CN112954187A - Camera CCD chip positioning mounting frame and cooling system - Google Patents
Camera CCD chip positioning mounting frame and cooling system Download PDFInfo
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- CN112954187A CN112954187A CN202110524920.3A CN202110524920A CN112954187A CN 112954187 A CN112954187 A CN 112954187A CN 202110524920 A CN202110524920 A CN 202110524920A CN 112954187 A CN112954187 A CN 112954187A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
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- Aviation & Aerospace Engineering (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The invention discloses a camera CCD chip positioning mounting frame which comprises a mounting plate and clamping blocks arranged at two ends of the top surface of the mounting plate, wherein a pressing component is arranged in an inner cavity of the mounting plate and is respectively and movably arranged at two ends of the clamping blocks, when an operator places a chip on a mounting plate main body, a screw is screwed to press down a pressing sleeve, the pressing sleeve drives a square frame to move downwards, the outer end part of a telescopic rod main body drives the clamping blocks to move inwards, and therefore the chip can be tightly fixed on the mounting plate main body. The invention also discloses a heat dissipation system of the camera CCD chip positioning mounting rack, wherein a heat dissipation device is arranged in the heat dissipation hole, fan blades are uniformly and movably arranged in the inner cavity of the heat dissipation hole, when the temperature sensor detects that the temperature of the chip is higher, the micro motor is started, and the fan blades can swing back and forth, so that the air is blown out to cool and dissipate the heat of the chip.
Description
Technical Field
The invention relates to the technical field of cameras, in particular to a camera CCD chip positioning mounting frame and a heat dissipation system.
Background
The CCD chip is installed in the video camera, and the CCD chip is a chip for converting optical signals into electric signals, for example, in a digital camera and a video camera, the optical signals seen by people are converted into the electric signals, and the electric signals are processed to become digital photos seen by people.
The current CCD chip location mounting bracket adopts the form of fix with screw to install, and requirement when producing the CCD chip is higher, corresponding be exactly that manufacturing cost can improve, and the installation effectiveness is low, need install two steps, when dispelling the heat, generally all punch on the mounting bracket to reach radiating purpose, the radiating effect is poor, is not convenient for use.
To the above problems, the existing device is improved, and a camera CCD chip positioning mounting frame and a heat dissipation system are provided.
Disclosure of Invention
The invention aims to provide a camera CCD chip positioning mounting frame and a heat dissipation system, which work by adopting the device, so that the problems that the CCD chip positioning mounting frame in the background is mounted in a screw fixing mode, the requirement on the production of a CCD chip is high, the production cost is correspondingly improved, the mounting efficiency is low, two steps of mounting are needed, and holes are generally punched in the mounting frame when heat dissipation is carried out, so that the heat dissipation purpose is achieved, the heat dissipation effect is poor, and the camera CCD chip positioning mounting frame is inconvenient to use are solved.
In order to achieve the purpose, the invention provides the following technical scheme: a camera CCD chip positioning mounting frame comprises a mounting plate and clamping blocks arranged at two ends of the top surface of the mounting plate, wherein a pressing assembly is arranged in an inner cavity of the mounting plate and movably arranged at two ends of the clamping blocks respectively;
the clamping block is fixedly arranged on the clamping mechanism through the sliding clamping block;
compress tightly the subassembly and include fastening frame and install the equidistance arm on the fastening frame, the four corners department of fastening frame sets up the four corners department at the mounting panel respectively, and the middle part movable mounting of equidistance arm is on the inner chamber top surface inner wall of mounting panel, and the both ends of equidistance arm movable mounting is respectively on limit slider's bottom surface.
Furthermore, the inner cavities at the two sides of the upper end of the mounting plate main body are respectively provided with a first mounting groove, the two ends of the top surface of the mounting plate main body are respectively provided with a pair of first sliding grooves, the first chute is communicated with the first mounting groove, the four sides of the mounting plate main body are provided with second mounting grooves, the second mounting groove is communicated with the first mounting groove, mounting holes are respectively arranged at four corners of the mounting plate main body, second sliding grooves are respectively arranged at the middle parts of two ends of the top surface of the mounting plate main body, heat dissipation holes are respectively arranged between the first sliding grooves and the second sliding grooves, a third mounting groove is also arranged in an inner cavity at the lower end of the mounting plate main body, a first spring is arranged in the second sliding groove, and one end of the first spring is fixed on the inner wall of the second sliding groove, the other end of the first spring is fixed on the outer wall of the sliding clamping block, and the first spring is always in a stretching state when the sliding clamping block moves in the second sliding groove.
Further, latch mechanism installs in the third mounting groove, latch mechanism includes the lower briquetting of difference fixed mounting with the connecting rod on the outer wall of lower extreme both sides, and the upper end of lower briquetting is the top surface setting of protrusion mounting panel main part, it is protruding to be provided with the triangle on the outer end top surface of connecting rod, and the triangle arch is the bottom surface setting of protrusion second spout, carry out the joint between the protruding and slip fixture block of triangle, the bottom of lower briquetting is provided with the second spring, and the lower extreme of second spring is installed on the inner chamber bottom surface of third mounting groove.
Further, the fastening frame sets up in the second mounting groove, and the fastening frame includes that four corners department fixed mounting has down the square frame who presses the cover respectively, presses the four corners top surface setting that the upper end of cover is the protrusion mounting panel main part down, and it is protruding that there is the installation on the middle part inner wall of square frame both sides respectively fixed mounting.
Further, the equidistance arm includes gear box and the telescopic link of difference movable mounting in gear box upper end and lower extreme, and movable mounting has the pull-down frame between the telescopic link, and the outer end of telescopic link is movable mounting respectively on spacing slider's lower extreme bottom surface.
Furthermore, an installation square frame is arranged in an inner cavity of the gear box, and a first bevel gear is movably installed on the inner wall of the inner cavity of the installation square frame.
Further, the telescopic rod comprises a telescopic rod main body and a second bevel gear fixedly mounted on the bottom surface of one end of the telescopic rod main body, and the second bevel gear is meshed with the first bevel gear.
Further, the lower support comprises a first reinforcing rod and a second reinforcing rod movably connected with the lower end portion of the first reinforcing rod, a bonding block is arranged at the joint of the first reinforcing rod and the second reinforcing rod and fixedly mounted on the top surface of the mounting protrusion, rotating shaft connecting blocks are movably mounted at the upper end portions of the first reinforcing rod and the second reinforcing rod respectively, and the rotating shaft connecting blocks are movably mounted on the outer wall of the telescopic rod main body respectively.
The invention provides another technical scheme that: the heat dissipation system for the camera CCD chip positioning mounting frame is provided: be provided with heat abstractor in the louvre, heat abstractor includes the micro motor of fixed mounting in one of them louvre inner wall and sets up the drive belt on the inboard inner wall of louvre respectively, and even movable mounting has a plurality of flabellums in the inner chamber of louvre, and lower extreme one side of flabellum is provided with first gear, and first gear setting still is provided with temperature sensor and central processing unit in the louvre on the drive belt.
Further, the drive belt includes the drive belt main part and sets up the inside second gear in drive belt main part both ends, and micro motor's output end fixed mounting is on the second gear, carries out the meshing between second gear and the drive belt main part and is connected, and first gear also carries out the meshing with being connected between the drive belt main part.
Compared with the prior art, the invention has the following beneficial effects:
1. when an operator places a chip on a mounting plate main body, the chip presses down a pressing block, the pressing block drives a triangular protrusion to move downwards through a connecting rod, so that the triangular protrusion is separated from a sliding clamping block, the clamping block moves inwards at equal intervals under the action of the elastic force of a first spring and an equal-interval arm, so that the chip can be clamped, at the moment, the operator penetrates through a mounting hole through a screw and screws the screw, the screw can press down a pressing sleeve, the pressing sleeve can drive a square frame to move downwards, the lower end of a lower pulling frame can be pulled downwards, the angle between a first reinforcing rod and a second reinforcing rod is reduced, the angle between telescopic rods can be reduced under the action of the lower pulling frame, the outer end part of the telescopic rod main body can drive the clamping block to move inwards, so that the chip can be tightly fixed on the mounting plate main body, not only the operation is got up convenient and fast, and the installation step is few simultaneously, and the installation effectiveness is high, has prevented that the chip from punching improper phenomenon of damage because of processing from taking place.
2. According to the camera CCD chip positioning mounting frame and the heat dissipation system, the mounting square frame is arranged in the inner cavity of the gear box, the first conical gear is movably mounted on the inner wall of the inner cavity for mounting the square frame, the telescopic rod comprises the telescopic rod main body and the second conical gear fixedly mounted on the bottom surface of one end of the telescopic rod main body, and the second conical gear is meshed with the first conical gear.
3. According to the camera CCD chip positioning mounting frame and the heat dissipation system, the first reinforcing rod is movably connected with the lower end part of the first reinforcing rod, the joint of the first reinforcing rod and the second reinforcing rod is provided with the bonding block, the bonding block is fixedly arranged on the top surface of the mounting protrusion, the upper end parts of the first reinforcing rod and the second reinforcing rod are respectively and movably provided with the rotating shaft connecting block, the rotating shaft connecting blocks are respectively and movably arranged on the outer wall of the telescopic rod main body, and the arrangement enables the upper ends of the first reinforcing rod and the second reinforcing rod to pull the telescopic rod main body inwards when the first reinforcing rod and the second reinforcing rod are pulled downwards by the bonding block, so that the angle between the telescopic rod main bodies is changed.
4. According to the camera CCD chip positioning mounting frame and the heat dissipation system, when the temperature sensor detects that the temperature of the chip is high, a signal is transmitted to the central processing unit, the central processing unit processes information and then transmits the signal to the micro motor, the micro motor is started to drive the second gear to perform reciprocating small-angle motion, and under the transmission action of the transmission belt main body and the first gear, the fan blade can swing in a reciprocating mode, so that the fan outlet cools and dissipates heat of the chip.
Drawings
FIG. 1 is a schematic view of the overall three-dimensional structure of a camera CCD chip positioning mounting frame and a heat dissipation system according to the present invention;
FIG. 2 is a cross-sectional view of a camera CCD chip positioning mounting bracket and a heat dissipation system of the present invention;
FIG. 3 is a schematic view of a plane structure of a clamping mechanism of the camera CCD chip positioning mounting rack of the present invention;
FIG. 4 is a schematic view of a isometric arm of the CCD chip positioning mounting bracket of the camera according to the present invention;
FIG. 5 is a sectional view of a gear box of the camera CCD chip positioning mounting bracket of the present invention;
FIG. 6 is a schematic perspective view of a fastening frame of the CCD chip positioning and mounting frame of the camera according to the present invention;
FIG. 7 is a schematic view of a three-dimensional structure of a clamping block of the CCD chip positioning and mounting rack of the camera of the invention
FIG. 8 is a schematic diagram of a planar structure of a transmission belt of the heat dissipation system of the camera CCD chip positioning mounting bracket according to the present invention;
fig. 9 is a flow chart of the heat dissipation system of the camera CCD chip positioning mounting bracket of the present invention.
In the figure: 1. mounting a plate; 11. a mounting plate main body; 111. a first mounting groove; 112. a first chute; 113. a second mounting groove; 114. mounting holes; 115. a second chute; 1151. a first spring; 116. heat dissipation holes; 117. a third mounting groove; 12. a clamping mechanism; 121. pressing the block; 122. a connecting rod; 123. a triangular bulge; 124. a second spring; 2. a clamping block; 21. a limiting slide block; 22. sliding the clamping block; 3. a compression assembly; 31. fastening the frame; 311. a square frame; 312. mounting a boss; 313. pressing down the sleeve; 32. equidistant arms; 4. a heat sink; 41. a micro motor; 42. a transmission belt; 421. a belt body; 422. a second gear; 43. a fan blade; 431. a first gear; 44. a temperature sensor; 45. a central processing unit;
321. a gear box; 3211. installing a square frame; 3212. a first bevel gear; 322. a telescopic rod; 3221. a main body of the telescopic rod; 3222. a second bevel gear; 323. a pull-down frame; 3231. a first reinforcing bar; 3232. a second reinforcing bar; 3233. a rotating shaft connecting block; 3234. and (7) bonding the blocks.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, 4, 6 and 7, a camera CCD chip positioning mounting frame comprises a mounting plate 1 and clamping blocks 2 disposed at two ends of the top surface of the mounting plate 1, wherein a pressing component 3 is disposed in the inner cavity of the mounting plate 1, the pressing component 3 is movably mounted at two ends of the clamping block 2, the mounting plate 1 comprises a mounting plate main body 11 and a clamping mechanism 12 disposed in the inner cavity of the lower end of the mounting plate main body 11, a limiting slider 21 is fixedly mounted on the bottom surface of each end of the clamping block 2, a sliding fixture block 22 is fixedly mounted on the bottom surface of the middle portion of the clamping block 2, the clamping block 2 is slidably mounted on the top surface of the mounting plate 1 through the limiting slider 21 and the sliding fixture block 22, the clamping block 2 is clamped on the clamping mechanism 12 through the sliding fixture block 22, thereby fixing the clamping block 2, the pressing component 3 comprises a fastening frame 31 and equidistant arms 32 mounted on the fastening frame 31, four corners of the fastening frame 31 are disposed at, the middle part of the equidistant arm 32 is movably arranged on the inner wall of the top surface of the inner cavity of the mounting plate 1, and the two ends of the equidistant arm 32 are respectively movably arranged on the bottom surface of the limiting slide block 21.
Referring to fig. 1 and 2, a camera CCD chip positioning mounting bracket, wherein two side cavities at the upper end of a mounting plate main body 11 are respectively provided with a first mounting groove 111, two ends of the top surface of the mounting plate main body 11 are respectively provided with a pair of first sliding grooves 112, the first sliding grooves 112 are communicated with the first mounting groove 111, four sides of the mounting plate main body 11 are provided with second mounting grooves 113, the second mounting grooves 113 are communicated with the first mounting groove 111, four corners of the mounting plate main body 11 are respectively provided with a mounting hole 114, the middle parts at two ends of the top surface of the mounting plate main body 11 are respectively provided with a second sliding groove 115, heat dissipation holes 116 are respectively arranged between the first sliding grooves 112 and the second sliding grooves 115, a third mounting groove 117 is further arranged in the lower end cavity of the mounting plate main body 11, a first spring 1151 is arranged in the second sliding groove 115, and one end of the first spring, the other end of the first spring 1151 is fixed to the outer wall of the sliding latch 22, and the first spring 1151 is always in a tension state when the sliding latch 22 moves in the second sliding groove 115.
Referring to fig. 2 and 3, a camera CCD chip positioning mounting frame, a clamping mechanism 12 is installed in a third mounting groove 117, the clamping mechanism 12 includes a lower pressing block 121 fixedly installed with a connecting rod 122 on outer walls of two sides of a lower end respectively, an upper end of the lower pressing block 121 is a top surface of a protruding mounting plate main body 11, a triangular protrusion 123 is arranged on a top surface of an outer end of the connecting rod 122, the triangular protrusion 123 is a bottom surface protruding from a second chute 115, the triangular protrusion 123 is clamped with a sliding clamping block 22, a second spring 124 is arranged at a bottom of the lower pressing block 121, and a lower end of the second spring 124 is installed on a bottom surface of an inner cavity of the third mounting groove 117.
Referring to fig. 4-6, a camera CCD chip positioning mounting frame, a fastening frame 31 is disposed in a second mounting groove 113, the fastening frame 31 includes a square frame 311 having four corners respectively fixedly mounted with a lower pressing sleeve 313, the upper end of the lower pressing sleeve 313 protrudes out of the top surface of the four corners of the mounting plate main body 11, mounting protrusions 312 are respectively fixedly mounted on the inner walls of the middle portions of the two sides of the square frame 311, an equidistant arm 32 includes a gear box 321 and telescopic rods 322 respectively movably mounted on the upper end and the lower end of the gear box 321, a lower pulling frame 323 is movably mounted between the telescopic rods 322, one side of the telescopic rod 322 having the lower pulling frame 323 disposed therebetween in an initial state is in an obtuse angle, the outer end of the telescopic rod 322 is respectively movably mounted on the bottom surface of the lower end of the limiting slider 21, a mounting square frame 3211 is disposed in the inner cavity of the gear box 321, a first bevel gear 3212, the telescopic rod 322 comprises a telescopic rod main body 3221 and a second bevel gear 3222 fixedly installed on the bottom surface of one end of the telescopic rod main body 3221, the second bevel gear 3222 is in meshed connection with the first bevel gear 3212, the lower pull frame 323 comprises a first reinforcing rod 3231 and a second reinforcing rod 3232 movably connected with the lower end portion of the first reinforcing rod 3231, a joint between the first reinforcing rod 3231 and the second reinforcing rod 3232 tends to move downwards in an initial state, a bonding block 3234 is arranged at the joint between the first reinforcing rod 3231 and the second reinforcing rod 3232, the bonding block 3234 is fixedly installed on the top surface of the installation protrusion 312, rotary shaft connecting blocks 3233 are movably installed at the upper end portions of the first reinforcing rod 3231 and the second reinforcing rod 3232 respectively, and the rotary shaft connecting blocks 3233 are movably installed on the outer wall of the telescopic rod main body 3221 respectively.
The invention provides another technical scheme that: the heat dissipation system for the camera CCD chip positioning mounting frame is provided:
referring to fig. 1, 2, 8 and 9, a heat dissipation system for a CCD chip positioning and mounting rack of a camera, a heat dissipation hole 116 is provided with a heat dissipation device 4, the heat dissipation device 4 comprises a micro motor 41 fixedly installed in the inner wall of one of the heat dissipation holes 116 and a transmission belt 42 respectively installed on the inner wall of the heat dissipation hole 116, a plurality of fan blades 43 are uniformly and movably installed in the inner cavity of the heat dissipation hole 116, a first gear 431 is arranged on one side of the lower end of each fan blade 43, the first gear 431 is arranged on the transmission belt 42, the temperature sensor 44 and the central processor 45 are also arranged in the heat dissipation hole 116, the transmission belt 42 comprises a transmission belt main body 421 and second gears 422 arranged inside two ends of the transmission belt main body 421, the output end of the micro motor 41 is fixedly mounted on the second gear 422, the second gear 422 is engaged with the belt main body 421, and the first gear 431 is also engaged with the belt main body 421.
The working principle is as follows: when an operator places a chip on the mounting plate main body 11, the chip presses down the pressing block 121, the pressing block 121 drives the triangular protrusion 123 to move downward through the connecting rod 122, so that the triangular protrusion 123 is separated from the sliding clamping block 22, the clamping block 2 moves inward at an equal distance under the action of the elastic force of the first spring 1151 and the equal distance arm 32, so that the chip can be clamped, at this time, after the operator passes through the mounting hole 114 through the screw, by screwing the screw, the screw presses down the pressing sleeve 313, the pressing sleeve 313 drives the square frame 311 to move downward, the lower end of the lower pulling frame 323 is pulled downward, the angle between the first reinforcing rod 3231 and the second reinforcing rod 3232 is reduced, the angle between the telescopic rods 322 is also reduced under the action of the lower pulling frame 323, the outer end portion of the telescopic rod main body 3221 drives the clamping block 2 to move inward, so that the chip can be fixed on the mounting plate main body 11 tightly, when temperature sensor 44 detects that the chip temperature is higher, then can give central processing unit 45 with signal transmission, central processing unit 45 can give micro motor 41 with signal transmission after with information processing again, and micro motor 41 starts, drives second gear 422 and carries out reciprocal small-angle motion, and under the drive effect of drive belt main part 421 and first gear 431, flabellum 43 then can carry out reciprocal swing to the fan air-out is cooled down the heat dissipation to the chip.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a camera CCD chip location mounting bracket, includes mounting panel (1) and clamp splice (2) of setting at mounting panel (1) top surface both ends, its characterized in that: the clamping mechanism is characterized in that a pressing component (3) is arranged in an inner cavity of the mounting plate (1), the pressing components (3) are respectively movably mounted at two ends of the clamping block (2), and the mounting plate (1) comprises a mounting plate main body (11) and a clamping mechanism (12) arranged in the inner cavity at the lower end of the mounting plate main body (11);
limiting sliding blocks (21) are fixedly mounted on the bottom surfaces of the two ends of the clamping block (2) respectively, a sliding clamping block (22) is fixedly mounted on the bottom surface of the middle part of the clamping block (2), and the clamping block (2) is slidably mounted on the top surface of the mounting plate (1) through the limiting sliding blocks (21) and the sliding clamping block (22);
compress tightly subassembly (3) including fastening frame (31) and install equidistance arm (32) on fastening frame (31), the four corners department of fastening frame (31) sets up the four corners department at mounting panel (1) respectively, the middle part movable mounting of equidistance arm (32) is on the inner chamber top surface inner wall of mounting panel (1), the both ends difference movable mounting of equidistance arm (32) is on the bottom surface of limit slide (21).
2. The camera CCD chip positioning mounting frame as set forth in claim 1, wherein: the inner cavities of two sides of the upper end of the mounting plate main body (11) are respectively provided with a first mounting groove (111), two ends of the top surface of the mounting plate main body (11) are respectively provided with a pair of first sliding grooves (112), the first sliding grooves (112) are communicated with the first mounting grooves (111), the four sides of the mounting plate main body (11) are provided with second mounting grooves (113), the second mounting grooves (113) are communicated with the first mounting grooves (111), the four corners of the mounting plate main body (11) are respectively provided with mounting holes (114), the middle parts of two ends of the top surface of the mounting plate main body (11) are respectively provided with a second sliding groove (115), heat dissipation holes (116) are respectively arranged between the first sliding grooves (112) and the second sliding grooves (115), the inner cavity of the lower end of the mounting plate main body (11) is also provided with a third mounting groove (117), the second sliding grooves (115) are respectively provided with a first spring (1151), and one end of the first spring (115, the other end of the first spring (1151) is fixed on the outer wall of the sliding fixture block (22).
3. The camera CCD chip positioning mounting frame as set forth in claim 1, wherein: clamping mechanism (12) are installed in third mounting groove (117), clamping mechanism (12) include on the outer wall of lower extreme both sides respectively fixed mounting have lower briquetting (121) of connecting rod (122), and the upper end of briquetting (121) is the top surface setting of protrusion mounting panel main part (11) down, be provided with triangle arch (123) on the outer end top surface of connecting rod (122), and triangle arch (123) are the bottom surface setting of protrusion second spout (115), carry out the joint between triangle arch (123) and slide fixture block (22), the bottom of briquetting (121) is provided with second spring (124) down, and the lower extreme of second spring (124) is installed on the inner chamber bottom surface of third mounting groove (117).
4. The camera CCD chip positioning mounting frame as set forth in claim 1, wherein: fastening frame (31) set up in second mounting groove (113), and fastening frame (31) include that four corners department respectively fixed mounting has square frame (311) of pressing cover (313) down, and the upper end that presses cover (313) down is the four corners top surface setting of protruding mounting panel main part (11), and it is protruding (312) to install fixed mounting respectively on the middle part inner wall of square frame (311) both sides.
5. The camera CCD chip positioning mounting frame as set forth in claim 1, wherein: the equidistant arm (32) comprises a gear box (321) and telescopic rods (322) movably mounted at the upper end and the lower end of the gear box (321) respectively, a pull-down frame (323) is movably mounted between the telescopic rods (322), and the outer ends of the telescopic rods (322) are movably mounted on the bottom surface of the lower end of the limiting slide block (21) respectively.
6. The camera CCD chip positioning mounting frame of claim 5, wherein: an installation square frame (3211) is arranged in an inner cavity of the gear box (321), and a first bevel gear (3212) is movably installed on the inner wall of the inner cavity of the installation square frame (3211).
7. The camera CCD chip positioning mounting frame of claim 5, wherein: the telescopic rod (322) comprises a telescopic rod main body (3221) and a second bevel gear (3222) fixedly mounted on the bottom surface of one end of the telescopic rod main body (3221), and the second bevel gear (3222) is in meshing connection with the first bevel gear (3212).
8. The camera CCD chip positioning mounting frame of claim 5, wherein: the pull-down frame (323) comprises a first reinforcing rod (3231) and a second reinforcing rod (3232) movably connected with the lower end part of the first reinforcing rod (3231), a bonding block (3234) is arranged at the joint of the first reinforcing rod (3231) and the second reinforcing rod (3232), the bonding block (3234) is fixedly installed on the top surface of the installation bulge (312), rotating shaft connecting blocks (3233) are respectively movably installed at the upper end parts of the first reinforcing rod (3231) and the second reinforcing rod (3232), and the rotating shaft connecting blocks (3233) are respectively movably installed on the outer wall of the telescopic rod main body (3221).
9. A heat dissipation system for a camera CCD chip positioning mounting frame according to any one of claims 1-8, wherein: be provided with heat abstractor (4) in louvre (116), heat abstractor (4) include micro motor (41) of fixed mounting in one of them louvre (116) inner wall and set up drive belt (42) on louvre (116) inboard inner wall respectively, and even movable mounting has flabellum (43) in the inner chamber of louvre (116), and lower extreme one side of flabellum (43) is provided with first gear (431), and first gear (431) set up on drive belt (42), still is provided with temperature sensor (44) and central processing unit (45) in louvre (116).
10. The heat dissipation system of claim 9, wherein the heat dissipation system comprises: the transmission belt (42) comprises a transmission belt main body (421) and second gears (422) arranged at the inner parts of two ends of the transmission belt main body (421), the output ends of the micro motors (41) are fixedly arranged on the second gears (422), the second gears (422) are meshed with the transmission belt main body (421), and the first gears (431) are meshed with the transmission belt main body (421).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110524920.3A CN112954187B (en) | 2021-05-14 | 2021-05-14 | Camera CCD chip positioning mounting frame and cooling system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110524920.3A CN112954187B (en) | 2021-05-14 | 2021-05-14 | Camera CCD chip positioning mounting frame and cooling system |
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| CN112954187A true CN112954187A (en) | 2021-06-11 |
| CN112954187B CN112954187B (en) | 2021-11-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114689910A (en) * | 2022-05-27 | 2022-07-01 | 苏州联讯仪器有限公司 | Chip reliability testing device |
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| CN111599773A (en) * | 2020-06-13 | 2020-08-28 | 常州工业职业技术学院 | Chip frame with heat radiation structure and convenient to install for single chip microcomputer |
| CN112361189A (en) * | 2020-11-09 | 2021-02-12 | 运城学院 | Computer installation equipment with multi-direction adjusting function and installation method thereof |
| CN212986486U (en) * | 2020-07-03 | 2021-04-16 | 褚小娟 | Scheduling control is with many displays stores pylon convenient to dismouting |
-
2021
- 2021-05-14 CN CN202110524920.3A patent/CN112954187B/en active Active
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| US6704052B1 (en) * | 1998-05-22 | 2004-03-09 | Olympus Corporation | Image pickup optical system comprising a prism fixing member for preventing a deterioration in the capability of correcting decentration abberation, and apparatus therefore |
| CN111599773A (en) * | 2020-06-13 | 2020-08-28 | 常州工业职业技术学院 | Chip frame with heat radiation structure and convenient to install for single chip microcomputer |
| CN212986486U (en) * | 2020-07-03 | 2021-04-16 | 褚小娟 | Scheduling control is with many displays stores pylon convenient to dismouting |
| CN112361189A (en) * | 2020-11-09 | 2021-02-12 | 运城学院 | Computer installation equipment with multi-direction adjusting function and installation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114689910A (en) * | 2022-05-27 | 2022-07-01 | 苏州联讯仪器有限公司 | Chip reliability testing device |
| CN114689910B (en) * | 2022-05-27 | 2022-08-16 | 苏州联讯仪器有限公司 | Chip reliability testing device |
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| Publication number | Publication date |
|---|---|
| CN112954187B (en) | 2021-11-26 |
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Effective date of registration: 20211103 Address after: 200000 room 553A, building 2, No. 787, manufacturing Bureau Road, Huangpu District, Shanghai Applicant after: Shanghai Shengwei Electronic Technology Co.,Ltd. Address before: 210000 room 104, 125 Shigu Road, Qinhuai District, Nanjing City, Jiangsu Province Applicant before: Nanjing Chuyue Digital Technology Co.,Ltd. |
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