199765U (en) | A kind of battery core bottom automatic attaching equipment | |
| CN111613529A (en) | Wafer packaging process | |
| CN102991082B (en) | Full-automatic matrix four-side self-adhesive glue coating device and self-adhesive glue coating method | |
| CN114843370A (en) | Packaging method of solar cell module | |
| CN101634809B (en) | Method for exposing single-sided flexible circuit board | |
| JP2011133499A (en) | Method and equipment for pasting film to wafer | |
| CN101344656B (en) | LCD panel and its sealing method | |
| CN210429842U (en) | Photovoltaic glass's preparation facilities | |
| CN112810172B (en) | Composite film dragging waste discharge method | |
| CN206370408U (en) | A kind of electrostatic protection product chips laminating apparatus | |
| CN216648314U (en) | Substrate structure capable of improving cutting yield | |
| CN110066607A (en) | A kind of preparation method of composite conducting adhesive tape | |
| CN117497621A (en) | Double-glass photovoltaic module and preparation method thereof | |
| CN207265062U (en) | Wafer and wafer unit | |
| CN101609222A (en) | Liquid crystal indicator and associated methods thereof | |
| CN206529428U (en) | A kind of structure for being easy to multi-product integrally to paste gum | |
| CN218783949U (en) | Whole back glue laminating equipment | |
| CN216300440U (en) | Reusable composite bubble sheet for water-pasted window | |
| CN115207146B (en) | Sizing method and sizing system | |
| CN219610443U (en) | Solar cell and photovoltaic module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |