CN111599797A - Flexible substrate stacking and packaging structure and flexible substrate stacking and packaging method - Google Patents
Flexible substrate stacking and packaging structure and flexible substrate stacking and packaging method Download PDFInfo
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- CN111599797A CN111599797A CN202010727451.0A CN202010727451A CN111599797A CN 111599797 A CN111599797 A CN 111599797A CN 202010727451 A CN202010727451 A CN 202010727451A CN 111599797 A CN111599797 A CN 111599797A
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- H01—ELECTRIC ELEMENTS
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Abstract
The embodiment of the invention provides a flexible substrate stacking and packaging structure and a flexible substrate stacking and packaging method, and relates to the technical field of chip packaging.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a flexible substrate stacking and packaging structure and a flexible substrate stacking and packaging method.
Background
With the rapid development of the semiconductor industry, electronic products are miniaturized with higher density, more functions, smaller product size and smaller distance between solder balls, so that a pop (package on package) stacking structure is widely applied to the semiconductor industry. And the flexible substrate stacking structure is combined with the POP product stacking, chips with different functions are packaged and stacked, and the packaging structure has the main advantages of high-density integration, small size of packaged products, excellent product performance and great utilization of stacking space.
In the prior art, the flexible substrate flank IC device needs to be connected with the flexible substrate flank circuit, in order to realize the flank stacking, the circuit layer needs to be arranged on the flexible substrate flank, the IC device is electrically connected with the circuit layer, and when the flexible substrate is bent to form the flank, the risk of damage of the bent circuit layer exists, so that the product stacking failure is caused.
Disclosure of Invention
The object of the present invention includes, for example, providing a flexible substrate stack packaging structure and a flexible substrate stack packaging method, which can avoid the risk of line failure caused by bending of a flexible substrate.
Embodiments of the invention may be implemented as follows:
in a first aspect, an embodiment of the present invention provides a flexible substrate stack package structure, including:
a flexible substrate;
the first device packaging assembly is attached to the middle of the flexible substrate and electrically connected with the flexible substrate;
the second device packaging assembly is attached to the side wing of the flexible substrate in an insulating mode;
the side wings of the flexible substrate are upwards turned and arranged, so that the second device packaging assembly is attached to the side wall of the first device packaging assembly, and the second device packaging assembly is electrically connected with the first device packaging assembly.
In an optional embodiment, the first device packaging assembly comprises a plurality of front-mounted IC devices stacked upwards in sequence, the front-mounted IC devices at the bottom are attached to the flexible substrate and electrically connected with the flexible substrate, every two adjacent front-mounted IC devices are stacked in a reverse direction, and the second device packaging assembly is electrically connected with at least two adjacent front-mounted IC devices at the bottom.
In an alternative embodiment, the plurality of front mounted IC devices includes a first IC device mounted in the middle of the flexible substrate and electrically connected to the flexible substrate, and a second IC device stacked on the first IC device, and the second device packaging assembly is electrically connected to the first IC device and the second IC device, respectively.
In an alternative embodiment, the plurality of the face-up IC devices further includes a third IC device, the second IC device being stacked upside down on the first IC device, the third IC device being stacked on the second IC device and electrically connected to the second IC device.
In an optional embodiment, solder balls are used for soldering between the third IC device and the second IC device and between the first IC device and the flexible substrate, and a coating adhesive layer is filled.
In an optional embodiment, the front-mounted IC device includes a first IC substrate, a first chip, and a first plastic package body, the first IC substrate is attached to the flexible substrate or the adjacent first IC substrate, the first chip is attached to the first IC substrate and electrically connected to the first IC substrate, and a conductive pillar is further disposed at an edge of the first IC substrate and used for connecting the second device package assembly. The first plastic package body is arranged on the first IC substrate and covers the first chip, and the first plastic package body is bonded on the adjacent first plastic package body.
In an alternative embodiment, the second device packaging assembly includes at least one side-mounted IC device, one side of the side-mounted IC device is attached to the side wing of the flexible substrate, and the other side of the side-mounted IC device is attached to the side wall of two adjacent front-mounted IC devices and is electrically connected to two adjacent front-mounted IC devices.
In an optional embodiment, the side-mounted IC device includes a second IC substrate, a second chip and a second plastic package body, the second chip is mounted on the second IC substrate and electrically connected to the second IC substrate, the second plastic package body is disposed on the second IC substrate and covers the second chip, the second plastic package body is bonded to the side edge of the flexible substrate, and the second IC substrate is mounted on the side wall of two adjacent front-mounted IC devices and electrically connected to two adjacent front-mounted IC devices.
In an alternative embodiment, the number of the second device packaging assemblies is two, and the two second device packaging assemblies are respectively attached to two sides of the first device packaging assembly.
In a second aspect, an embodiment of the present invention provides a flexible substrate stack packaging method, including the following steps:
mounting a first device packaging assembly in the middle of the flexible substrate;
mounting a second device packaging assembly on the side wing of the flexible substrate in an insulating manner;
the side wings of the flexible substrate are turned upwards, and the second device packaging assembly is attached to the side wall of the first device packaging assembly;
wherein the second device package assembly is electrically connected with the first device package assembly.
In an alternative embodiment, the step of mounting the first device package assembly on the middle portion of the flexible substrate includes:
preparing a formal IC device;
sequentially stacking a plurality of the front-mounted IC devices on the middle part of the flexible substrate to form a first device packaging assembly;
wherein every two adjacent forward mounted IC devices are reversely stacked.
In an alternative embodiment, the step of preparing a face-up IC device comprises:
forming a conductive pillar on the first IC substrate;
mounting a first chip on the first IC substrate;
forming a first plastic package body wrapping the first chip on the first IC substrate;
and planting balls on the back surface of the first IC substrate to prepare and form the front-mounted IC device.
In an alternative embodiment, the step of sequentially stacking a plurality of the front-mounted IC devices on a middle portion of the flexible substrate to form the first device package assembly includes:
mounting a first IC device on the middle part of the flexible substrate;
inversely stacking a second IC device on the first IC device;
stacking a third IC device on the second IC device;
and the second IC device is bonded with the first IC device, and the third IC device is welded with the second IC device through a solder ball.
The beneficial effects of the embodiment of the invention include, for example:
according to the flexible substrate stacking and packaging structure, the second device packaging assembly is pasted on the side wing of the flexible substrate, the second device packaging assembly is electrically isolated from the flexible substrate, and the second device is electrically connected with the first device packaging assembly to achieve an electrical connection function, so that a circuit layer is prevented from being arranged on the flexible substrate, the problem that the circuit layer fails due to bending of the flexible substrate is further avoided, and the stacking effectiveness and stability are guaranteed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a structural diagram illustrating a final state of a flexible substrate stack package structure according to a first embodiment of the invention;
fig. 2 is a schematic structural diagram of an intermediate step of a flexible substrate stack package structure according to a first embodiment of the present invention;
FIG. 3 is a schematic diagram of the front-mount IC device of FIG. 1;
FIG. 4 is a schematic diagram of the side-mounted IC device of FIG. 1;
fig. 5 is a block diagram illustrating steps of a flexible substrate stack packaging method according to a second embodiment of the present invention;
fig. 6-16 are process flow diagrams of preparing a first IC substrate in a flexible substrate stack packaging method according to a second embodiment of the invention;
fig. 17-19 are process flow diagrams of a flexible substrate stack packaging method according to a second embodiment of the invention.
Icon: 100-flexible substrate stack package structure; 110-a flexible substrate; 130-a first device package assembly; 131-a front-mount IC device; 131 a-a first IC substrate; 131 b-a first chip; 131 c-a first plastic package body; 131 d-conductive post; 131 e-a resin layer; 131 f-side mount pads; 133-a first IC device; 135-a second IC device; 137-a third IC device; 139-a coating glue layer; 150-a second device package assembly; 151-side mounted IC device; 153-a second IC substrate; 153 a-side mounting tin ball; 155-a second chip; 157-second plastic package body.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
First embodiment
With reference to fig. 1 to 4, the present embodiment provides a flexible substrate stacked package structure 100, which is applied to device packaging of a flexible carrier, and can avoid the problem of failure of a circuit layer due to bending of a flexible substrate 110 while ensuring the number of stacked packages of devices, thereby ensuring the effectiveness and stability of stacking.
The flexible substrate stacked package structure 100 provided by the embodiment includes a flexible substrate 110, a first device package assembly 130 and a second device package assembly 150, wherein the first device package assembly 130 is attached to the middle portion of the flexible substrate 110 and electrically connected to the flexible substrate 110, and the second device package assembly 150 is attached to the side wing of the flexible substrate 110 in an insulating manner; the side wings of the flexible substrate 110 are folded upwards to attach the second device package assembly 150 to the side walls of the first device package assembly 130, and the second device package assembly 150 is electrically connected to the first device package assembly 130.
It should be noted that, in this embodiment, the middle portion of the flexible substrate 110 refers to a middle position on the flexible substrate 110 where the folding is not needed, and has a first mounting area for mounting the first device package assembly 130. The side wings of the flexible substrate 110 refer to edge positions on one side or both sides of the first mounting region on the flexible substrate 110, and have a second mounting region for mounting the second device package assembly 150, which needs to be folded when mounting, so that the second device package assembly 150 can be mounted on the side walls of the first device package assembly 130.
It should be noted that, in the embodiment, the second device packaging assembly 150 is attached to the side wings of the flexible substrate 110 in an insulating manner, which means that the second device packaging assembly 150 is not directly electrically connected to the side wings of the flexible substrate 110, specifically, the non-conductive surface of the second device packaging assembly 150 is attached to the side wings of the flexible substrate 110 by a glue layer/silver glue, so as to avoid wiring on the flexible substrate 110, and the second device packaging assembly 150 is electrically connected to the first device packaging assembly 130.
In this embodiment, the back surface of the flexible substrate 110 is further provided with a plurality of solder balls as the bonding pads of the whole device through ball implantation.
In this embodiment, the first device package assembly 130 includes a plurality of front-mounted IC devices 131 stacked upward in sequence, the bottom front-mounted IC device 131 is attached to the flexible substrate 110 and electrically connected to the flexible substrate 110, every two adjacent front-mounted IC devices 131 are stacked in an opposite direction, and the second device package assembly 150 is electrically connected to at least two adjacent front-mounted IC devices 131 at the bottom.
Note that, here, that adjacent two of the forward-mounted IC devices 131 are stacked in the reverse direction means that the stacking directions of adjacent two of the forward-mounted IC devices 131 are opposite. In the present embodiment, the front-mounted IC device 131 stacked on top is turned over by 180 degrees to be stacked compared to the front-mounted IC device 131 stacked on bottom.
In this embodiment, the number of the second device package assemblies 150 is two, and the two second device package assemblies 150 are respectively attached to two sidewalls of the first device package assembly 130. Specifically, the flexible substrate 110 has two side wings, and two second device package assemblies 150 are respectively attached to the side wings on both sides of the first device package assembly 130.
In the present embodiment, the plurality of front-mounted IC devices 131 includes a first IC device 133, a second IC device 135 and a third IC device 137, and the chip structures of the first IC device 133, the second IC device 135 and the third IC device 137 are the same, and the arrangement is different. The first IC device 133 is attached to the middle portion of the flexible substrate 110 and electrically connected to the flexible substrate 110, the second IC device 135 is stacked on the first IC device 133, and the second device package assembly 150 is electrically connected to the first IC device 133 and the second IC device 135, respectively. Specifically, the second IC device 135 is stacked upside down on the first IC device 133, and the third IC device 137 is stacked on the second IC device 135 and electrically connected to the second IC device 135.
It should be noted that in other preferred embodiments, the plurality of front-mounted IC devices 131 may include only the first IC device 133 and the second IC device 135, the first IC device 133 is stacked on the second IC device 135, and the second device package assembly 150 is electrically connected to the first IC device 133 and the second IC device 135, respectively.
In the embodiment, the third IC device 137 and the second IC device 135, and the first IC device 133 and the flexible substrate 110 are soldered by solder balls, and are filled with the encapsulating adhesive layer 139. Specifically, the coating adhesive layer 139 is coated outside the tin ball, so that the purpose of reducing the gap at the bottom of the IC device is achieved, the effect of protecting the tin ball by using the underfill adhesive is achieved, the strength of the bottom welding area is enhanced, and the stacking structure and the stacking strength are improved. The problem of traditional structure pile up more high, the bottom tin ball welding is not firm, leads to the product to become invalid is solved. Of course, the covering adhesive layer 139 can be replaced by a cured silver paste.
In the present embodiment, the second IC device 135 and the first IC device 133 are bonded by a glue layer/silver paste.
Each of the front-mounted IC devices 131 includes a first IC substrate 131a, a first chip 131b, and a first plastic package body 131c, the first IC substrate 131a is attached to the flexible substrate 110 or the adjacent first IC substrate 131a, the first chip 131b is attached to the first IC substrate 131a and electrically connected to the first IC substrate 131a, and a conductive pillar 131d is further disposed at an edge of the first IC substrate 131a and used for connecting the second device package assembly 150 to the conductive pillar 131 d. The first plastic package body 131c is disposed on the first IC substrate 131a and covers the first chip 131b, and the first plastic package body 131c is bonded to the adjacent first plastic package body 131 c. Specifically, the conductive pillar 131d is electrically connected to the first IC substrate 131a, while the second device package assembly 150 is electrically connected to the conductive pillar 131 d. The first IC substrate 131a is provided with a conductive layer through a wire, the conductive layer is electrically connected through a pad on the surface of the first IC substrate 131a, and the conductive layer realizes an electrical connection function of the first IC substrate 131 a.
In this embodiment, the first chip 131b is electrically connected to the first IC substrate 131a through a first connection line, and the first plastic package body 131c covers the first chip 131b and the first connection line, so as to support and protect the first chip.
In this embodiment, the plastic package body of the second IC device 135 is mounted on the first IC device 133, stacking is achieved by using the solidified silver paste/adhesive layer, the solder ball at the bottom of the second IC device 135 is used as a solder joint for upward stacking, and the third IC device 137 is stacked on the second IC device 135 through the solder ball, thereby avoiding that the solder ball welding is formed again after the plastic package body is grooved by laser in the conventional stacking structure.
In the present embodiment, the conductive pillar 131d is covered with a resin layer 131e to serve as a structural support, the sidewall of the resin layer 131e constitutes the sidewall of the front-mounted IC device 131, and a pad is disposed on the sidewall of the resin layer 131e, and is electrically connected to the conductive pillar 131d and used for connecting the second device package assembly 150. Specifically, the two side edges of the first IC substrate 131a are provided with conductive pillars 131d, and the conductive pillars 131d on the two sides are electrically connected to the second device package assemblies 150 on the two sides, respectively. The bonding pad on the side wall of the plastic package body is connected to the substrate cutting channel, and the bonding pad on the side wall is exposed after the plastic package body is cut.
Each second device package assembly 150 includes at least one side-mounted IC device 151, where one side of the side-mounted IC device 151 is attached to a side wing of the flexible substrate 110, and the other side is attached to a side wall of two adjacent front-mounted IC devices 131 and electrically connected to the two adjacent front-mounted IC devices 131.
In this embodiment, each second device package assembly 150 includes a side-mounted IC device 151, with a single side-mounted IC device 151 mounted on the first IC device 133 and the second IC device 135. Specifically, both sidewalls of the first IC device 133 and the second IC device 135 are flush, so that the mounting of the side-mounted IC device 151 can be ensured.
In this embodiment, the side-mounted IC device 151 includes a second IC substrate 153, a second chip 155, and a second plastic package 157, the second chip 155 is attached to the second IC substrate 153 and electrically connected to the second IC substrate 153, the second plastic package 157 is disposed on the second IC substrate 153 and covers the second chip 155, the second plastic package 157 is adhered to the side of the flexible substrate 110, and the second IC substrate 153 is attached to the side wall of two adjacent front-mounted IC devices 131 and electrically connected to two adjacent front-mounted IC devices 131.
In the present embodiment, the second chip 155 is electrically connected to the second IC substrate 153 through the second connecting line and is supported and protected by the second plastic package 157, in the present embodiment, the side-mounted solder ball 153a is disposed on the back surface of the second IC substrate 153, and is soldered on the sidewall of the front-mounted IC device 131 through the side-mounted solder ball 153 a.
It should be noted that the second plastic package body 157 is attached to the side wings of the flexible substrate 110 by an insulating adhesive, and the second IC substrate 153 is attached to the side walls of the first IC device 133 and the second IC device 135 by side-mounted solder balls 153a, and is soldered to the pads on the side walls of the first IC device 133 and the second IC device 135, so as to achieve electrical connection with the conductive posts 131 d. Thereby electrically connecting the side-mounted IC device 151 with the front-mounted IC device 131.
It is worth noting that the side-mounted pads 131f are arranged on the side wall of the resin layer 131e, so that the function of side-face welding of the IC device is achieved, the side-mounted IC device 151 is attached to the side wall of the resin layer 131e, and the solder balls of the second IC substrate 153 are welded to the side-mounted pads 131f of the side wall, so that the problem that the flexible substrate 110 and the IC device are directly electrically connected in a traditional stacking structure is solved, and the problem that a wiring circuit of the flexible substrate 110 in a bending area is damaged due to bending fatigue and the stacking structure product fails is solved.
In summary, the present embodiment provides a flexible substrate stack package structure 100, which is formed by mounting a second IC device 135 on a first IC device 133 by molding and then stacking the first IC device and the second IC device by using a cured silver paste/adhesive layer. The solder balls at the bottom of the substrate of the second IC device 135 are used as upward stacking welding points, so that the process of forming solder ball welding after grooving the plastic package body by using laser in the traditional stacking process is avoided, and the structure and the process are simplified. By utilizing the dispensing process, the bottom filling glue of the first IC device 133 and the third IC device 137 is completed, the purpose of reducing the bottom gap of the IC devices is achieved, the bottom filling glue is utilized to play a role in protecting the solder balls, the strength of a bottom welding area is enhanced, the stacking strength of a stacking structure is improved, and the problems that the traditional structure is higher in stacking, the solder balls at the bottom are not firmly welded, and the product is invalid are solved. The side-mounted pads 131f are designed on the resin layer 131e, and the conductive posts 131d are used for realizing electrical connection, so that a side-face welding function of the IC device is realized, thereby avoiding a scheme that a circuit needs to be arranged in the flexible substrate 110 to realize side-wall stacking in the conventional side-wall stacking structure, and avoiding a problem that a wiring circuit of the flexible substrate 110 in a bending area in the conventional side-wall stacking structure is damaged due to bending fatigue, so that a product of the stacking structure fails. Through in the IC device, the design has conductive pillar 131d, realizes that side dress pad 131f links to each other with the base plate pad, adopts novel stacked structure, can effectively solve traditional flexible substrate 110 and pile up the problem.
Second embodiment
Referring to fig. 5, an embodiment of the present invention provides a flexible substrate stack packaging method for preparing the flexible substrate stack packaging structure 100 according to the first embodiment, the method including the following steps:
s1: the first device package assembly 130 is attached to the middle of the flexible substrate 110.
Specifically, it is necessary to prepare the front-mounted IC devices 131 and stack a plurality of the front-mounted IC devices 131 in sequence on the middle portion of the flexible substrate 110 to form the first device package assembly 130, in which every adjacent two front-mounted IC devices 131 are reversely stacked.
In the present embodiment, the plurality of front-mounted IC devices 131 includes the first IC device 133, the second IC device 135 and the third IC device 137, and when step S1 is executed, the first IC device 133 is first attached to the middle portion of the flexible substrate 110, and the adhesive layer is filled at the bottom of the first IC device 133 to form the encapsulating adhesive layer 139. The second IC device 135 is then stacked upside down on the first IC device 133, bonded by a glue layer/silver paste. Then, the third IC device 137 is stacked on the second IC device 135, and an adhesive layer is filled at the bottom of the third IC device 137 to form a coating adhesive layer 139, wherein the second IC device 135 is bonded to the first IC device 133, the third IC device 137 is soldered to the second IC device 135 by a solder ball, the first IC device 133 is soldered to the flexible substrate 110 by a solder ball, the first IC device 133 is electrically connected to the flexible substrate 110, and the third IC device 137 is electrically connected to the second IC device 135.
It is to be noted that, when the front-mounted IC device 131 is prepared, the conductive pillar 131d is formed on the first IC substrate 131a, the first chip 131b is attached to the first IC substrate 131a, the first plastic package 131c covering the first chip 131b is formed on the first IC substrate 131a by a plastic packaging machine, and the ball is mounted on the back surface of the first IC substrate 131a, so as to prepare the front-mounted IC device 131.
S2: the second device package assembly 150 is attached to the side wings of the flexible substrate 110 in an insulating manner.
Specifically, it is necessary to prepare the side-mounted IC device 151 and attach the side-mounted IC device 151 to the side wing of the flexible substrate 110 through a glue layer/silver paste to form the second device packaging assembly 150. The non-conductive surface of the side-mounted IC device 151 is bonded to the side wings of the flexible substrate 110, and the insulating mounting means that the side-mounted IC device 151 is not directly electrically connected to the side wings of the flexible substrate 110, thereby avoiding wiring on the side wings of the flexible substrate 110.
In the preparation of the side-mounted IC device 151, the second chip 155 is first mounted on the second IC substrate 153, then the second plastic package 157 covering the second chip 155 is formed on the second IC substrate 153 by a plastic packaging machine, and finally the ball is mounted on the back surface of the second IC substrate 153, thereby preparing and forming the side-mounted IC device 151.
In this embodiment, the second device package assembly 150 is mounted on the flexible substrate 110 on both sides of the first device package assembly 130.
It should be noted that, in this embodiment, step S1 and step S2 may be performed simultaneously without any sequence, and specifically, in actual operation, the first IC device 133 and the side-mounted IC device 151 are first mounted on the flexible substrate 110, and then the second IC device 135 and the third IC device 137 are sequentially stacked.
It should be further noted that, steps S1 and S2 are steps of batch mounting the first device packaging assemblies 130 and the second device packaging assemblies 150, that is, a plurality of first device packaging assemblies 130 and a plurality of second device packaging assemblies 150 are simultaneously mounted on the same flexible substrate 110, and after steps S1 and S2 are completed, the flexible substrate 110 needs to be cut into a single piece, so that only one first device packaging assembly 130 and two second device packaging assemblies 150 are arranged on the single flexible substrate 110.
S3: the side wings of the flexible substrate 110 are turned upward and the second device package assembly 150 is attached to the side walls of the first device package assembly 130.
Specifically, the side wings of the flexible substrate 110 are folded upward so that the solder balls of the side-mounted IC devices 151 are soldered on the side walls of the first IC device 133 and the second IC device 135, and the side-mounted IC devices 151 are electrically connected to the first IC device 133 and the second IC device 135, respectively.
As shown in fig. 6 to 19, in actual operation, the flexible substrate stacking and packaging method provided by the present invention includes steps of manufacturing a first IC substrate 131a, preparing a front mounted IC device 131, preparing a side mounted IC device 151, mounting a first IC device 133, mounting a side mounted IC device 151, mounting a second IC device 135, mounting a third IC device 137, mounting balls on a flexible substrate 110, cutting, and folding, and the like, and specifically includes the following steps:
step 1, referring to fig. 6 to 16 in combination, a first IC substrate 131a is prepared, wherein the first IC substrate 131a is used for preparing the front-mounted IC device 131.
Step 2, preparing a front-mounted IC device 131 and a side-mounted IC device 151 by using a first IC substrate 131a and a second IC substrate 153, wherein the first IC substrate 131a is a conventional substrate.
Step 3, referring to fig. 17, the first IC device 133 and the side-mounted IC device 151 are mounted on the flexible substrate 110, specifically, after the solder balls at the bottom of the first IC device 133 are welded and fixed to the pads of the flexible substrate 110, a glue is dispensed at the bottom of the first IC device 133 to form a coating glue layer 139 coating the solder balls, then the plastic package body of the side-mounted IC device 151 is mounted on the side wings of the flexible substrate 110 through a silver paste/glue layer, and finally, the silver paste/glue layer is baked, so that the side-mounted IC device 151 is fixed on the side wings of the flexible substrate 110 after curing.
Step 4, referring to fig. 18, a second IC device 135 is mounted on the first IC device 133, wherein the second IC device 135 is mounted upside down, the plastic package body of the second IC device 135 is mounted on the plastic package body of the first IC device 133 through a silver paste/adhesive layer, and the bottom silver paste/adhesive layer is baked to achieve curing. The upward stacking is achieved by the second IC device 135 being mounted upside down with its substrate solder ball side up.
Step 5, referring to fig. 19, a third IC device 137 is mounted on the second IC device 135, wherein a solder ball at the bottom of the third IC device 137 is soldered to a solder ball of the second IC device 135, so as to realize stacking of the third IC device 137, thereby avoiding the need of using a laser grooving plastic package body in the conventional stacking structure.
Step 6, referring to fig. 2, the back surface of the flexible substrate 110 is implanted with balls, and the flexible substrate 110 is cut into individual pieces.
And 7: referring to fig. 1, the flexible substrate 110 is folded by using a machine, so that the side-mounted IC device 151 is attached to the side walls of the first IC device 133 and the second IC device 135, wherein the solder ball side of the substrate of the side-mounted IC device 151 is soldered to the side-mounted pads 131f of the first IC device 133 and the second IC device 135, so that a side wall stacking structure is realized, and the product performance is greatly improved by using the side wall structure, so that a circuit does not need to be designed on the side wing of the flexible substrate 110, thereby avoiding the problems of bending of the flexible substrate 110 and damage of the side wing circuit, and greatly improving the product performance.
It is noted that, when the step 1 is executed, the following steps are included:
step 1a, referring to fig. 6, a substrate is taken, a surface pad is formed on the substrate, an RDL circuit is formed inside the substrate, and the substrate circuit connection is realized through a conductive hole (through hole), so as to complete the substrate manufacturing process, which is a conventional substrate manufacturing process.
Step 1b, referring to fig. 7, a PP material is laminated on the surface of the substrate to form a first insulating layer.
Step 1c, referring to fig. 8, a pad on the edge surface of the substrate is exposed by notching the first insulating layer by using a laser notching technique, so as to form a first groove.
Step 1d, referring to fig. 9, electroplating a copper layer in the first groove and on the surface of the first insulating layer to fill the first groove and the surface of the first insulating layer to form a first copper layer;
step 1e, referring to fig. 10, performs patterning process on the first copper layer, and uses the patterned layer to protect the required area, and etches away the unnecessary copper layer area to form the first layer conductive pillar 131d and the side mounting pad 131 f.
Step 1f, referring to fig. 11, a PP material is laminated on the surface of the first insulating layer to form a second insulating layer.
Step 1g, referring to fig. 12, by using the laser grooving technique, the first layer conductive pillar 131d is leaked out of the groove in the second insulating layer, and a second groove is formed.
Step 1h, referring to fig. 13, electroplating a copper layer in the second groove and on the surface of the second insulating layer to fill the second groove and the surface of the second insulating layer to form a second copper layer;
step 1i, referring to fig. 14, the second copper layer is patterned, the required region is protected by the pattern layer, and the unnecessary copper layer region is etched away, so as to form a second layer of conductive pillars 131d and a side mounting pad 131 f.
Step 1j, referring to fig. 15, a PP material is laminated on the surface of the second insulating layer to form a third insulating layer.
Step 1k, referring to fig. 16, the third insulating layer is grooved down by using the laser grooving technique to leak the substrate, thereby completing the preparation of the first IC substrate 131 a.
In the present embodiment, the first IC board 131a is prepared through the above steps, and the front-mounted IC device 131 is formed using the first IC board 131a, but for the preparation of the first IC board 131a, other methods may be adopted as long as the conductive posts 131d can be formed on both sides of the board, and the sidewall connection can be achieved.
It should be noted that the number of layers of the conductive pillar 131d and the side-mounted pad 131f in this embodiment can be made according to actual requirements, that is, the multiple layers of the conductive pillar 131d and the side-mounted pad 131f are formed by repeatedly performing steps 1f to 1i, and the number of layers is not specifically limited herein.
In summary, in the flexible substrate stack packaging method provided in this embodiment, the second IC device 135 is mounted on the first IC device 133 by molding, and the stack is realized by using the cured silver paste/adhesive layer. The solder balls at the bottom of the substrate of the second IC device 135 are used as upward stacking welding points, so that the process of forming solder ball welding after grooving the plastic package body by using laser in the traditional stacking process is avoided, and the structure and the process are simplified. By utilizing the dispensing process, the bottom filling glue of the first IC device 133 and the third IC device 137 is completed, the purpose of reducing the bottom gap of the IC devices is achieved, the bottom filling glue is utilized to play a role in protecting the solder balls, the strength of a bottom welding area is enhanced, the stacking strength of a stacking structure is improved, and the problems that the traditional structure is higher in stacking, the solder balls at the bottom are not firmly welded, and the product is invalid are solved. The side-mounted pads 131f are designed on the resin layer 131e, and the conductive posts 131d are used for realizing electrical connection, so that a side-face welding function of the IC device is realized, thereby avoiding a scheme that a circuit needs to be arranged in the flexible substrate 110 to realize side-wall stacking in the conventional side-wall stacking structure, and avoiding a problem that a wiring circuit of the flexible substrate 110 in a bending area in the conventional side-wall stacking structure is damaged due to bending fatigue, so that a product of the stacking structure fails. Through in the IC device, the design has conductive pillar 131d, realizes that side dress pad 131f links to each other with the base plate pad, adopts novel stacked structure, can effectively solve traditional flexible substrate 110 and pile up the problem.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (13)
1. A flexible substrate stack package structure, comprising:
a flexible substrate;
the first device packaging assembly is attached to the middle of the flexible substrate and electrically connected with the flexible substrate;
the second device packaging assembly is attached to the side wing of the flexible substrate in an insulating mode;
the side wings of the flexible substrate are upwards turned and arranged, so that the second device packaging assembly is attached to the side wall of the first device packaging assembly, and the second device packaging assembly is electrically connected with the first device packaging assembly.
2. The flexible substrate package on package structure of claim 1, wherein the first device package assembly comprises a plurality of front-mounted IC devices stacked in an upward direction, the bottom front-mounted IC device is attached to the flexible substrate and electrically connected to the flexible substrate, every two adjacent front-mounted IC devices are stacked in an inverted direction, and the second device package assembly is electrically connected to at least two adjacent bottom front-mounted IC devices.
3. The flexible substrate stack package structure of claim 2, wherein the plurality of the front-mounted IC devices includes a first IC device and a second IC device, the first IC device is attached to a middle portion of the flexible substrate and electrically connected to the flexible substrate, the second IC device is stacked on the first IC device, and the second device package assembly is electrically connected to the first IC device and the second IC device, respectively.
4. The flexible substrate stack package structure of claim 3, wherein the plurality of the front-mounted IC devices further comprises a third IC device, the second IC device is stacked upside down on the first IC device, and the third IC device is stacked on the second IC device and electrically connected to the second IC device.
5. The flexible substrate stack package structure of claim 4, wherein the third IC device and the second IC device, and the first IC device and the flexible substrate are all soldered by solder balls and filled with an encapsulating adhesive layer.
6. The flexible substrate stack package structure of claim 2, wherein the front-mounted IC device includes a first IC substrate, a first chip and a first plastic package body, the first IC substrate is attached to the flexible substrate or the adjacent first IC substrate, the first chip is attached to the first IC substrate and electrically connected to the first IC substrate, a conductive pillar is further disposed at an edge of the first IC substrate, the conductive pillar is used for connecting the second device package assembly, the first plastic package body is disposed on the first IC substrate and covers the first chip, and the first plastic package body is bonded to the adjacent first plastic package body.
7. The flexible substrate stack package structure of claim 2, wherein the second device package assembly comprises at least one side-mounted IC device, one side of the side-mounted IC device is attached to the side wing of the flexible substrate, and the other side of the side-mounted IC device is attached to the side wall of two adjacent front-mounted IC devices and is electrically connected to two adjacent front-mounted IC devices.
8. The flexible substrate stack package structure of claim 7, wherein the side-mounted IC device comprises a second IC substrate, a second chip and a second plastic package body, the second chip is attached to the second IC substrate and electrically connected to the second IC substrate, the second plastic package body is disposed on the second IC substrate and covers the second chip, the second plastic package body is attached to the side wings of the flexible substrate, and the second IC substrate is attached to the side walls of two adjacent front-mounted IC devices and electrically connected to two adjacent front-mounted IC devices.
9. The flexible substrate package on package structure of claim 1, wherein the number of the second device package assemblies is two, and the two second device package assemblies are respectively attached to two sidewalls of the first device package assembly.
10. A flexible substrate stack packaging method is characterized by comprising the following steps:
mounting a first device packaging assembly in the middle of the flexible substrate;
mounting a second device packaging assembly on the side wing of the flexible substrate in an insulating manner;
the side wings of the flexible substrate are turned upwards, and the second device packaging assembly is attached to the side wall of the first device packaging assembly;
wherein the second device package assembly is electrically connected with the first device package assembly.
11. The flexible substrate stack packaging method of claim 10, wherein the step of mounting the first device package assembly on the middle portion of the flexible substrate comprises:
preparing a formal IC device;
sequentially stacking a plurality of the front-mounted IC devices on the middle part of the flexible substrate to form a first device packaging assembly;
wherein every two adjacent forward mounted IC devices are reversely stacked.
12. The flexible substrate stack packaging method of claim 11, wherein the step of preparing a face-up IC device comprises:
forming a conductive pillar on the first IC substrate;
mounting a first chip on the first IC substrate;
forming a first plastic package body wrapping the first chip on the first IC substrate;
and planting balls on the back surface of the first IC substrate to prepare and form the front-mounted IC device.
13. The flexible substrate stack packaging method of claim 11, wherein the step of sequentially stacking a plurality of the front-mounted IC devices on a middle portion of the flexible substrate to form the first device package assembly comprises:
mounting a first IC device on the middle part of the flexible substrate;
inversely stacking a second IC device on the first IC device;
stacking a third IC device on the second IC device;
and the second IC device is bonded with the first IC device, and the third IC device is welded with the second IC device through a solder ball.
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| CN111146194A (en) * | 2019-12-30 | 2020-05-12 | 华进半导体封装先导技术研发中心有限公司 | System-in-package structure and manufacturing method |
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