CN113747739B - Multi-heat source temperature management method and multi-heat source wireless communication device - Google Patents
Multi-heat source temperature management method and multi-heat source wireless communication device Download PDFInfo
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- CN113747739B CN113747739B CN202010477859.7A CN202010477859A CN113747739B CN 113747739 B CN113747739 B CN 113747739B CN 202010477859 A CN202010477859 A CN 202010477859A CN 113747739 B CN113747739 B CN 113747739B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/035—Cooling of active equipments, e.g. air ducts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The temperature management method of the multiple heat sources is applied to the multiple heat source wireless communication device, the multiple heat source wireless communication device at least comprises a wireless communication module, a heat source combination, a heat conduction assembly, a heat dissipation fin group and a cooling fan, the heat conduction assembly is connected with the wireless communication module and the heat source combination, the heat dissipation fin group is connected with the heat conduction assembly and corresponds to the heat source combination or the wireless communication module configuration, and the cooling fan normally executes forced air cooling on the heat dissipation fin group at a first rotation speed. The temperature management method comprises the steps of sequentially increasing the first rotating speed to a second rotating speed, reducing power consumption of the heat source combination and executing an event trigger according to the temperature value of the wireless communication module, so as to maintain the temperature value of the wireless communication module at an appropriate temperature.
Description
Technical Field
The present invention relates to temperature management of a wireless communication device, and more particularly, to a temperature management method of multiple heat sources and a wireless communication device with multiple heat sources.
Background
Wireless data transmission has been widely used in electronic devices. The introduction of high-speed data transmission technology, such as the five-generation mobile communication technology (5 th generation Mobile Networks), improves the data transmission efficiency of the electronic device. However, temperature management of the high-speed data transmission module is also important, and the temperature needs to be maintained within a certain temperature interval to maintain the optimal efficiency.
However, the existing temperature management schemes are mainly the adjustment of performance and the improvement of heat dissipation capability. The performance is usually adjusted by directly adjusting the overall operation performance of the system when the temperature reaches a threshold value, so as to reduce the heating value. Direct degradation of performance also results in slow performance of the electronic device, which affects the user's performance. The increase in heat dissipation capacity is typically an increase in the rotational speed of the cooling fan. However, the increase in rotation speed is accompanied by noise, which also affects the operation of the user.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a multi-heat-source temperature management method and a multi-heat-source wireless communication device, which can effectively cool down a system and maintain the operation performance of the system.
The invention provides a temperature management method of multiple heat sources, which is applied to a multiple heat source wireless communication device, wherein the multiple heat source wireless communication device at least comprises a wireless communication module, a heat source combination, a heat conduction component, a heat radiation fin group and a cooling fan, the heat conduction component is connected with the wireless communication module and the heat source combination, the heat radiation fin group is connected with the heat conduction component and corresponds to the heat source combination or the wireless communication module configuration, and the cooling fan normally executes forced air cooling on the heat radiation fin group at a first rotation speed.
The temperature management method comprises the following steps: setting a first threshold temperature, a second threshold temperature and a third threshold temperature; wherein the third threshold temperature is greater than the second threshold temperature, and the second threshold temperature is greater than the first threshold temperature; performing a system test; wherein the system detection comprises detecting a temperature value of the wireless communication module and the heat source combination; judging whether the temperature value of the wireless communication module is larger than a first threshold temperature; when the temperature value of the wireless communication module is greater than the first threshold temperature, determining a second rotating speed which is greater than the first rotating speed, and controlling the cooling fan to perform forced air cooling on the radiating fin group at the second rotating speed; judging whether the temperature value of the wireless communication module is larger than the temperature of the second threshold; when the temperature value of the wireless communication module is larger than the temperature of the second threshold, reducing power consumption of the heat source combination; judging whether the temperature value of the wireless communication module is larger than a third threshold temperature; and executing an event trigger when the temperature value of the wireless communication module is greater than the third threshold temperature.
In at least one embodiment of the present invention, the method for managing temperature of multiple heat sources further includes providing another cooling fan corresponding to the wireless communication module.
In at least one embodiment of the present invention, performing the event trigger includes detecting a noise of the cooling fan to obtain a volume of the noise, and setting an upper volume limit; and raising the second rotating speed to a third rotating speed, wherein the third rotating speed is set to a sound volume of the noise not larger than the upper limit of the sound volume.
The invention provides another temperature management method of multiple heat sources, which is applied to a multiple heat source wireless communication device, wherein the multiple heat source wireless communication device at least comprises a wireless communication module, a heat source combination, a heat conduction assembly and a heat radiation fin group, the heat conduction assembly is connected with the wireless communication module and the heat source combination, and the heat radiation fin group is connected with the heat conduction assembly and is configured corresponding to the heat source combination.
The temperature management method comprises setting a second threshold temperature and a third threshold temperature; wherein the third threshold temperature is greater than the second threshold temperature; performing a system test; wherein the system detection comprises detecting a temperature value of the wireless communication module and the heat source combination; judging whether the temperature value of the wireless communication module is larger than the temperature of the second threshold; when the temperature value of the wireless communication module is larger than the temperature of the second threshold, reducing power consumption of the heat source combination; judging whether the temperature value of the wireless communication module is larger than a third threshold temperature; and executing an event trigger when the temperature value of the wireless communication module is greater than the third threshold temperature.
In at least one embodiment of the present invention, executing the event trigger includes issuing an alert message.
In at least one embodiment of the present invention, performing the event triggering further includes further reducing power consumption of the heat source assembly.
In at least one embodiment of the present invention, performing the event trigger further includes reducing a transmission speed of the wireless communication module.
The invention also provides a multi-heat source wireless communication device which comprises a wireless communication module, a heat source combination, a heat conduction component, a heat radiation fin group and a temperature management module. The wireless communication module is used for carrying out wireless communication. The heat conducting component comprises at least one heat pipe and a plurality of heat conducting fins, the heat conducting fins are respectively contacted with the wireless communication module and the heat source combination, and the heat pipe is connected with the heat conducting fins. The heat radiation fin group is connected with the heat conduction component and corresponds to the heat source combination or the wireless communication module configuration. The temperature management module is in signal connection with the wireless communication module and the heat source combination and is used for adjusting the power consumption of the wireless communication module and the heat source combination.
The temperature management module sets a second threshold temperature and a third threshold temperature, and the third threshold temperature is greater than the second threshold temperature; the temperature management module performs a system detection including detecting the temperature values of the wireless communication module and the heat source combination; when the temperature value of the wireless communication module is larger than the temperature of the second threshold, the temperature management module reduces power consumption of the heat source combination; and executing an event trigger when the temperature value of the wireless communication module is greater than the third threshold temperature.
In at least one embodiment of the present invention, the heat source assembly includes a cpu, and the heat sink fin set corresponds to the cpu.
In at least one embodiment of the present invention, the multi-heat source wireless communication device further includes a cooling fan for normally performing a forced air cooling on the heat dissipation fin set at a first rotational speed.
In at least one embodiment of the present invention, the temperature management module further sets a first threshold temperature, and the second threshold temperature is greater than the first threshold temperature; and when the temperature management module judges that the temperature value of the wireless communication module is greater than the third threshold temperature, the temperature management module determines a second rotating speed which is greater than the first rotating speed, and controls the cooling fan to execute forced air cooling on the radiating fin group at the second rotating speed.
In at least one embodiment of the present invention, the multi-heat source wireless communication device further comprises a microphone for detecting a noise of the cooling fan to obtain a volume of the noise; executing the event trigger includes setting an upper volume limit, and increasing the second rotational speed to a third rotational speed, wherein the third rotational speed is set such that the volume of the noise is not greater than the upper volume limit.
In at least one embodiment of the present invention, executing the event trigger includes issuing an alert message.
In at least one embodiment of the present invention, performing the event triggering further includes further reducing power consumption of the heat source assembly.
In at least one embodiment of the present invention, performing the event trigger further includes reducing a transmission speed of the wireless communication module.
The temperature management method of the multi-heat source monitors the temperature value change of the wireless communication module through system detection. When the temperature is too high, the invention starts different cooling means one by one to control the temperature value of the wireless communication module to be in an allowable range so as to maintain the working efficiency of the wireless communication module. The temperature management method of multiple heat sources adopts multiple cooling means, so that the problems of rapid reduction of the overall efficiency of the system or overlarge noise of a fan caused by a single cooling means can be avoided.
The invention will now be described in more detail with reference to the drawings and specific examples, which are not intended to limit the invention thereto.
Drawings
Fig. 1 is a schematic structural diagram of a multi-heat source wireless communication device according to a first embodiment of the present invention;
fig. 2 is a circuit block diagram of a multi-heat source wireless communication device in a first embodiment of the invention;
FIGS. 3 and 4 are flowcharts illustrating a method of managing temperatures of multiple heat sources according to a first embodiment of the present invention;
fig. 5 is a schematic structural diagram of a multi-heat source wireless communication device according to a second embodiment of the present invention;
fig. 6 is a circuit block diagram of a multi-heat source wireless communication device in a second embodiment of the invention;
fig. 7 is a schematic structural diagram of a multi-heat source wireless communication device according to a third embodiment of the present invention;
fig. 8 is a circuit block diagram of a multi-heat source wireless communication device in a third embodiment of the invention;
fig. 9 is a flowchart of a temperature management method of multiple heat sources in a third embodiment of the present invention.
Wherein reference numerals are used to refer to
110 wireless communication module
122 central processing unit
124 System chipset
126 drawing chip
128 memory
132 heat pipe
134 heat conducting fin
150 radiating fin group
160 cooling fan
170 temperature management module
180 microphone
200 cloud database
Step 110 to Step 170, step
Detailed Description
The term "module" as used in the following description refers to an Application Specific Integrated Circuit (ASIC), an electronic circuit, a microprocessor, a chip executing one or more software or firmware programs, a circuit design. The modules are configured to perform various algorithms, transformations, and/or logic processes to generate one or more signals. When the module is implemented in software, the module may be implemented in memory as a chip, a circuit design readable program by program execution.
Referring to fig. 1 and fig. 2, a multi-heat source wireless communication device according to a first embodiment of the invention can perform a multi-heat source temperature management method. The multi-heat source wireless communication device comprises a wireless communication module 110, a heat source assembly, a heat conducting component, a heat dissipation fin set 150, a cooling fan 160 and a temperature management module 170.
As shown in fig. 1, the wireless communication module 110 is configured to perform wireless communication. In one embodiment, the wireless communication module 110 may be a 5G communication module supporting the fifth generation mobile communication technology (5 th generationMobile Networks), but is not limited to a 3G/4G or other wireless communication protocol supporting communication module.
As shown in FIG. 1, the heat source assembly includes a plurality of heat sources including, but not limited to, a CPU 122, a system chipset 124, a graphics chip 126, a memory 128, and the like. The system chipset 124 may be, but is not limited to, a combination of a south bridge chip and a north bridge chip, a platform path controller (platform control hub, PCH), a memory controller (Memory Controller Hub, MCH), an I/O control hub (ICH), AMD Fusion Controller Hub, etc.
As shown in fig. 1, the heat conducting component includes one or more heat pipes 132 and a plurality of heat conducting fins 134, and the heat conducting fins 134 contact the wireless communication module 110 and the heat source assembly, respectively. In the case where the heat source combination has a plurality of heat sources, each of the heat sources corresponds to one of the heat conductive sheets 134, or only a part of the heat sources corresponds to one of the heat conductive sheets 134. For example, in this embodiment, one heat conducting fin 134 is disposed on each of the cpu 122 and the system chipset 124, and the other heat sources are not disposed with the heat conducting fin 134 and are not connected to the heat pipe 132. The heat conductive sheet 134 is made of a high heat conductive material, for example, the heat conductive sheet 134 may be a copper sheet. The heat pipes 132 are used to connect the respective heat conductive fins 134. In the case of only one heat pipe 132, the heat pipes 132 may be appropriately folded and configured, so that each heat conducting fin 134 is welded to a different portion of the heat pipe 132. In the case of a plurality of heat pipes 132, one or more heat conducting fins 134 may be selected to connect more than two heat pipes 132 simultaneously, so as to achieve parallel connection or series connection of the heat pipes 132. The heat dissipation fin set 150 is connected to the heat conduction component and is configured corresponding to the heat source combination, in particular to the cpu 122; the heat pipe 132 may be disposed through the heat sink fin set 150, such that the heat pipe 132 is located adjacent to the cpu 122; or the heat sink fin set 150 may be disposed on the heat conducting plate 134 contacting the cpu 122.
As shown in fig. 1, the cooling fan 160 is fixed to the heat sink fin group 150, and is used for forced air cooling of the heat sink fin group 150. In the first embodiment, the cooling fan 160 normally performs forced air cooling on the fin set 150 at a first rotation speed.
As shown in fig. 2, the temperature management module 170 is in signal connection with the wireless communication module 110, the heat source assembly, and the cooling fan 160. The temperature management module 170 is configured to perform a system detection to detect the temperature value and power consumption of the wireless communication module 110 and the heat source combination. The temperature management module 170 is further configured to adjust the power consumption of the wireless communication module 110 and the heat source combination, and adjust the rotation speed of the cooling fan 160.
The temperature management module 170 may obtain the temperature value by a temperature sensor such as a thermocouple, or may directly or indirectly obtain the temperature value by a Basic Input Output System (BIOS) and a return of the combination of the wireless communication module 110 and the heat source. Similarly, the temperature management module 170 obtains power consumption directly or indirectly through a Basic Input Output System (BIOS), and obtains the power consumption from the wireless communication module 110 and the return of the heat source combination. The power consumption is determined by the operating voltage, operating current, or operating frequency of the wireless communication module 110 and the heat source combination, and thus, the power consumption may be increased or decreased by increasing or decreasing the operating voltage, operating current, and/or operating frequency.
The temperature management module 170 may be implemented in hardware or software. When the temperature management module 170 is implemented in software, the cpu 122 loads and executes the program codes into the memory 128. When the temperature management module 170 is implemented in software, it may be a chip or a circuit design.
Referring to fig. 2, 3 and 4, a flow of a method for performing temperature management of multiple heat sources by the multi-heat source wireless communication device is described as follows.
As shown in fig. 3, the temperature management module 170 sets a first threshold temperature, a second threshold temperature, and a third threshold temperature in advance; wherein the third threshold temperature is greater than the second threshold temperature, and the second threshold temperature is greater than the first threshold temperature. The temperature management module 170 performs system detection to detect the temperature and power consumption of the combination of the wireless communication module 110 and the heat source, as shown in Step 110.
For example, in the case that the wireless communication module 110 is a 5G communication module, the wireless communication module 110 has an optimal operation performance when the temperature is 60 ℃. When the temperature of the wireless communication module 110 exceeds 70 degrees, the performance of the wireless communication module 110 will quickly decline. Therefore, to maintain the operation performance of the wireless communication module 110, it is necessary to avoid the temperature value exceeding 70 degrees. At this time, the temperature management module 170 may set the first threshold temperature to 70 degrees, and set the appropriate temperature increment value (e.g. 5 degrees), so as to obtain the second threshold temperature value to 75 degrees and the third threshold temperature value to 80 degrees one by one.
As shown in fig. 2 and fig. 3, the temperature management module 170 determines whether the temperature value of the wireless communication module 110 is greater than a first threshold temperature, as shown in Step 120. When the temperature value of the wireless communication module 110 is greater than the first threshold temperature, the temperature management module 170 determines a second rotation speed greater than the first rotation speed, and controls the cooling fan 160 to increase the rotation speed to perform forced air cooling on the heat sink fin set 150 at the second rotation speed, as shown in Step 130. In this step, forced air cooling is mainly performed for the cpu 122; since the heat source assembly is connected to the wireless communication module 110 by one or more heat pipes 132, the average temperature between the wireless communication module 110 and the heat source assembly is reduced after the temperature of the cpu 122 is reduced, so that the temperature value of the wireless communication module 110 can be reduced.
As shown in fig. 2 and 3, the temperature management module 170 determines whether the temperature value of the wireless communication module 110 is greater than the second threshold temperature, as shown in Step 140. This step is mainly used to determine whether the temperature of the wireless communication module 110 can be maintained from rising when the fan speed is increased, and if the temperature is increased, the temperature management module 170 needs to further execute other temperature management steps. After the rotation speed of the cooling fan 160 is increased to the second rotation speed, if the amount of heat that can be removed is still lower than the combination of the wireless communication module 110 and the heat source, the temperature value of the wireless communication module 110 still continuously increases.
As shown in fig. 2 and 3, when the temperature value of the wireless communication module 110 is greater than the second threshold temperature, the temperature management module 170 reduces the power consumption of the heat source combination, as shown in Step 150. The power consumption of the heat source combination is reduced, and the heat source with the largest power consumption can be selected to execute the power consumption reduction. For example, the operating voltage, operating current, and/or operating frequency of the central processing unit 122 is reduced.
As shown in fig. 2 and fig. 4, the temperature management module 170 determines whether the temperature value of the wireless communication module 110 is greater than a third threshold temperature, as shown in Step 160. When the temperature value of the wireless communication module 110 is greater than the third threshold temperature, the temperature management module 170 performs an event trigger, as shown in Step 170. The condition that the temperature value of the wireless communication module 110 is greater than the third threshold temperature represents that the management scheme performed by the temperature management module 170 is insufficient to maintain the temperature value of the wireless communication module 110 below the first threshold temperature, and therefore an event trigger is performed to change the management condition. Executing the event trigger includes sending an alert message to alert the user that the power consumption of the heat source assembly needs to be further reduced or that the transmission speed of the wireless communication module 110 is reduced. Reducing the power consumption of the heat source combination will reduce the system operating efficiency; reducing the transmission speed of the wireless communication module 110 will result in a reduction in data transmission efficiency. The temperature management module 170 may change the settings of the first threshold temperature, the second threshold temperature, and the third threshold temperature automatically or manually via a user switch.
The second rotation speed is set according to the execution performance of the wireless communication module 110 or the cpu 122. For example, through a previous test, the cloud database 200 may store a performance map of the wireless communication module 110 and the heat source combination (the cpu 122 and the system chipset 124) separately operated. The performance table may include a comparison of the operating frequency of the cpu 122, a comparison of the temperature of the load change, a comparison of the temperature of the system chipset 124 at different hard disk data transmission speeds, and a comparison of the temperature of the wireless communication module 110 at different data transmission conditions (download rate and upload rate).
Through setting the performance of the wireless communication module 110 and querying the performance map, the temperature management module 170 can determine the optimal performance distribution of the heat source combination when the wireless communication module 110 maintains the set performance, and can determine the second rotation speed in cooperation with the relationship between the heat removal capacity of the cooling fan 160 and the rotation speed.
Referring to fig. 5 and 6, a multi-heat source wireless communication device according to a second embodiment of the invention is shown. The multi-heat source wireless communication device comprises a plurality of cooling fans 160 and a heat dissipation fin set 150, wherein at least one cooling fan 160 and at least one heat dissipation fin set 150 correspond to the central processing unit 122, and at least one cooling fan 160 and at least one heat dissipation fin set 150 correspond to the wireless communication module 110. Meanwhile, the multi-heat source wireless communication device further comprises a microphone 180 for detecting a noise of the cooling fan 160 to obtain the volume of the noise. In Step 170, since the temperature of the wireless communication module 110 exceeds the third threshold temperature, the event triggering performed by the temperature management module 170 may be an indication of the need to further increase the rotation speed of the cooling fan 160 to maintain the transmission efficiency of the wireless communication module 110. At this time, the temperature management module 170 may provide the option of increasing the rotation speed of the cooling fan 160 for the user to execute, and continuously receive the volume of the noise and generate the volume prompt message, so that the user can increase the second rotation speed to a third rotation speed, and the volume of the noise is maintained within an acceptable range. Alternatively, the temperature management module 170 may set a volume upper limit, and the third rotation speed is set such that the volume of the noise is not greater than the volume upper limit. The upper limit of the volume can be set by the user.
In addition, during the system test phase (Step 110), the temperature management module 170 tests the type of software being executed to determine the performance load of the wireless communication module 110 or the cpu 122. For example, when performing the internet operation, the wireless communication module 110 needs to maintain high transmission efficiency, and the performance of the cpu 122 is reduced. At this time, the rotation speed of the cooling fan 160 may be increased only for the cooling fan 160 corresponding to the wireless communication module 110, and the initial first rotation speed may be maintained corresponding to the cpu 122. At this time, the rotation speed of the cooling fan 160 can be greatly increased without being limited by the upper volume limit. Similarly, if the performance load of the cpu 122 is increased and the wireless communication module 110 only needs to maintain low transmission efficiency when executing the game software, the rotation speed of the cooling fan 160 is increased, and the rotation speed of the cooling fan 160 corresponding to the cpu 122 can be increased.
Referring to fig. 7 and 8, a multi-heat source wireless communication device according to a third embodiment of the invention can perform a multi-heat source temperature management method. In the third embodiment, the configuration of the cooling fan 160 is omitted.
The temperature management module 170 sets only the second threshold temperature and the third threshold temperature; wherein the third threshold temperature is greater than the second threshold temperature. The second threshold temperature at this time is set to a lower temperature value approximately equal to the second threshold temperature of the first embodiment. The third threshold temperature may be set to be substantially the same as the third threshold temperature of the first embodiment.
As shown in fig. 9, in the third embodiment, after the system detection is performed in Step 110, step 120 and Step 130 are skipped, and the temperature management module 170 directly performs Step 140 to determine whether the temperature value of the wireless communication module 110 is greater than the second threshold temperature. When the temperature value of the wireless communication module 110 is greater than the second threshold temperature, the temperature management module 170 reduces the power consumption of the heat source combination, as shown in Step 150. When the temperature value of the wireless communication module 110 is greater than the third threshold temperature, the temperature management module 170 performs event triggering, as shown in Step 160 and Step 170.
The temperature management method of the multiple heat sources of the present invention monitors the temperature value change of the wireless communication module 110 through system detection. When the temperature is too high, the present invention starts different cooling means one by one to control the temperature value of the wireless communication module 110 to be within the allowable range, so as to maintain the working efficiency of the wireless communication module 110. The temperature management method of multiple heat sources adopts multiple cooling means, so that the problems of rapid reduction of the overall efficiency of the system or overlarge noise of a fan caused by a single cooling means can be avoided.
Of course, the present invention is capable of other various embodiments and its several details are capable of modification and variation in light of the present invention, as will be apparent to those skilled in the art, without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (6)
1. The temperature management method of a multi-heat source, apply to a multi-heat source wireless communication device, the wireless communication device of the multi-heat source includes a wireless communication module, a heat source assembly, a heat conduction assembly, a heat-dissipating fin group and a cooling fan at least, the heat conduction assembly connects the wireless communication module and the heat source assembly, the heat-dissipating fin group connects to the heat conduction assembly and corresponds to the heat source assembly or the wireless communication module is disposed, and the cooling fan carries out a forced air cooling to the heat-dissipating fin group at a first rotational speed normally; the temperature management method is characterized in that the temperature management method monitors the temperature value change of the wireless communication module, and starts different cooling means one by one to control the temperature value of the wireless communication module in an allowable range and maintain the working efficiency of the wireless communication module and the sound volume of noise in an acceptable range, and the temperature management method comprises the following steps:
setting a first threshold temperature, a second threshold temperature and a third threshold temperature; wherein the third threshold temperature is greater than the second threshold temperature, and the second threshold temperature is greater than the first threshold temperature;
performing a system test; wherein the system detection includes detecting a temperature value of the wireless communication module and the heat source combination;
judging whether the temperature value of the wireless communication module is larger than the first threshold temperature;
when the temperature value of the wireless communication module is greater than the first threshold temperature, determining a second rotating speed which is greater than the first rotating speed, and controlling the cooling fan to execute the forced air cooling on the radiating fin group at the second rotating speed;
judging whether the temperature value of the wireless communication module is larger than the second threshold temperature;
when the temperature value of the wireless communication module is larger than the second threshold temperature, reducing power consumption of the heat source combination;
judging whether the temperature value of the wireless communication module is larger than the third threshold temperature; and
executing an event trigger when the temperature value of the wireless communication module is greater than the third threshold temperature;
wherein executing the event trigger comprises:
detecting a noise of the cooling fan to obtain the volume of the noise and setting an upper volume limit; and
the second rotating speed is raised to be a third rotating speed, and the third rotating speed is set to be that the sound volume of the noise is not larger than the upper limit of the sound volume.
2. A multi-heat source wireless communication device, comprising:
a wireless communication module for performing a wireless communication;
a heat source assembly;
the heat conduction component comprises at least one heat pipe and a plurality of heat conduction sheets, the heat conduction sheets are respectively contacted with the wireless communication module and the heat source combination, and the at least one heat pipe is connected with each heat conduction sheet;
the heat radiation fin group is connected with the heat conduction component and corresponds to the heat source combination or the wireless communication module configuration;
the temperature management module is in signal connection with the wireless communication module and the heat source combination and is used for adjusting the power consumption of the wireless communication module and the heat source combination; the temperature management module monitors the temperature value change of the wireless communication module, and starts different cooling means one by one to control the temperature value of the wireless communication module to be in an allowable range and maintain the working efficiency of the wireless communication module and the volume of noise to be in an acceptable range; the temperature management module sets a second threshold temperature and a third threshold temperature, and the third threshold temperature is greater than the second threshold temperature; the temperature management module performs a system detection including detecting a temperature value of the wireless communication module and the heat source combination;
a cooling fan for normally performing a forced air cooling on the heat dissipation fin set at a first rotation speed; the temperature management module is further configured to set a first threshold temperature, and the second threshold temperature is greater than the first threshold temperature; when the temperature management module judges that the temperature value of the wireless communication module is greater than the first threshold temperature, the temperature management module determines a second rotating speed which is greater than the first rotating speed, and controls the cooling fan to execute the forced air cooling on the radiating fin group at the second rotating speed; and
a microphone for detecting a noise of the cooling fan to obtain a volume of the noise;
when the temperature value of the wireless communication module is larger than the second threshold temperature, the temperature management module reduces power consumption of the heat source combination; and when the temperature value of the wireless communication module is greater than the third threshold temperature, executing an event trigger, wherein executing the event trigger comprises setting a volume upper limit, and raising the second rotating speed to a third rotating speed, wherein the third rotating speed is set to a volume of the noise not greater than the volume upper limit.
3. The multi-heat source wireless communication device of claim 2, wherein the heat source assembly comprises a cpu and the set of heat sink fins is configured to correspond to the cpu.
4. The multi-heat source wireless communication device of claim 2, wherein performing the event trigger comprises:
sending out a warning message.
5. The multi-heat source wireless communication device of claim 2, wherein performing the event trigger further comprises:
the power consumption of the heat source combination is further reduced.
6. The multi-heat source wireless communication device of claim 2, wherein performing the event trigger further comprises:
reducing a transmission speed of the wireless communication module.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1581019A (en) * | 2003-08-06 | 2005-02-16 | 建碁股份有限公司 | Cooling system for computer device |
| CN1622046A (en) * | 2003-11-24 | 2005-06-01 | 顺德市顺达电脑厂有限公司 | Method of heat radiation for CPU in computer system |
| JP2009163589A (en) * | 2008-01-09 | 2009-07-23 | Lenovo Singapore Pte Ltd | Heat radiation system loaded on computer system, and heat radiation method |
| CN102027431A (en) * | 2008-05-23 | 2011-04-20 | 高通股份有限公司 | Thermal management for data modules |
| CN102298431A (en) * | 2010-06-28 | 2011-12-28 | 鸿富锦精密工业（深圳）有限公司 | Computer heat radiation control system and method |
| CN102791106A (en) * | 2011-05-20 | 2012-11-21 | 富瑞精密组件（昆山）有限公司 | Thermal module and method for controlling same |
| CN107168109A (en) * | 2016-03-07 | 2017-09-15 | 中兴通讯股份有限公司 | The adaptive cool-down method and device of a kind of mobile terminal |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201918151A (en) * | 2017-10-18 | 2019-05-01 | 廣達電腦股份有限公司 | Electronic devices and cooling methods |
| US10747279B2 (en) * | 2018-04-05 | 2020-08-18 | Motorola Mobility Llc | Managing noise levels of active cooling devices |
-
2020
- 2020-05-29 CN CN202010477859.7A patent/CN113747739B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1581019A (en) * | 2003-08-06 | 2005-02-16 | 建碁股份有限公司 | Cooling system for computer device |
| CN1622046A (en) * | 2003-11-24 | 2005-06-01 | 顺德市顺达电脑厂有限公司 | Method of heat radiation for CPU in computer system |
| JP2009163589A (en) * | 2008-01-09 | 2009-07-23 | Lenovo Singapore Pte Ltd | Heat radiation system loaded on computer system, and heat radiation method |
| CN102027431A (en) * | 2008-05-23 | 2011-04-20 | 高通股份有限公司 | Thermal management for data modules |
| CN102298431A (en) * | 2010-06-28 | 2011-12-28 | 鸿富锦精密工业（深圳）有限公司 | Computer heat radiation control system and method |
| CN102791106A (en) * | 2011-05-20 | 2012-11-21 | 富瑞精密组件（昆山）有限公司 | Thermal module and method for controlling same |
| CN107168109A (en) * | 2016-03-07 | 2017-09-15 | 中兴通讯股份有限公司 | The adaptive cool-down method and device of a kind of mobile terminal |
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