CN111599773A - Chip frame with heat radiation structure and convenient to install for single chip microcomputer - Google Patents
Chip frame with heat radiation structure and convenient to install for single chip microcomputer Download PDFInfo
- Publication number
- CN111599773A CN111599773A CN202010538573.5A CN202010538573A CN111599773A CN 111599773 A CN111599773 A CN 111599773A CN 202010538573 A CN202010538573 A CN 202010538573A CN 111599773 A CN111599773 A CN 111599773A
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- convenient
- fixed frame
- frame
- heat dissipation
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
Abstract
The invention discloses a chip frame with a heat dissipation structure and convenient installation for a single chip microcomputer, which comprises a bottom plate, embedded grooves and heat dissipation holes, wherein mounting nuts are connected at four corners of the bottom plate, a fixed frame is distributed at the upper part of the middle part of the bottom plate, the embedded grooves are formed in the two sides of the fixed frame, cover plates are distributed at the top part of the fixed frame, an inner plate is arranged at the bottom part of the inner part of the fixed frame, fixing screws are connected at four corners of the inner plate, the heat dissipation holes are distributed in the middle part of the inner plate, and clamping mechanisms are arranged at two ends of the inner part of. This singlechip is provided with compression spring with the chip frame that has the heat radiation structure installation of being convenient for, is convenient for drive slide and centre gripping cushion through compression spring and inwards extrudees to be convenient for carry out the centre gripping to the singlechip chip and fix the installation work for the staff and bring the convenience, arrange the department through the heat that the louvre distributes the singlechip chip, make the life of greatly increased chip.
Description
Technical Field
The invention relates to the field of electronic chip heat dissipation, in particular to a chip frame with a heat dissipation structure and convenient installation for a single chip microcomputer.
Background
The single chip computer is an integrated circuit chip, and integrates the functions of CPU, RAM, ROM, interrupt system of various I/O ports, timer/counter, etc. with data processing capacity into one silicon chip by means of very large scale integrated circuit technology to form a small and perfect microcomputer system. Since the 4-bit and 8-bit single chip microcomputer is developed to the current 300M high-speed single chip microcomputer from the 80 s of the last century, the single chip microcomputer needs to be installed before being used, and therefore a chip frame with a heat dissipation structure and convenient installation is needed for the single chip microcomputer.
The chip frame for the single chip microcomputer in the market is mostly not provided with a heat dissipation structure, so that the chip frame is extremely easy to damage in the using process of the single chip microcomputer because heat cannot be emitted, the single chip microcomputer is inconvenient to install, and troublesome problems are brought to the installation work of workers.
Disclosure of Invention
The invention aims to provide a chip frame with a heat dissipation structure for a single chip microcomputer, which is convenient to mount, and aims to solve the problems that most of the chip frames for the single chip microcomputers in the market, which are proposed in the background art, are not provided with the heat dissipation structure, so that the single chip microcomputer is very easy to damage due to the fact that heat cannot be dissipated in the using process of the single chip microcomputer, the single chip microcomputer is inconvenient to mount, and trouble is brought to the mounting work of workers.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a chip frame that singlechip is convenient for install with having heat radiation structure, includes bottom plate, embedded groove and louvre, the four corners connection of bottom plate has mounting nut, and the middle part upper portion distribution of bottom plate has fixed frame, the embedded groove is seted up inside fixed frame's both sides, and just fixed frame's top distributes and have the apron, the lower wall of apron is fixed with the embedding strip, fixed frame's inside bottom is provided with the inner panel, and the four corners connection of inner panel has set screw, the louvre distributes in the middle part of inner panel, fixed frame's inside both ends are provided with fixture.
Preferably, the cover plate forms a clamping structure between the embedding strip and the embedding groove and the fixed frame, and the cover plate and the fixed frame are distributed in a parallel manner.
Preferably, the inner plate is fixedly connected with the fixing frame through fixing screws, and the heat dissipation holes and the inner plate form an integrated structure.
Preferably, fixture is including slide, centre gripping cushion, spacing slider, compression spring, fixture block and draw-in groove, the inboard distribution of slide has the centre gripping cushion, and the both ends of slide are fixed with spacing slider, the outside of slide is provided with compression spring, and compression spring's outer end is connected with the fixture block, the outer cloth of fixture block has the draw-in groove.
Preferably, the sliding plate forms a sliding structure with the fixed frame through the limiting sliding block, and the sliding plate is fixedly connected with the clamping cushion.
Preferably, the sliding plate and the clamping blocks form an elastic structure through the compression springs, and the clamping blocks and the clamping grooves are distributed in an embedded mode.
Compared with the prior art, the invention has the beneficial effects that: the single chip microcomputer is provided with the compression spring by using the chip frame with the heat dissipation structure and convenient to install, the sliding plate and the clamping soft cushion are driven to extrude inwards by the compression spring, so that the single chip microcomputer chip is clamped and fixed conveniently, and convenience is brought to installation work of workers;
the single chip microcomputer is provided with the embedded strip and the embedded groove by the chip frame which is provided with the heat dissipation structure and convenient to install, the cover plate is convenient to install and fix by embedding the embedded strip into the embedded groove, the installation work of workers is convenient, the internal chip can be well protected by the cover plate, the fixation through a nut is not needed in the installation through the clamping and the installation, and the convenience is brought to the dismounting work of the workers;
this singlechip is provided with the chip frame that has the heat radiation structure installation of being convenient for, is convenient for drive slide and the inside extrusion of centre gripping cushion through compression spring to be convenient for carry out the centre gripping to the singlechip chip and fix, and can carry on spacingly when removing the slide through spacing slider, make and strengthen the centre gripping effect, and be convenient for dismantle compression spring through fixture block and draw-in groove, it is convenient to bring for the clearance work of inside.
Drawings
FIG. 1 is a schematic top view of the internal structure of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a bottom view of the fixing frame according to the present invention.
In the figure: 1. a base plate; 2. mounting a nut; 3. a fixed frame; 4. a groove is embedded; 5. a cover plate; 6. an embedding strip; 7. an inner plate; 8. a set screw; 9. heat dissipation holes; 10. a clamping mechanism; 1001. a slide plate; 1002. clamping the soft cushion; 1003. a limiting slide block; 1004. a compression spring; 1005. a clamping block; 1006. a clamping groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a chip frame with a heat dissipation structure and convenient to install for a single chip microcomputer comprises a bottom plate 1, an installation nut 2, a fixed frame 3, an embedded groove 4, a cover plate 5, embedded strips 6, an inner plate 7, fixing screws 8, heat dissipation holes 9, a clamping mechanism 10, a sliding plate 1001, a clamping cushion 1002, a limiting slider 1003, a compression spring 1004, a clamping block 1005 and a clamping groove 1006, wherein the four corners of the bottom plate 1 are connected with the installation nut 2, the fixed frame 3 is distributed on the upper portion of the middle of the bottom plate 1, the embedded grooves 4 are formed in the inner portions of two sides of the fixed frame 3, the cover plate 5 is distributed on the top of the fixed frame 3, the embedded strips 6 are fixed on the lower wall of the cover plate 5, the cover plate 5 forms a clamping structure with the fixed frame 3 through the embedded strips 6 and the embedded grooves 4, the cover plate 5 and the fixed frame 3 are distributed in a parallel shape, and the cover plate 5, the installation work of workers is facilitated, the internal chip can be well protected through the cover plate 5, and the fixation through nuts is not needed during installation through the clamping and installation, so that the disassembly and assembly work of the workers is facilitated; an inner plate 7 is arranged at the bottom inside the fixed frame 3, fixing screws 8 are connected to four corners of the inner plate 7, heat dissipation holes 9 are distributed in the middle of the inner plate 7, the inner plate 7 is fixedly connected with the fixed frame 3 through the fixing screws 8, an integrated structure is formed between the heat dissipation holes 9 and the inner plate 7, heat dissipation can be performed in the using process of the single chip microcomputer chip through the heat dissipation holes 9, heat dissipated by the single chip microcomputer chip is discharged through the heat dissipation holes 9, and therefore the service life of the chip is greatly prolonged; the clamping mechanisms 10 are arranged at two ends of the inside of the fixed frame 3, each clamping mechanism 10 comprises a sliding plate 1001, a clamping cushion 1002, a limiting slide block 1003, a compression spring 1004, a clamping block 1005 and a clamping groove 1006, the clamping cushion 1002 is distributed on the inner side of the sliding plate 1001, the limiting slide blocks 1003 are fixed at two ends of the sliding plate 1001, the compression spring 1004 is arranged on the outer side of the sliding plate 1001, the clamping block 1005 is connected to the outer end of the compression spring 1004, the clamping grooves 1006 are distributed on the outer portion of the clamping block 1005, the sliding plate 1001 forms a sliding structure with the fixed frame 3 through the limiting slide blocks 1003, the sliding plate 1001 is fixedly connected with the clamping cushion 1002, the sliding plate 1001 forms an elastic structure with the clamping block 1005 through the compression spring 1004, the clamping blocks 1005 and the clamping grooves 1006 are distributed in an embedded manner, the sliding plate 1001 and the clamping cushion 1002 are, and can carry on spacingly when moving the slide 1001 through spacing slider 1003 for strengthen the centre gripping effect, and be convenient for dismantle compression spring 1004 through fixture block 1005 and draw-in groove 1006, bring the convenience for the cleaning work of inside.
The working principle is as follows: for the chip frame with the heat dissipation structure convenient to install for the single chip microcomputer, firstly, the bottom plate 1 is installed at a place needing to be used through the installation nut 2, then the inner plate 7 is fixed at the bottom of the fixed frame 3 through the fixing screw 8, the heat dissipation can be carried out through the heat dissipation hole 9 in the working process of the single chip microcomputer chip, the heat dissipated by the single chip microcomputer chip can be discharged through the heat dissipation hole 9, the service life of the chip is greatly prolonged, then, the single chip microcomputer chip is placed in the fixed frame 3, the clamping and fixing are carried out through the clamping mechanism 10, the sliding plate 1001 and the clamping cushion 1002 are conveniently driven to extrude inwards through the compression spring 1004 during the clamping, the single chip microcomputer chip is clamped and fixed, the limiting slide plate 1001 can be limited when moving through the limiting slide block 1003, the clamping effect is strengthened, and the compression spring 1004 can be conveniently detached through the clamping block 1005, bring the convenience for inside cleaning work, install fixedly the apron 5 through embedding the embedding strip 6 in the embedded groove 4 again at last to make through such block installation need not to fix through the nut when the installation, bring the convenience for staff's dismouting work.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a chip frame that singlechip is convenient for install with having heat radiation structure, includes bottom plate (1), embedded groove (4) and louvre (9), its characterized in that: the four corners of bottom plate (1) are connected with mounting nut (2), and the middle part upper portion distribution of bottom plate (1) has fixed frame (3), embedded groove (4) are seted up inside the both sides of fixed frame (3), and the top of fixed frame (3) distributes and have apron (5), the lower wall of apron (5) is fixed with embedding strip (6), the inside bottom of fixed frame (3) is provided with inner panel (7), and the four corners of inner panel (7) is connected with set screw (8), louvre (9) distribute in the middle part of inner panel (7), the inside both ends of fixed frame (3) are provided with fixture (10).
2. The chip frame with the heat dissipation structure for the single chip microcomputer, according to claim 1, is convenient for mounting, and is characterized in that: the cover plate (5) is clamped with the fixed frame (3) through the embedded strip (6) and the embedded groove (4), and the cover plate (5) and the fixed frame (3) are distributed in a parallel mode.
3. The chip frame with the heat dissipation structure for the single chip microcomputer, according to claim 1, is convenient for mounting, and is characterized in that: the inner plate (7) is fixedly connected with the fixed frame (3) through the fixing screws (8), and an integrated structure is formed between the heat dissipation holes (9) and the inner plate (7).
4. The chip frame with the heat dissipation structure for the single chip microcomputer, according to claim 1, is convenient for mounting, and is characterized in that: clamping mechanism (10) is including slide (1001), centre gripping cushion (1002), spacing slider (1003), compression spring (1004), fixture block (1005) and draw-in groove (1006), the inboard distribution of slide (1001) has centre gripping cushion (1002), and the both ends of slide (1001) are fixed with spacing slider (1003), the outside of slide (1001) is provided with compression spring (1004), and compression spring (1004) outer end is connected with fixture block (1005), the outer distribution of fixture block (1005) has draw-in groove (1006).
5. The chip frame with the heat dissipation structure for the single chip microcomputer, which is convenient to mount according to claim 4, is characterized in that: the sliding plate (1001) and the fixed frame (3) form a sliding structure through a limiting sliding block (1003), and the sliding plate (1001) and the clamping cushion (1002) form fixed connection.
6. The chip frame with the heat dissipation structure for the single chip microcomputer, which is convenient to mount according to claim 4, is characterized in that: the sliding plate (1001) and the clamping block (1005) form an elastic structure through the compression spring (1004), and the clamping block (1005) and the clamping groove (1006) are distributed in an embedded mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010538573.5A CN111599773A (en) | 2020-06-13 | 2020-06-13 | Chip frame with heat radiation structure and convenient to install for single chip microcomputer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010538573.5A CN111599773A (en) | 2020-06-13 | 2020-06-13 | Chip frame with heat radiation structure and convenient to install for single chip microcomputer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111599773A true CN111599773A (en) | 2020-08-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010538573.5A Pending CN111599773A (en) | 2020-06-13 | 2020-06-13 | Chip frame with heat radiation structure and convenient to install for single chip microcomputer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111599773A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133809A (en) * | 2020-09-06 | 2020-12-25 | 杭州金知科技有限公司 | Vertical packaging structure of full-color gallium nitride-based chip |
| CN112216668A (en) * | 2020-09-10 | 2021-01-12 | 安徽龙芯微科技有限公司 | Lead frame of high-power drive circuit and production method |
| CN112954187A (en) * | 2021-05-14 | 2021-06-11 | 南京初越数码科技有限公司 | Camera CCD chip positioning mounting frame and cooling system |
-
2020
- 2020-06-13 CN CN202010538573.5A patent/CN111599773A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133809A (en) * | 2020-09-06 | 2020-12-25 | 杭州金知科技有限公司 | Vertical packaging structure of full-color gallium nitride-based chip |
| CN112216668A (en) * | 2020-09-10 | 2021-01-12 | 安徽龙芯微科技有限公司 | Lead frame of high-power drive circuit and production method |
| CN112216668B (en) * | 2020-09-10 | 2022-08-02 | 安徽龙芯微科技有限公司 | Lead frame of high-power drive circuit and production method |
| CN112954187A (en) * | 2021-05-14 | 2021-06-11 | 南京初越数码科技有限公司 | Camera CCD chip positioning mounting frame and cooling system |
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