CN111613175A

CN111613175A - Display panel, preparation method thereof and display device

Info

Publication number: CN111613175A
Application number: CN202010611401.6A
Authority: CN
Inventors: 王林志; 席克瑞; 粟平; 秦锋
Original assignee: Shanghai Tianma Microelectronics Co Ltd
Current assignee: Shanghai Tianma Microelectronics Co Ltd
Priority date: 2020-06-29
Filing date: 2020-06-29
Publication date: 2020-09-01
Anticipated expiration: 2040-06-29
Also published as: CN111613175B

Abstract

The embodiment of the invention discloses a display panel, a preparation method thereof and a display device, wherein the display panel comprises a transfer substrate and a driving substrate, and the transfer substrate, the driving substrate and a bridging part are included; the transfer substrate comprises a transfer substrate, a plurality of light emitting diodes transferred to the transfer substrate and a first bridging terminal; the driving substrate comprises a driving substrate, a driving circuit and a second bridging terminal, wherein the driving circuit is arranged on one side of the driving substrate, which faces the transfer substrate; the bridging part is electrically connected with the first bridging terminal and the second bridging terminal respectively and is used for bridging the transfer substrate and the driving substrate. The display panel is simple in structure and preparation process, and large-area transparent display can be achieved.

Description

Display panel, preparation method thereof and display device

Technical Field

The embodiment of the invention relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.

Background

Micro-LED (Micro light emitting diode) is a novel display technology, compared with the existing OLED (organic light emitting diode) display, the Micro-LED has higher brightness and better luminous efficiency, has smaller volume and can realize transparent display by adopting the Micro-LED.

For large-area transparent display, the existing mature Micro-LED transfer equipment can only support 8-inch substrate transfer basically, so that the Micro-LED transfer equipment cannot be directly formed on a large-area transparent substrate at one time, for example, a large-area transparent display can be directly realized on a vehicle window.

Disclosure of Invention

In view of this, embodiments of the present invention provide a display panel, a manufacturing method thereof, and a display device, where the display panel can be formed in one step by a bridging manner, so as to implement large-area transparent display.

In a first aspect, an embodiment of the present invention provides a display panel, where the display panel includes a transfer substrate and a driving substrate, and includes the transfer substrate, the driving substrate, and a bridge portion; the transfer substrate comprises a transfer substrate, a plurality of light emitting diodes transferred to the transfer substrate and a first bridging terminal; the driving substrate comprises a driving substrate, a driving circuit and a second bridging terminal, wherein the driving circuit is arranged on one side of the driving substrate, which faces the transfer substrate; the bridging part is electrically connected with the first bridging terminal and the second bridging terminal respectively and is used for bridging the transfer substrate and the driving substrate.

In a second aspect, an embodiment of the present invention further provides a preparation method of a display panel, for preparing the display panel of the first aspect, where the preparation method includes:

providing a transfer substrate, preparing a first bridging terminal on the transfer substrate and transferring a plurality of light emitting diodes to obtain a transfer substrate;

providing a driving substrate and preparing a driving circuit and a second bridging terminal on the driving substrate to obtain a driving substrate;

providing a bridge portion;

the bridge connection part and the first bridge terminal are connected.

In a third aspect, an embodiment of the present invention further provides a display device, including the display panel of the first aspect.

In the display panel provided by the embodiment of the invention, the transfer substrate comprises a plurality of light emitting diodes transferred to the transfer substrate, the plurality of light emitting diodes correspond to a plurality of light emitting diodes required by large-area transparent display, the driving substrate is provided with a corresponding driving circuit for controlling the light emission of the plurality of light emitting diodes, and the first bridging terminal of the transfer substrate and the second bridging terminal of the driving substrate are connected by the bridging part through the arrangement of the bridging part, so that the electric connection between the transfer substrate and the driving substrate is realized. The display panel provided by the embodiment of the invention can be obtained by electrically connecting the transfer substrate and the driving substrate through the bridging part at one time, and compared with the technical scheme that the diode display panel can be obtained only by carrying out alignment bonding for many times in batches in the prior art, the display panel provided by the embodiment of the invention has the advantages of simple structure and simple preparation process, and can realize large-area transparent display.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings:

fig. 1 is a schematic top view of a display panel according to an embodiment of the present invention;

fig. 2 is a schematic top view illustrating a display panel according to another embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view of the display panel shown in FIG. 2 taken along AA';

FIG. 4 is a schematic illustration of alignment for transferring the light emitting diode to the transfer substrate shown in FIG. 2;

FIG. 5 is a schematic cross-sectional view of the display panel shown in FIG. 2 taken along line BB';

FIG. 6 is a schematic cross-sectional view of the display panel shown in FIG. 2 taken along line DD';

fig. 7 is a schematic top view illustrating a display panel according to another embodiment of the present invention;

FIG. 8 is a schematic cross-sectional view of the display panel shown in FIG. 2 taken along BB';

FIG. 9 is a schematic cross-sectional view of the display panel shown in FIG. 2 taken along line DD';

fig. 10 is a schematic top view illustrating a display panel according to another embodiment of the present invention;

FIG. 11 is a schematic diagram of a driving circuit according to an embodiment of the present invention;

FIG. 12 is a schematic diagram of another driving circuit provided in an embodiment of the invention;

fig. 13 is a schematic layout of a circuit configuration of the drive circuit shown in fig. 12;

FIG. 14 is a schematic cross-sectional view of the transfer substrate of the circuit layout shown in FIG. 13 taken along EE';

FIG. 15 is a schematic view illustrating alignment of the LEDs when they are transferred to the transfer substrate shown in FIG. 14;

fig. 16 is a schematic structural diagram of a display panel according to yet another embodiment of the present invention;

fig. 17 is a schematic structural diagram of a display panel according to yet another embodiment of the present invention;

fig. 18 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention;

FIG. 19 is a schematic flow chart illustrating a method for fabricating a display panel according to another embodiment of the present invention;

FIG. 20 is a schematic flow chart illustrating a method for fabricating a display panel according to another embodiment of the present invention;

fig. 21 is a schematic flow chart illustrating a method for manufacturing a display panel according to another embodiment of the present invention;

fig. 22 is a schematic flow chart illustrating a method for manufacturing a display panel according to another embodiment of the present invention;

FIG. 23 is a schematic flow chart illustrating a method for fabricating a display panel according to another embodiment of the present invention;

fig. 24 is a schematic structural diagram of a display device according to an embodiment of the present invention;

fig. 25 is a schematic structural diagram of a display device according to still another embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be fully described by the detailed description with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are a part of the embodiments of the present invention, not all embodiments, and all other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without inventive efforts fall within the scope of the present invention.

Fig. 1 is a schematic top view of a display panel according to an embodiment of the present invention, and referring to fig. 1, the display panel 10 includes a transfer substrate 100, a driving substrate 200, and a bridging portion 300; the transfer substrate 100 includes a transfer substrate, a plurality of light emitting diodes 101 transferred onto the transfer substrate, and a first bridge terminal 102; the driving substrate 200 includes a driving substrate, a driving circuit disposed on a side of the driving substrate facing the transfer substrate 100, and a second bridge terminal 201; the bridge portion 300 is electrically connected to the first bridge terminal 102 and the second bridge terminal 201, respectively, for bridging the transfer substrate 100 and the driving substrate 200.

Illustratively, the transfer substrate may be a transparent substrate, and the transfer substrate 100 may be obtained by disposing the first bridge terminal 102 on the transfer substrate and transferring the plurality of light emitting diodes 101. The plurality of light emitting diodes 101 may correspond to a plurality of light emitting diodes required for large-area transparent display, and the transfer substrate 100 may correspond to a display area, thereby implementing large-area transparent display.

It should be noted that, the embodiment of the present invention does not limit how to transport the plurality of light emitting diodes 101 on the transport substrate, and the transport may be multiple batch transports or one simultaneous transport. Further, the light emitting diode 101 may be a micro-LED having a size of about 50 μm or a mini-LED having a size of about 100 μm, and both the micro-LED and the mini-LED are small compared to a conventional LED and may be used to implement a transparent display. The person skilled in the art can select the method according to the needs, and the embodiment of the present invention is not limited thereto.

Illustratively, the driving substrate may be a transparent substrate. The driving circuit mainly comprises a driving element and a wire connected between the driving element and the electrode of the light emitting diode 101, so that the wire is used for providing a control signal for the light emitting diode 101 to control the light emitting of the light emitting diode.

Since the led 101 and its driving circuit are located on different substrates, in order to implement the connection of electrical signals between the two, the following scheme is adopted in this embodiment: the first bridge terminal 102 is electrically connected to the light emitting diode 101 by providing the first bridge terminal 102 on the transfer substrate, the second bridge terminal 201 is electrically connected to the driving circuit (driving element) by providing the second bridge terminal 201 on the driving substrate, and the first bridge terminal 102 and the second bridge terminal 201 are respectively connected by providing the bridge section 300, so that the transfer substrate 100 is electrically connected to the driving substrate 200.

In the display panel provided by the embodiment of the invention, the transfer substrate comprises a plurality of light emitting diodes transferred to the transfer substrate, the plurality of light emitting diodes correspond to a plurality of light emitting diodes required by large-area transparent display, the driving substrate is provided with a corresponding driving circuit for controlling the light emission of the plurality of light emitting diodes, and the first bridging terminal of the transfer substrate and the second bridging terminal of the driving substrate are connected by the bridging part through the arrangement of the bridging part, so that the electric connection between the transfer substrate and the driving substrate is realized. The display panel provided by the embodiment of the invention can be obtained by electrically connecting the transfer substrate and the driving substrate through the bridging part at one time, and compared with the technical scheme that the diode display panel can be obtained only by carrying out alignment bonding for many times in batches in the prior art, the display panel provided by the embodiment of the invention has the advantages of simple structure and simpler preparation process, and can realize large-area transparent display.

On the basis of the foregoing embodiment, in the display panel provided in the embodiment of the present invention, in order to implement electrical connection between the light emitting diode and the first bridge terminal, a connection electrode electrically connected to the light emitting diode and the first bridge terminal, respectively, may be disposed on the transfer substrate, and in order to implement electrical connection between the driving circuit and the second bridge terminal, a connection electrode trace electrically connected to the driving element and the second bridge terminal, respectively, may be disposed on the driving substrate, and considering that the driving manner of the light emitting diode may be passive driving or active driving, the connection electrode and the connection electrode trace have different arrangement manners corresponding to different driving manners, therefore, the transfer substrate and the driving substrate have different structures; meanwhile, the bridge parts can adopt different bridge connection modes to realize the electrical connection between the driving substrate and the transferring substrate. The structure of the display panel will be described in detail below based on different driving methods for the light emitting diodes and different bridge connection methods for the bridge portions.

First, the structure of the transfer substrate and the driving substrate and the bridge connection method between them will be described when the driving method of the light emitting diode is passive driving.

On the basis of the above embodiments, fig. 2 is a schematic top view of a display panel according to another embodiment of the present invention, and shows the structures of the transfer substrate 100 and the driving substrate 200 when the light emitting diode is driven passively. Referring to fig. 2, the light emitting diode 101 includes a light emitting structure 1011 and first and

second electrodes

1012 and 1013 disposed at one side of the light emitting structure 1011; the transfer substrate 100 includes a transfer substrate 103, and a first connection electrode 104 and a second connection electrode 105 which are laminated on one side of the transfer substrate 103; the first electrode 1012 is connected to the first connection electrode 104, and the second electrode 1013 is connected to the second connection electrode 105; the first bridge terminal is electrically connected to the first connection electrode 104 and the second connection electrode 105, respectively; the driving circuit includes a first connection electrode trace 203 and a second connection electrode trace 204, and the first connection electrode trace 203 and the second connection electrode trace 204 are electrically connected to the second bridge terminal, respectively.

The first electrode 1012 may be an anode of the light emitting diode 101, and the second electrode 1013 may be a cathode of the light emitting diode 101. In the passive driving circuit of the led 101, the light emission of the led 101 is controlled by providing control signals to the anode and the cathode of the led respectively.

Referring to fig. 2, optionally, the driving circuit further includes a binding terminal 205, and a driving chip is bound to the binding terminal 205; alternatively, a flexible circuit board is bound to the binding terminal 205, and a driver chip is bound to the flexible circuit board. The first connection electrode trace 203 and the second connection electrode trace 204 are electrically connected to the bonding terminal 205, respectively, so that the driving chip outputs a control signal to the outside through the bonding terminal 205. Specifically, the control signal is transmitted to the first electrode 1012 through the first connection electrode 104 and the first connection electrode wire 203, and the control signal is transmitted to the second electrode 1013 through the second connection electrode 105 and the second connection electrode wire 204.

In the embodiment, the first connection electrode 104 and the first connection electrode trace 203, and the second connection electrode 105 and the second connection electrode trace 204 are electrically connected through the first bridge terminal, the second bridge terminal and the bridge portion. Specifically, as shown in fig. 1 and fig. 2, the first bridge terminal 102 includes a plurality of first sub-bridge terminals 1021, the second bridge terminal 201 includes a plurality of second sub-bridge terminals 2011, and the first sub-bridge terminals 1021 and the second sub-bridge terminals 2011 correspond to each other one to one. Specifically, in the present embodiment, the number of the first sub-bridge terminals 1021 is the same as the sum of the numbers of the first connection electrodes 104 and the second connection electrodes 105, and the number of the second sub-bridge terminals 2011 is the same as the sum of the numbers of the first connection electrode traces 203 and the second connection electrode traces 204. The first connecting electrode 104 and the first connecting electrode routing line 203 are electrically connected through the first sub-bridge terminal 1021 and the second sub-bridge terminal 2011 corresponding to the first connecting electrode and the bridge 300, and the second connecting electrode 105 and the second connecting electrode routing line 204 are electrically connected through the first sub-bridge terminal 1021 and the second sub-bridge terminal 2011 corresponding to the second connecting electrode and the bridge 300, so that the control signals of the light emitting diodes 101 are transmitted.

As can be seen from fig. 2, the first connection electrode 104 and the second connection electrode 105 may cross each other, and thus the first connection electrode 104 and the second connection electrode 105 need to be disposed in different film layers to achieve mutual independence of electrical signals. For example, fig. 3 is a schematic cross-sectional structure of the display panel shown in fig. 2 taken along AA', referring to fig. 3, a first connection electrode 104, an insulating layer 106 and a second connection electrode 105 are sequentially disposed on the surface of the transport substrate 103 from bottom to top, and the first connection electrode 104 located at the lower layer can be extended to a film layer where the second connection electrode 105 is located by disposing a through hole in the insulating layer 106 and filling the through hole with a conductive electrode 1041, so as to prepare for the subsequent electrical connection of the first electrode 1012 of the light emitting diode 101 and the first connection electrode 104. For example, the conductive electrode 1041 may be prepared under the same mask process as the second connection electrode 105. Fig. 4 is a schematic diagram of an alignment manner when the light emitting diode is transferred to the transfer substrate shown in fig. 2, referring to fig. 4, the first electrode 1012 can be aligned with the first connecting electrode 104 by aligning with the conductive electrode 1041, the second electrode 1013 is aligned with the second connecting electrode 105, and after the first connecting electrode 104, the second connecting electrode 105 and the first bridge terminal are disposed on the transfer substrate 103, the plurality of light emitting diodes 101 can be transferred according to the alignment manner, so as to obtain the transfer substrate 100.

Further, fig. 5 is a schematic cross-sectional view of the display panel shown in fig. 2 taken along BB ', and fig. 6 is a schematic cross-sectional view of the display panel shown in fig. 2 taken along DD', showing a partial structure of the display panel 10 at different viewing angles. The structures of the transfer substrate and the driving substrate and the manufacturing methods thereof will be described in detail with reference to fig. 2, 5, and 6. Referring to fig. 5 and 6, the first bridge terminal 102 is disposed at the same layer as the first connection electrode 104, and the second bridge terminal 201 is disposed at the same layer as the first connection electrode trace 203 and/or the second connection electrode trace 204.

Specifically, for the transport substrate 100, the plurality of first sub-bridge terminals 1021 and the first connection electrodes 104 are disposed at the same layer, and for example, the plurality of first sub-bridge terminals 1021 and the first connection electrodes 104 may be obtained by the same mask process. Next, an insulating layer 106 is formed to isolate the electrical signal, and a mask process is used to fabricate a second connection electrode 105 on the insulating layer 106 to electrically connect the second connection electrode 105 and the first sub-bridge terminal 1021. For the driving substrate 200, the first connecting electrode trace 203 and the second connecting electrode trace 204 may be disposed on the same film layer, or may be disposed on different film layers, and preferably, the first connecting electrode trace 203 and the second connecting electrode trace 204 are disposed on the same film layer. When the first connecting electrode trace 203 and the second connecting electrode trace 204 are disposed on the same film layer, the first connecting electrode trace 203, the second connecting electrode trace 204 and the plurality of second sub-bridge terminals 2011 can be obtained by using the same mask process, which is simpler in process. When the first connection electrode trace 203 and the second connection electrode trace 204 are disposed on different film layers, the second sub-bridge terminal 2011 may be disposed on the same layer as any connection electrode trace.

Further, in order to achieve a good transparent display effect, optionally, the first connection electrode 104 and the second connection electrode 105 are both transparent electrodes, and the first connection electrode trace 203 and the second connection electrode trace 204 are both transparent traces. For example, the material of the first connection electrode 104, the second connection electrode 105, the first connection electrode wire 203, and the second connection electrode wire 204 may be ITO (indium tin oxide).

In summary, the above embodiments describe the structure of the transfer substrate and the driving substrate when the driving method of the light emitting diode is passive driving. Next, based on this driving method, the structure of the bridge portion and the manner of bridging the transfer substrate and the driving substrate will be further described. Two bridge structures and bridge methods are provided.

First, the cross-sectional structures shown in fig. 5 and 6 exemplarily show the structure of the first bridge portion and the bridge manner thereof provided by the embodiment of the present invention. Referring to fig. 5 and 6, the bridge 300 includes a bridge substrate including a bridge substrate 301 and a conductive electrode 302 stacked, and the conductive electrode 302 is electrically connected to the plurality of first sub-bridge terminals 1021 and the plurality of second sub-bridge terminals 2011, respectively.

Illustratively, the number of the conductive electrodes 302 is plural, and the plural conductive electrodes 302 correspond to the plural first sub-bridge terminals 1021 and the plural second sub-bridge terminals 2011, and the plural conductive electrodes 302 are insulated from each other to achieve isolation of the electrical signals. In the embodiment of the present invention, the electrical connection manner between the conductive electrode 302 and the corresponding first sub-bridge terminal 1021 and second sub-bridge terminal 2011 is not limited, and can be set by a person skilled in the art.

For example, referring to fig. 5 or fig. 6, optionally, the display panel 10 further includes a first anisotropic conductive adhesive 401 and a second anisotropic conductive adhesive 402, where the first anisotropic conductive adhesive 401 and the second anisotropic conductive adhesive 402 both extend along a first direction, and the first direction intersects with a direction in which the first bridge terminal 102 points to the second bridge terminal 201; the conductive electrode 302 is electrically connected to the first bridge terminal 102 (first sub-bridge terminal 1021) through a first anisotropic conductive paste 401, and is electrically connected to the second bridge terminal 201 (second sub-bridge terminal 2011) through a second anisotropic conductive paste 402; along the second direction, the extension length of the first anisotropic conductive adhesive 401 is L1, wherein L1 is not more than 1 mm; along the second direction, the extension length of the second anisotropic conductive adhesive 402 is L2, wherein L2 is not more than 1 mm; the second direction is parallel to the direction in which the first bridge terminal 102 points to the second bridge terminal 201.

For example, the first Anisotropic Conductive paste 401 and the second Anisotropic Conductive paste 402 may adopt Anisotropic Conductive Films (ACFs) to electrically connect the first sub-bridge terminal 1021 and the second sub-bridge terminal 2011 corresponding to each other. In order to reduce the influence of the first anisotropic conductive paste 401 and the second anisotropic conductive paste 402 on the transparent display of the display panel 10, the widths of the first anisotropic conductive paste 401 and the second anisotropic conductive paste 402 may be set to be less than 1 mm.

Fig. 7 is a schematic top view illustrating a display panel according to another embodiment of the present invention, which shows a structure of the display panel when a bridge portion is a bridge substrate. As can be seen from fig. 7, the first anisotropic conductive paste 401 and the second anisotropic conductive paste 402 both extend in the first direction and cover the first bridge terminal 102 and the second bridge terminal 201, respectively, and the bridge substrate 301 of the bridge substrate covers the first anisotropic conductive paste 401 and the second anisotropic conductive paste 402. In this embodiment, the bridging portion is an integrally formed bridging substrate, and the conductive electrode 302 on the bridging substrate 301, the first anisotropic conductive adhesive 401 covering the first bridging terminal 102, and the second anisotropic conductive adhesive 402 covering the second bridging terminal 201 are used to electrically connect the corresponding first sub-bridging terminal 1021 and the second sub-bridging terminal 2011, so as to bridge the transfer substrate 100 and the driving substrate 200.

Next, the structure of the second bridge portion and the bridge manner thereof will be described. Fig. 8 is another schematic cross-sectional structure of the display panel shown in fig. 2 taken along BB ', fig. 9 is another schematic cross-sectional structure of the display panel shown in fig. 2 taken along DD', and fig. 8 and 9 are schematic cross-sectional structures showing a second bridge structure and a bridge manner thereof according to an embodiment of the present invention. Referring to fig. 8 and 9, optionally, the bridge 300 includes a plurality of connection wires 303; a first end of the connection wire 303 is electrically connected to the first sub-bridge terminal 1021, and a second end of the connection wire 303 is electrically connected to the second sub-bridge terminal 2011.

Illustratively, the connecting wires 303 may be gold wires, and the electrical connection between the transport substrate 100 and the driving substrate 200 is realized by bonding gold wires. Specifically, a solder layer 403 may be formed on the upper surface of each of the first sub-bridge terminal 1021 and the second sub-bridge terminal 2011, and a first end of a gold wire may be electrically connected to the first sub-bridge terminal 1021 and a second end of the gold wire may be electrically connected to the second sub-bridge terminal 2011 by using the solder layer 403.

Fig. 10 is a schematic top view of a display panel according to another embodiment of the present invention, which shows a structure of the display panel when a bridge portion is a plurality of connecting wires. Referring to fig. 10, the first sub-bridge terminal 1021 and the second sub-bridge terminal 2011 corresponding to each other are electrically connected by a connection wire 303. Further alternatively, the connecting wires 303 have a diameter d (not shown in fig. 10), and the distance between two adjacent connecting wires 303 is L3, d < L3.

Specifically, in order to reduce the visibility of the connection wire 303 (e.g., gold wire) and improve the transparent display effect of the display panel, the distance L3 between two adjacent straight lines may be set to be greater than the diameter d of the connection wire 303. It can be understood that, the smaller the diameter of the connecting wires 303 is, the larger the distance between two adjacent connecting wires 303 is, and the better the transparent display effect of the display panel 10 is, a person skilled in the art can reasonably set the distance between two adjacent connecting wires 303 according to the number of the connecting electrode wires, and appropriately reduce the diameter of the connecting wires 303 on the premise of ensuring the performance of the connecting wires 303, which is not limited in the embodiment of the present invention. Illustratively, to achieve a good transparent display effect, the diameter d of the connecting wires 303 may be 10 μm, and the distance L3 between two adjacent connecting wires 303 is at least 1000 μm.

In summary, the above embodiments describe the driving method of the light emitting diode in detail as the structure of the transfer substrate and the driving substrate and the bridging method of the two in the passive driving. Next, the structure of the transfer substrate and the driving substrate when the driving method of the light emitting diode is active driving will be described in detail. It should be noted that, when the driving mode of the light emitting diode is active driving, the structure of the bridging portion and the bridging mode thereof may also adopt two schemes provided by the above embodiments, and will not be described more in the following.

First, an active drive circuit is described as "1T" (one drive transistor) as an example. Fig. 11 is a schematic diagram of a driving circuit according to an embodiment of the present invention, which only illustrates a circuit structure in which a driving manner of a light emitting diode is active driving. Corresponding to fig. 11, when the active driving circuit is "1T", the structures of the transfer substrate 100 and the driving substrate 200 in the display panel 10 are as follows: the light emitting diode 101 includes a light emitting structure 1011 and a first electrode 1012 and a second electrode 1013 disposed on one side of the light emitting structure 1011; the transfer substrate 100 includes a transfer substrate, a plurality of first scan lines G1, a plurality of first data lines S1, a plurality of first transistors T1, a plurality of second connection electrodes, and a first bridge terminal, the first scan lines G1 are electrically connected to a control terminal of the first transistor T1, the first data lines S1 are electrically connected to an input terminal of the first transistor T1, and an output terminal of the first transistor T1 is connected to the first electrodes 1012 in an aligned manner; the second connecting electrode is connected to the second electrode 1013 in an aligned manner; the first bridge terminal is electrically connected with the first scan line G1, the first data line S1, and the second connection electrode, respectively; the driving circuit comprises a first scanning connection line, a first data connection line, a second connection electrode line and a second bridging terminal, wherein the first scanning connection line, the first data connection line and the second connection electrode line are respectively electrically connected with the second bridging terminal.

The second connection electrode and the second connection electrode trace are used for transmitting a control signal to the cathode (the second electrode 1013) of the light emitting diode 101, and therefore, referring to fig. 11, the second connection electrode trace is the Vss signal line in fig. 11.

Further, in order to enable the display panel to have a good transparent display effect, optionally, the second connection electrode is a transparent electrode, and the first scan line G1, the first data line S1, the first scan connection trace, the first data connection trace, and the second connection electrode trace are all transparent traces.

Next, an example in which the active drive circuit is "2T 1C" (two drive transistors and one capacitor) will be described. In the diode display panel, the active driving circuit is usually designed in a manner of 2T 1C. Referring to fig. 12, fig. 12 is a schematic diagram of another driving circuit according to an embodiment of the present invention, which illustrates another active driving circuit of the light emitting diode. The structure of the display panel corresponding to the driving circuit shown in fig. 11 can be designed according to the present embodiment, and only the structure of the 2T1C type active driving circuit will be described as an example. Fig. 13 is a schematic circuit structure layout of the driving circuit shown in fig. 12, fig. 14 is a schematic cross-sectional structure of the transfer substrate taken along EE' of the circuit layout shown in fig. 13, fig. 13 and 14 show a partial structure of the transfer substrate, and referring to fig. 12, 13 and 14, when the active driving circuit is "2T 1C", the structures of the transfer substrate 100 and the driving substrate 200 in the display panel 10 are as follows: the light emitting diode 101 includes a light emitting structure 1011 and a first electrode 1012 and a second electrode 1013 disposed on one side of the light emitting structure 1011; the transfer substrate 100 includes a transfer substrate 103, a plurality of second scan lines G2, a plurality of second data lines S2, a plurality of voltage signal lines PVDD, a plurality of second transistors T2, a plurality of third transistors T3, a plurality of storage capacitors C, a plurality of second connection electrodes 105, and a first bridge terminal, wherein the control terminal 111 of the second transistor T2 is electrically connected to the corresponding second scan line G2, the input terminal 112 of the second transistor T2 is electrically connected to the corresponding second data line S2, the output terminal 113 of the second transistor T2 is electrically connected to the control terminal 121 of the third transistor T3 and the first plate 131 of the storage capacitor C, the output terminal 123 of the third transistor T3 and the second plate 132 of the storage capacitor C are connected to the first electrode 1012 in an aligned manner, and the input terminal 122 of the third transistor T3 is electrically connected to the corresponding voltage signal line PVDD; the second connecting electrode 105 is connected to the second electrode 1013; the first bridge terminal is electrically connected to the second scan line G2, the second data line S2, the voltage signal line PVDD, and the second connection electrode 105, respectively; the driving circuit comprises a second scanning connection line, a second data connection line, a voltage connection line, a second connection electrode line and a second bridging terminal, wherein the second scanning connection line, the second data connection line, the voltage connection line and the second connection electrode line are respectively and electrically connected with the second bridging terminal.

Specifically, referring to fig. 1, the first bridge terminal 102 includes a plurality of first sub-bridge terminals 1021, the second bridge terminal 201 includes a plurality of second sub-bridge terminals 2011, and the first sub-bridge terminals 1021 and the second sub-bridge terminals 2011 correspond to each other one to one. The difference from the above embodiment is that in this embodiment, the number of the first sub-bridge terminals 1021 is the same as the sum of the numbers of the second scan lines G2, the second data lines S2, the voltage signal lines PVDD, and the second connection electrodes 105, and the number of the second sub-bridge terminals 2011 is the same as the sum of the numbers of the second scan connection traces, the second data connection traces, the voltage connection traces, and the second connection electrode traces, so as to implement independent transmission of each control signal. In addition, the bridging portion may be disposed in a manner of bridging the substrate or connecting the wires, which is not described herein again. The following description focuses on the structures of the transfer substrate 100 and the driving substrate 200.

As can be seen from fig. 12, the output terminal of the third transistor T3 is electrically connected to the anode (first electrode 1012) of the light emitting diode 101, and the cathode (second electrode 1013) of the light emitting diode 101 is electrically connected to the PVEE signal line, so that a pad 141 and a pad 142 are further provided in the circuit layout shown in fig. 13, referring to fig. 13 and 14, the pad 141 is electrically connected to the output terminal 123 of the third transistor T3 and the second plate 132 of the storage capacitor C, and the pad 142 is electrically connected to the second connection electrode 105. Further, fig. 15 is a schematic diagram of an alignment manner when the light emitting diode is transferred to the transfer substrate shown in fig. 14, referring to fig. 15, the output terminal 123 of the third transistor T3 and the second plate 132 of the storage capacitor C are aligned and connected to the first electrode 1012 through the pad 141, and the second connection electrode 105 is aligned and connected to the second electrode 1013 through the pad 142.

It should be noted that, the first bridging terminal is not shown in fig. 13 and fig. 14, and for the sake of simple manufacturing process, it is preferable that the first bridging terminal is disposed on the same layer as the metal layer closest to the transport substrate 103, and the connection manner between the signal line or the connection electrode located on the other film layer and the first sub-bridging terminal can be designed with reference to fig. 6 or fig. 9, and is not described herein again.

For the driving substrate 200, the second scan connection trace, the second data connection trace, the voltage connection trace, and the second connection electrode trace respectively correspond to the G2 signal line, the S2 signal line, the PVDD signal line, and the PVEE signal line in fig. 12 in sequence. In order to simplify the manufacturing process, it is preferable that each of the connection traces and the second bridge terminal in the driving substrate 200 are disposed in the same layer. Of course, in other embodiments, each of the connection traces and the second bridge terminal in the driving substrate 200 may be disposed on different film layers, which is not limited in the embodiment of the present invention.

Further, in order to enable the display panel to have a good transparent display effect, optionally, the second connection electrode 105 is a transparent electrode, and the second scan line G2, the second data line S2, the voltage signal line PVDD, the second scan connection line, the second data connection line, the voltage connection line, and the second connection electrode line are all transparent lines.

In summary, the above embodiments have described the structure of the display panel in detail based on different driving methods of the light emitting diodes and different bridge connection methods of the bridge portions. Next, a relative positional relationship between the transfer substrate and the driving substrate in the display panel will be further described on the basis of the above-described embodiments.

Referring to fig. 2, in the above embodiment, the transfer substrate 100 and the driving substrate 200 are sequentially disposed along the second direction, which is parallel to the direction in which the first bridge terminal points to the second bridge terminal. In addition to this, the transfer substrate 100 and the driving substrate 200 may be stacked. Fig. 16 is a schematic structural diagram of a display panel according to still another embodiment of the present invention, and referring to fig. 16, the driving substrate includes a first region Q1 and a second region Q2, the transfer substrate 100 is disposed in the first region Q1, and the driving circuit and the second bridge terminal are disposed in the second region Q2.

It can be understood that when the transfer substrate 100 and the driving substrate 200 are arranged in parallel, the bridge portion may be partially broken due to the external force, and therefore, in the embodiment of the invention, by arranging the transfer substrate 100 and the driving substrate 200 in a stacked manner, not only the driving substrate 200 can be used to provide a supporting function for the transfer substrate 100, but also the transfer substrate 100 can be fixed on the driving substrate 200, so that the electrical connection of the bridge portion is firmer, and the performance of the display panel is improved.

Fig. 17 is a schematic structural diagram of a display panel according to another embodiment of the present invention, referring to fig. 17, optionally, the display panel 10 further includes a supporting substrate 500; the transfer substrate and the driving substrate are disposed on the support substrate 500. This embodiment utilizes the supporting substrate to fix and support the transfer substrate 100 and the driving substrate 200, which has the same effect as the structure shown in fig. 16 and will not be described herein again.

In the above description, the transfer substrate corresponds to the display area of the display panel, and the connection electrode traces in the driving substrate are mainly used for realizing the connection of the electrical signals between the driving element and the light emitting diode. It should be noted that the length of the connection electrode trace or the size of the driving substrate (the second region) along the extending direction of the trace may be set according to the actual situation. Specifically, taking the display panel located in the interlayer of the window glass as an example, if the transfer substrate is located at the center of the window glass, the routing in the drive substrate is longer, so that the circuit can be extended to the side of the frame of the window and electrically connected with the binding terminal located at the side of the frame of the window; if the transfer substrate is located at the edge of the window pane, the drive substrate may be a bonding zone, and the length of the lead wire is short as long as the lead wire correspondingly connected to the connection electrode in the transfer substrate is located in the bonding zone.

Based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing a display panel, which is used for manufacturing the display panel provided in any one of the embodiments, so that the method for manufacturing a display panel provided in the embodiment of the present invention has the technical effects of the technical solutions in any one of the embodiments, and explanations of structures and terms that are the same as or corresponding to those in the embodiment of the display panel are not repeated herein.

Fig. 18 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention, which can be used to manufacture the display panel according to any of the embodiments. Referring to fig. 18, the preparation method includes the steps of:

s110, providing a transfer substrate, preparing a first bridging terminal on the transfer substrate, and transferring a plurality of light emitting diodes to obtain a transfer substrate.

And S120, providing a driving substrate, and preparing a driving circuit and a second bridging terminal on the driving substrate to obtain the driving substrate.

And S130, providing a bridging part.

S140, a connecting bridge part and a first bridge terminal, and the connecting bridge part and a second bridge terminal.

The manufacturing method of the display panel provided by the embodiment of the invention comprises the steps of firstly providing a transfer substrate, preparing a first bridge terminal on the transfer substrate, transferring a plurality of light emitting diodes to obtain a transfer substrate, providing a driving substrate, preparing a driving circuit and a second bridge terminal on the driving substrate to obtain a driving substrate, and realizing bridging between the driving substrate and the transfer substrate by providing the bridge part, connecting the bridge part with the first bridge terminal, and connecting the bridge part with the second bridge terminal.

On the basis of the above embodiments, first, the manufacturing methods of the transfer substrate and the driving substrate will be described in detail based on different driving methods of the light emitting diode.

Fig. 19 is a schematic flow chart of a method for manufacturing a display panel according to another embodiment of the present invention, which can be used to manufacture a display panel when the driving method of the light emitting diode is passive driving, and specific structures of the display panel can be seen in fig. 3 to fig. 10. Referring to fig. 19, the preparation method includes the steps of:

and S210, providing a transfer substrate.

S220, preparing a first connecting electrode, a second connecting electrode and a first bridging terminal on one side of the transfer substrate, wherein the first bridging terminal is electrically connected with the first connecting electrode and the second connecting electrode respectively, and the second connecting electrode is located on one side, far away from the transfer substrate, of the first connecting electrode.

Alternatively, the same mask process may be used to form the first connecting electrode and the first bridge terminal on the substrate side of the transfer substrate, and the second connecting electrode on the side of the first connecting electrode away from the transfer substrate.

And S230, transferring the plurality of light emitting diodes in a mode that the first electrode is aligned with the first connecting electrode and the second electrode is aligned with the second connecting electrode to obtain a transfer substrate.

And S240, providing a driving substrate.

And S250, preparing a first connecting electrode wire, a second connecting electrode wire and a second bridging terminal on one side of the driving substrate, wherein the second bridging terminal is electrically connected with the first connecting electrode wire and the second connecting electrode wire respectively.

Optionally, the first connection electrode trace, the second connection electrode trace and the second bridge terminal may be prepared on one side of the driving substrate by using the same mask process.

And S260, providing a bridging part.

S270, a connecting bridge portion and a first bridge terminal, and the connecting bridge portion and a second bridge terminal are connected.

Fig. 20 is a schematic flow chart of a method for manufacturing a display panel according to another embodiment of the present invention, which can be used to manufacture a display panel in which a driving manner of a light emitting diode is a "1T" type active driving, and a specific structure of the display panel can be seen in fig. 11. Referring to fig. 20, the preparation method includes the steps of:

s310, providing a transfer substrate.

S320, preparing a plurality of first scanning lines, a plurality of first data lines, a plurality of first transistors, a plurality of second connecting electrodes and a first bridging terminal on one side of the transfer substrate, wherein the control end of each first transistor is electrically connected with the corresponding first scanning line, the input end of each first transistor is electrically connected with the corresponding first data line, and the first bridging terminal is respectively electrically connected with the first scanning lines, the first data lines and the second connecting electrodes.

S330, transferring the plurality of light emitting diodes in a mode that the first electrode is aligned with the output end of the first transistor and the second electrode is aligned with the second connecting electrode to obtain a transfer substrate.

And S340, providing a driving substrate.

S350, preparing a first scanning connection line, a first data connection line, a second connection electrode line and a second bridging terminal on one side of the driving substrate, wherein the second bridging terminal is electrically connected with the first scanning connection line, the first data connection line and the second connection electrode line respectively.

And S360, providing a bridging part.

And S370, a connecting bridge part and a first bridge terminal, and the connecting bridge part and a second bridge terminal.

Fig. 21 is a schematic flow chart of a method for manufacturing a display panel according to another embodiment of the present invention, which can be used to manufacture a display panel in which the driving mode of the light emitting diode is "2T 1C" in active driving, and the specific structure can be seen in fig. 12 to fig. 15. Referring to fig. 21, the preparation method includes the steps of:

s410, providing a transfer substrate.

S420, preparing a plurality of second scanning lines, a plurality of second data lines, a plurality of voltage signal lines, a plurality of second transistors, a plurality of third transistors, a plurality of storage capacitors, a plurality of second connecting electrodes and a first bridging terminal on one side of a transfer substrate, wherein the control end of each second transistor is electrically connected with the corresponding second scanning line, the input end of each second transistor is electrically connected with the corresponding second data line, the output end of each first transistor is electrically connected with the control end of each third transistor and the first electrode plate of each storage capacitor, the input end of each third transistor is electrically connected with the corresponding voltage signal line, and the first bridging terminal is electrically connected with the second scanning lines, the second data lines, the voltage signal lines and the second connecting electrodes respectively.

And S430, transferring the plurality of light emitting diodes in a mode that the first electrode is aligned with the output end of the third transistor and the second plate of the storage capacitor, and the second connecting electrode is aligned with the second electrode to obtain a transfer substrate.

And S440, providing a driving substrate.

S450, preparing a second scanning connection line, a second data connection line, a voltage connection line, a second connection electrode line and a second bridging terminal on one side of the driving substrate, wherein the second bridging terminal is electrically connected with the second scanning connection line, the second data connection line, the voltage connection line and the second connection electrode line respectively.

And S460, providing a bridging part.

S470, a connecting bridge part and a first bridge terminal, and a connecting bridge part and a second bridge terminal.

The above embodiments have described the manufacturing methods of the transfer substrate and the driving substrate in detail, and on this basis, the manufacturing method of the bridge portion is further described below.

Fig. 22 is a schematic flow chart of a method for manufacturing a display panel according to another embodiment of the present invention, which can be used to manufacture a display panel when a bridge portion is a bridge substrate, and the specific structure can be seen in fig. 5 to 7. Specifically, the first bridge terminal includes a plurality of first sub-bridge terminals, the second bridge terminal includes a plurality of second sub-bridge terminals, and the first sub-bridge terminals correspond to the second sub-bridge terminals one to one. Referring to fig. 22, the preparation method includes the steps of:

s510, providing a transfer substrate, preparing a first bridging terminal on the transfer substrate, and transferring a plurality of light emitting diodes to obtain a transfer substrate.

S520, providing a driving substrate, and preparing a driving circuit and a second bridging terminal on the driving substrate to obtain the driving substrate.

And S530, providing a bridging substrate.

And S540, preparing a conductive electrode on one side of the bridging substrate to obtain the bridging substrate.

And S550, a connecting bridge part and a plurality of first sub-bridge terminals, and a connecting bridge part and a plurality of second sub-bridge terminals.

Further optionally, the conductive electrode and the first sub-bridge terminal are connected by a first anisotropic conductive adhesive, and the conductive electrode and the second sub-bridge terminal are connected by a second anisotropic conductive adhesive.

Fig. 23 is a schematic flow chart of a method for manufacturing a display panel according to another embodiment of the present invention, which can be used to manufacture a display panel with a plurality of connecting wires as bridging portions, and the specific structure can be seen in fig. 8 to fig. 10. Specifically, the first bridge terminal includes a plurality of first sub-bridge terminals, the second bridge terminal includes a plurality of second sub-bridge terminals, and the first sub-bridge terminals correspond to the second sub-bridge terminals one to one. Referring to fig. 23, the preparation method includes the steps of:

s610, providing a transfer substrate, preparing a first bridging terminal on the transfer substrate, and transferring a plurality of light emitting diodes to obtain a transfer substrate.

And S620, providing a driving substrate, and preparing a driving circuit and a second bridging terminal on the driving substrate to obtain the driving substrate.

And S630, providing a plurality of connecting wires.

And S640, electrically connecting the first end of the connecting wire with the first sub-bridge terminal, and electrically connecting the second end of the connecting wire with the second sub-bridge terminal.

Based on the same inventive concept, an embodiment of the present invention further provides a display device, and for example, fig. 24 is a schematic structural diagram of the display device provided in the embodiment of the present invention, and referring to fig. 24, the display device 20 includes the display panel 10 according to any embodiment of the present invention, so that the display device provided in the embodiment of the present invention has the technical effects of the technical solutions in any embodiment described above, and the explanations of the structures and terms that are the same as or corresponding to the embodiments described above are not repeated herein. The display device provided in the embodiment of the present invention may be a vehicle-mounted display shown in fig. 24, or may be any electronic product having a large-area transparent display function, which is not limited in the embodiment of the present invention.

With continued reference to fig. 24, the display device 20 further includes a first transparent substrate 21 and a second lens substrate 22, and the transfer substrate 100 and the driving substrate 200 are disposed between the first transparent substrate 21 and the second transparent substrate 22.

Illustratively, the first transparent substrate 21 and the second transparent substrate 22 may be two-layer glass substrates of a vehicle window, and a transparent display may be implemented on the vehicle window by disposing the transfer substrate 100 and the driving substrate 200 bonded in alignment between the first transparent substrate 21 and the second transparent substrate 22.

Fig. 25 is a schematic structural diagram of a display device according to still another embodiment of the present invention, and referring to fig. 25, the display device 20 further includes a transparent encapsulating adhesive 23 disposed between the first transparent substrate 21 and the second transparent substrate 22, and the transparent encapsulating adhesive is used to fill a gap between the transfer substrate 100 and the driving substrate 200 and the first transparent substrate 21 and/or the second transparent substrate 22.

In this embodiment, by providing the transparent encapsulation glue 23, the stability of the transfer substrate 100 and the driving substrate 200 is improved, and it is avoided that the transfer substrate 100 and the driving substrate 200 are loose due to the existence of the pores, and optionally, the transparent encapsulation glue may be an optical glue (OC).

It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the specific embodiments described herein, and that the features of the various embodiments of the invention may be partially or fully coupled or combined with each other and may be coordinated with each other and technically driven in various ways. Numerous variations, rearrangements, combinations, and substitutions will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel is characterized by comprising a transfer substrate, a driving substrate and a bridging part;

the transfer substrate comprises a transfer substrate, a plurality of light emitting diodes transferred onto the transfer substrate and a first bridging terminal;

the driving substrate comprises a driving substrate, a driving circuit and a second bridging terminal, wherein the driving circuit and the second bridging terminal are arranged on one side, facing the transfer substrate, of the driving substrate;

the bridging part is electrically connected with the first bridging terminal and the second bridging terminal respectively and is used for bridging the transfer substrate and the driving substrate.

2. The display panel according to claim 1, wherein the light emitting diode comprises a light emitting structure and a first electrode and a second electrode provided on one side of the light emitting structure;

the transfer substrate comprises a transfer substrate, a first connecting electrode and a second connecting electrode which are arranged on one side of the transfer substrate in a laminated mode;

the first electrode is connected with the first connecting electrode in an alignment mode, and the second electrode is connected with the second connecting electrode in an alignment mode; the first bridge terminal is electrically connected to the first connection electrode and the second connection electrode, respectively;

the driving circuit comprises a first connecting electrode wire and a second connecting electrode wire, and the first connecting electrode wire and the second connecting electrode wire are respectively electrically connected with the second bridging terminal.

3. The display panel according to claim 2, wherein the driving circuit further comprises a binding terminal;

the binding terminal is bound with a driving chip; or the binding terminal is bound with a flexible circuit board, and the flexible circuit board is bound with a driving chip.

4. The display panel according to claim 2, wherein the first connection electrodes and the second connection electrodes are both transparent electrodes, and the first connection electrode wirings and the second connection electrode wirings are both transparent wirings.

5. The display panel according to claim 2, wherein the first bridge terminal is disposed in the same layer as the first connection electrode, and the second bridge terminal is disposed in the same layer as the first connection electrode trace and/or the second connection electrode trace.

6. The display panel according to claim 1, wherein the light emitting diode comprises a light emitting structure and a first electrode and a second electrode provided on one side of the light emitting structure;

the transfer substrate comprises a transfer substrate, a plurality of first scanning lines, a plurality of first data lines, a plurality of first transistors, a plurality of second connecting electrodes and a first bridging terminal, wherein the plurality of first scanning lines, the plurality of first data lines, the plurality of first transistors, the plurality of second connecting electrodes and the first bridging terminal are arranged on one side of the transfer substrate; the second connecting electrode is connected with the second electrode in an alignment way;

the first bridge terminal is electrically connected to the first scan line, the first data line, and the second connection electrode, respectively;

the driving circuit comprises a first scanning connection line, a first data connection line, a second connection electrode line and a second bridging terminal, wherein the first scanning connection line, the first data connection line and the second connection electrode line are respectively and electrically connected with the second bridging terminal.

7. The display panel according to claim 6, wherein the second connection electrode is a transparent electrode, and the first scan line, the first data line, the first scan connection trace, the first data connection trace, and the second connection electrode trace are all transparent traces.

8. The display panel according to claim 1, wherein the light emitting diode comprises a light emitting structure and a first electrode and a second electrode provided on one side of the light emitting structure;

the transfer substrate comprises a transfer substrate, a plurality of second scanning lines, a plurality of second data lines, a plurality of voltage signal lines, a plurality of second transistors, a plurality of third transistors, a plurality of storage capacitors, a plurality of second connecting electrodes and a first bridging terminal, wherein the plurality of second scanning lines, the plurality of second data lines, the plurality of voltage signal lines, the plurality of second transistors, the plurality of third transistors, the plurality of storage capacitors, the plurality of second connecting electrodes and the first bridging terminal are arranged on one side of the transfer substrate; the second connecting electrode is connected with the second electrode in an alignment way;

the first bridge terminal is electrically connected to the second scan line, the second data line, the voltage signal line, and the second connection electrode, respectively;

the driving circuit comprises a second scanning connection line, a second data connection line, a voltage connection line, a second connection electrode line and a second bridging terminal, wherein the second scanning connection line, the second data connection line, the voltage connection line and the second connection electrode line are respectively and electrically connected with the second bridging terminal.

9. The display panel according to claim 8, wherein the second connection electrode is a transparent electrode, and the second scan line, the second data line, the voltage signal line, the second scan connection trace, the second data connection trace, the voltage connection trace, and the second connection electrode trace are all transparent traces.

10. The display panel according to any one of claims 1 to 9, wherein the first bridge terminal includes a plurality of first sub-bridge terminals, the second bridge terminal includes a plurality of second sub-bridge terminals, and the first sub-bridge terminals correspond to the second sub-bridge terminals one to one;

the bridge portion includes a bridge substrate;

the bridge substrate includes a bridge substrate and a conductive electrode stacked on each other, and the conductive electrode is electrically connected to the plurality of first sub-bridge terminals and the plurality of second sub-bridge terminals, respectively.

11. The display panel according to claim 10, wherein the display panel further comprises a first anisotropic conductive paste and a second anisotropic conductive paste, the first anisotropic conductive paste and the second anisotropic conductive paste each extending in a first direction, the first direction intersecting a direction in which the first bridge terminal points toward the second bridge terminal;

the conductive electrode is electrically connected with the first bridge terminal through the first anisotropic conductive adhesive and is electrically connected with the second bridge terminal through the second anisotropic conductive adhesive;

along a second direction, the extension length of the first anisotropic conductive adhesive is L1, wherein L1 is not less than 1 mm;

along the second direction, the extension length of the second anisotropic conductive adhesive is L2, wherein L2 is not less than 1 mm;

the second direction is parallel to a direction in which the first bridge terminal points to the second bridge terminal.

12. The display panel according to any one of claims 1 to 9, wherein the first bridge terminal comprises a plurality of first sub-bridge terminals, the second bridge terminal comprises a plurality of second sub-bridge terminals, and the first sub-bridge terminals correspond to the second sub-bridge terminals one to one;

the bridge portion includes a plurality of connection wires;

the first end of the connecting wire is electrically connected with the first sub-bridge terminal, and the second end of the connecting wire is electrically connected with the second sub-bridge terminal.

13. The display panel according to claim 12, wherein the connecting wires have a diameter d, and a distance between two adjacent connecting wires is L3, d < L3.

14. The display panel according to claim 1, wherein the transfer substrate and the driving substrate are disposed in sequence along a second direction, the second direction being parallel to a direction in which the first bridge terminal points to the second bridge terminal;

alternatively, the driving substrate includes a first region and a second region, the transfer substrate is disposed in the first region, and the driving circuit and the second bridge terminal are disposed in the second region.

15. The display panel according to claim 1, further comprising a support substrate;

the transfer substrate and the driving substrate are both arranged on the supporting substrate.

16. A method for manufacturing a display panel, which is used for manufacturing the display panel according to any one of claims 1 to 15, comprising:

providing a transfer substrate, preparing a first bridging terminal on the transfer substrate, and transferring a plurality of light emitting diodes to obtain a transfer substrate;

providing a driving substrate, and preparing a driving circuit and a second bridging terminal on the driving substrate to obtain a driving substrate;

providing a bridge portion;

and connecting the bridging part with the first bridging terminal and connecting the bridging part with the second bridging terminal.

17. The manufacturing method according to claim 16, wherein the light emitting diode includes a light emitting structure, and a first electrode and a second electrode provided on one side of the light emitting structure;

providing a transfer substrate and preparing a first bridge terminal on the transfer substrate and transferring a plurality of light emitting diodes to obtain a transfer substrate, comprising:

providing a transfer substrate;

preparing a first connecting electrode, a second connecting electrode and a first bridging terminal on one side of the transfer substrate, wherein the first bridging terminal is electrically connected with the first connecting electrode and the second connecting electrode respectively, and the second connecting electrode is positioned on one side, far away from the transfer substrate, of the first connecting electrode;

transferring a plurality of light emitting diodes in a mode that the first electrode is aligned with the first connecting electrode and the second electrode is aligned with the second connecting electrode to obtain a transfer substrate;

providing a driving substrate and preparing a driving circuit and a second bridge terminal on the driving substrate to obtain a driving substrate, comprising:

providing a driving substrate;

preparing a first connecting electrode wire, a second connecting electrode wire and a second bridging terminal on one side of the driving substrate, wherein the second bridging terminal is electrically connected with the first connecting electrode wire and the second connecting electrode wire respectively.

18. The production method according to claim 17, wherein producing the first connection electrode, the second connection electrode, and the first bridge terminal on the transfer substrate base plate side includes:

preparing a first connecting electrode and a first bridging terminal on one side of the transfer substrate base plate by adopting the same mask process;

preparing a second connecting electrode on the side of the first connecting electrode away from the transport substrate;

preparing a first connecting electrode wire, a second connecting electrode wire and a second bridging terminal on one side of the driving substrate, comprising:

and preparing a first connecting electrode wire, a second connecting electrode wire and a second bridging terminal on one side of the driving substrate by adopting the same mask process.

19. The manufacturing method according to claim 16, wherein the light emitting diode includes a light emitting structure, and a first electrode and a second electrode provided on one side of the light emitting structure;

providing a transfer substrate;

preparing a plurality of first scan lines, a plurality of first data lines, a plurality of first transistors, a plurality of second connection electrodes and a first bridge terminal on one side of the transfer substrate, wherein a control terminal of each first transistor is electrically connected with the corresponding first scan line, an input terminal of each first transistor is electrically connected with the corresponding first data line, and the first bridge terminal is electrically connected with the first scan lines, the first data lines and the second connection electrodes respectively;

transferring a plurality of light emitting diodes in a mode that the first electrode is aligned with the output end of the first transistor, and the second electrode is aligned with the second connecting electrode to obtain a transfer substrate;

providing a driving substrate;

preparing a first scanning connection line, a first data connection line, a second connection electrode line and a second bridging terminal on one side of the driving substrate, wherein the second bridging terminal is electrically connected with the first scanning connection line, the first data connection line and the second connection electrode line respectively.

20. The manufacturing method according to claim 16, wherein the light emitting diode includes a light emitting structure, and a first electrode and a second electrode provided on one side of the light emitting structure;

providing a transfer substrate;

preparing a plurality of second scanning lines, a plurality of second data lines, a plurality of voltage signal lines, a plurality of second transistors, a plurality of third transistors, a plurality of storage capacitors, a plurality of second connecting electrodes and a first bridging terminal on one side of the transfer substrate, wherein a control end of each second transistor is electrically connected with the corresponding second scanning line, an input end of each second transistor is electrically connected with the corresponding second data line, an output end of each first transistor is electrically connected with a control end of each third transistor and a first electrode plate of each storage capacitor, an input end of each third transistor is electrically connected with the corresponding voltage signal line, and the first bridging terminal is electrically connected with the second scanning lines, the second data lines, the voltage signal lines and the second connecting electrodes respectively;

transferring a plurality of light emitting diodes in a manner that the first electrode is aligned with the output end of the third transistor and the second plate of the storage capacitor, and the second connection electrode is aligned with the second electrode, so as to obtain a transfer substrate;

providing a driving substrate;

and preparing a second scanning connection line, a second data connection line, a voltage connection line, a second connection electrode line and a second bridging terminal on one side of the driving substrate, wherein the second bridging terminal is electrically connected with the second scanning connection line, the second data connection line, the voltage connection line and the second connection electrode line respectively.

21. The manufacturing method according to any one of claims 16 to 20, wherein the first bridge terminal includes a plurality of first sub-bridge terminals, the second bridge terminal includes a plurality of second sub-bridge terminals, and the first sub-bridge terminals correspond to the second sub-bridge terminals one to one;

providing a bridge portion comprising:

providing a bridging substrate;

preparing a conductive electrode on one side of the bridging substrate to obtain a bridging substrate;

connecting the bridge portion with the first bridge terminal, connecting the bridge portion with the second bridge terminal, comprising:

and connecting the bridging portion and the plurality of first sub-bridging terminals, and connecting the bridging portion and the plurality of second sub-bridging terminals.

22. The method for preparing as claimed in claim 21, wherein connecting the bridge portion and the plurality of first sub-bridge terminals and connecting the bridge portion and the plurality of second sub-bridge terminals comprises:

connecting the conductive electrode and the first sub-bridge terminal with a first anisotropic conductive adhesive;

and connecting the conductive electrode and the second sub-bridge terminal by using a second anisotropic conductive adhesive.

23. The manufacturing method according to any one of claims 16 to 20, wherein the first bridge terminal includes a plurality of first sub-bridge terminals, the second bridge terminal includes a plurality of second sub-bridge terminals, and the first sub-bridge terminals correspond to the second sub-bridge terminals one to one;

providing a bridge portion connecting the bridge portion and the first bridge terminal, and connecting the bridge portion and the second bridge terminal, including:

providing a plurality of connecting wires;

and electrically connecting the first end of the connecting wire with the first sub-bridge terminal, and electrically connecting the second end of the connecting wire with the second sub-bridge terminal.

24. A display device characterized by comprising the display panel according to any one of claims 1 to 15.

25. The display device according to claim 24, further comprising a first transparent substrate and a second transparent substrate;

the transfer substrate and the driving substrate are disposed between the first transparent substrate and the second transparent substrate.

26. The display device according to claim 25, further comprising a transparent encapsulation adhesive disposed between the first transparent substrate and the second transparent substrate, the transparent encapsulation adhesive being configured to fill a gap between the transfer substrate and the driving substrate and the first transparent substrate and/or the second transparent substrate.