CN111613508A - Air inlet device and reaction chamber - Google Patents
Air inlet device and reaction chamber Download PDFInfo
- Publication number
- CN111613508A CN111613508A CN201910138374.2A CN201910138374A CN111613508A CN 111613508 A CN111613508 A CN 111613508A CN 201910138374 A CN201910138374 A CN 201910138374A CN 111613508 A CN111613508 A CN 111613508A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- air inlet
- hole
- mounting hole
- annular concave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
Abstract
The invention provides an air inlet device and a reaction chamber, which comprise an air inlet body and a nozzle, wherein an annular concave channel is arranged on the upper end surface of the air inlet body, a mounting hole is formed in the annular concave channel of the air inlet body, an air inlet hole is formed in the nozzle, the nozzle is detachably mounted in the mounting hole, and the air inlet hole is communicated with the annular concave channel. The air inlet device and the reaction chamber provided by the invention can be conveniently cleaned, and the maintenance cost of the air inlet device is reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to an air inlet device and a reaction chamber.
Background
At present, in a semiconductor processing technology, various physical and chemical reactions occur on the surface of a substrate through interaction between plasma and the substrate, so that the properties of the surface of the substrate are changed. The plasma is typically generated by exciting a process gas.
In the prior art, a process gas for generating a plasma is generally introduced into a reaction chamber through an upper electrode gas inlet device, through holes are directly formed in the upper electrode gas inlet device, the through holes are used as gas inlet holes for the process gas to pass through, the process gas is introduced into the gas inlet holes through a gas inlet pipeline, enters the reaction chamber through the gas inlet holes, and is excited in the reaction chamber to form the plasma.
However, in the prior art, in order to meet the process requirements, the inner diameter of the air inlet hole in the upper electrode air inlet device is usually very small, and fine impurities such as dust and the like are often mixed in the process gas, and some byproducts are inevitably generated in the processing process, and the fine impurities and the byproducts are deposited at the air inlet hole to cause the blockage of the air inlet hole.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides an air inlet device and a reaction chamber, which can be used for conveniently cleaning the air inlet device and reducing the maintenance cost of the air inlet device.
The air inlet device comprises an air inlet body and a nozzle, wherein an annular concave channel is arranged on the upper end surface of the air inlet body, a mounting hole is formed in the annular concave channel of the air inlet body, an air inlet hole is formed in the nozzle, the nozzle is detachably mounted in the mounting hole, and the air inlet hole is communicated with the annular concave channel.
Preferably, a first convex part is arranged on the wall of the mounting hole;
a second convex part is arranged on the outer wall of the nozzle and is superposed on the first convex part of the mounting hole; a seal ring is provided between two surfaces where the first convex portion and the second convex portion overlap each other.
Preferably, the upper end of the mounting hole is arranged at the bottom of the annular concave channel, and the lower end of the mounting hole is arranged on the lower end face of the air inlet body; the nozzle is in clearance fit with the mounting hole, the air inlet hole penetrates through two ends of the nozzle, and the upper end of the air inlet hole is communicated with the annular concave channel.
Preferably, the upper end of the mounting hole is arranged on the upper end face of the air inlet body, and the lower end of the mounting hole is arranged on the lower end face of the air inlet body;
the nozzle is in clearance fit with the mounting hole, a communicating groove is formed in the upper portion of the nozzle, the lower end of the air inlet hole is formed in the lower end face of the nozzle, and the upper end of the air inlet hole is communicated with the annular concave channel through the communicating groove.
Preferably, the material of the nozzle comprises ceramic or quartz.
Preferably, an internal thread is arranged on the wall of the mounting hole;
the outer peripheral wall of the nozzle is provided with an external thread matched with the internal thread; the nozzle is in threaded connection with the mounting hole.
Preferably, the mounting hole comprises a threaded hole and a counterbore which are coaxially arranged from top to bottom, wherein,
the diameter of the counterbore is greater than the diameter of the threaded hole; the upper end of the threaded hole is formed at the bottom of the annular concave channel, and the lower end of the reaming hole is formed in the lower end face of the air inlet body;
the nozzle comprises a first body and a second body which are sequentially arranged from top to bottom, wherein the outer peripheral wall of the first body is provided with the external thread and is in threaded connection with the threaded hole; the second body is disposed in the counterbore, the second body having a diameter greater than the diameter of the first body;
the air inlet hole penetrates through two ends of the nozzle, and the upper end of the air inlet hole is communicated with the annular concave channel.
Preferably, the mounting hole comprises a threaded hole and a counterbore which are coaxially arranged from top to bottom, wherein,
the diameter of the counterbore is greater than the diameter of the threaded hole; the upper end of the threaded hole is formed in the upper end face of the air inlet body, and the lower end of the reaming hole is formed in the lower end face of the air inlet body;
the nozzle comprises a first body and a second body which are sequentially arranged from top to bottom, wherein the outer peripheral wall of the first body is provided with the external thread and is in threaded connection with the threaded hole; the second body is disposed in the counterbore, the second body having a diameter greater than the diameter of the first body;
the upper portion of the nozzle is provided with a communicating groove, the lower end of the air inlet hole is formed in the lower end face of the nozzle, and the upper end of the air inlet hole is communicated with the annular concave channel through the communicating groove.
Preferably, a seal ring is arranged between the end surface of the second body facing the threaded hole and the counter surface of the counterbore.
Preferably, the material of the nozzle comprises a metal.
The invention also provides a reaction chamber comprising the gas inlet device.
The invention has the following beneficial effects:
the air inlet device comprises an air inlet body and a nozzle, wherein an annular concave channel is arranged on the upper end surface of the air inlet body, a mounting hole is formed in the annular concave channel of the air inlet body, the nozzle is detachably mounted in the mounting hole, an air inlet hole is formed in the nozzle and communicated with the annular concave channel.
According to the reaction chamber provided by the invention, the air inlet device can be conveniently cleaned by virtue of the air inlet device provided by the invention, and the maintenance cost of the air inlet device is reduced.
Drawings
FIG. 1 is a schematic structural view of a first detachable structure of a nozzle and a mounting hole in an air inlet device according to the present invention;
FIG. 2 is a schematic structural view of a mounting hole in a first arrangement structure of a nozzle and a mounting hole in a first detachable structure of the nozzle and the mounting hole in an air inlet device provided by the invention;
FIG. 3 is a schematic structural view of a nozzle in a first arrangement structure of the nozzle and the mounting hole in a first detachable structure of the nozzle and the mounting hole in the air inlet device provided by the invention;
FIG. 4 is a schematic structural diagram of a second arrangement structure of nozzles and mounting holes in a first detachable structure of nozzles and mounting holes in an air inlet device according to the present invention;
FIG. 5 is a schematic structural view of a nozzle in a second arrangement structure of the nozzle and the mounting hole in a first detachable structure of the nozzle and the mounting hole in the air inlet device provided by the invention;
FIG. 6 is a schematic structural view of a second detachable structure of a nozzle and a mounting hole in the air inlet device provided by the invention;
FIG. 7 is a schematic view of a mounting hole of a second detachable structure of a nozzle and a mounting hole of an air inlet device according to the present invention;
FIG. 8 is a schematic structural view of a nozzle in a first arrangement structure of the nozzle and the mounting hole in a second detachable structure of the nozzle and the mounting hole in the air intake device provided by the present invention;
FIG. 9 is a schematic structural view of a second arrangement structure of nozzles and mounting holes in a second detachable structure of nozzles and mounting holes in an air inlet device according to the present invention;
FIG. 10 is a schematic structural view of a nozzle in a second arrangement of the nozzle and the mounting hole in a second detachable structure of the nozzle and the mounting hole in the air intake apparatus provided by the present invention;
description of reference numerals:
1-an air intake body; 111-a first protrusion; 112-annular concave channel; 113-mounting holes; 114-a threaded hole; 115-reaming; 21-a nozzle; 211-a second protrusion; 212-a communication groove; 222-an air intake; 223-a first body; 224-a second body; 3-sealing ring.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the gas inlet device and the reaction chamber provided by the present invention are described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 10, the present embodiment provides an air intake device, which includes an air intake body 1 and a nozzle 21, wherein an annular concave channel 112 is disposed on an upper end surface of the air intake body 1, a mounting hole 113 is disposed at the annular concave channel 112 of the air intake body 1, an air intake hole 222 is disposed in the nozzle 21, the nozzle 21 is detachably mounted in the mounting hole 113, and the air intake hole 222 is communicated with the annular concave channel 112.
The air inlet device that this embodiment provided, with the help of the nozzle 21 of detachable installation in mounting hole 113, when the inlet port 222 in the nozzle 21 was blockked up, through directly changing new nozzle 21 to mounting hole 113 in, perhaps demolish nozzle 21 from mounting hole 113, clear up inlet port 222 to the realization is to air inlet device's clearance, thereby can be convenient clear up air inlet device, reduce air inlet device's maintenance cost.
Specifically, in the air intake device provided in this embodiment, the annular concave channel 112 is disposed on the upper end surface of the air intake device, and the air intake device is provided with a plurality of mounting holes 113 for mounting the plurality of nozzles 21, and the air intake holes 222 of the plurality of nozzles 21 are all communicated with the annular concave channel 112, when the process gas is introduced into the annular concave channel 112, the process gas will flow along the annular concave channel 112 to fill the entire annular concave channel 112, so that the process gas enters the plurality of air intake holes 222 through the annular concave channel 112, and then enters the reaction chamber through the plurality of air intake holes 222, therefore, impurities in the process gas and impurities generated during the processing process may remain in the annular concave channel 112 and the air intake holes 222, because the annular concave channel 112 is disposed on the upper end surface of the air intake device, and the annular concave channel 112 is a continuous ring, which makes the cleaning of the annular concave channel 112 easier, when the air inlet hole 222 in the nozzle 21 is blocked, the blocked nozzle 21 is detached from the mounting hole 113, and a new nozzle 21 is installed in the mounting hole 113, so that the air inlet device is cleaned, or the blocked nozzle 21 is detached from the mounting hole 113, and the air inlet hole 222 is cleaned and then installed in the mounting hole 113, so that the air inlet device is cleaned, the air inlet device is cleaned simply and conveniently, and the maintenance cost of the air inlet device is reduced.
As shown in fig. 1 to 5, a first detachable structure of the nozzle 21 and the mounting hole 113 in the present embodiment is provided, in which a first protrusion 111 is provided on a wall of the mounting hole 113; the outer wall of the nozzle 21 is provided with a second protrusion 211, and the second protrusion 211 of the nozzle 21 is superposed on the first protrusion 111 of the mounting hole 113; a seal ring 3 is provided between two surfaces of the first convex portion 111 and the second convex portion 211 that overlap each other.
In this embodiment, the first protrusion 111 is disposed on the wall of the bottom of the mounting hole 113 and protrudes toward the direction close to the axis of the mounting hole 113, the second protrusion 211 is disposed on the outer wall of the top of the nozzle 21 and protrudes toward the direction away from the axis of the nozzle 21, when the nozzle 21 is mounted in the mounting hole 113, the nozzle 21 is put into the mounting hole 113 from the top of the mounting hole 113, when the upper end surface of the first protrusion 111 of the mounting hole 113 abuts against the lower end surface of the second protrusion 211 of the nozzle 21, the lower end surface of the second protrusion 211 presses against the upper end surface of the first protrusion 111, so that the nozzle 21 is supported by the first protrusion 111 to be stably located in the mounting hole 113, when the nozzle 21 is dismounted from the mounting hole 113, the nozzle 21 can be slid out of the mounting hole 113 by gravity by merely turning the air inlet body 1 by a certain angle, or can be inserted into the mounting hole 113 from the bottom of the mounting hole 113 by using a dismounting tool, the nozzle 21 may be pushed out from the top of the mounting hole 113, or the nozzle 21 may be pulled out from the mounting hole 113 by inserting a removal tool into the air inlet hole 222 and pressing the removal tool against the inner wall of the air inlet hole 222, but the manner of removing the nozzle 21 is not limited thereto.
In this embodiment, when the nozzle 21 is located at the position where the upper end surface of the first protrusion 111 abuts against the lower end surface of the second protrusion 211, the sealing ring 3 is located between the upper end surface of the first protrusion 111 and the lower end surface of the second protrusion 211, and the sealing ring 3 is extruded by the pressure of the second protrusion 211 on the first protrusion 111, so that the sealing ring 3 seals the gap between the nozzle 21 and the mounting hole 113.
In the present embodiment, the first protrusion 111 is annular and is circumferentially disposed on the wall of the mounting hole 113 along the circumferential direction of the mounting hole 113, and the second protrusion 211 is also annular and is circumferentially disposed on the outer wall of the nozzle 21 along the circumferential direction of the nozzle 21, so that the contact area between the first protrusion 111 and the second protrusion 211 can be increased, thereby improving the stability of the first protrusion 111 in supporting the nozzle 21 and the stability of the nozzle 21 in the mounting hole 113, but the arrangement manner of the first protrusion 111 and the second protrusion 211 is not limited thereto, and it may not be annular, as long as the first protrusion 111 and the second protrusion 211 can be abutted against each other.
In the present embodiment, the material of the nozzle 21 includes ceramic or quartz. In practical applications, chlorine (Cl) is often used as the process gas2) Hydrobromic acid (HBr), and the like, have corrosive gases, while ceramics and quartz have good corrosion resistance, so as to prevent the nozzle 21 and the gas inlet 222 from being corroded by the process gas, reduce the occurrence of deposition of impurities on the inner wall of the gas inlet 222, and reduce the probability of blockage of the gas inlet 222, and in the semiconductor processing technology, the temperature is generally higher, while ceramics and quartz also have good thermal stability, so as to improve the use stability of the nozzle 21 in the semiconductor processing technology.
Since the strength of the ceramic is high compared to quartz, the use of the ceramic as the material of the nozzle 21 can further improve the stability of the nozzle 21.
As shown in fig. 1-3, the first detachable structure is a first arrangement structure of the nozzle 21 and the mounting hole 113, in which the upper end of the mounting hole 113 is opened at the bottom of the annular groove 112, and the lower end of the mounting hole 113 is opened at the lower end surface of the air intake body 1; the nozzle 21 is in clearance fit with the mounting hole 113, the air inlet hole 222 penetrates through two ends of the nozzle 21, and the upper end of the air inlet hole 222 is communicated with the annular concave channel 112.
Specifically, the upper end surface of the mounting hole 113 is flush with the lower end surface of the annular concave channel 112, the lower end surface of the mounting hole 113 is flush with the lower end surface of the air inlet body 1, the mounting hole 113 penetrates from the lower end surface of the annular concave channel 112 to the lower end surface of the air inlet body 1, and the nozzle 21 and the mounting hole 113 are in clearance fit, because the thermal expansion coefficients of the materials of the nozzle 21 and the air inlet body 1 are different, clearance fit is adopted, so that the nozzle 21 can be prevented from being stuck or damaged, and the nozzle 21 can be more easily disassembled and assembled, thereby the cleaning of the air inlet device is simpler and more convenient, when the nozzle 21 is installed in the mounting hole 113, the nozzle 21 is positioned in the mounting hole 113, the air inlet hole 222 penetrates from the upper end surface of the nozzle 21 to the lower end surface of the nozzle 21, and the upper end of the air inlet hole 222 is communicated with the annular concave channel 112, after the process gas enters the annular concave channel 112, the lower end surface of the annular concave, flows through the gas inlet hole 222 and is injected into the reaction chamber from the lower end of the gas inlet hole 222.
Optionally, when the nozzle 21 is installed in the installation hole 113, the upper end surface of the nozzle 21 is flush with the lower end surface of the annular concave channel 112, and the lower end surface of the nozzle 21 is flush with the lower end surface of the gas inlet body 1, so that impurities can be prevented from entering the installation hole 113, the installation hole 113 can be prevented from being blocked, and the nozzle 21 can be prevented from affecting the flow of the process gas.
As shown in fig. 4-5, the second arrangement structure of the nozzle 21 and the mounting hole 113 in the first detachable structure is provided, in which the upper end of the mounting hole 113 is opened on the upper end surface of the air intake body 1, and the lower end of the mounting hole 113 is opened on the lower end surface of the air intake body 1; the nozzle 21 is in clearance fit with the mounting hole 113, a communication groove 212 is arranged at the upper part of the nozzle 21, the lower end of the air inlet hole 222 is arranged on the lower end surface of the nozzle 21, and the upper end of the air inlet hole 222 is communicated with the annular concave channel 112 through the communication groove 212.
In the first detachable structure, the second arrangement structure of the nozzle 21 and the mounting hole 113 is different from the first arrangement structure of the nozzle 21 and the mounting hole 113 in that, in the second arrangement structure of the nozzle 21 and the mounting hole 113, the upper end face of the mounting hole 113 is flush with the upper end face of the annular recessed passage 112, that is, the mounting hole 113 is included in the annular recessed passage 112, and when the nozzle 21 is mounted in the mounting hole 113, the upper end face of the nozzle 21 is higher than the lower end face of the annular recessed passage 112, whereas in the first arrangement structure of the nozzle 21 and the mounting hole 113, the upper end face of the nozzle 21 is lower than or equal to the lower end face of the annular recessed passage 112, and therefore, in the second arrangement structure of the nozzle 21 and the mounting hole 113, it is necessary to provide a communication groove 212 communicating with the annular recessed passage 112 in a portion of the nozzle 21 in the annular recessed passage 112 so as to prevent the nozzle 21 from blocking the diffusion of the process gas in the annular recessed passage 112, that is, it can be considered that a portion of the annular recessed channel 112 includes the communication groove 212 in the nozzle 21, and when the process gas diffuses in the annular recessed channel 112, it enters the communication groove 212 when passing through one of the nozzles 21 in the gas inlet body 1, and a portion of the process gas entering the communication groove 212 enters the gas inlet hole 222 of the nozzle 21 to enter the reaction chamber through the gas inlet hole 222, and another portion continues to diffuse into the annular recessed channel 112 through the communication groove 212 to diffuse into the remaining nozzles 21.
Optionally, when the nozzle 21 is installed in the installation hole 113, the upper end surface of the nozzle 21 is flush with the upper end surface of the annular concave channel 112, and the lower end surface of the nozzle 21 is flush with the lower end surface of the gas inlet body 1, so that impurities can be prevented from entering the installation hole 113, the installation hole 113 can be prevented from being blocked, and the nozzle 21 can be prevented from affecting the flow of the process gas.
In the first detachable construction, the second setting structure of the nozzle 21 and the mounting hole 113 is compared with the first setting structure of the nozzle 21 and the mounting hole 113, because a part of the nozzle 21 is located in the annular concave channel 112, this makes the processing difficulty of the annular concave channel 112 reduced, the size of the nozzle 21 is not limited by the annular concave channel 112, the processing difficulty of the nozzle 21 is reduced, and after the nozzle 21 is installed in the mounting hole 113, the upper part of the nozzle 21 is located in the annular concave channel 112, the nozzle 21 is more convenient to disassemble and assemble, thereby the cleaning of the air inlet device is simpler and more convenient.
In the first detachable configuration, the gap between the nozzle 21 and the mounting hole 113 comprises 0.2mm to 0.4 mm. However, the gap between the nozzle 21 and the mounting hole 113 is not limited to this, and may be adjusted according to the thermal expansion coefficient of the material of the nozzle 21 and the mounting hole 113.
As shown in fig. 6-10, the second detachable structure of the nozzle 21 and the mounting hole 113 in this embodiment is shown, in which an internal thread is provided on the wall of the mounting hole 113; the outer peripheral wall of the nozzle 21 is provided with an external thread matched with the internal thread; the nozzle 21 is screwed into the mounting hole 113, when the nozzle 21 is mounted in the mounting hole 113, the nozzle 21 is screwed into the mounting hole 113 by rotating the nozzle 21 clockwise or counterclockwise through the engagement of the external thread and the internal thread, and when the nozzle 21 is removed from the mounting hole 113, the nozzle 21 can be unscrewed from the mounting hole 113 by rotating the nozzle 21 in the direction opposite to the direction in which the nozzle 21 is mounted, that is, the nozzle 21 and the mounting hole 113 are detachably mounted by screwing the nozzle 21 and the mounting hole 113.
As shown in fig. 6-8, the nozzle 21 and the mounting hole 113 are arranged in a first arrangement in the second detachable structure, in which the mounting hole 113 includes a threaded hole 114 and a counterbore 115 coaxially arranged from top to bottom, wherein the diameter of the counterbore 115 is larger than that of the threaded hole 114; the upper end of the threaded hole 114 is arranged at the bottom of the annular concave channel 112, and the lower end of the reaming hole 115 is arranged on the lower end surface of the air inlet body 1; the nozzle 21 includes a first body 223 and a second body 224 which are arranged in sequence from top to bottom, wherein an external thread is provided on the outer circumferential wall of the first body 223 and is screwed in the threaded hole 114; second body 224 is disposed in counterbore 115, second body 224 having a diameter greater than the diameter of first body 223; the air inlet holes 222 penetrate through both ends of the nozzle 21, and the upper ends of the air inlet holes 222 communicate with the annular groove 112.
Specifically, the internal thread in the mounting hole 113 is arranged on the inner wall of the threaded hole 114 at the upper part of the mounting hole 113, the upper end face of the threaded hole 114 is flush with the lower end face of the annular channel 112, the lower end face of the threaded hole 114 is flush with the upper end face of the counterbore 115, and the lower end face of the counterbore 115 is flush with the lower end face of the air inlet body 1, when the nozzle 21 is mounted in the mounting hole 113, the first body 223 of the nozzle 21 extends into the counterbore 115 and the nozzle 21 is rotated, the first body 223 enters the threaded hole 114 through the matching of the external thread of the first body 223 and the internal thread in the threaded hole 114, because the diameter of the second body 224 of the nozzle 21 is larger than that of the first body 223, in the process of continuously rotating the nozzle 21, along with the increase of the length of the first body 223 extending into the threaded hole 114, the second body 224 can abut against the lower end face of the threaded hole 114, so that the nozzle 21 is fixed in, at this time, the first body 223 is located in the threaded hole 114, the second body 224 is located in the counterbore 115, the air inlet hole 222 penetrates through the first body 223 and the second body 224 from the upper end surface of the nozzle 21 to the lower end surface of the nozzle 21, and the upper end of the air inlet hole 222 is communicated with the annular groove 112, after the process gas enters the annular groove 112, the process gas enters the air inlet hole 222 from the lower end surface of the annular groove 112 through the upper end of the first body 223, and flows through the air inlet hole 222 and is sprayed into the reaction chamber from the lower end of the second body 224, when the nozzle 21 is disassembled, the nozzle 21 can be unscrewed from the mounting hole 113 only by rotating the nozzle 21 in the direction opposite to the mounting direction of the nozzle 21 from the lower end of the air inlet body 1.
Optionally, when the nozzle 21 is installed in the installation hole 113, the upper end surface of the first body 223 is flush with the upper end surface of the threaded hole 114, and the lower end surface of the second body 224 is flush with the lower end surface of the gas inlet body 1, so that impurities can be prevented from entering the threaded hole 114 and the counterbore 115, the installation hole 113 can be prevented from being blocked, and the nozzle 21 can be prevented from affecting the flow of the process gas.
As shown in fig. 9-10, the nozzle 21 and the mounting hole 113 are arranged in a second detachable configuration, in which the mounting hole 113 includes a threaded hole 114 and a counterbore 115 coaxially arranged from top to bottom, and the diameter of the counterbore 115 is larger than that of the threaded hole 114; the upper end of the threaded hole 114 is arranged on the upper end surface of the air inlet body 1, and the lower end of the reaming hole 115 is arranged on the lower end surface of the air inlet body 1; the nozzle 21 includes a first body 223 and a second body 224 which are arranged in sequence from top to bottom, wherein an external thread is provided on the outer circumferential wall of the first body 223 and is screwed in the threaded hole 114; second body 224 is disposed in counterbore 115, second body 224 having a diameter greater than the diameter of first body 223; the upper part of the nozzle 21 is provided with a communication groove 212, the lower end of the air inlet hole 222 is arranged on the lower end surface of the nozzle 21, and the upper end of the air inlet hole 222 is communicated with the annular concave channel 112 through the communication groove 212.
In the second detachable structure, the second arrangement structure of the nozzle 21 and the mounting hole 113 is different from the first arrangement structure of the nozzle 21 and the mounting hole 113 in that, in the second arrangement structure of the nozzle 21 and the mounting hole 113, the upper end surface of the screw hole 114 is flush with the upper end surface of the annular recessed passage 112, that is, the screw hole 114 is included in the annular recessed passage 112, and when the nozzle 21 is mounted in the mounting hole 113, the upper end surface of the first body 223 of the nozzle 21 is higher than the lower end surface of the annular recessed passage 112, whereas in the first arrangement structure of the nozzle 21 and the mounting hole 113, the upper end surface of the first body 223 is lower than or equal to the lower end surface of the annular recessed passage 112, and therefore, in the second arrangement structure of the nozzle 21 and the mounting hole 113, it is necessary to provide a communication groove 212 communicating with the annular recessed passage 112 in part of the first body 223 of the nozzle 21 in the annular recess to prevent the first body 223 from blocking the diffusion of the process gas in the annular recessed passage 112, that is, it can be considered that a portion of the annular concave passage 112 includes the communication groove 212 in the nozzle 21, and when the process gas diffuses in the annular concave passage 112, it enters the communication groove 212 while passing through the first body 223 of one of the nozzles 21 in the gas inlet body 1, and a portion of the process gas entering the communication groove 212 enters the gas inlet hole 222 of the nozzle 21 to enter the reaction chamber through the gas inlet hole 222, and another portion continues to diffuse into the annular concave passage 112 through the communication groove 212 to diffuse into the remaining nozzles 21.
Optionally, when the nozzle 21 is installed in the installation hole 113, the upper end surface of the first body 223 is flush with the upper end surface of the annular groove 112, and the lower end surface of the second body 224 is flush with the lower end surface of the gas inlet body 1, so that impurities can be prevented from entering the threaded hole 114 and the counterbore 115, the installation hole 113 can be prevented from being blocked, and the nozzle 21 can be prevented from affecting the flow of the process gas.
In the second detachable structure, the second arrangement structure of the nozzle 21 and the mounting hole 113 is compared with the first arrangement structure of the nozzle 21 and the mounting hole 113, because a part of the nozzle 21 is located in the annular concave channel 112, the processing difficulty of the annular concave channel 112 is reduced, the size of the nozzle 21 is not limited by the annular concave channel 112, the processing difficulty of the nozzle 21 is reduced, and after the nozzle 21 is installed in the mounting hole 113, the upper part of the nozzle 21 is located in the annular concave channel 112, the nozzle 21 is more convenient to disassemble and assemble, and the cleaning of the air inlet device is simpler and more convenient.
In the second kind of detachable construction, be provided with sealing washer 3 between the terminal surface of second body 224 towards screw hole 114 and reaming 115's opposite face, when the nozzle 21 of screwing, the lower extreme through second body 224 and reaming 115 extrudees sealing washer 3, make sealing washer 3 seal the clearance between nozzle 21 and mounting hole 113, similar with the first kind of detachable construction, through the sealing washer 3 to mounting hole 113 sealed, can avoid the air to get into the reaction chamber through mounting hole 113, influence the seal of reaction chamber, thereby improve the stability of reaction chamber internal pressure, improve the technological effect of processing technology.
In the second detachable structure, the material of the nozzle 21 includes metal, which has good thermal conductivity and radio frequency shielding performance and facilitates the machining of threads.
In this embodiment, the inner diameter of the annular groove 112 may be set to 4mm, the gas inlet holes 222 may be set to a plurality of sub-holes whose inner diameters are sequentially reduced from top to bottom in the axial direction of the gas inlet holes 222, wherein the inner diameter of the sub-hole for the process gas to enter may be set to 3mm near the annular groove 112, and the inner diameter of the sub-hole for the process gas to be sprayed may be set to 0.8mm near the lower end surface of the gas inlet body 1, but the inner diameters of the plurality of sub-holes are not limited thereto and may be adjusted according to the processing technology.
The embodiment also provides a reaction chamber, which comprises the gas inlet device provided by the embodiment.
According to the reaction chamber provided by the invention, the air inlet device can be conveniently cleaned by virtue of the air inlet device provided by the invention, and the maintenance cost of the air inlet device is reduced.
In conclusion, the air inlet device and the reaction chamber provided by the embodiment can be cleaned conveniently, and the maintenance cost of the air inlet device is reduced.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (11)
1. The air inlet device is characterized by comprising an air inlet body and a nozzle, wherein an annular concave channel is formed in the upper end face of the air inlet body, a mounting hole is formed in the annular concave channel of the air inlet body, an air inlet hole is formed in the nozzle, the nozzle is detachably mounted in the mounting hole, and the air inlet hole is communicated with the annular concave channel.
2. The intake apparatus according to claim 1, wherein a first protrusion is provided on a hole wall of the mounting hole;
a second convex part is arranged on the outer wall of the nozzle and is superposed on the first convex part of the mounting hole; a seal ring is provided between two surfaces where the first convex portion and the second convex portion overlap each other.
3. The air inlet device according to claim 2, wherein the upper end of the mounting hole is formed at the bottom of the annular concave channel, and the lower end of the mounting hole is formed at the lower end face of the air inlet body; the nozzle is in clearance fit with the mounting hole, the air inlet hole penetrates through two ends of the nozzle, and the upper end of the air inlet hole is communicated with the annular concave channel.
4. The intake device of claim 2, wherein the upper end of the mounting hole opens at the upper end face of the intake body, and the lower end of the mounting hole opens at the lower end face of the intake body;
the nozzle is in clearance fit with the mounting hole, a communicating groove is formed in the upper portion of the nozzle, the lower end of the air inlet hole is formed in the lower end face of the nozzle, and the upper end of the air inlet hole is communicated with the annular concave channel through the communicating groove.
5. The gas inlet device according to any one of claims 2 to 4, wherein the material of the nozzle comprises ceramic or quartz.
6. The air intake apparatus according to claim 1, wherein an internal thread is provided on a hole wall of the mounting hole;
the outer peripheral wall of the nozzle is provided with an external thread matched with the internal thread; the nozzle is in threaded connection with the mounting hole.
7. The air intake apparatus of claim 6, wherein the mounting hole comprises a threaded hole and a counterbore arranged coaxially from top to bottom,
the diameter of the counterbore is greater than the diameter of the threaded hole; the upper end of the threaded hole is formed at the bottom of the annular concave channel, and the lower end of the reaming hole is formed in the lower end face of the air inlet body;
the nozzle comprises a first body and a second body which are sequentially arranged from top to bottom, wherein the outer peripheral wall of the first body is provided with the external thread and is in threaded connection with the threaded hole; the second body is disposed in the counterbore, the second body having a diameter greater than the diameter of the first body;
the air inlet hole penetrates through two ends of the nozzle, and the upper end of the air inlet hole is communicated with the annular concave channel.
8. The air intake apparatus of claim 6, wherein the mounting hole comprises a threaded hole and a counterbore arranged coaxially from top to bottom,
the diameter of the counterbore is greater than the diameter of the threaded hole; the upper end of the threaded hole is formed in the upper end face of the air inlet body, and the lower end of the reaming hole is formed in the lower end face of the air inlet body;
the nozzle comprises a first body and a second body which are sequentially arranged from top to bottom, wherein the outer peripheral wall of the first body is provided with the external thread and is in threaded connection with the threaded hole; the second body is disposed in the counterbore, the second body having a diameter greater than the diameter of the first body;
the upper portion of the nozzle is provided with a communicating groove, the lower end of the air inlet hole is formed in the lower end face of the nozzle, and the upper end of the air inlet hole is communicated with the annular concave channel through the communicating groove.
9. An air inlet arrangement according to claim 7 or 8, wherein a sealing ring is provided between the end face of the second body facing the threaded bore and the opposite face of the counterbore.
10. The air inlet arrangement according to any of claims 6-8, characterized in that the material of the nozzle comprises metal.
11. A reaction chamber comprising a gas inlet device as claimed in any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910138374.2A CN111613508A (en) | 2019-02-25 | 2019-02-25 | Air inlet device and reaction chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910138374.2A CN111613508A (en) | 2019-02-25 | 2019-02-25 | Air inlet device and reaction chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111613508A true CN111613508A (en) | 2020-09-01 |
Family
ID=72202851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910138374.2A Pending CN111613508A (en) | 2019-02-25 | 2019-02-25 | Air inlet device and reaction chamber |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111613508A (en) |
Citations (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1189859A (en) * | 1995-07-10 | 1998-08-05 | 沃特金斯·约翰逊公司 | Plasma enhanced chemical processing reactor and method |
| JPH11274087A (en) * | 1998-03-25 | 1999-10-08 | Toshiba Corp | Shower plate |
| JP2001210628A (en) * | 1994-12-05 | 2001-08-03 | Tokyo Electron Ltd | Plasma treatment apparatus |
| US6334983B1 (en) * | 1997-04-11 | 2002-01-01 | Tokyo Electron Limited | Processing system |
| CN1365138A (en) * | 2001-01-11 | 2002-08-21 | 三星电子株式会社 | Gas projector and etching device comprising said projector |
| US20020179247A1 (en) * | 2001-06-04 | 2002-12-05 | Davis Matthew F. | Nozzle for introduction of reactive species in remote plasma cleaning applications |
| CN1639831A (en) * | 2001-10-15 | 2005-07-13 | 兰姆研究公司 | Tunable multi-zone gas injection system |
| CN1842240A (en) * | 2005-04-01 | 2006-10-04 | 周星工程股份有限公司 | Gas injector and apparatus including the same |
| CN1848371A (en) * | 2005-12-05 | 2006-10-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma etching apparatus |
| CN1850349A (en) * | 2005-12-07 | 2006-10-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Air-intake nozzle |
| TW200710270A (en) * | 2005-08-11 | 2007-03-16 | Applied Materials Inc | Two-piece dome with separate RF coils for inductively coupled plasma reactors |
| US20080121177A1 (en) * | 2006-11-28 | 2008-05-29 | Applied Materials, Inc. | Dual top gas feed through distributor for high density plasma chamber |
| CN101197271A (en) * | 2006-12-06 | 2008-06-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas injection apparatus |
| US20080254220A1 (en) * | 2006-01-20 | 2008-10-16 | Tokyo Electron Limited | Plasma processing apparatus |
| US20090047426A1 (en) * | 2007-08-17 | 2009-02-19 | Asm Genitech Korea Ltd. | Deposition apparatus |
| US20090120364A1 (en) * | 2007-11-09 | 2009-05-14 | Applied Materials, Inc. | Gas mixing swirl insert assembly |
| CN101488446A (en) * | 2008-01-14 | 2009-07-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma processing apparatus and gas dispensing apparatus thereof |
| CN101491164A (en) * | 2006-07-20 | 2009-07-22 | 东京毅力科创株式会社 | Shower plate, method for producing the same, plasma processing apparatus using the shower plate, plasma processing method, and method for manufacturing electronic device |
| US20090320756A1 (en) * | 2008-06-25 | 2009-12-31 | Tokyo Electron Limited | Microwave plasma processing apparatus |
| KR20100038942A (en) * | 2008-10-07 | 2010-04-15 | 김남진 | Plasma processing apparatus |
| US20100178775A1 (en) * | 2006-10-23 | 2010-07-15 | Tokyo Electron Limited | Shower plate sintered integrally with gas release hole member and method for manufacturing the same |
| CN101952940A (en) * | 2008-02-22 | 2011-01-19 | 株式会社Eugene科技 | Apparatus and method for processing substrate |
| CN102709144A (en) * | 2011-03-25 | 2012-10-03 | 东京毅力科创株式会社 | Plasma processing apparatus |
| CN102763199A (en) * | 2010-02-12 | 2012-10-31 | 应用材料公司 | Process chamber gas flow improvements |
| CN103155716A (en) * | 2010-10-15 | 2013-06-12 | 应用材料公司 | Method and apparatus for reducing particle defects in plasma etch chambers |
| TW201334060A (en) * | 2011-10-25 | 2013-08-16 | Lam Res Corp | Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber |
| CN103262661A (en) * | 2010-12-20 | 2013-08-21 | 应用材料公司 | Methods and apparatus for gas delivery into plasma processing chambers |
| CN103422071A (en) * | 2012-05-18 | 2013-12-04 | 中国地质大学（北京） | Vacuum cavity chamber capable of rapidly changing gas-homogenizing mode |
| US20140273301A1 (en) * | 2013-03-12 | 2014-09-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Moveable and adjustable gas injectors for an etching chamber |
| CN104651838A (en) * | 2013-11-22 | 2015-05-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas inlet apparatus and reaction chamber |
| CN106601580A (en) * | 2015-10-19 | 2017-04-26 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Air inlet mechanism and reaction cavity |
| US20170365444A1 (en) * | 2016-06-17 | 2017-12-21 | Samsung Electronics Co., Ltd. | Plasma Processing Apparatus |
| CN207398075U (en) * | 2017-08-15 | 2018-05-22 | 北京北方华创微电子装备有限公司 | Nozzle holder, processing chamber and semiconductor processing equipment |
-
2019
- 2019-02-25 CN CN201910138374.2A patent/CN111613508A/en active Pending
Patent Citations (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001210628A (en) * | 1994-12-05 | 2001-08-03 | Tokyo Electron Ltd | Plasma treatment apparatus |
| CN1189859A (en) * | 1995-07-10 | 1998-08-05 | 沃特金斯·约翰逊公司 | Plasma enhanced chemical processing reactor and method |
| US6334983B1 (en) * | 1997-04-11 | 2002-01-01 | Tokyo Electron Limited | Processing system |
| JPH11274087A (en) * | 1998-03-25 | 1999-10-08 | Toshiba Corp | Shower plate |
| CN1365138A (en) * | 2001-01-11 | 2002-08-21 | 三星电子株式会社 | Gas projector and etching device comprising said projector |
| US20020179247A1 (en) * | 2001-06-04 | 2002-12-05 | Davis Matthew F. | Nozzle for introduction of reactive species in remote plasma cleaning applications |
| CN1639831A (en) * | 2001-10-15 | 2005-07-13 | 兰姆研究公司 | Tunable multi-zone gas injection system |
| CN1842240A (en) * | 2005-04-01 | 2006-10-04 | 周星工程股份有限公司 | Gas injector and apparatus including the same |
| TW200710270A (en) * | 2005-08-11 | 2007-03-16 | Applied Materials Inc | Two-piece dome with separate RF coils for inductively coupled plasma reactors |
| CN1848371A (en) * | 2005-12-05 | 2006-10-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma etching apparatus |
| CN1850349A (en) * | 2005-12-07 | 2006-10-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Air-intake nozzle |
| US20080254220A1 (en) * | 2006-01-20 | 2008-10-16 | Tokyo Electron Limited | Plasma processing apparatus |
| CN101491164A (en) * | 2006-07-20 | 2009-07-22 | 东京毅力科创株式会社 | Shower plate, method for producing the same, plasma processing apparatus using the shower plate, plasma processing method, and method for manufacturing electronic device |
| US20100178775A1 (en) * | 2006-10-23 | 2010-07-15 | Tokyo Electron Limited | Shower plate sintered integrally with gas release hole member and method for manufacturing the same |
| US20080121177A1 (en) * | 2006-11-28 | 2008-05-29 | Applied Materials, Inc. | Dual top gas feed through distributor for high density plasma chamber |
| CN101197271A (en) * | 2006-12-06 | 2008-06-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas injection apparatus |
| US20090047426A1 (en) * | 2007-08-17 | 2009-02-19 | Asm Genitech Korea Ltd. | Deposition apparatus |
| US20090120364A1 (en) * | 2007-11-09 | 2009-05-14 | Applied Materials, Inc. | Gas mixing swirl insert assembly |
| CN101488446A (en) * | 2008-01-14 | 2009-07-22 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma processing apparatus and gas dispensing apparatus thereof |
| CN101952940A (en) * | 2008-02-22 | 2011-01-19 | 株式会社Eugene科技 | Apparatus and method for processing substrate |
| US20090320756A1 (en) * | 2008-06-25 | 2009-12-31 | Tokyo Electron Limited | Microwave plasma processing apparatus |
| KR20100038942A (en) * | 2008-10-07 | 2010-04-15 | 김남진 | Plasma processing apparatus |
| CN102763199A (en) * | 2010-02-12 | 2012-10-31 | 应用材料公司 | Process chamber gas flow improvements |
| CN107968032A (en) * | 2010-10-15 | 2018-04-27 | 应用材料公司 | To reduce the method and apparatus of the particle defects in plasma etch chamber |
| CN103155716A (en) * | 2010-10-15 | 2013-06-12 | 应用材料公司 | Method and apparatus for reducing particle defects in plasma etch chambers |
| CN103262661A (en) * | 2010-12-20 | 2013-08-21 | 应用材料公司 | Methods and apparatus for gas delivery into plasma processing chambers |
| CN102709144A (en) * | 2011-03-25 | 2012-10-03 | 东京毅力科创株式会社 | Plasma processing apparatus |
| TW201334060A (en) * | 2011-10-25 | 2013-08-16 | Lam Res Corp | Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber |
| CN103422071A (en) * | 2012-05-18 | 2013-12-04 | 中国地质大学（北京） | Vacuum cavity chamber capable of rapidly changing gas-homogenizing mode |
| US20140273301A1 (en) * | 2013-03-12 | 2014-09-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Moveable and adjustable gas injectors for an etching chamber |
| CN104651838A (en) * | 2013-11-22 | 2015-05-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas inlet apparatus and reaction chamber |
| CN106601580A (en) * | 2015-10-19 | 2017-04-26 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Air inlet mechanism and reaction cavity |
| US20170365444A1 (en) * | 2016-06-17 | 2017-12-21 | Samsung Electronics Co., Ltd. | Plasma Processing Apparatus |
| CN107527782A (en) * | 2016-06-17 | 2017-12-29 | 三星电子株式会社 | Plasma Processing Apparatus |
| CN207398075U (en) * | 2017-08-15 | 2018-05-22 | 北京北方华创微电子装备有限公司 | Nozzle holder, processing chamber and semiconductor processing equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9093483B2 (en) | Showerhead electrode assembly with gas flow modification for extended electrode life | |
| US5885358A (en) | Gas injection slit nozzle for a plasma process reactor | |
| JP6552155B2 (en) | Ceramic showerhead with embedded RF electrode for capacitively coupled plasma reactor | |
| KR100779814B1 (en) | Plasma processing apparatus and method | |
| US20070075503A1 (en) | Sealing part and substrate processing apparatus | |
| KR20120004158U (en) | Replaceable upper chamber parts of plasma processing apparatus | |
| JP2010077537A (en) | Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition | |
| KR101611955B1 (en) | Plasma reactor for purifying exhaust gas of the process facility | |
| US20090314435A1 (en) | Plasma processing unit | |
| KR101776235B1 (en) | Plasma reactor for purifying exhaust gas of the process facility | |
| JPH09283499A (en) | Plasma processing device | |
| CN111613508A (en) | Air inlet device and reaction chamber | |
| CN111564399B (en) | Uniform flow mechanism in semiconductor process equipment and semiconductor process equipment | |
| TW202201460A (en) | Capacitive sensors and capacitive sensing locations for plasma chamber condition monitoring | |
| TWI808459B (en) | Plasma treatment device and manufacturing method of gas spray ring thereof | |
| US20120192398A1 (en) | Process Gas Conduits Having Increased Usage Lifetime and Related Methods | |
| CN103764261A (en) | Apparatus for treating a gas stream | |
| CN212834020U (en) | Gas distributor structure of chemical vapor deposition equipment | |
| JP6321997B2 (en) | Detoxifying device, scraping part and bearing device used in the detoxifying device | |
| GB2493750A (en) | Apparatus for treating a gas stream | |
| TW202117842A (en) | Corrosion-resistant gas delivery part and plasma processing device thereof having advantage of effectively preventing the corrosive gas in the process gas from corroding the gas delivery system and the plasma processing device | |
| KR20210026814A (en) | Exhaust line cleaning device for semiconductor manufacturing apparatus | |
| TWI790482B (en) | Gas shower head components and plasma processing equipment | |
| TW201900266A (en) | Decompression and detoxification method of exhaust gas and device thereof | |
| JP2001104774A (en) | Plasma treatment apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |