CN209842536U - CPU heat radiation module structure - Google Patents

CPU heat radiation module structure Download PDF

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Publication number
CN209842536U
CN209842536U CN201920760883.4U CN201920760883U CN209842536U CN 209842536 U CN209842536 U CN 209842536U CN 201920760883 U CN201920760883 U CN 201920760883U CN 209842536 U CN209842536 U CN 209842536U
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CN
China
Prior art keywords
fixing
fin
cpu
bolt
module structure
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920760883.4U
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Chinese (zh)
Inventor
项帅求
蔡剑宁
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Shenzhen Institute of Information Technology
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Shenzhen Institute of Information Technology
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Priority to CN201920760883.4U priority Critical patent/CN209842536U/en
Application granted granted Critical
Publication of CN209842536U publication Critical patent/CN209842536U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a CPU heat dissipation module structure, including fixed bolster, first fin, square mounting bracket and draw runner, the inside of first fin is provided with two sets of heat conduction copper pipes, the second fixed plate is all installed with one side at first fin both ends, one side that the second fixed plate was kept away from at first fin both ends is installed first fixed plate, and the inboard of first fixed plate and second fixed plate all is provided with the spout, the inboard of spout is provided with the draw runner. The utility model discloses an installation is provided with the draw runner on the storehouse, mutually supports through draw runner and spout for the installation storehouse is installed in the outside of first fin with the form of taking out the plug, and will install the storehouse through the use of fixed bolster and first bolt and fix, thereby can directly unscrew a bolt and just can take off the installation storehouse, need not fix through the multiunit screw again, even dismantle many times, also can not lead to first fin or installation storehouse damage.

Description

CPU heat radiation module structure
Technical Field
The utility model relates to a CPU heat dissipation technical field specifically is a CPU heat dissipation module structure.
Background
Along with the appearance and the development of a computer, the functions of the computer are more and more diversified, the high-efficiency operation of the CPU of the computer is not separated, the heat dissipation strength of the CPU is directly related to the performance of the CPU, the current heat dissipation structure of the computer is generally realized by a whole set of matched heat dissipation devices, but the air circulation is accelerated in the current heat dissipation structure, most of heat dissipation fans for enhancing the heat dissipation effect are directly installed on the heat dissipation fins through screws, the disassembly and the installation are troublesome, the damage of the heat dissipation fins can be directly caused when the heat dissipation fins are disassembled for a plurality of times, the heat dissipation effect is influenced, meanwhile, the current heat dissipation structure does not have a structure capable of helping the heat dissipation fins to filter dust, the simple filtration of a chassis alone is far from insufficient, the service time is long, the heat dissipation fans and the heat dissipation fins are easily full of dust, and the heat dissipation of the CPU.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a CPU heat dissipation module structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a CPU heat dissipation module structure comprises a fixed support, a first heat dissipation sheet, a square mounting frame and a sliding strip, wherein two groups of heat conduction copper pipes are arranged inside the first heat dissipation sheet, a second fixing plate is arranged on the same side of two ends of the first heat dissipation sheet, a first fixing plate is arranged on one side, away from the second fixing plate, of two ends of the first heat dissipation sheet, sliding grooves are formed in the inner sides of the first fixing plate and the second fixing plate, sliding strips are arranged on the inner sides of the sliding grooves, a mounting bin is arranged on one side, away from the sliding grooves, of the sliding strip, a square through hole is formed in one end, away from the first heat dissipation sheet, of one group of mounting bins, a frame is arranged on the inner side of the square through hole, a filter screen is arranged on the inner side of the frame, a heat dissipation fan is arranged inside the mounting bin, a fixed block is, and the fixed bolster keeps away from one end screw thread of articulated department and installs first bolt, the fixed bolster passes through first bolt and fixed block fixed connection, the dead lever is installed to the bottom of first fin both sides, and the bottom of dead lever is provided with two sets of splice pieces, the second bolt is installed to the both ends screw thread at dead lever top, square mounting bracket is installed to the bottom of dead lever, and square mounting bracket passes through second bolt and dead lever fixed connection, the both sides at square mounting bracket top are provided with two sets of splice grooves with splice piece matched with, the stabilizer blade is all installed in the four corners of square mounting bracket bottom, and the bottom screw thread of stabilizer blade installs the third bolt, the bottom plate is installed to the inboard bottom of heat conduction copper pipe, and the bracing piece is installed to the both sides at bottom plate top, the top and the first fin of.
Preferably, one end of the frame, which is far away from the first radiating fin, is evenly hinged with a row of baffles, and the inner sides of the baffles are provided with limiting blocks.
Preferably, the bottom of the leg is provided with a gasket.
Preferably, a spring is mounted at the bottom of the inner side of the sliding groove.
Preferably, a rubber layer is arranged on the inner side of the fixed support.
Preferably, the top of the bottom plate is uniformly provided with second cooling fins.
Compared with the prior art, the beneficial effects of the utility model are that: the mounting bin of the CPU heat dissipation module structure is provided with the sliding strip, the mounting bin is arranged on the outer side of the first heat radiating fin in a drawing and inserting mode through the mutual matching of the sliding strip and the sliding groove, the mounting bin is fixed through the fixing support and the first bolt, so that the mounting bin can be taken down by directly unscrewing one bolt, the mounting bin is simpler to mount, the mounting bin is not fixed through a plurality of groups of screws, the first heat radiating fin or the mounting bin cannot be damaged even if the mounting bin is dismounted for a plurality of times, the outer side of the mounting bin is provided with the filter screen, when the heat dissipation fan works, dust in air is filtered, excessive dust is prevented from entering the inner part of the first heat radiating fin and affecting the heat dissipation effect of the first heat radiating fin, the outer side of a frame provided with the filter screen is uniformly hinged with the baffle, the inner side of the baffle is provided with the limiting block, the phenomenon that the larger dust in a machine case is attached to the filter screen due to, influence the filter effect of filter screen, and when clearing up the dust, the dust of the inside and outside both sides of clearance baffle that can be very convenient, the bottom of dead lever is provided with the splice piece simultaneously, and the top of square mounting bracket is provided with and splices piece matched with splice groove, can play the effect of supplementary fixed and location when the installation fin, unusual practicality.
Drawings
Fig. 1 is a front view of the present invention;
fig. 2 is a front sectional view of the present invention;
fig. 3 is a side sectional view of the present invention;
FIG. 4 is a front view of the installation chamber of the present invention;
fig. 5 is a schematic perspective view of a square mounting bracket of the present invention;
fig. 6 is a perspective view of the fixing rod of the present invention.
In the figure: 1. a first bolt; 2. fixing a bracket; 3. a frame; 4. a first fixing plate; 5. a baffle plate; 6. A first heat sink; 7. a second bolt; 8. a square mounting rack; 9. a gasket; 10. a support bar; 11. a second heat sink; 12. a base plate; 13. a heat conducting copper pipe; 14. a third bolt; 15. a support leg; 16. splicing blocks; 17. fixing the rod; 18. a filter screen; 19. a second fixing plate; 20. a fixed block; 21. a slide bar; 22. a chute; 23. a spring; 24. a heat radiation fan; 25. installing a bin; 26. a square through hole; 27. a limiting block; 28. And (6) splicing the grooves.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides an embodiment: a CPU heat radiation module structure comprises a fixed support 2, a first heat radiation fin 6, a square mounting rack 8 and a slide bar 21, wherein two groups of heat conduction copper tubes 13 are arranged inside the first heat radiation fin 6, the same side of the two ends of the first heat radiation fin 6 is provided with a second fixed plate 19, one side of the two ends of the first heat radiation fin 6 far away from the second fixed plate 19 is provided with a first fixed plate 4, the inner sides of the first fixed plate 4 and the second fixed plate 19 are provided with a sliding groove 22, the inner side of the sliding groove 22 is provided with the slide bar 21, one side of the sliding bar 21 far away from the sliding groove 22 is provided with a mounting bin 25, one end of one group of mounting bins 25 far away from the first heat radiation fin 6 is provided with a square through hole 26, the inner side of the square through hole 26 is provided with a frame 3, the inner side of the frame 3 is provided with a filter screen 18, the inner part of the mounting bin 25 is provided with a heat radiation fan 24, the top of the first fixing plate 4 is hinged with a fixing support 2, a first bolt 1 is installed on one end, far away from the hinged part, of the fixing support 2 through the first bolt 1, the fixing support 2 is fixedly connected with a fixing block 20 through the first bolt 1, fixing rods 17 are installed on the bottoms of two sides of the first radiating fin 6, two groups of splicing blocks 16 are arranged on the bottom of each fixing rod 17, second bolts 7 are installed on two ends of the top of each fixing rod 17 through threads, a square mounting frame 8 is installed on the bottom of each fixing rod 17, each square mounting frame 8 is fixedly connected with each fixing rod 17 through the corresponding second bolt 7, two groups of splicing grooves 28 matched with the splicing blocks 16 are arranged on two sides of the top of each square mounting frame 8, supporting legs 15 are installed on four corners of the bottom of each square mounting frame 8, third bolts 14 are installed on the bottom of each supporting leg 15 through, the top of the support bar 10 is connected to the first heat sink 6.
In the embodiment, one end of the frame 3 far away from the first radiating fin 6 is evenly hinged with a row of baffles 5, and the inner side of the baffle 5 is provided with a limit block 27 which is helpful for preventing larger dust in the air from being adsorbed on the filter screen 18 after directly falling off, the bottom of the support leg 15 is provided with a gasket 9 which can increase the contact area, make between mainboard and the stabilizer blade 15 more firm, spring 23 is installed to the inboard bottom of spout 22, both can increase the laminating degree of draw runner 21 and fixed bolster 2, can make installation bin 25 rise out spout 22 take the altitude when opening fixed bolster 2 again, be convenient for extract installation bin 25, the inboard of fixed bolster 2 is provided with the rubber layer, avoid screwing up 1 in-process fixed bolster 2 of first bolt and installation bin 25 contact extrusion damage, the top of bottom plate 12 evenly is provided with second fin 11, help improving device's radiating effect.
The working principle is as follows: when the CPU heat dissipation module structure is used, firstly, the bottoms of the four groups of support legs 15 are aligned to the corresponding screw holes arranged on the computer mainboard, then the third bolt 14 is used for penetrating the screw holes on one side of the mainboard far away from the support legs 15 to fix the support legs 15 on the mainboard, then the heat conducting silica gel is coated on the CPU, then the splicing blocks 16 arranged at the bottoms of the fixed rods 17 at the two sides of the first heat dissipation plate 6 are aligned to the splicing grooves 28 at the top of the square mounting rack 8, and the splicing blocks 16 and the splicing grooves 28 are mutually clamped, thereby realizing the primary fixation of the first heat dissipation plate 6, because the splicing blocks 16 and the splicing grooves 28 are mutually clamped, the second bolts 7 which are arranged on the fixed rods 17 in a threaded manner can be directly aligned to the screw holes at the top of the square mounting rack 8, then the fixed rods 17 are fixedly connected with the square mounting rack 8 through the second bolts, in the process, the bottom of the heat conducting copper pipe 13 is fully contacted with the CPU through the heat conducting silica gel, a power supply is switched on before use, the heat radiating fan 24 is controlled to be switched on, the heat generated by the work of the CPU is conducted to the top of the heat conducting copper pipe 13 along the bottom of the heat conducting copper pipe 13, the heat is transferred to the multi-layer first heat radiating fins 6 on the outer side of the heat conducting copper pipe 13 in the process of conducting on the heat conducting copper pipe 13, the working heat radiating fan 24 blows air with lower temperature around from gaps among the first heat radiating fins 6 and then blows out the air from the other side of the first heat radiating fins 6, most of the heat on the first heat radiating fins 6 is taken away by the flowing air, meanwhile, the first heat radiating fins 6 also radiate heat around, so that the heat conducted by the CPU to the heat conducting copper pipe 13 can be timely radiated by the first heat radiating fins 6 ceaselessly, the bottom plate 12 is, part of heat at the bottom of the heat conduction copper pipe 13 is transferred to the second radiating fin 11 through the bottom plate 12, the heat is radiated to the periphery by the second radiating fin 11, during the normal use of the CPU radiating module structure, the radiating fan 24 on one side of the first radiating fin 6 blows air to the inner side of the first radiating fin 6 for radiating, large dust in the air is blocked by the baffle 5 when falling, small dust is blocked by the filter screen 18 for filtering, so that the situation that the large dust enters the inner side of the multilayer first radiating fin 6 is avoided, when the filter screen 18 and the outer side of the installation bin 25 need to be cleaned, the first bolt 1 is manually unscrewed, at the moment, the spring 23 at the bottom of the sliding groove 22 supports the installation bin 25 due to elasticity, the installation bin 25 is convenient to take out, and the dust can be cleaned on the inner side of the baffle 5 and the outer side of the filter screen 18 through a special dust cleaning brush.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. The utility model provides a CPU heat dissipation module structure, includes fixed bolster (2), first fin (6), square mounting bracket (8) and draw runner (21), its characterized in that: the heat dissipation device is characterized in that two groups of heat conduction copper pipes (13) are arranged inside the first radiating fin (6), the second fixing plates (19) are arranged on the same sides of the two ends of the first radiating fin (6), the first fixing plate (4) is arranged on one side, far away from the second fixing plates (19), of the two ends of the first radiating fin (6), sliding grooves (22) are formed in the inner sides of the first fixing plate (4) and the second fixing plate (19), sliding strips (21) are arranged on the inner sides of the sliding grooves (22), an installation bin (25) is arranged on one side, far away from the sliding grooves (22), of each sliding strip (21), a square through hole (26) is formed in one end, far away from the first radiating fin (6), of each installation bin (25), a frame (3) is arranged on the inner side of each square through hole (26), a filter screen (18) is arranged on the inner side of each frame, the fixing structure is characterized in that a fixing block (20) is installed at the top of one side, far away from the first fixing plate (4), of the second fixing plate (19), a fixing support (2) is hinged to the top of the first fixing plate (4), a first bolt (1) is installed at one end, far away from the hinged position, of the fixing support (2), the fixing support (2) is fixedly connected with the fixing block (20) through the first bolt (1), a fixing rod (17) is installed at the bottoms of two sides of the first radiating fin (6), two groups of splicing blocks (16) are arranged at the bottom of the fixing rod (17), a second bolt (7) is installed at two ends of the top of the fixing rod (17) through threads, a square mounting frame (8) is installed at the bottom of the fixing rod (17), the square mounting frame (8) is fixedly connected with the fixing rod (17) through the second bolt (7), two groups of splicing grooves (28) matched with the splicing blocks (, stabilizer blade (15) are all installed in the four corners of square mounting bracket (8) bottom, and the bottom screw thread of stabilizer blade (15) installs third bolt (14), bottom plate (12) are installed to the bottom of heat conduction copper pipe (13) inboard, and the both sides at bottom plate (12) top install bracing piece (10), the top and first fin (6) of bracing piece (10) are connected.
2. The heat sink module structure of CPU of claim 1, wherein: one end of the frame (3) far away from the first radiating fins (6) is evenly hinged with a row of baffles (5), and the inner sides of the baffles (5) are provided with limiting blocks (27).
3. The heat sink module structure of CPU of claim 1, wherein: and a gasket (9) is arranged at the bottom of the supporting leg (15).
4. The heat sink module structure of CPU of claim 1, wherein: and a spring (23) is arranged at the bottom of the inner side of the sliding chute (22).
5. The heat sink module structure of CPU of claim 1, wherein: and a rubber layer is arranged on the inner side of the fixed support (2).
6. The heat sink module structure of CPU of claim 1, wherein: and second radiating fins (11) are uniformly arranged at the top of the bottom plate (12).
CN201920760883.4U 2019-05-24 2019-05-24 CPU heat radiation module structure Expired - Fee Related CN209842536U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920760883.4U CN209842536U (en) 2019-05-24 2019-05-24 CPU heat radiation module structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920760883.4U CN209842536U (en) 2019-05-24 2019-05-24 CPU heat radiation module structure

Publications (1)

Publication Number Publication Date
CN209842536U true CN209842536U (en) 2019-12-24

Family

ID=68897803

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920760883.4U Expired - Fee Related CN209842536U (en) 2019-05-24 2019-05-24 CPU heat radiation module structure

Country Status (1)

Country Link
CN (1) CN209842536U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191224

Termination date: 20200524

CF01 Termination of patent right due to non-payment of annual fee