CN110066607A - A kind of preparation method of composite conducting adhesive tape - Google Patents
A kind of preparation method of composite conducting adhesive tape Download PDFInfo
- Publication number
- CN110066607A CN110066607A CN201810063471.5A CN201810063471A CN110066607A CN 110066607 A CN110066607 A CN 110066607A CN 201810063471 A CN201810063471 A CN 201810063471A CN 110066607 A CN110066607 A CN 110066607A
- Authority
- CN
- China
- Prior art keywords
- glue
- adhesive tape
- knife
- layer upper
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D11/00—Combinations of several similar cutting apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to conductive tape technical field more particularly to a kind of preparation methods of composite conducting adhesive tape, first pass through compound A glue, and cut on A glue, and B glue and C glue region are regarded as waste material removal；Compound B glue again, and cut on B glue, A glue and C glue region are regarded as waste material removal；Last compound C glue, and cut on C glue, A glue and B glue region are regarded as waste material removal.The knife knot of five processes is closed, and the shape of the release film and gum in conductive tape is obtained.Preparation method provided by the invention is to cut to obtain the shape of gum after fitting, rather than first cut out gum shape and be bonded again, is consequently adapted to composite conducting adhesive tape automated production, improves production efficiency, can effectively realize electromagnetic wave shielding.
Description
Technical field
The present invention relates to conductive tape technical field more particularly to a kind of preparation methods of composite conducting adhesive tape.
Background technique
Existing conductive tape is the integral structure that two-sided gum is pasted on release film.Currently, composite conducting adhesive tape
The preparation method comprises the following steps: cutting gum → cutting release film → fitting release paper is bonded release film and back with gum → punching press gum →
Glue → punching press release film is bonded release paper with gum → torn edges material (waste discharge) →.It is first punching press gum in above-mentioned technique, then will
Molding gum is attached on release film, finally carries out the punching of shape.However, when gum is by various material, according to above-mentioned work
Skill can only use and gum is manually attached to release film, time-consuming and laborious, cause processing efficiency low.
Summary of the invention
The purpose of the present invention is to solve the shortcomings of the prior art providing a kind of preparation method of composite conducting adhesive tape.
To achieve the above object, the preparation method of a kind of composite conducting adhesive tape of the invention, including five processes, wherein
First procedure are as follows: (1-1) is attached to an A glue adhesive tape is compound in layer upper surface one, and is distinguished along two long sides of layer upper surface one
A compound silica gel adhesive tape, the release film and layer upper surface two of exchangining cards containing all personal details and become sworn brothers for tearing A glue adhesive tape itself off are affixed with it；(1-2) uses first
Set cutting die, the punching location hole on silica gel adhesive tape, meanwhile, knife carries out stepping towards layer upper surface two and cuts, and does in layer upper surface one
Hemisection excludes the A glue waste material of B glue and C glue position, but the layer upper surface two being not excluded on indwelling A glue later；(1-3) is in A glue
Compound B glue adhesive tape on adhesive tape, and it is not excluded for the virgin rubber release paper of B glue adhesive tape；
Second operation work are as follows: (2-1) on second set of cutting die, knife is cut towards B glue stepping, does hemisection in layer upper surface one, it
Heel row removes the B glue waste material of A glue and C glue position, but the virgin rubber release paper being not excluded on indwelling B glue；(2-2) is multiple on B glue
Unify a C glue adhesive tape, exhausts virgin rubber release paper and mute film of exchangining cards containing all personal details and become sworn brothers；
Third procedure are as follows: (3-1) on third set cutting die, knife is cut towards mute film stepping, and hemisection, Kong Quan are in layer upper surface one
It cuts, excludes A glue, B glue and layer upper surface and mute film waste material on C glue；Then (3-2) is torn off in the compound release film of reverse side of gum
Layer upper surface two on two silica gel adhesive tapes, then by the glue surface of weak adhered protection film be affixed on release film not from face；(3-3) is used
Differential jig, knife enter knife towards on the inside of silica gel adhesive tape, layer upper surface one are decided what is right and what is wrong in the layer glue surface of weak adhered protection film and is exhausted, and
Compound upper layer upper surface two is affixed with silica gel adhesive tape；
4th procedure are as follows: (4-1) on the 4th set of cutting die, knife is cut towards mute film stepping, and knife line is done on weak adhered protection film
Hemisection excludes the waste material in shadow region；(4-2) tears the mute film on gum, then compound one new mute film, layer upper surface and gum off
It is affixed, then in weak adhered protection film without one layer of backing film of glue surface plaster；
Five processes are as follows: (5-1) on the 5th set of cutting die, knife is cut towards mute film stepping, and knife line is done on weak adhered protection film
Hemisection exhausts waste material.
Preferably, in (3-3) of the third procedure, knife is towards entering knife at 1mm on the inside of silica gel adhesive tape.
Preferably, the five processes exhaust waste material after, conductive tape is checked, is packed.
Beneficial effects of the present invention: a kind of preparation method of composite conducting adhesive tape of the invention first passes through compound A glue, and
It is cut on A glue, B glue and C glue region is regarded as waste material removal；Compound B glue again, and cut on B glue, by A glue and C glue
Region is regarded as waste material removal；Last compound C glue, and cut on C glue, A glue and B glue region are regarded as waste material and gone
It removes.The knife knot of five processes is closed, and the shape of the release film and gum in conductive tape is obtained.Preparation method provided by the invention
It is to cut to obtain the shape of gum after fitting, rather than first cut out gum shape and be bonded again, is consequently adapted to composite conducting
Adhesive tape automated production improves production efficiency, can effectively realize electromagnetic wave shielding, is based on the compound raising conducting resinl of the multilayer traditional method of indicating the pronunciation of a Chinese character
Band shielding Electromagnetic performance.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment, the present invention is further explained.
A kind of preparation method of composite conducting adhesive tape of the invention, including five processes, wherein
First procedure are as follows:
(1-1) is attached to an A glue adhesive tape is compound in layer upper surface one, and distinguishes a compound silicon along two long sides of layer upper surface one
Glue adhesive tape, the release film and layer upper surface two of exchangining cards containing all personal details and become sworn brothers for tearing A glue adhesive tape itself off are affixed with it；(1-2) uses first set cutting die, in silicon
Punching location hole on glue adhesive tape, meanwhile, knife towards layer upper surface two carry out stepping cut, do hemisection in layer upper surface one, heel row
Except the A glue waste material of B glue and C glue position, but the layer upper surface two being not excluded on indwelling A glue；
(1-3) compound B glue adhesive tape on A glue adhesive tape, and it is not excluded for the virgin rubber release paper of B glue adhesive tape；
Second operation work are as follows:
(2-1) on second set of cutting die, knife is cut towards B glue stepping, and hemisection is done in layer upper surface one, excludes A glue and C glue later
The B glue waste material of position, but the virgin rubber release paper being not excluded on indwelling B glue；
(2-2) compound C glue adhesive tape on B glue, exhausts virgin rubber release paper and mute film of exchangining cards containing all personal details and become sworn brothers；
Third procedure are as follows:
(3-1) on third set cutting die, knife is cut towards mute film stepping, and hemisection is done in layer upper surface one, and Kong Quan is cut, and excludes A glue, B
Glue and layer upper surface and mute film waste material on C glue；
Then (3-2) tears the layer upper surface two on two silica gel adhesive tapes off in the compound release film of reverse side of gum, then weak viscosity is protected
The glue surface of cuticula be affixed on release film not from face；
(3-3) uses differential jig, and knife enters knife towards on the inside of silica gel adhesive tape, by layer upper surface in the layer glue surface of weak adhered protection film
One, which decides what is right and what is wrong, exhausts, and compound upper layer upper surface two is affixed with silica gel adhesive tape；
4th procedure are as follows:
(4-1) on the 4th set of cutting die, knife is cut towards mute film stepping, and knife line does hemisection on weak adhered protection film, excludes shade
The waste material in area；
(4-2) tears the mute film on gum off, then compound one new mute film, layer upper surface are affixed with gum, then protects in weak viscosity
Cuticula without one layer of backing film of glue surface plaster；
Five processes are as follows:
(5-1) on the 5th set of cutting die, knife is cut towards mute film stepping, and knife line does hemisection on weak adhered protection film, exhausts waste material.
A kind of preparation method of composite conducting adhesive tape of the invention first passes through compound A glue, and cuts on A glue, by B glue
Waste material removal is regarded as with C glue region；Compound B glue again, and cut on B glue, A glue and C glue region are regarded as waste material
Removal；Last compound C glue, and cut on C glue, A glue and B glue region are regarded as waste material removal.The knife line of five processes
In conjunction with obtaining the shape of the release film and gum in conductive tape.Preparation method provided by the invention is cut after fitting
The shape of gum is obtained, rather than first cuts out gum shape and is bonded again, is consequently adapted to conductive tape automated production, improves life
Efficiency is produced, can effectively realize electromagnetic wave shielding.
In (3-3) of the third procedure of the present embodiment, knife is towards entering knife at 1mm on the inside of silica gel adhesive tape.
The five processes of the present embodiment exhaust waste material after, conductive tape is checked, is packed.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (3)
1. a kind of preparation method of composite conducting adhesive tape, it is characterised in that: including five processes:
First procedure are as follows: (1-1) is attached to an A glue adhesive tape is compound in layer upper surface one, and along two long sides of layer upper surface one
A compound silica gel adhesive tape respectively, the release film and layer upper surface two of exchangining cards containing all personal details and become sworn brothers for tearing A glue adhesive tape itself off are affixed with it；(1-2) is used
First set cutting die, the punching location hole on silica gel adhesive tape, meanwhile, knife carries out stepping towards layer upper surface two and cuts, in layer upper surface one
On do hemisection, exclude the A glue waste material of B glue and C glue position, but the layer upper surface two being not excluded on indwelling A glue later；(1-3)
The compound B glue adhesive tape on A glue adhesive tape, and it is not excluded for the virgin rubber release paper of B glue adhesive tape；
Second operation work are as follows: (2-1) on second set of cutting die, knife is cut towards B glue stepping, does hemisection in layer upper surface one, it
Heel row removes the B glue waste material of A glue and C glue position, but the virgin rubber release paper being not excluded on indwelling B glue；(2-2) is multiple on B glue
Unify a C glue adhesive tape, exhausts virgin rubber release paper and mute film of exchangining cards containing all personal details and become sworn brothers；
Third procedure are as follows: (3-1) on third set cutting die, knife is cut towards mute film stepping, and hemisection, Kong Quan are in layer upper surface one
It cuts, excludes A glue, B glue and layer upper surface and mute film waste material on C glue；Then (3-2) is torn off in the compound release film of reverse side of gum
Layer upper surface two on two silica gel adhesive tapes, then by the glue surface of weak adhered protection film be affixed on release film not from face；(3-3) is used
Differential jig, knife enter knife towards on the inside of silica gel adhesive tape, layer upper surface one are decided what is right and what is wrong in the layer glue surface of weak adhered protection film and is exhausted, and
Compound upper layer upper surface two is affixed with silica gel adhesive tape；
4th procedure are as follows: (4-1) on the 4th set of cutting die, knife is cut towards mute film stepping, and knife line is done on weak adhered protection film
Hemisection excludes the waste material in shadow region；(4-2) tears the mute film on gum, then compound one new mute film, layer upper surface and gum off
It is affixed, then in weak adhered protection film without one layer of backing film of glue surface plaster；
Five processes are as follows: (5-1) on the 5th set of cutting die, knife is cut towards mute film stepping, and knife line is done on weak adhered protection film
Hemisection exhausts waste material.
2. a kind of preparation method of composite conducting adhesive tape according to claim 1, it is characterised in that: the third procedure
(3-3) in, knife is towards entering knife at 1mm on the inside of silica gel adhesive tape.
3. a kind of preparation method of composite conducting adhesive tape according to claim 1, it is characterised in that: the five processes
Exhaust waste material after, conductive tape is checked, is packed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810063471.5A CN110066607A (en) | 2018-01-23 | 2018-01-23 | A kind of preparation method of composite conducting adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810063471.5A CN110066607A (en) | 2018-01-23 | 2018-01-23 | A kind of preparation method of composite conducting adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110066607A true CN110066607A (en) | 2019-07-30 |
Family
ID=67365096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810063471.5A Pending CN110066607A (en) | 2018-01-23 | 2018-01-23 | A kind of preparation method of composite conducting adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110066607A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111086059A (en) * | 2019-12-30 | 2020-05-01 | 深圳安洁电子有限公司 | Mylar processing technology of local gum |
| CN114292600A (en) * | 2021-12-29 | 2022-04-08 | 金贵菊 | Composite adhesive tape and preparation method thereof |
-
2018
- 2018-01-23 CN CN201810063471.5A patent/CN110066607A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111086059A (en) * | 2019-12-30 | 2020-05-01 | 深圳安洁电子有限公司 | Mylar processing technology of local gum |
| CN111086059B (en) * | 2019-12-30 | 2021-11-05 | 深圳安洁电子有限公司 | Mylar processing technology of local gum |
| CN114292600A (en) * | 2021-12-29 | 2022-04-08 | 金贵菊 | Composite adhesive tape and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190730 |