CN111600103B - Filter based on printed ridge gap waveguide - Google Patents
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- CN111600103B CN111600103B CN202010448107.8A CN202010448107A CN111600103B CN 111600103 B CN111600103 B CN 111600103B CN 202010448107 A CN202010448107 A CN 202010448107A CN 111600103 B CN111600103 B CN 111600103B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
- H01P1/2088—Integrated in a substrate
Abstract
The embodiment of the invention provides a filter based on a printed ridge gap waveguide, which is characterized by comprising the following components: a ground layer 113, a dielectric substrate 114, an air plane plate 115 and a metal parallel plate 116; wherein: the dielectric substrate 114 comprises a filter microstrip line structure 117 and a mushroom bed array 118, the mushroom bed array 118 comprises a plurality of metal units 121, and the dielectric substrate 114 is located between the ground layer 113 and the air plane plate 115; the ground layer 113 includes an input port 111 and an output port 112, the input port 111 is connected to the metal parallel plate 116 through a feed conductor passing through the dielectric substrate 114, and the output port 112 is connected to the metal parallel plate 116 through a feed conductor passing through the dielectric substrate 114; the air layer plate 115 is a substrate having a through hole of a predetermined shape, and the air layer plate 115 is located between the metal parallel plate 116 and the dielectric substrate 114.
Description
Technical Field
The invention relates to the technical field of millimeter wave radio frequency, in particular to a filter based on a printed ridge gap waveguide.
Background
The millimeter wave wireless communication technology is an extension of the microwave wireless communication technology to a higher frequency band, and the main reasons why the millimeter wave wireless communication technology has been widely focused and valued in recent years include: the frequency spectrum resources corresponding to the millimeter waves are rich, and the transmission characteristics of the millimeter waves are good. Millimeter wave communication technology has become a development need for many emerging technologies. For example, in 2019, the world radio communication conference has newly established 1.13 issues for a fifth generation mobile communication technology (5G) system, available frequency bands are searched above 6GHz, and the researched frequency range is 24.25-86 GHz. In the face of new requirements of the fifth generation mobile communication technology (5th generation mobile networks, 5G) system, research and design of millimeter wave devices matched with the system are urgently needed.
The filter, which is an important component of a Radio Frequency (RF) wireless communication system, has a function of dividing and extracting a signal Frequency, and the quality of the performance directly determines the communication quality of the entire communication system. The traditional microstrip filter is directly connected with a microstrip line structure on a dielectric substrate through an input port, and then is connected with an output port through the microstrip line structure, so that current is transmitted in the microstrip line, and a filtering function is realized. However, when filtering high-frequency electromagnetic waves, the current in the microstrip line structure is high, i.e., the current in the dielectric substrate is high, and when the current in the dielectric substrate is high, high transmission loss is generated, so that the insertion loss of the conventional microstrip filter is high.
Disclosure of Invention
It is an object of embodiments of the present invention to provide a filter based on printed ridge gap waveguides to reduce the insertion loss of the filter. The specific technical scheme is as follows:
a printed ridge gap waveguide based filter comprising: a ground layer 113, a dielectric substrate 114, an air plane plate 115, and a parallel metal plate 116; wherein:
the dielectric substrate comprises a filter microstrip line structure 117 and a mushroom bed array 118, the mushroom bed array 118 comprises a plurality of metal units 121, each metal unit 121 comprises a metal patch and a metal through hole 130 which is located below the metal patch and connected with the metal patch, the metal through hole 130 which is comprised by the metal unit 121 is connected with the ground layer 113, and the dielectric substrate 114 is located between the ground layer 113 and the air layer plate 115;
the ground layer 113 includes an input port 111 and an output port 112, the input port 111 is connected to the parallel metal plate 116 through a feed conductor passing through the dielectric substrate 114, and the output port 112 is connected to the parallel metal plate 116 through a feed conductor passing through the dielectric substrate 114;
the air layer plate 115 is a substrate with a through hole in a preset shape, and the air layer plate 115 is positioned between the parallel metal plates 116 and the dielectric substrate 114;
the medium between the mushroom bed array 118 and the parallel metal plate 116 is air, and the distance between the mushroom bed array 118 and the parallel metal plate 116 is less than a quarter wavelength of the electromagnetic wave to be filtered.
Optionally, the mushroom bed array 118 is located around the microstrip filter line structure 117, and a distance between every two adjacent metal units 121 included in the mushroom bed array 118 is the same.
Optionally, the filter microstrip line structure 117 includes: the device comprises a coaxial ridge line transition line, an open-circuit coupling line and a stepped impedance open-circuit branch, wherein the coaxial ridge line transition line is connected with the open-circuit coupling line, and the open-circuit coupling line is connected with the stepped impedance open-circuit branch.
Optionally, the coaxial-to-spine transition line includes a first microstrip feed line 124 and a second microstrip feed line 125, the open-circuit coupled line includes a first open-circuit coupled line 1261 and a second open-circuit coupled line 1262, the first microstrip feed line 124 is connected to the first open-circuit coupled line 1261, and the second microstrip feed line 125 is connected to the second open-circuit coupled line 1262.
Optionally, the first microstrip feed line 124 and the second microstrip feed line 125 include a metal via 131 connected to the ground layer 113.
Optionally, the distance between two adjacent metal vias 131 included in the first microstrip feed line 124 is the same as the distance between two adjacent metal units 121 included in the mushroom bed array 118, and the distance between two adjacent metal vias 131 included in the second microstrip feed line 125 is the same as the distance between two adjacent metal units 121 included in the mushroom bed array 118.
Optionally, the stepped impedance open-circuit branch includes a first sub-branch 127, a second sub-branch 128 and a third sub-branch 129, and the first sub-branch 127 is connected to the first open-circuit coupled line 1261 and the second open-circuit coupled line 1262.
Optionally, the impedances of the first sub-branch 127 and the second sub-branch 128 are different, and the impedances of the second sub-branch 128 and the third sub-branch 129 are the same.
Optionally, a straight line where the second sub-branch 128 and the third sub-branch 129 are located is parallel to a straight line where the open-circuit coupling line is located.
Optionally, the first sub-branch 127 includes a metal via 131 connected to the ground layer 113.
The embodiment of the invention at least has the following beneficial effects: since the medium between the mushroom bed array and the parallel metal plates is air, and the distance between the mushroom bed array and the parallel metal plates is less than a quarter wavelength of the electromagnetic wave to be filtered, the mushroom bed array and the parallel metal plates form an electromagnetic band gap structure, so that the electromagnetic wave is prevented from being transmitted between the mushroom bed array and the parallel metal plates. And the input port is connected with the parallel metal plate, and the microstrip line structure of the filter is not connected with the input port, so that the electromagnetic wave radiated by the parallel metal plate can be transmitted in the air between the microstrip line structure of the filter and the parallel metal plate. Since electromagnetic waves are transmitted in the air without being transmitted in the dielectric substrate, the embodiment of the invention reduces the transmission loss during filtering and reduces the insertion loss of the filter.
Of course, not all of the advantages described above need to be achieved at the same time in the practice of any one product or method of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a filter according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a dielectric substrate according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a transition line from a coaxial line to a ridgeline according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a metal unit according to an embodiment of the present invention;
fig. 5 is an equivalent circuit diagram of a filter according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a simulation result of S-parameters of a filter according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to provide a low insertion loss filter, as shown in fig. 1, an embodiment of the present invention provides a filter based on a printed ridge gap waveguide, the filter comprising: a ground layer 113, a dielectric substrate 114, an air plane plate 115, and a parallel metal plate 116; wherein:
the dielectric substrate 114 includes a filter microstrip line structure 117 and a mushroom bed array 118, as shown in fig. 2, the mushroom bed array 118 includes a plurality of metal units 121, each metal unit 121 includes a metal patch and a metal via 130 connected to the metal patch under the metal patch, the metal unit 121 includes a metal via 130 connected to the ground layer 113, and the dielectric substrate 114 is located between the ground layer 113 and the air layer plate 115;
the ground layer 113 includes an input port 111 and an output port 112, the input port 111 being connected to the parallel metal plate 116 through a feed conductor passing through the dielectric substrate 114, the output port 112 being connected to the parallel metal plate 116 through a feed conductor passing through the dielectric substrate 114;
the air layer plate 115 is a substrate with a through hole in a preset shape, and the air layer plate 115 is positioned between the parallel metal plates 116 and the dielectric substrate 114;
the medium between the mushroom bed array 118 and the parallel metal plate 116 is air, and the distance between the mushroom bed array 118 and the parallel metal plate 116 is less than a quarter wavelength of the electromagnetic wave to be filtered.
It should be noted that the mushroom bed array 118 in fig. 1 includes a plurality of metal units 121 having the same shape. Not shown in fig. 1, the metal vias 130 included in the metal units 121 are connected to the gold ground layer 113, and actually, the metal vias 130 included in each metal unit 121 are connected to the ground layer 113. Also on the ground plane 113, the white dots on the left side represent the input ports 111, the white dots on the right side represent the output ports 112, the input ports 111 are connected to the parallel metal plates 116 through the feed conductors, and the output ports 112 are connected to the parallel metal plates 116 through the feed conductors, not shown in fig. 1, in fact, the input ports 111 are connected to the parallel metal plates 116 through the feed conductors, and the output ports 112 are connected to the parallel metal plates 116 through the feed conductors.
The embodiment of the invention at least has the following beneficial effects: since the medium between the mushroom bed array and the parallel metal plates is air, and the distance between the mushroom bed array and the parallel metal plates is less than a quarter wavelength of the electromagnetic wave to be filtered, the mushroom bed array and the parallel metal plates form an electromagnetic band gap structure, so that the electromagnetic wave is prevented from being transmitted between the mushroom bed array and the parallel metal plates. And the input port is connected with the parallel metal plate, and the microstrip line structure of the filter is not connected with the input port, so that the electromagnetic wave radiated by the parallel metal plate can be transmitted in the air between the microstrip line structure of the filter and the parallel metal plate. Since electromagnetic waves are transmitted in the air without being transmitted in the dielectric substrate, the embodiment of the invention reduces the transmission loss during filtering and reduces the insertion loss of the filter.
In the embodiment of the present invention, the electromagnetic wave to be filtered is an electromagnetic wave that is filtered by using the filter provided in the embodiment of the present invention, and the wavelength (λ) of the electromagnetic wave to be filtered is a wave speed (c)/an operating frequency (f), where the wave speed c is a light speed, and the operating frequency f can be set according to actual needs, for example, the operating frequency f is 35 GHZ.
In the embodiment of the present invention, the ground layer 113, the parallel metal plate 116, the filter microstrip line structure 117, and the metal unit 121 are all conductive metals. Alternatively, the conductive metal may be brass.
Alternatively, as shown in fig. 1, the air layer plate 115 may be a Printed Circuit Board (PCB) having a through hole of a predetermined shape such that a middle portion of the hollowed air layer plate 115 includes an air gap. For example, the preset shape may be a rectangle having an area not smaller than the area occupied by the mushroom bed array 118.
Referring to fig. 1, in the embodiment of the present invention, the parallel metal plates 116 and the periodic mushroom bed array 118 constitute an electromagnetic bandgap structure, and since electromagnetic waves can propagate in the air, and the electromagnetic bandgap structure blocks the electromagnetic waves from propagating between the mushroom bed array 118 and the parallel metal plates 116, the electromagnetic waves propagate in the air gap between the filter microstrip line structure 117 and the parallel metal plates 116. Here, the periodicity of the mushroom bed array 118 is represented by the same distance between every two adjacent metal units 121 included in the mushroom bed array 118.
In one embodiment, referring to fig. 1, the ground plane 113 includes the input port 111 and the output port 112, and the embodiment of the present invention employs a coaxial feed technique, so that the input port 111 and the output port 112 are SMA connectors. Wherein, the SMA connector is a coaxial connector, and the connector head of the connector is 2.4 millimeters (mm). The SMA connector comprises an outer conductor connected to the ground plane 113 and an inner conductor, which is the feed conductor hereinbefore described, with an insulating layer between the outer and inner conductors. Alternatively, the feed conductor may be an electrical wire, such as a copper wire.
Optionally, the type of the dielectric substrate 114 may be Roger RT6002, the dielectric constant is 2.94, the thickness is 0.762mm, and the dielectric loss is 0.0012.
In the embodiment of the present invention, the filter microstrip line structure 117 may be printed on the dielectric substrate 114 by using a printed circuit board, so that the dielectric substrate 114 of the embodiment of the present invention has the advantages of light structure, low cost, loss performance superior to that of the conventional microstrip waveguide, and the like, and has a wide application prospect.
In one embodiment, the filter microstrip line structure 117 includes: the device comprises a coaxial ridge line transition line, an open-circuit coupling line and a stepped impedance open-circuit branch, wherein the coaxial ridge line transition line is connected with the open-circuit coupling line, and the open-circuit coupling line is connected with the stepped impedance open-circuit branch.
Specifically, referring to fig. 2, the coaxial-to-ridgeline transition line includes a first microstrip feed line 124 and a second microstrip feed line 125, the open-coupled line includes a first open-coupled line 1261 and a second open-coupled line 1262, the first microstrip feed line 124 is connected to the first open-coupled line 1261, and the second microstrip feed line 125 is connected to the second open-coupled line 1262.
In the embodiment of the present invention, a feeding conductor (not shown in fig. 1) is connected between the input port 111 included in the ground layer 113 in fig. 1 and the parallel metal plate 116, and a feeding conductor (not shown in fig. 1) is also connected between the output port 112 included in the ground layer 113 and the parallel metal plate 116. The feed conductor passes through the dielectric substrate 114 and the air plane plate 115, i.e. the feed conductor is not connected to the dielectric substrate 114.
In the embodiment of the invention, the feeding position of the dielectric substrate 114 is designed with the feeding lines which are in transition from coaxial to ridgeline, namely the first microstrip feeding line 124 and the second microstrip feeding line 125, so that good impedance matching of the input end can be realized.
Referring to fig. 3, fig. 3 is a structural view of the first microstrip feed line 124. The first microstrip feed line 124 in fig. 3 includes a reference RinA circular through hole with a radius, through which the feed conductor can passinIs a circular through hole, connecting the input port 111 and the parallel metal plate 116.
The second microstrip feed line 125 has a structure similar to that of the first microstrip feed line 124, and the second microstrip feed line 125 includes a circular through-hole through which a feed conductor can pass to connect the output port 112 and the parallel metal plate 116.
The size of the transition line from the coaxial line to the ridgeline may be set according to actual needs, which is not specifically limited in the embodiment of the present invention. For example, Wline＝1.38mm，Lline＝4.3mm，Wm＝1.8mm，Lm＝2.2mm，Rout＝0.85mm，Rin＝0.59mm。
In one embodiment, referring to fig. 2, the first and second microstrip feed lines 124 and 125 include a metal via 131 connected to the ground layer 113. For example, the first microstrip feed line 124 in fig. 2 includes 2 metal vias 131, and the second microstrip feed line 125 includes 2 metal vias 131.
It should be noted that, for convenience of reading, the metal vias 131 are not shown in fig. 1 to be connected to the ground layer 113, and the metal vias 131 are actually connected to the ground layer 113.
In one possible embodiment, referring to fig. 4, a basic component of the printed ridge-gap waveguide is a quasi-periodic mushroom-shaped bandgap cell, i.e., a metal cell 121. The metal unit 121 forms an electromagnetic bandgap structure together with the parallel metal plates 116. The propagation of a quasi-Transverse Electromagnetic Wave (TEM) mode is supported by introducing a filter microstrip line structure 117 at the center of the Electromagnetic bandgap structure.
In the embodiment of the present invention, the mushroom bed array 118 is located around the microstrip line structure 117 of the filter, and the distance between every two adjacent metal units 121 included in the mushroom bed array 118 is the same. For example, referring to fig. 4, the mushroom bed array includes every two adjacent metal units 121 having a distance a of 1.7 mm.
In one possible embodiment, the distance between two adjacent metal vias 131 included in the first microstrip feed line 124 is the same as the distance between two adjacent metal elements 121 included in the mushroom bed array 118, and the distance between two adjacent metal vias 131 included in the second microstrip feed line 125 is the same as the distance between two adjacent metal elements 121 included in the mushroom bed array 118, so that the electromagnetic wave can be more efficiently suppressed from propagating between the mushroom bed array 118 and the parallel metal plate 116, and can also be prevented from propagating in the substrate below the filter microstrip line structure 117, i.e., from propagating between the dielectric substrate 114 and the ground layer 113.
Note that, the distance between adjacent metal vias 131 included in the microstrip feed line refers to the distance between the center points of the adjacent metal vias 131; the distance between adjacent metal units 121 refers to the distance between the center points of the adjacent metal units 121.
Referring to FIG. 4, the diameter d of the metal vias 130via0.39mm, circular metal patch diameter dcap1.5mm and the height h of the air layer is 0.289 mm. The size of the mushroom bed array is only an example provided by the embodiment of the present invention, and the size of the mushroom bed array may also be determined according to actual needs, which is not particularly limited by the embodiment of the present invention. Here, the air layer height refers to a distance between the mushroom bed array 118 and the parallel metal plates 116, and also a distance between the circular metal patches in the mushroom bed array and the parallel metal plates 116.
The embodiment of the invention can also bring the following beneficial effects: the artificial magnetic conductor is formed by using the periodic mushroom bed array, and the propagation loss and the anti-interference capability of microstrip line transmission can be greatly improved by using the mushroom bed array and the microstrip line structure of the filter in a combined manner. Compared with a microstrip line, the microstrip line has smaller insertion loss, has the characteristics of self-packaging, miniaturization and integration, overcomes the defects of large volume and heavy mass of a metal waveguide structure, and has the advantages of small volume, compact structure, easy processing and manufacturing, easy integration, low cost and wide application range.
In one embodiment, referring to fig. 2, the open ladder impedance branch comprises a first sub-branch 127, a second sub-branch 128 and a third sub-branch 129, wherein the first sub-branch 127 is connected to the first open-circuit coupled line 124 and the second open-circuit coupled line 125.
In one embodiment, the impedance of the first sub-branch 127 is different from the impedance of the second sub-branch 128, and the impedance of the second sub-branch 128 is the same as the impedance of the third sub-branch 129.
In one embodiment, referring to fig. 2, the straight line of the second sub-branch 128 and the third sub-branch 129 is parallel to the straight line of the open-circuit coupling line. Since the distances between the adjacent metal units 121 included in the mushroom bed array 118 are the same, the straight line where the second sub-branch 128 and the third sub-branch 129 are arranged is parallel to the straight line where the open-circuit coupling line is arranged, and the positions of the metal units 121 included in the mushroom bed array 118 can be more conveniently arranged.
In the embodiment of the present invention, the size of the filter microstrip line structure 117 may be set according to actual requirements, which is not specifically limited in the embodiment of the present invention.
For example, in one possible embodiment, the transmission line width of the first sub-branch 127 may be greater than the second sub-branch 128 and the third sub-branch 129. For example, the transmission line width of the first sub-branch is 2.4mm, the line length is 1.35mm, the transmission line width of the second sub-branch is 0.3mm, the line length is 1.62mm, the transmission line width of the third sub-branch is 0.3mm, and the line length is 1.62 mm.
In one embodiment, the first sub-branch 127 includes a metal via 131 connected to the ground layer 113. For example, as shown in fig. 2, the first sub-branch 127 includes 1 metal via 131.
Alternatively, the first sub-branch 127 may include a plurality of metal vias 131, and when the first sub-branch 127 includes a plurality of metal vias 131, a distance between adjacent metal vias 131 included in the first sub-branch 127 is the same as a distance between two adjacent metal units 121 included in the mushroom bed array 118.
The embodiment of the invention also has the following beneficial effects: the stepped impedance open-circuit branch in the filter in the embodiment of the invention comprises three sub-branches to form an impedance stepped T-shaped structure circuit, and compared with the traditional T-shaped structure filter, the impedance stepped T-shaped structure circuit has two extra transmission zeros, so that out-of-band interference can be better shielded and inhibited. The T-shaped structure circuit comprises two sections of parallel coupling lines and three impedance branches, and is combined with an electromagnetic band gap structure formed by the periodic mushroom bed array.
The traditional microstrip filter has the advantages of low production cost, small volume, light weight and the like, but also has higher insertion loss, and particularly in a millimeter wave band, the performance of the microstrip filter is far inferior to that of the microstrip filter in a low frequency band. However, the metal waveguide structure is large in size, heavy in weight and high in cost. Because the millimeter wave device based on the PCB technology is low in cost and easy to integrate other equipment and chips on the PCB, the millimeter wave device based on the PCB technology needs to be researched, and therefore user requirements are better met.
Based on this, the periodic mushroom bed array 118, the filter microstrip line structure 117, the air layer plate 115, and the parallel metal plate 116 in the embodiment of the present invention form a ridge gap waveguide structure. The ridge gap waveguide structure in the embodiment of the invention is realized based on the traditional PCB technology, and the design method is flexible and simple and is easy to process. Referring to fig. 2, in the embodiment of the present invention, the periodic mushroom bed array 118 is located around the microstrip line structure 117 of the filter (for example, four rows of periodic metal units 121 are formed), and surrounds the microstrip line structure 117 of the filter, and the periodic mushroom bed array 118 and the parallel metal plate 116 form an electromagnetic bandgap structure, so that electromagnetic waves radiated by the parallel metal plate 116 can be transmitted in the air between the microstrip line structure 117 of the filter and the parallel metal plate 116, and do not need to contact a dielectric substrate, so that the filter circuit structure can achieve a broadband electromagnetic shielding effect without direct physical contact. Therefore, when the filter is integrated with other devices or chips, compared with the traditional microstrip line filter, the embodiment of the invention does not need to additionally increase the shielding cover and the isolation component, and does not need to consider the influences of resonance and the like caused by the addition of the additional component.
In addition, the embodiment of the invention utilizes air as a propagation medium of electromagnetic waves, thereby saving the loss of dielectric materials to a great extent.
The ridge gap waveguide embodiment provided by the embodiment of the invention can enable the filter to work in a required millimeter wave frequency band. For example, the working frequency band of the filter provided by the embodiment of the present invention includes 31.6 gigahertz (GHz) -41.6GHz, which is one of the broader millimeter wave bands applied in the 5G technology, so that the filter provided by the embodiment of the present invention can be applied in a 5G communication system.
The circuit structure of the filter in the millimeter wave filter with high selectivity and low insertion loss based on the printed ridge-gap waveguide is shown in fig. 5, wherein Port1 represents an input Port, Port2 represents an output Port, Z represents impedance, and θ represents impedance phase.
In the embodiment of the present invention, the impedance of the second sub-branch 128 is the same as the impedance of the third sub-branch 129, and both are Z2(ii) a The impedance of the first sub-branch 127 is Z1(ii) a Open-circuit coupled line impedance of Ze1And Zo1. The first microstrip feed line 124 and the second microstrip feed line 125 have the same impedance, and are both Z0。
The impedance and the impedance phase of the microstrip line structure 117 of the filter may be set according to actual needs, which is not particularly limited in the embodiment of the present invention. For example, Ze1＝138Ω、Zo1＝31Ω、Z1＝91Ω、Z2＝104Ω、Z0＝50Ω、θ＝π/2。
In order to show the filtering effect of the filter provided by the embodiment of the present invention, referring to fig. 6, fig. 6 is a schematic diagram of a simulation result of S parameters of the filter provided by the embodiment of the present invention, where the S parameters include return loss (S)11) And transmission coefficient (S)21) The square line segment in fig. 6 represents S of the filter provided in the embodiment of the present invention11The line segment with triangle represents S of the filter provided by the embodiment of the invention21. The abscissa in fig. 6 represents the frequency, and the ordinate represents the value of the S parameter.
In an embodiment of the invention, the passband bandwidth (S) of the filter11Less than or equal to-10 dB) is 31.6 GHz-40.6 GHz, and the relative bandwidth is 24.9%. As can be seen from fig. 6, the filter provided by the embodiment of the present invention has two transmission zeros at 29.8GHz and 41.5 GHz. Therefore, the filter provided by the embodiment of the invention has better isolation to millimeter wave bands outside the passband, and realizes stronger out-of-band interference suppression. In addition, the band-pass filter provided by the embodiment of the invention adopts a printed ridge gap waveguide-based technology, and has the advantages of lower insertion loss, high selectivity and good impedance matching in a pass band.
According to the embodiment of the invention, the band-pass filter with the stepped impedance T-shaped structure is designed in the printed ridge gap waveguide technology, and the position of the transmission zero point is adjusted by adjusting the impedance ratio of the stepped impedance branch, so that the high selectivity of the working frequency of the filter is realized. The periodic mushroom bed array surrounds the filter microstrip line structure to form a novel electromagnetic transmission structure, and the filter microstrip line structure can realize a broadband electromagnetic shielding effect under the condition of no direct physical contact. In addition, the embodiment of the invention utilizes air as a propagation medium, thereby avoiding the loss of the medium material to a great extent. The millimeter wave filter has the advantages of self-packaging, light structure, low cost, loss performance superior to that of the traditional microstrip device and the like. In addition, compared with the traditional waveguide, the ridge gap waveguide has the characteristics of low cost, low loss, easiness in heat dissipation and the like, and is more suitable for scenes with high working frequency and high power capacity density.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for other embodiments, since they are substantially similar to the method embodiments, the description is simple, and for relevant points, reference may be made to part of the description of the method embodiments.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (4)
1. A filter based on a printed ridge gap waveguide, comprising: a ground layer (113), a dielectric substrate (114), an air laminate (115) and a parallel metal plate (116); wherein:
the dielectric substrate (114) comprises a filter microstrip line structure (117) and a mushroom bed array (118), the mushroom bed array (118) comprises a plurality of metal units (121), each metal unit (121) comprises a metal patch and a metal through hole (130) which is located below the metal patch and connected with the metal patch, the metal through hole (130) which is contained in the metal unit (121) is connected with the ground layer (113), and the dielectric substrate (114) is located between the ground layer (113) and the air layer plate (115);
the ground layer (113) comprises an input port (111) and an output port (112), the input port (111) is connected with the parallel metal plates (116) through a feed conductor passing through the dielectric substrate (114), and the output port (112) is connected with the parallel metal plates (116) through a feed conductor passing through the dielectric substrate (114);
the air layer plate (115) is a substrate with a through hole in a preset shape, and the air layer plate (115) is positioned between the parallel metal plates (116) and the medium substrate (114);
the medium between the mushroom bed array (118) and the parallel metal plates (116) is air, and the distance between the mushroom bed array (118) and the parallel metal plates (116) is less than a quarter wavelength of the electromagnetic waves to be filtered;
the mushroom bed array (118) is positioned around the filter microstrip line structure (117), and the distance between every two adjacent metal units (121) included in the mushroom bed array (118) is the same;
the filter microstrip line structure (117) comprises: the device comprises a coaxial ridge line transition line, an open-circuit coupling line and a stepped impedance open-circuit branch, wherein the coaxial ridge line transition line is connected with the open-circuit coupling line, and the open-circuit coupling line is connected with the stepped impedance open-circuit branch;
the coaxial-to-spine transition line comprises a first microstrip feed line (124) and a second microstrip feed line (125), the open-circuit coupled line comprises a first open-circuit coupled line (1261) and a second open-circuit coupled line (1262), the first microstrip feed line (124) is connected with the first open-circuit coupled line (1261), and the second microstrip feed line (125) is connected with the second open-circuit coupled line (1262);
the ladder impedance open-circuit branch comprises a first sub-branch (127), a second sub-branch (128) and a third sub-branch (129), and the first sub-branch (127) is connected with the first open-circuit coupling line (1261) and the second open-circuit coupling line (1262);
the first sub-branch (127) has a different impedance than the second sub-branch (128), and the second sub-branch (128) has the same impedance as the third sub-branch (129);
the straight line where the second sub-branch (128) and the third sub-branch (129) are located is parallel to the straight line where the open-circuit coupling line is located.
2. The filter according to claim 1, characterized in that the first (124) and second (125) microstrip feed lines comprise metal vias (131) connected to a ground plane (113).
3. The filter according to claim 2, characterized in that the first microstrip feed line (124) comprises two adjacent metal vias (131) having the same distance as the two adjacent metal elements (121) of the mushroom bed array (118), and the second microstrip feed line (125) comprises two adjacent metal vias (131) having the same distance as the two adjacent metal elements (121) of the mushroom bed array (118).
4. The filter according to claim 1, characterized in that the first sub-stub (127) comprises a metal via (131) connected to the ground plane (113).
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