CN111610837A - Heat dissipation method and device - Google Patents
Heat dissipation method and device Download PDFInfo
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- CN111610837A CN111610837A CN202010409415.XA CN202010409415A CN111610837A CN 111610837 A CN111610837 A CN 111610837A CN 202010409415 A CN202010409415 A CN 202010409415A CN 111610837 A CN111610837 A CN 111610837A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- A—HUMAN NECESSITIES
- A63—SPORTS; GAMES; AMUSEMENTS
- A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
- A63F13/00—Video games, i.e. games using an electronically generated display having two or more dimensions
- A63F13/90—Constructional details or arrangements of video game devices not provided for in groups A63F13/20 or A63F13/25, e.g. housing, wiring, connections or cabinets
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Abstract
The application discloses a heat dissipation method and device, belongs to the technical field of electronic equipment, and is used for solving the problems that a heat dissipation device in the prior art is poor in heat dissipation effect and low in heat dissipation efficiency. The method comprises the following steps: acquiring a current application scene of the electronic equipment; determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled; and starting a target refrigeration module corresponding to the target area to be cooled, wherein the target refrigeration module is used for cooling the target area to be cooled.
Description
Technical Field
The present application belongs to the technical field of electronic devices, and in particular, to a heat dissipation method and apparatus.
Background
With the development of electronic device technology, the electronic device processor is running faster and faster, and heavy-load scenes are more and more, for example, users playing large online games or performing video calls with the electronic device. In addition, in order to save the charging time, the charging current is also set to be larger and larger.
Therefore, the power consumption of the electronic device is correspondingly increased, and the heat generation phenomenon of the electronic device is more and more serious, which greatly affects the experience of the user using the electronic device. In the conventional heat dissipation technology for electronic equipment, a heat transfer element such as a heat pipe or a vapor chamber is generally disposed in the electronic equipment to dissipate heat from the electronic equipment. External heat dissipation devices such as an external heat dissipation back clip are also adopted to solve the heat dissipation problem during heavy load of the application program and high power charging.
However, the conventional heat dissipation method has poor heat dissipation effect and low heat dissipation efficiency.
Disclosure of Invention
The embodiment of the application provides a heat dissipation method and a heat dissipation device, which are used for solving the problems of poor heat dissipation effect and low heat dissipation efficiency of a heat dissipation device in the prior art.
In order to solve the technical problem, the present application is implemented as follows: in a first aspect, an embodiment of the present application provides a heat dissipation method, including:
acquiring a current application scene of the electronic equipment;
determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled;
and starting a target refrigeration module corresponding to the target area to be cooled, wherein the target refrigeration module is used for cooling the target area to be cooled.
In a second aspect, an embodiment of the present application further provides a heat dissipation apparatus, including:
the device comprises an acquisition unit, a processing unit and a display unit, wherein the acquisition unit is used for acquiring a current application scene of the electronic equipment;
the determining unit is used for determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled;
the starting unit is used for starting a target refrigeration module corresponding to the target area to be cooled, and the target refrigeration module is used for cooling the target area to be cooled.
In a third aspect, an embodiment of the present application provides an electronic device, which includes a processor, a memory, and a program or instructions stored on the memory and executable on the processor, and when executed by the processor, the program or instructions implement the steps of the method according to the first aspect.
In a fourth aspect, embodiments of the present application provide a readable storage medium, on which a program or instructions are stored, which when executed by a processor implement the steps of the method according to the first aspect.
In a fifth aspect, an embodiment of the present application provides a chip, where the chip includes a processor and a communication interface, where the communication interface is coupled to the processor, and the processor is configured to execute a program and instructions to implement the method according to the first aspect.
By adopting the method provided by the embodiment of the application, firstly, the current application scene of the electronic equipment is obtained; then, determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled; and finally, starting a target refrigeration module corresponding to the target area to be cooled, and cooling the target area to be cooled. Therefore, when the electronic equipment is in different application scenes, the target area to be cooled of the electronic equipment, which needs to be cooled, can be determined according to the mapping relation between the application scenes and the heating positions, and the target area to be cooled is cooled, so that the problem that when only partial areas of the electronic equipment need to be cooled, the whole electronic equipment is cooled indiscriminately is avoided, the energy consumption of the refrigeration module is reduced, and the cooling effect and efficiency are improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic flow chart illustrating an implementation of a heat dissipation method according to an embodiment of the present disclosure;
fig. 2 is a schematic view of a plurality of areas to be cooled of an electronic device in a cooling method according to an embodiment of the present disclosure;
fig. 3 is a schematic connection diagram of an electronic device and a heat dissipation apparatus in a heat dissipation method according to an embodiment of the present disclosure;
fig. 4 is a schematic flowchart of an embodiment of a heat dissipation method according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present disclosure;
fig. 6 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In the specification and claims, "and/or" indicates at least one of the connected objects, and a character "/" generally indicates that the preceding and following related objects are in an "or" relationship.
In order to solve the problems of poor heat dissipation effect and low heat dissipation efficiency of a heat dissipation device in the prior art, the application provides a heat dissipation method, and an execution main body of the method can be configured to execute at least one of the electronic devices provided by the embodiment of the application, such as but not limited to a mobile phone, a tablet computer, a wearable device and the like.
For convenience of description, the following description will be made on embodiments of the method, taking an execution subject of the method as an example of an electronic device capable of executing the method. It is to be understood that the implementation of the method as an electronic device is merely an exemplary illustration and should not be construed as a limitation of the method.
Specifically, the heat dissipation method provided by the application comprises the following steps: acquiring a current application scene of the electronic equipment; determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled; and starting a target refrigeration module corresponding to the target area to be cooled, and cooling the target area to be cooled.
Therefore, when the electronic equipment is in different application scenes, the target area to be cooled of the electronic equipment, which needs to be cooled, can be determined according to the mapping relation between the application scenes and the heating positions, and the target area to be cooled is cooled, so that the problem that when only partial areas of the electronic equipment need to be cooled, the whole electronic equipment is cooled indiscriminately is avoided, the energy consumption of the refrigeration module is reduced, and the cooling effect and efficiency are improved.
The following describes in detail an implementation process of the heat dissipation method, which is described in detail with reference to an implementation flow diagram of the heat dissipation method shown in fig. 1, and includes:
it should be understood that the electronic device may generate heat at different locations in different application scenarios. For example, when an electronic device is charged, a battery of the electronic device often generates heat seriously; when a user uses the electronic equipment to play a game, a central processing unit of the electronic equipment generates heat due to high-speed operation; when a user uses the electronic device to perform a video call, a camera of the electronic device generates heat due to long-time operation.
Therefore, in the method provided in the embodiment of the present application, a plurality of heat generating parts of the electronic device may be set as a plurality of areas to be cooled according to the heat generating parts of the electronic device in different application scenarios, as shown in fig. 2, which is a schematic diagram of a plurality of areas to be cooled of the electronic device in the heat dissipation method provided in the embodiment of the present application. In fig. 2, according to the heat generation conditions of the electronic device in different scenes, a plurality of heat generation parts are respectively set as a region to be radiated 1, a region to be radiated 2 and a region to be radiated 3.
It should be understood that the number of the areas to be radiated can be determined according to the actual radiating requirement, and the position of the areas to be radiated can be determined according to the position of the heating element or the device.
Optionally, the area to be dissipated is corresponding to a heat generating part of the electronic device, and the heat generating part of the electronic device is determined by an application scenario of the electronic device. In order to determine a target area to be cooled, which needs to be cooled immediately, from a plurality of areas to be cooled, the method provided by the embodiment of the application can acquire a current application scene of the electronic device.
The current application scene refers to a current application scene or a current-stage application scene, that is, an application scene in which the electronic device is currently located when the application scene is acquired, such as a game scene, a charging scene, a video call scene, and the like.
Specifically, the electronic device may send information of the current application scenario to the control module of the designated heat dissipation apparatus, so that the control module of the heat dissipation apparatus can further determine the target area to be dissipated and dissipate heat of the target area to be dissipated.
It should be understood that the electronic device and the heat dissipation device may be independent of each other, and the heat dissipation device is controlled by the control module of the heat dissipation device, or the heat dissipation device may be built in the electronic device and controlled by the electronic device.
Fig. 3 is a schematic view illustrating a connection between an electronic device and a heat dissipation apparatus in a heat dissipation method according to an embodiment of the present disclosure. In fig. 3, the electronic device may be connected to a control module of the heat sink, so that the electronic device can send information of the electronic device to the heat sink, and the heat sink can send information of the started target cooling module and the like to the electronic device.
102, determining a target area to be cooled corresponding to a current application scene of the electronic equipment according to a mapping relation between the application scene and the area to be cooled;
optionally, after the current application scene of the electronic device is obtained, the control module of the heat dissipation device may determine the target area to be dissipated according to the received current application scene of the electronic device and the mapping relationship between the application scene and the area to be dissipated.
For example, if the current application scene is a charging scene, the target area to be cooled may be an area corresponding to a battery of the electronic device; if the current application scene is a game scene, the target area to be radiated can be an area corresponding to a central processing unit of the electronic equipment; if the current application scene is a video call scene, the target area to be cooled may be an area corresponding to a camera of the electronic device.
And 103, starting a target refrigeration module corresponding to the target area to be cooled.
The target refrigeration module is used for dissipating heat of a target area to be dissipated.
It should be understood that the target refrigeration module corresponding to the target area to be cooled may be a target refrigeration module overlapping the target area to be cooled in position, a target refrigeration module capable of providing refrigeration service for the target area to be cooled, or the like.
Optionally, the heat dissipation device in the method provided by the embodiment of the present application may include a plurality of refrigeration modules. Therefore, after the target to-be-cooled area corresponding to the current application scene of the electronic equipment is determined, only the refrigeration module corresponding to the target to-be-cooled area can be started, namely, only the heating part corresponding to the current application scene is cooled, so that differential cooling is realized, the power consumption of the cooling device is reduced, and the cooling effect and efficiency are improved.
Specifically, in the method provided in the embodiment of the present application, starting a target refrigeration module corresponding to a target area to be cooled includes:
determining a target refrigeration module corresponding to a target area to be cooled from a plurality of refrigeration modules of the electronic equipment according to the mapping relation between the area to be cooled and the refrigeration modules;
and starting a target refrigeration module, wherein the target refrigeration module corresponds to the target area to be cooled.
Optionally, in order to determine whether the target area to be cooled needs to be cooled according to the temperature of the target area to be cooled, the control device in the cooling device may obtain the temperature of the target area to be cooled, and determine whether the temperature of the target area to be cooled is greater than or equal to a first preset threshold. If the temperature of the target area to be cooled is greater than the first preset threshold, it indicates that the temperature of the target area to be cooled exceeds the temperature range in which the electronic device can normally operate.
The temperature of the target area to be cooled may be obtained by detecting the electronic device and sending the temperature to the control module of the cooling device, or obtained by detecting the temperature of the target area to be cooled by the control module.
Specifically, in the method provided in the embodiment of the present application, starting a target refrigeration module corresponding to a target area to be cooled includes:
acquiring the temperature of a target area to be radiated;
and starting a target refrigeration module under the condition that the temperature of the target area to be cooled is greater than or equal to a first preset threshold value, wherein the target refrigeration module corresponds to the target area to be cooled.
Optionally, in order to save energy of the heat dissipation device and perform heat dissipation with reasonable intensity on the target area to be dissipated according to the actual temperature of the target area to be dissipated of the electronic device, the control module may determine the intensity of heat dissipation according to the temperature of the target area to be dissipated.
Specifically, in this embodiment of the present application, starting a target refrigeration module includes:
determining the refrigeration intensity of a target refrigeration module according to the temperature of the target area to be cooled;
and starting the target refrigeration module according to the refrigeration intensity of the target refrigeration module.
As shown in fig. 3, the control module is connected to the plurality of refrigeration modules and configured to send a control command to the plurality of refrigeration modules, so as to control the start, the shut, and the adjustment of the refrigeration modules. That is, the control module can adjust the intensity of the cooling module in addition to turning the cooling module on and off.
It is to be understood that the cooling module may comprise both elements for cooling only, such as semiconductor cooling plates, or elements containing a refrigerant, etc., and a combination of elements for cooling and a fan.
Optionally, in order to timely turn off the refrigeration module of the heat dissipation device after the temperature of the target area to be dissipated is reduced to the desired temperature due to heat dissipation, so as to avoid wasting the energy of the heat dissipation device, the temperature of the target area to be dissipated may be monitored, and the real-time temperature of the target area to be dissipated is compared with the second preset threshold.
Specifically, after the target refrigeration module corresponding to the target area to be cooled is started, the method provided by the embodiment of the present application further includes:
and under the condition that the temperature of the target area to be cooled is not greater than a second preset threshold value, closing the target refrigeration module.
It will be appreciated that the second preset threshold may be a temperature threshold that ensures that the operation of the electronic device is not affected by temperature.
Fig. 4 is a schematic flow chart of an embodiment of the heat dissipation method according to the embodiment of the present application. In the flowchart shown in fig. 4, the electronic device and the heat dissipation apparatus may be independent from each other, and the heat dissipation apparatus is controlled by the control module of the heat dissipation apparatus, or the heat dissipation apparatus may be built in the electronic device and controlled by the electronic device. The steps in fig. 4 are explained in detail below:
in step 409, if the temperature of the target area to be cooled is not greater than the second preset threshold, the control module closes the refrigeration module in the started cooling device.
By adopting the method provided by the embodiment of the application, firstly, the current application scene of the electronic equipment is obtained; then, determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled; and finally, starting a target refrigeration module corresponding to the target area to be cooled, wherein the target refrigeration module is used for cooling the target area to be cooled. Therefore, when the electronic equipment is in different application scenes, the target area to be cooled of the electronic equipment, which needs to be cooled, can be determined according to the mapping relation between the application scenes and the heating positions, and the target area to be cooled is cooled, so that the problem that when only partial areas of the electronic equipment need to be cooled, the whole electronic equipment is cooled indiscriminately is avoided, the energy consumption of the refrigeration module is reduced, and the cooling effect and efficiency are improved.
An embodiment of the present application further provides a heat dissipation apparatus 500, as shown in fig. 5, including:
an obtaining unit 501, configured to obtain a current application scene of an electronic device;
a determining unit 502, configured to determine, according to a mapping relationship between an application scene and a region to be cooled, a target region to be cooled corresponding to a current application scene of the electronic device;
a starting unit 503, configured to start a target refrigeration module corresponding to the target area to be cooled, where the target refrigeration module is configured to cool the target area to be cooled.
Optionally, in an embodiment, the starting unit 503 includes:
the first determining sub-module 5031 is configured to determine, according to a mapping relationship between an area to be cooled and a refrigeration module, a target refrigeration module corresponding to the target area to be cooled from among the multiple refrigeration modules of the electronic device;
the first starting sub-module 5032 is configured to start the target refrigeration module, where the target refrigeration module corresponds to the target area to be cooled.
Optionally, in an embodiment, the starting unit 503 includes:
the obtaining submodule 5033 is used for obtaining the temperature of the target area to be cooled;
the second starting sub-module 5034 is configured to start the target refrigeration module to dissipate heat of the target area to be dissipated if the temperature of the target area to be dissipated is greater than or equal to a first preset threshold.
Optionally, in an embodiment, the second initiator sub-module 5034 includes:
the second determining submodule 5035 is configured to determine the refrigeration intensity of the target refrigeration module according to the temperature of the target area to be cooled;
the third starting sub-module 5036 is configured to start the target refrigeration module according to the refrigeration intensity of the target refrigeration module, and dissipate heat of the target area to be dissipated.
Optionally, in an embodiment, the apparatus further includes:
a closing unit 504, configured to close the target refrigeration module when the temperature of the target region to be cooled is not greater than a second preset threshold.
The heat dissipation device in the embodiment of the present application may be a device, or may be a component, an integrated circuit, or a chip in a terminal. The device can be mobile electronic equipment or non-mobile electronic equipment. By way of example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a server, a Network Attached Storage (NAS), a Personal Computer (PC), a Television (TV), a teller machine or a kiosk, and the like, and the embodiments of the present application are not particularly limited.
The heat dissipation device in the embodiment of the present application may be a device having an operating system. The operating system may be an Android (Android) operating system, an ios operating system, or other possible operating systems, and embodiments of the present application are not limited specifically.
The heat dissipation device provided in the embodiment of the present application can implement each process implemented by the heat dissipation device in the method embodiments of fig. 1 to fig. 4, and is not described here again to avoid repetition.
By adopting the method provided by the embodiment of the application, firstly, the current application scene of the electronic equipment is obtained; then, determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled; and finally, starting a target refrigeration module corresponding to the target area to be cooled, wherein the target refrigeration module is used for cooling the target area to be cooled. Therefore, when the electronic equipment is in different application scenes, the target area to be cooled of the electronic equipment, which needs to be cooled, can be determined according to the mapping relation between the application scenes and the heating positions, and the target area to be cooled is cooled, so that the problem that when only partial areas of the electronic equipment need to be cooled, the whole electronic equipment is cooled indiscriminately is avoided, the energy consumption of the refrigeration module is reduced, and the cooling effect and efficiency are improved.
Optionally, an electronic device is further provided in this embodiment of the present application, and includes a processor 610, a memory 609, and a program or an instruction stored in the memory 609 and capable of being executed on the processor 610, where the program or the instruction is executed by the processor 610 to implement each process of the foregoing heat dissipation method embodiment, and can achieve the same technical effect, and details are not repeated here to avoid repetition.
It should be noted that the electronic devices in the embodiments of the present application include the mobile electronic devices and the non-mobile electronic devices described above.
Fig. 6 is a schematic diagram of a hardware structure of an electronic device implementing an embodiment of the present application.
The electronic device 600 includes, but is not limited to: a radio frequency unit 601, a network module 602, an audio output unit 603, an input unit 604, a sensor 605, a display unit 606, a user input unit 607, an interface unit 608, a memory 609, a processor 610, and the like.
Those skilled in the art will appreciate that the electronic device 600 may further comprise a power source (e.g., a battery) for supplying power to the various components, and the power source may be logically connected to the processor 610 through a power management system, so as to implement functions of managing charging, discharging, and power consumption through the power management system. The electronic device structure shown in fig. 6 does not constitute a limitation of the electronic device, and the electronic device may include more or less components than those shown, or combine some components, or arrange different components, and thus, the description is omitted here.
The processor 610 is configured to obtain a current application scenario of the electronic device; determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled; and starting a target refrigeration module corresponding to the target area to be cooled, and cooling the target area to be cooled.
By adopting the method provided by the embodiment of the application, firstly, the current application scene of the electronic equipment is obtained; then, determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled; and finally, starting a target refrigeration module corresponding to the target area to be cooled, wherein the target refrigeration module is used for cooling the target area to be cooled. Therefore, when the electronic equipment is in different application scenes, the target area to be cooled of the electronic equipment, which needs to be cooled, can be determined according to the mapping relation between the application scenes and the heating positions, and the target area to be cooled is cooled, so that the problem that when only partial areas of the electronic equipment need to be cooled, the whole electronic equipment is cooled indiscriminately is avoided, the energy consumption of the refrigeration module is reduced, and the cooling effect and efficiency are improved.
The processor 610 is further configured to close the target refrigeration module if it is detected that the temperature of the target area to be cooled is not greater than a second preset threshold.
The embodiment of the present application further provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or the instruction is executed by a processor, the process of the embodiment of the heat dissipation method is implemented, and the same technical effect can be achieved, and in order to avoid repetition, details are not repeated here.
The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and so on.
The embodiment of the present application further provides a chip, where the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is configured to execute a program or an instruction to implement each process of the foregoing heat dissipation method embodiment, and can achieve the same technical effect, and the details are not repeated here to avoid repetition.
It should be understood that the chips mentioned in the embodiments of the present application may also be referred to as system-on-chip, system-on-chip or system-on-chip, etc.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A method of dissipating heat, comprising:
acquiring a current application scene of the electronic equipment;
determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled;
and starting a target refrigeration module corresponding to the target area to be cooled, wherein the target refrigeration module is used for cooling the target area to be cooled.
2. The method of claim 1, wherein the activating a target refrigeration module corresponding to the target area to be cooled comprises:
determining a target refrigeration module corresponding to the target area to be cooled from a plurality of refrigeration modules of the electronic equipment according to the mapping relation between the area to be cooled and the refrigeration module;
and starting the target refrigeration module, wherein the target refrigeration module corresponds to the target area to be cooled.
3. The method of claim 1, wherein the activating a target refrigeration module corresponding to the target area to be cooled comprises:
acquiring the temperature of the target area to be radiated;
and starting the target refrigeration module when the temperature of the target area to be cooled is greater than or equal to a first preset threshold value, wherein the target refrigeration module corresponds to the target area to be cooled.
4. The method of claim 3, wherein said activating the target refrigeration module comprises:
determining the refrigeration intensity of the target refrigeration module according to the temperature of the target area to be cooled;
and starting the target refrigeration module according to the refrigeration intensity of the target refrigeration module.
5. The method of any of claims 3-4, wherein after the activating the target refrigeration module corresponding to the target area to be cooled, the method further comprises:
and under the condition that the temperature of the target area to be cooled is not greater than a second preset threshold value, closing the target refrigeration module.
6. A heat dissipating device, comprising:
the device comprises an acquisition unit, a processing unit and a display unit, wherein the acquisition unit is used for acquiring a current application scene of the electronic equipment;
the determining unit is used for determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled;
the starting unit is used for starting a target refrigeration module corresponding to the target area to be cooled, and the target refrigeration module is used for cooling the target area to be cooled.
7. The apparatus of claim 6, wherein the activation unit comprises;
the first determining submodule is used for determining a target refrigeration module corresponding to the target area to be cooled from a plurality of refrigeration modules of the electronic equipment according to the mapping relation between the area to be cooled and the refrigeration modules;
the first starting submodule is used for starting the target refrigeration module, and the target refrigeration module corresponds to the target area to be cooled.
8. The apparatus of claim 7, wherein the starting unit comprises:
the obtaining submodule is used for obtaining the temperature of the target area to be cooled;
and the second starting submodule is used for starting the target refrigeration module under the condition that the temperature of the target area to be cooled is greater than or equal to a first preset threshold value, and the target refrigeration module corresponds to the target area to be cooled.
9. The apparatus of claim 8, wherein the second initiator module comprises:
the second determining submodule is used for determining the refrigerating intensity of the target refrigerating module according to the temperature of the target area to be cooled;
and the third starting submodule is used for starting the target refrigeration module according to the refrigeration intensity of the target refrigeration module.
10. The apparatus of any of claims 8 to 9, further comprising:
and the closing unit is used for closing the target refrigeration module under the condition that the temperature of the target area to be cooled is not greater than a second preset threshold value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010409415.XA CN111610837A (en) | 2020-05-14 | 2020-05-14 | Heat dissipation method and device |
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| CN202010409415.XA CN111610837A (en) | 2020-05-14 | 2020-05-14 | Heat dissipation method and device |
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| CN111610837A true CN111610837A (en) | 2020-09-01 |
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| CN202010409415.XA Pending CN111610837A (en) | 2020-05-14 | 2020-05-14 | Heat dissipation method and device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112118718A (en) * | 2020-10-31 | 2020-12-22 | Oppo广东移动通信有限公司 | Electronic equipment and heat dissipation method thereof |
| CN113204274A (en) * | 2021-04-29 | 2021-08-03 | 山东英信计算机技术有限公司 | Heat dissipation control method and system of server and related components |
| CN114706465A (en) * | 2022-04-25 | 2022-07-05 | 紫光计算机科技有限公司 | Method and device for adjusting performance of electronic equipment, electronic equipment and medium |
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| CN112118718A (en) * | 2020-10-31 | 2020-12-22 | Oppo广东移动通信有限公司 | Electronic equipment and heat dissipation method thereof |
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| CN114706465A (en) * | 2022-04-25 | 2022-07-05 | 紫光计算机科技有限公司 | Method and device for adjusting performance of electronic equipment, electronic equipment and medium |
| CN114706465B (en) * | 2022-04-25 | 2024-05-10 | 紫光计算机科技有限公司 | Performance adjustment method and device of electronic equipment, electronic equipment and medium |
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Application publication date: 20200901 |