CN111610837A - Heat dissipation method and device - Google Patents

Abstract

The application discloses a heat dissipation method and device, belongs to the technical field of electronic equipment, and is used for solving the problems that a heat dissipation device in the prior art is poor in heat dissipation effect and low in heat dissipation efficiency. The method comprises the following steps: acquiring a current application scene of the electronic equipment; determining a target area to be cooled corresponding to the current application scene of the electronic equipment according to the mapping relation between the application scene and the area to be cooled; and starting a target refrigeration module corresponding to the target area to be cooled, wherein the target refrigeration module is used for cooling the target area to be cooled.

Description

Heat dissipation method and device

technical field

The present application belongs to the technical field of electronic equipment, and in particular, relates to a heat dissipation method and device.

Background technique

With the continuous development of electronic device technology, electronic device processors run faster and more frequently, and there are more and more overload scenarios. For example, users are using electronic devices to play large online games or make video calls. In addition, in order to save charging time, the charging current is also set to be larger and larger.

Therefore, the power consumption of the electronic device increases accordingly, and the heating phenomenon of the electronic device becomes more and more serious, which greatly affects the user's experience of using the electronic device. In the existing heat dissipation technology of electronic equipment, heat transfer elements such as heat pipes or vapor chambers are usually arranged inside the electronic equipment to dissipate heat from the electronic equipment. There are also external heat dissipation devices such as external heat dissipation back clips to solve the heat dissipation problem during heavy-duty applications and high-power charging.

However, the existing heat dissipation methods have poor heat dissipation effect and low heat dissipation efficiency.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a heat dissipation method and device to solve the problems of poor heat dissipation effect and low heat dissipation efficiency of the heat dissipation device in the prior art.

In order to solve the above technical problems, the present application is implemented as follows: In the first aspect, an embodiment of the present application provides a heat dissipation method, including:

Obtain the current application scenario of the electronic device;

According to the mapping relationship between the application scenario and the area to be dissipated, the target area to be dissipated corresponding to the current application scenario of the electronic device is determined;

A target refrigeration module corresponding to the target area to be dissipated is activated, and the target refrigeration module is configured to dissipate heat from the target area to be dissipated.

In a second aspect, an embodiment of the present application further provides a heat dissipation device, including:

an acquisition unit for acquiring the current application scenario of the electronic device;

a determining unit, configured to determine the target area to be dissipated corresponding to the current application scenario of the electronic device according to the mapping relationship between the application scenario and the area to be dissipated;

The starting unit is configured to start a target refrigeration module corresponding to the target area to be dissipated, and the target refrigeration module is configured to dissipate heat from the target area to be dissipated.

In a third aspect, embodiments of the present application provide an electronic device, the electronic device includes a processor, a memory, and a program or instruction stored on the memory and executable on the processor, the program or instruction being The processor implements the steps of the method according to the first aspect when executed.

In a fourth aspect, an embodiment of the present application provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or instruction is executed by a processor, the steps of the method according to the first aspect are implemented .

In a fifth aspect, an embodiment of the present application provides a chip, where the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is used for running programs and instructions, implementing the first the method described in the aspect.

Using the method provided by the embodiment of the present application, first, the current application scenario of the electronic device is obtained; then, according to the mapping relationship between the application scenario and the area to be dissipated, the target area to be dissipated corresponding to the current application scenario of the electronic device is determined; Finally, the target cooling module corresponding to the target area to be dissipated is activated to dissipate heat from the target area to be dissipated. In this way, when the electronic device is in different application scenarios, the target area to be radiated by the electronic device can be determined according to the mapping relationship between the application scenario and the heating position, and the target area to be radiated can be dissipated, so as to avoid the need for When dissipating heat in a part of the electronic device, the entire electronic device is dissipated indiscriminately, thereby reducing the energy consumption of the cooling module and improving the effect and efficiency of heat dissipation.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments of the present application. Obviously, the drawings in the following description are only some embodiments of the present application. , for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative labor.

FIG. 1 is a schematic diagram of an implementation flow of a heat dissipation method provided by an embodiment of the present application;

2 is a schematic diagram of a plurality of regions to be dissipated in an electronic device in a dissipating method provided by an embodiment of the present application;

3 is a schematic diagram of a connection between an electronic device and a heat dissipation device in the heat dissipation method provided by the embodiment of the present application;

FIG. 4 is a schematic flowchart of an embodiment of a heat dissipation method provided by an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;

FIG. 6 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

The terms "first", "second" and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that data so used may be interchanged under appropriate circumstances so that embodiments of the application can be practiced in sequences other than those illustrated or described herein. In addition, "and/or" in the description and claims refers to at least one of the connected objects, and the character "/" generally indicates that the related objects are in an "or" relationship.

In order to solve the problems of poor heat dissipation effect and low heat dissipation efficiency of the heat dissipation device in the prior art, the present application provides a heat dissipation method. At least one of the electronic devices configured to execute the method provided by the embodiments of the present application.

For the convenience of description, the implementation of the method is described below by taking an electronic device capable of executing the method as an example to introduce the implementation of the method. It can be understood that the execution subject of the method is an electronic device, which is only an exemplary description, and should not be construed as a limitation of the method.

Specifically, the heat dissipation method provided by the present application includes: obtaining a current application scenario of an electronic device; determining a target heat dissipation area corresponding to the current application scenario of the electronic device according to the mapping relationship between the application scenario and the area to be dissipated; The target cooling module corresponding to the target area to be dissipated heats the target area to be dissipated.

In this way, when the electronic device is in different application scenarios, the target area to be radiated by the electronic device can be determined according to the mapping relationship between the application scenario and the heating position, and the target area to be radiated can be dissipated, so as to avoid the need for When dissipating heat in a part of the electronic device, the entire electronic device is dissipated indiscriminately, thereby reducing the energy consumption of the cooling module and improving the effect and efficiency of heat dissipation.

The following describes the implementation process of the method in detail with reference to the schematic diagram of the implementation flow of the heat dissipation method shown in FIG. 1 , including:

Step 101, obtaining the current application scenario of the electronic device;

It should be understood that, in different application scenarios of electronic devices, the heating parts will be different. For example, when charging an electronic device, the battery of the electronic device tends to heat up seriously; when the user uses the electronic device to play games, the central processing unit of the electronic device will heat up due to high-speed operation; when the user uses the electronic device to make a video call , the camera of the electronic device will heat up due to long working hours.

Therefore, in the method provided by the embodiments of the present application, according to the heat-generating parts of the electronic device in different application scenarios, multiple heat-generating parts of the electronic device can be set as multiple areas to be dissipated, as shown in FIG. 2 , which is implemented in this application. A schematic diagram of a plurality of regions to be dissipated in an electronic device in the dissipating method provided by the example. In FIG. 2 , according to the heating conditions of the electronic device in different scenarios, a plurality of heating parts are respectively set as the area to be radiated 1 , the area to be radiated 2 , and the area to be radiated 3 .

It should be understood that the number of the areas to be dissipated may be determined according to actual heat dissipation requirements, and the location of the areas to be dissipated may be determined depending on the location of the heating element or device.

Optionally, since the area to be dissipated corresponds to the heat-generating part of the electronic device, and the heat-generating part of the electronic device is determined by the application scenario of the electronic device. In order to determine a target area to be dissipated that needs to be dissipated immediately from the multiple areas to be dissipated, the method provided by the embodiment of the present application can first obtain the current application scenario of the electronic device.

The current application scenario refers to the current application scenario or the current application scenario, that is, the application scenario the electronic device is in when the application scenario is acquired, such as a game scenario, a charging scenario, a video call scenario, and the like.

Specifically, the electronic device can send the information of the current application scenario to the control module of the designated heat dissipation device, so that the control module of the heat dissipation device can further determine the target area to be dissipated and dissipate heat from the target area to be dissipated.

It should be understood that the electronic device and the heat dissipation device may be independent of each other, and the heat dissipation device is controlled by the control module of the heat dissipation device, or the heat dissipation device may also be built in the electronic device and controlled by the electronic device.

As shown in FIG. 3 , a schematic diagram of a connection between an electronic device and a heat dissipation device in a heat dissipation method provided by an embodiment of the present application is shown. In FIG. 3 , the electronic device can be connected to the control module of the cooling device, so that the electronic device can send information of the electronic device to the cooling device, and the cooling device can send information such as the activated target refrigeration module to the electronic device.

Step 102, according to the mapping relationship between the application scenario and the area to be dissipated, determine the target area to be dissipated corresponding to the current application scenario of the electronic device;

Optionally, after acquiring the current application scenario of the electronic device, the control module of the heat dissipation device may determine the target area to be dissipated according to the received current application scenario of the electronic device and the mapping relationship between the application scenario and the area to be dissipated.

For example, if the current application scene is a charging scene, the target area to be dissipated may be the area corresponding to the battery of the electronic device; if the current application scene is a game scene, the target area to be dissipated may be the area corresponding to the central processing unit of the electronic device area; if the current application scenario is a video call scenario, the target area to be dissipated may be the area corresponding to the camera of the electronic device.

Step 103: Activate the target refrigeration module corresponding to the target area to be dissipated.

Wherein, the target cooling module is used to dissipate heat in the target area to be dissipated.

It should be understood that the target cooling module corresponding to the target area to be dissipated may be a target refrigeration module overlapping the target area to be dissipated in position, or a target refrigeration module capable of providing cooling services for the target area to be dissipated.

Optionally, the heat dissipation device in the method provided by the embodiment of the present application may include a plurality of refrigeration modules. In this way, after determining the target area to be radiated corresponding to the current application scenario of the electronic device, only the cooling module corresponding to the target area to be radiated can be activated, that is, only the heat-generating parts corresponding to the current application scenario can be radiated, so as to achieve differential heat dissipation. Reduce the power consumption of the heat sink and improve the effect and efficiency of heat dissipation.

Specifically, in the method provided by the embodiment of the present application, activating the target refrigeration module corresponding to the target area to be radiated includes:

According to the mapping relationship between the area to be dissipated and the cooling module, the target refrigeration module corresponding to the target area to be dissipated is determined from the plurality of refrigeration modules of the electronic device;

The target cooling module is activated, and the target cooling module corresponds to the target area to be dissipated.

Optionally, in order to be able to determine whether it is necessary to dissipate heat in the target area to be dissipated according to the temperature of the area to be dissipated, the control device in the heat dissipating device may obtain the temperature of the area to be dissipated and determine the temperature of the area to be dissipated. Is it greater than or equal to the first preset threshold. If the temperature of the target area to be dissipated is greater than the first preset threshold, it means that the temperature of the target area to be dissipated has exceeded the temperature range in which the electronic device can operate normally.

The temperature of the target area to be dissipated may be detected by electronic equipment and sent to the control module of the heat dissipation device, or the temperature of the target area to be dissipated may be detected by the control module.

Specifically, in the method provided by the embodiment of the present application, activating the target refrigeration module corresponding to the target area to be radiated includes:

Obtain the temperature of the target area to be dissipated;

When the temperature of the target area to be dissipated is greater than or equal to the first preset threshold, the target refrigeration module is activated, and the target refrigeration module should correspond to the target area to be dissipated.

Optionally, in order to save the energy of the heat dissipation device, and according to the actual temperature of the target area to be dissipated in the electronic device, the target area to be dissipated can be radiated with reasonable intensity, the control module can determine the amount of heat dissipation according to the temperature of the target area to be dissipated. strength.

Specifically, in the embodiment of the present application, starting the target refrigeration module includes:

Determine the cooling intensity of the target cooling module according to the temperature of the target area to be dissipated;

According to the cooling intensity of the target cooling module, the target cooling module is activated.

As shown in FIG. 3 , the control module is connected to a plurality of refrigeration modules, and is used for sending control instructions to the plurality of refrigeration modules, thereby controlling the activation, shutdown and adjustment of the refrigeration modules. That is to say, the control module can not only turn on and off the cooling module, but also adjust the cooling intensity of the cooling module.

It should be understood that the cooling module may include only components for cooling, or may include a combination of components for cooling and a fan, wherein the components for cooling may be, for example, semiconductor refrigeration chips, or elements containing refrigerant.

Optionally, in order to shut down the cooling module of the heat sink in time to avoid wasting the energy of the heat sink after the temperature of the target area to be dissipated decreases to a desired temperature due to heat dissipation, the temperature of the target area to be dissipated can be monitored, and the target area to be dissipated can be monitored. The real-time temperature of the area to be dissipated is compared with the second preset threshold.

Specifically, after starting the target refrigeration module corresponding to the target area to be dissipated, the method provided by the embodiment of the present application further includes:

When the temperature of the target area to be dissipated is not greater than the second preset threshold, the target refrigeration module is turned off.

It should be understood that the second preset threshold may be a temperature threshold capable of ensuring that the operation of the electronic device will not be affected by temperature.

As shown in FIG. 4 , it is a schematic flowchart of an embodiment of the heat dissipation method provided by the embodiment of the present application. In the flowchart shown in FIG. 4 , the electronic device and the heat sink can be independent of each other, and the heat sink is controlled by the control module of the heat sink, or the heat sink can also be built in the electronic device and controlled by the electronic device. The steps in Figure 4 are described in detail below:

Step 401, the electronic device sends the current application scenario to the control module of the cooling device;

Step 402, the control module determines the target area to be dissipated according to the current application scenario and the mapping relationship between the application scenario and the area to be dissipated;

Step 403, the control module detects or obtains the temperature of the target area to be dissipated from the electronic device;

Step 404, the control module determines whether the temperature of the target area to be radiated is greater than or equal to the first preset threshold, and if the temperature of the target area to be radiated is less than the first preset threshold, the control module continues to detect or obtain the target area to be radiated from the electronic device. temperature;

Step 405, if the temperature of the target heat dissipation area is greater than or equal to the first preset threshold, the control module determines the heat dissipation intensity of the heat dissipation device according to the temperature of the target heat dissipation area, wherein the heat dissipation intensity of the heat dissipation device includes the cooling intensity of the cooling module;

Step 406, the control module activates the cooling module in the cooling device according to the determined heat dissipation intensity;

Step 407, the control module continuously detects or obtains the temperature of the target area to be dissipated from the electronic device;

Step 408, the control module determines whether the temperature of the target area to be dissipated is not greater than the second preset threshold, and if the temperature of the target area to be dissipated is greater than the second preset threshold, the control module continues to detect or obtains from the electronic device the temperature of the area to be dissipated. temperature;

Step 409 , if the temperature of the target area to be radiated is not greater than the second preset threshold, the control module turns off the cooling module in the activated radiator.

Using the method provided by the embodiment of the present application, first, the current application scenario of the electronic device is obtained; then, according to the mapping relationship between the application scenario and the area to be dissipated, the target area to be dissipated corresponding to the current application scenario of the electronic device is determined; Finally, a target cooling module corresponding to the target area to be radiated is activated, and the target refrigerated module is used for cooling the target area to be radiated. In this way, when the electronic device is in different application scenarios, the target area to be radiated by the electronic device can be determined according to the mapping relationship between the application scenario and the heating position, and the target area to be radiated can be dissipated, so as to avoid the need for When dissipating heat in a part of the electronic device, the entire electronic device is dissipated indiscriminately, thereby reducing the energy consumption of the cooling module and improving the effect and efficiency of heat dissipation.

The embodiment of the present application also provides a heat dissipation device 500, as shown in FIG. 5, including:

an obtaining unit 501, configured to obtain a current application scenario of an electronic device;

A determining unit 502, configured to determine a target area to be dissipated corresponding to the current application scenario of the electronic device according to the mapping relationship between the application scenario and the area to be dissipated;

The starting unit 503 is configured to start a target refrigeration module corresponding to the target area to be dissipated, and the target refrigeration module is configured to dissipate heat from the target area to be dissipated.

Optionally, in one embodiment, the startup unit 503 includes:

a first determination sub-module 5031, configured to determine a target cooling module corresponding to the target heat-dissipating area from a plurality of cooling modules of the electronic device according to the mapping relationship between the heat-dissipating area and the cooling module;

The first activation sub-module 5032 is configured to activate the target refrigeration module, and the target refrigeration module corresponds to the target area to be dissipated.

Optionally, in one embodiment, the startup unit 503 includes:

Obtaining sub-module 5033, for obtaining the temperature of the target area to be dissipated;

The second activation sub-module 5034 is configured to activate the target cooling module if the temperature of the target area to be dissipated is greater than or equal to a first preset threshold, to dissipate heat to the target area to be dissipated.

Optionally, in one embodiment, the second promoter module 5034 includes:

The second determination sub-module 5035 is configured to determine the cooling intensity of the target cooling module according to the temperature of the target area to be dissipated;

The third activation sub-module 5036 is configured to activate the target cooling module according to the cooling intensity of the target cooling module to dissipate heat from the target area to be dissipated.

Optionally, in one embodiment, the device further includes:

A shut-off unit 504 is configured to shut down the target refrigeration module when the temperature of the target area to be dissipated is not greater than a second preset threshold.

The heat dissipation device in this embodiment of the present application may be a device, or may be a component, an integrated circuit, or a chip in a terminal. The apparatus may be a mobile electronic device or a non-mobile electronic device. Exemplarily, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palmtop computer, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (personal digital assistant). , PDA), etc., the non-mobile electronic device may be a server, a network attached storage (NAS), a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc. The embodiments of the present application There is no specific limitation.

The heat dissipation device in the embodiment of the present application may be a device with an operating system. The operating system may be an Android (Android) operating system, an ios operating system, or other possible operating systems, which are not specifically limited in the embodiments of the present application.

The heat dissipation device provided in the embodiments of the present application can implement each process implemented by the heat dissipation device in the method embodiments of FIG. 1 to FIG. 4 , and to avoid repetition, details are not repeated here.

Using the method provided by the embodiment of the present application, first, the current application scenario of the electronic device is obtained; then, according to the mapping relationship between the application scenario and the area to be dissipated, the target area to be dissipated corresponding to the current application scenario of the electronic device is determined; Finally, a target cooling module corresponding to the target area to be radiated is activated, and the target refrigerated module is used for cooling the target area to be radiated. In this way, when the electronic device is in different application scenarios, the target area to be radiated by the electronic device can be determined according to the mapping relationship between the application scenario and the heating position, and the target area to be radiated can be dissipated, so as to avoid the need for When dissipating heat in a part of the electronic device, the entire electronic device is dissipated indiscriminately, thereby reducing the energy consumption of the cooling module and improving the effect and efficiency of heat dissipation.

Optionally, an embodiment of the present application further provides an electronic device, including a processor 610, a memory 609, a program or instruction stored in the memory 609 and executable on the processor 610, the program or instruction being processed by the processor When 610 is executed, each process of the above heat dissipation method embodiment is implemented, and the same technical effect can be achieved. To avoid repetition, details are not described here.

It should be noted that the electronic devices in the embodiments of the present application include the aforementioned mobile electronic devices and non-mobile electronic devices.

FIG. 6 is a schematic diagram of a hardware structure of an electronic device implementing an embodiment of the present application.

The electronic device 600 includes but is not limited to: a radio frequency unit 601, a network module 602, an audio output unit 603, an input unit 604, a sensor 605, a display unit 606, a user input unit 607, an interface unit 608, a memory 609, and a processor 610, etc. part.

Those skilled in the art can understand that the electronic device 600 may also include a power source (such as a battery) for supplying power to various components, and the power source may be logically connected to the processor 610 through a power management system, so as to manage charging, discharging, and power management through the power management system. consumption management and other functions. The structure of the electronic device shown in FIG. 6 does not constitute a limitation on the electronic device, and the electronic device may include more or less components than those shown in the figure, or combine some components, or arrange different components, which will not be repeated here. .

Among them, the processor 610 is used to obtain the current application scenario of the electronic device; according to the mapping relationship between the application scenario and the area to be dissipated, determine the target area to be dissipated corresponding to the current application scenario of the electronic device; A target refrigeration module corresponding to the target area to be dissipated heat is used to dissipate heat to the area to be dissipated.

Using the method provided by the embodiment of the present application, first, the current application scenario of the electronic device is obtained; then, according to the mapping relationship between the application scenario and the area to be dissipated, the target area to be dissipated corresponding to the current application scenario of the electronic device is determined; Finally, a target cooling module corresponding to the target area to be radiated is activated, and the target refrigerated module is used for cooling the target area to be radiated. In this way, when the electronic device is in different application scenarios, the target area to be radiated by the electronic device can be determined according to the mapping relationship between the application scenario and the heating position, and the target area to be radiated can be dissipated, so as to avoid the need for When dissipating heat in a part of the electronic device, the entire electronic device is dissipated indiscriminately, thereby reducing the energy consumption of the cooling module and improving the effect and efficiency of heat dissipation.

The processor 610 is further configured to turn off the target refrigeration module if it is detected that the temperature of the target area to be dissipated is not greater than a second preset threshold.

Embodiments of the present application further provide a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or instruction is executed by a processor, each process of the foregoing heat dissipation method embodiment can be achieved, and can achieve the same The technical effect, in order to avoid repetition, will not be repeated here.

Wherein, the processor is the processor in the electronic device described in the foregoing embodiments. The readable storage medium includes a computer-readable storage medium, such as a computer read-only memory (Read-Only Memory, ROM), a random access memory (Random Access Memory, RAM), a magnetic disk or an optical disk, and the like.

An embodiment of the present application further provides a chip, where the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is configured to run a program or an instruction to implement each of the foregoing heat dissipation method embodiments process, and can achieve the same technical effect, in order to avoid repetition, it will not be repeated here.

It should be understood that the chip mentioned in the embodiments of the present application may also be referred to as a system-on-chip, a system-on-chip, a system-on-a-chip, or a system-on-a-chip, or the like.

It should be noted that, herein, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements, It also includes other elements not expressly listed or inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element. In addition, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in the reverse order depending on the functions involved. To perform functions, for example, the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to some examples may be combined in other examples.

From the description of the above embodiments, those skilled in the art can clearly understand that the method of the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is better implementation. Based on this understanding, the technical solution of the present application can be embodied in the form of a software product in essence or in a part that contributes to the prior art, and the computer software product is stored in a storage medium (such as ROM/RAM, magnetic disk, CD-ROM), including several instructions to make a terminal (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) execute the methods described in the various embodiments of this application.

The embodiments of the present application have been described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific embodiments, which are merely illustrative rather than restrictive. Under the inspiration of this application, without departing from the scope of protection of the purpose of this application and the claims, many forms can be made, which all fall within the protection of this application.

Claims (10)

1. a heat dissipation method, is characterized in that, comprises: Obtain the current application scenario of the electronic device; According to the mapping relationship between the application scenario and the area to be dissipated, the target area to be dissipated corresponding to the current application scenario of the electronic device is determined; A target refrigeration module corresponding to the target area to be dissipated is activated, and the target refrigeration module is configured to dissipate heat from the target area to be dissipated. 2. The method according to claim 1, wherein the activating the target refrigeration module corresponding to the target area to be dissipated comprises: According to the mapping relationship between the area to be dissipated and the refrigeration module, a target refrigeration module corresponding to the target area to be dissipated is determined from the plurality of refrigeration modules of the electronic device; The target refrigeration module is activated, and the target refrigeration module corresponds to the target area to be dissipated. 3. The method of claim 1, wherein the activating the target refrigeration module corresponding to the target area to be dissipated comprises: obtaining the temperature of the target area to be dissipated; When the temperature of the target area to be dissipated is greater than or equal to a first preset threshold, the target refrigeration module is activated, and the target refrigeration module corresponds to the target area to be dissipated. 4. The method of claim 3, wherein the activating the target refrigeration module comprises: determining the cooling intensity of the target cooling module according to the temperature of the target area to be dissipated; The target refrigeration module is activated according to the refrigeration intensity of the target refrigeration module. 5. The method according to any one of claims 3 to 4, wherein after the activation of the target refrigeration module corresponding to the target area to be dissipated, the method further comprises: When the temperature of the target area to be dissipated is not greater than a second preset threshold, the target refrigeration module is turned off. 6. A heat dissipation device, characterized in that, comprising: an acquisition unit for acquiring the current application scenario of the electronic device; a determining unit, configured to determine the target area to be dissipated corresponding to the current application scenario of the electronic device according to the mapping relationship between the application scenario and the area to be dissipated; The starting unit is configured to start a target refrigeration module corresponding to the target area to be dissipated, and the target refrigeration module is configured to dissipate heat from the target area to be dissipated. 7. The apparatus of claim 6, wherein the activation unit comprises: a first determination sub-module, configured to determine a target refrigeration module corresponding to the target area to be dissipated from among a plurality of refrigeration modules of the electronic device according to the mapping relationship between the area to be dissipated and the refrigeration module; The first activation sub-module is used to activate the target refrigeration module, and the target refrigeration module corresponds to the target area to be dissipated. 8. The device according to claim 7, wherein the starting unit comprises: obtaining a submodule for obtaining the temperature of the target area to be dissipated; a second activation sub-module, configured to activate the target cooling module when the temperature of the target area to be dissipated is greater than or equal to a first preset threshold, the target refrigeration module corresponding to the target area to be dissipated . 9. The device of claim 8, wherein the second promoter module comprises: a second determination sub-module, configured to determine the cooling intensity of the target cooling module according to the temperature of the target area to be dissipated; A third activation sub-module, configured to activate the target refrigeration module according to the refrigeration intensity of the target refrigeration module. 10. The device according to any one of claims 8 to 9, wherein the device further comprises: A shut-off unit, configured to shut down the target refrigeration module when the temperature of the target area to be dissipated is not greater than a second preset threshold.

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