CN111599726A - Suspender and wafer processing equipment - Google Patents
Suspender and wafer processing equipment Download PDFInfo
- Publication number
- CN111599726A CN111599726A CN202010485344.1A CN202010485344A CN111599726A CN 111599726 A CN111599726 A CN 111599726A CN 202010485344 A CN202010485344 A CN 202010485344A CN 111599726 A CN111599726 A CN 111599726A
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- rod
- connecting portion
- connection
- pole
- wafer
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- 239000003302 ferromagnetic material Substances 0.000 claims description 14
- 230000013011 mating Effects 0.000 claims description 14
- 230000002265 prevention Effects 0.000 claims 1
- 239000003814 drug Substances 0.000 abstract description 16
- 239000007788 liquid Substances 0.000 abstract description 16
- 235000012431 wafers Nutrition 0.000 description 41
- 230000005291 magnetic effect Effects 0.000 description 21
- 239000000463 material Substances 0.000 description 10
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a suspender and wafer processing equipment, wherein the suspender comprises a first rod used for being connected with a crane, a second rod used for hanging and taking a product, and a connecting component used for connecting the first rod and the second rod, the connecting component comprises a first connecting part and a second connecting part which are respectively arranged on the first rod and the second rod, and the first connecting part and the second connecting part are respectively provided with matching surfaces facing to each other; the first and second connection portions are configured to be detachably connected; when the wafer processing device is used for processing the wafer and has a fault, the second rod can be quickly detached through the connecting component, so that the wafer arranged on the second rod can be taken out of the liquid medicine in time, and the phenomenon that the wafer is scrapped due to the fact that the wafer is soaked in the liquid medicine for a long time is avoided.
Description
Technical Field
The present invention relates generally to the field of semiconductor manufacturing, and more particularly to a hanger bar and wafer processing equipment.
Background
In the semiconductor manufacturing industry, a large number of etching processes use an automatic groove type etching machine, the automatic groove type etching machine sequentially puts material boxes containing wafers according to process set parameters through a crane in a machine station to finish the whole process flow, when the crane or other abnormal conditions occur, the machine station can be caused to stop working, when the crane places the material boxes containing the wafers in the etching groove, the crane or equipment is abnormal, the crane can block the material boxes, the wafers cannot be taken out in a short time, and the wafers can be discarded after being soaked in liquid medicine for a long time.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a suspension rod and a wafer processing apparatus.
In a first aspect, the present invention discloses a boom, comprising a first rod for connecting with a crane, a second rod for hanging a product, and a connecting assembly for connecting the first rod and the second rod, wherein the connecting assembly comprises a first connecting part and a second connecting part respectively disposed on the first rod and the second rod, and the first connecting part and the second connecting part respectively have mating surfaces facing each other;
the first connecting portion and the second connecting portion are detachably connected, and when the first connecting portion is connected to the second connecting portion, the matching surface of the first connecting portion abuts against the matching surface of the second connecting portion.
Specifically, through coupling assembling connects first pole with the second pole, when wafer processing equipment is handling the trouble to the wafer, through coupling assembling can in time separate the second pole of getting the product with hanging with first pole to in time take out the wafer from the liquid medicine, avoided the wafer to soak in the liquid medicine for a specified time and scrap.
Further, the first connecting portion and the second connecting portion are connected in a magnetic adsorption mode, and at least one of the first connecting portion and the second connecting portion is a variable magnet.
Specifically, the first rod and the second rod are connected through the magnet, at least one of the first connecting portion and the second connecting portion is the variable magnet, so that the first rod and the second rod can be quickly separated when equipment is in fault, the soaking time of wafers in liquid medicine is shortened, and the quality of the wafers is guaranteed.
Further, the first connecting portion is a variable magnet, and the second connecting portion is an end portion of the first rod or the second rod made of a ferromagnetic material.
Specifically, when the first rod and the second rod are connected and both made of magnetic adsorption materials or one of the first rod and the second rod is made of magnetic adsorption materials, the first connecting part is set to be a variable magnet, and the variable magnet is a magnet with a changeable magnetic pole direction or capable of being switched between a magnetic state and a non-magnetic state; the variable magnet is fixedly connected with one of the first rod and the second rod, the other rod is adsorbed by the variable magnet to realize the connection of the first rod and the second rod, and when the second rod needs to be separated, the first magnet is in a non-magnetic state or the direction of a magnetic pole is perpendicular to the length direction of the hanging rod, so that the purpose of separating the second rod is achieved.
Further, the first connecting part is a variable magnet, and the second connecting part is a connecting part made of ferromagnetic material.
Specifically, when the first rod and the second rod are both made of a material which cannot be attracted by a magnet, the purpose of connecting the first rod and the second rod can be achieved by connecting a connecting piece made of a ferromagnetic material with one of the first rod or the second rod and connecting the other rod with the variable magnet, and when the first rod or the second rod needs to be separated, the variable magnet is also magnetized to achieve the purpose of separating the second rod.
Furthermore, a first guide portion is arranged on the matching surface of the first connecting portion, and a second guide portion matched with the first guide portion is arranged on the matching surface of the second connecting portion.
Specifically, the first connecting portion can be quickly connected to the second connecting portion by providing the guide portion.
Further, the connector also comprises a first connector; the first connecting part can form a projection area on the second connecting part in the direction perpendicular to the length of the hanging rod, and the first plug connector simultaneously penetrates through the part of the first connecting part forming the projection area and the part of the second connecting part coinciding with the projection area
Specifically, will through first plug connector first connecting portion with the second connecting portion is pegged graft together, can avoid first connecting portion with the unexpected separation of second connecting portion guarantees the operational safety of jib.
Further, first plug connector is the bolt, the one end of first bolt is provided with the ring that draws, and the other end is provided with anticreep spare.
The bolt is preferred to the first plug connector, the end portion of the first bolt is provided with a pull ring, the bolt can be rapidly taken out through the pull ring in the process of separating the first rod from the second rod through the bolt, the purpose of rapid separation is achieved, the first plug connector can be prevented from accidentally falling off through the anti-falling part, and safety is guaranteed.
In a second aspect, the present application discloses a wafer handling device, the crane being mounted with a boom as described in any of the above.
Further, the device is connected with an alarm device.
Specifically, through setting up alarm device, can send alarm signal when equipment trouble, in time remind operating personnel to take out the wafer from the liquid medicine, guarantee the quality of wafer.
Advantageous effects
The invention discloses a suspender and a wafer processing device, wherein the suspender comprises a first rod used for being connected with a crane, a second rod used for hanging and taking a product, and a connecting assembly used for connecting the first rod and the second rod, the connecting assembly comprises a first connecting part and a second connecting part which are respectively arranged on the first rod and the second rod, and the first connecting part and the second connecting part are respectively provided with matching surfaces facing to each other; the first connecting part and the second connecting part are detachably connected, when the first connecting part is connected to the second connecting part, the matching surface of the first connecting part is pressed against the matching surface of the second connecting part, when the wafer processing device is used for processing a wafer and has a fault, the second rod can be quickly detached through the connecting component, so that the wafer arranged on the second rod can be timely taken out of the liquid medicine, and the phenomenon that the wafer is scrapped due to the fact that the wafer is soaked in the liquid medicine for a long time is avoided.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a schematic view of the construction of the hanger bar of the present invention;
FIG. 2 is a schematic structural diagram of a connecting assembly according to an embodiment of the present invention;
fig. 3 is another structural schematic diagram of a connecting assembly according to an embodiment of the invention.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1 to 3, in a first aspect, the present invention discloses a boom comprising a first pole 10 for connection with a crane, a second pole 20 for hanging a product, and a connecting assembly 30 for connecting the first pole 10 and the second pole 20, the connecting assembly comprising a first connecting portion 31 and a second connecting portion 32, the first connecting portion 31 and the second connecting portion 32 having a mating face 310 and a mating face 320 facing each other, respectively;
the first connecting portion 31 and the second connecting portion 32 are configured to be detachably connected, and when the first connecting portion 31 is connected to the second connecting portion 32, the mating surface 310 of the first connecting portion abuts against the mating surface 320 of the second connecting portion.
Specifically, through coupling assembling 30's first connecting portion 31 and second connecting portion 32 respectively with first pole 10 and second pole 20 fixed connection, through configuring first connecting portion 31 and second connecting portion 32 into can dismantling the connection, thereby make first pole 10 with second pole 20 configures into can dismantling the connection, when wafer treatment equipment is handling the wafer and is breaking down, through coupling assembling 30 can in time separate first pole 10 with the second pole 20 of getting the product of hanging to in time take out the wafer from the liquid medicine, avoided the wafer to soak in the liquid medicine for a long time and scrapped, guaranteed the quality of product, and then guaranteed the security that wafer treatment equipment handled the wafer, can dismantle the connection and for hanging, threaded connection, the mode of pegging graft.
Further, as a preferred embodiment, the first connection portion 31 and the second connection portion 32 are magnetically attracted, and at least one of the first connection portion 31 and the second connection portion 32 is a variable magnet.
Specifically, the first rod 10 and the second rod 20 are connected in a magnetic adsorption mode, and at least one of the first connecting portion 31 and the second connecting portion 32 is a variable magnet, so that the first rod 10 and the second rod 20 can be quickly separated when equipment is in fault, the time for soaking wafers in liquid medicine is shortened, and the quality of the wafers is guaranteed.
Referring to fig. 2 and 3, the first connecting portion 31 is a variable magnet, and the second connecting portion 32 is an end portion of the first rod 10 or the second rod 20 made of a ferromagnetic material.
Specifically, when the first rod 10 and the second rod 20 are made of a ferromagnetic material or one of the first rod and the second rod is made of a ferromagnetic material, the first connecting portion 31 is configured as a variable magnet, which is a magnet with a variable magnetic pole direction or capable of being switched between a magnetic state and a non-magnetic state, such as a magnetic base, an electromagnet, and the like.
When the second rod 20 is made of ferromagnetic material or at least the end of the second rod 20 close to the first rod 10 is made of ferromagnetic material, the first connection portion 31 is connected to the end of the first rod 10 close to the second rod 20, and the specific connection manner may be a hinged connection manner, a fixed connection manner, etc., the end of the second rod 20 is adsorbed by the first connection portion 31, so as to connect the first rod 10 and the second rod 20, when the second rod 20 needs to be separated from the first rod 10, only the magnetic pole of the first connection portion 31 needs to disappear or change the magnetic force direction, which can achieve the purpose of separating the first rod 10 and the second rod 20, that is, when the first connection portion 31 is a magnetic seat, the separation of the first rod 10 and the second rod 20 can be achieved by adjusting the knob 311 on the magnetic seat, and when the first connection portion 31 is an electromagnet, the electromagnet is powered off, so as to achieve the separation of the first rod 10 and the second rod 20, the design mode is convenient and simple, the first rod 10 and the second rod 20 can be quickly separated, and the wafer can be quickly taken out of the liquid medicine, so that the quality of the wafer is well guaranteed.
When the first rod 10 is made of a ferromagnetic material or at least the end of the first rod 10 close to the second rod 20 is made of a ferromagnetic material, the specific implementation is the same as above, and the details are not repeated here.
Referring to fig. 2 and 3, further, the first connecting portion 31 is a variable magnet, the second connecting portion 32 is a connecting member made of a magnetic absorption material, and one of the first rod 10 and the second rod 20 is fixedly connected to the first connecting portion 31, and the other is fixedly connected to the connecting member.
Specifically, when the first rod 10 and the second rod 20 are both made of a material that cannot be attracted by a magnet, the first rod 10 and the second rod 20 can be connected by connecting a connecting piece made of a magnet-attracting material to one of the first rod 10 and the second rod 20 and connecting the other rod to the first connecting portion 31, and when the first rod 10 or the second rod 20 needs to be separated, the first connecting portion 31 is also magnetized, so that the second rod is separated.
Referring to fig. 2 and 3, further, the first connecting portion 31 is a variable magnet, and the second connecting portion 32 is a connecting member made of a ferromagnetic material.
Specifically, when the first rod 10 and the second rod 20 are both made of a material that cannot be attracted by a magnet, the purpose of connecting the first rod 10 and the second rod 20 can be achieved by connecting a connecting member made of a ferromagnetic material to one of the first rod 10 and the second rod 20 and connecting the other rod to the variable magnet, and when the first rod 10 or the second rod 20 needs to be separated, the variable magnet is also magnetized, so that the purpose of separating the second rod 10 is achieved.
Specifically, as another real-time mode, both the first connection portion 31 and the second connection portion 32 may be provided as magnets, one of the first connection portion 31 and the second connection portion 32 may be provided as a variable magnet, and the other thereof may be provided as a non-variable magnet, or both the first connection portion 31 and the second connection portion 32 may be provided as variable magnets; the adsorption reliability of the first connecting part 31 and the second connecting part 32 can be ensured by arranging the first connecting part 31 and the second connecting part 32 as magnets, so that the use safety of the suspension rod can be ensured, at least one of the first connecting part 31 and the second connecting part 32 is arranged as a variable magnet, and when the second rod 20 needs to be separated from the first rod 10, the magnetic pole is changed or a non-magnetic state is changed by the variable magnet, so that the second rod 20 can be separated.
Specifically, the variable magnet comprises a switch type magnetic base or an electromagnet.
Referring to fig. 2 and 3, a first guide portion 313 is disposed on the mating surface 310 of the first connecting portion 31, and a second guide portion 323 is disposed on the mating surface 320 of the second connecting portion 32 and is engaged with the first guide portion 313.
Specifically, the first connection portion 31 can be quickly connected to the second connection portion 32 by providing a guide portion, as shown in fig. 2, the guide portion may be a groove provided on the mating surface 310 of the first connection portion 31, and the mating surface 320 of the second connection portion 32 may be a protrusion adapted to the groove, so that when the first connection portion 31 is connected to the second connection portion 32, the protrusion and the groove are cooperatively guided to realize quick connection, thereby improving the working efficiency, and similarly, the mating surface 310 of the first connection portion 31 may be convex, and the mating surface 320 of the second connection portion 32 may be concave; specifically, the protrusion may be a tapered protrusion, and the groove may be a tapered groove.
Refer to fig. 2, 3; further, the boom further comprises a first plug 33; the first connection portion 31 may form a projection area on the second connection portion 32 in a direction perpendicular to the length of the suspension lever, and the first connector 33 simultaneously passes through a portion 312 of the first connection portion 31 where the projection area is formed and a portion 321 of the second connection portion 32 where the projection area coincides with the projection area.
Specifically, the first connector 33 is used for inserting the first connecting portion 31 and the second connecting portion 32 together, so that the first connecting portion 31 and the second connecting portion 32 can be prevented from being accidentally separated, and the operation safety of the suspension rod is ensured, referring to fig. 2, it can be understood that the connector 33 can also simultaneously penetrate through the first guide portion 313 and the second guide portion 323 of the first connecting portion 31 and the second connecting portion 32, the first guide portion 313 and the second guide portion 323 can both play a role in guiding, and can also play a role in inserting and fixing the first connecting portion 31 and the second connecting portion 32 by using the first connector 33, specifically, the first connector 33 can be a screw rod, a bolt, and the like.
Further, as a preferred embodiment, the first plug 33 is a first plug, and one end of the first plug 33 is provided with a pull ring 331, and the other end is provided with a separation preventing member 332.
Specifically, the preferred bolt of first plug connector 33, the tip of first bolt 33 is provided with pull ring 331, when needs separate first pole 10 and second pole 20, can take out first bolt 33 fast through hand power pull ring 331 through the setting of bolt, realizes the purpose of quickly separating, can prevent through setting up anticreep piece 332 the accident of first bolt 33 drops, guarantees safety, and anticreep piece 332 can be for the tip of first bolt 33 sets up the pinhole along its footpath, passes the pinhole and sets up the bayonet lock, or sets up the jump ring groove through the tip at first bolt, prevents that first bolt 33 from dropping through setting up the jump ring.
In a second aspect, the application discloses wafer processing equipment, the equipment fixing is as above arbitrary the jib, it is specific, wafer processing equipment includes the etching equipment of wafer, can carry out the wafer sculpture and when equipment trouble takes place at equipment, through coupling assembling with first pole and second pole quickly separating to in time take out the wafer that will soak in the liquid medicine, avoided the wafer to soak in the liquid medicine for a long time and lead to the wafer to scrap.
Further, the device is connected with an alarm device.
Specifically, through setting up alarm device with equipment, can send alarm signal when equipment trouble, in time remind operating personnel to take out the wafer from the liquid medicine, guarantee the quality of wafer.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (10)
1. A boom, comprising a first pole for connection to a crane, a second pole for hanging a product, and a connection assembly for connecting the first pole and the second pole, the connection assembly comprising a first connection portion and a second connection portion disposed at the first pole and the second pole, the first connection portion and the second connection portion having mating surfaces facing each other, respectively;
the first connecting portion and the second connecting portion are detachably connected, and when the first connecting portion is connected to the second connecting portion, the matching surface of the first connecting portion abuts against the matching surface of the second connecting portion.
2. The boom of claim 1, wherein the first and second connection portions are magnetically attracted connections and at least one of the first and second connection portions is a variable magnet.
3. The boom of claim 2, wherein the first connection is a variable magnet and the second connection is an end of the first rod or the second rod made of a ferromagnetic material.
4. The boom of claim 2, wherein the first connection is a variable magnet and the second connection is a connection made of a ferromagnetic material.
5. Boom according to any of claims 2-4, ch a racterized i n that the variable magnet comprises a switched magnet holder or an electromagnet.
6. The boom according to any one of claims 1 to 4, wherein a first guide portion is provided on a mating surface of the first connecting portion, and a second guide portion that mates with the first guide portion is provided on a mating surface of the second connecting portion.
7. The hanger bar of any one of claims 1 to 4, further comprising a first plug; in the direction perpendicular to jib length the first connecting portion can be formed with the projection area on the second connecting portion, first plug connector passes simultaneously first connecting portion forms the part of projection area and passes the second connecting portion with the part of projection area coincidence.
8. The boom of claim 7, wherein the first connector is a pin, and wherein the first pin is provided with a pull ring at one end and a release prevention member at the other end.
9. A wafer processing apparatus, characterized in that the apparatus is provided with a boom according to any of claims 1-8.
10. The wafer processing apparatus of claim 9, wherein an alarm device is further connected to the apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010485344.1A CN111599726A (en) | 2020-06-01 | 2020-06-01 | Suspender and wafer processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010485344.1A CN111599726A (en) | 2020-06-01 | 2020-06-01 | Suspender and wafer processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111599726A true CN111599726A (en) | 2020-08-28 |
Family
ID=72188220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010485344.1A Pending CN111599726A (en) | 2020-06-01 | 2020-06-01 | Suspender and wafer processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111599726A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010208798A (en) * | 2009-03-10 | 2010-09-24 | Osurogureen Kk | Suspending device of steel plate |
| CN105261575A (en) * | 2014-05-30 | 2016-01-20 | 盛美半导体设备（上海）有限公司 | Magnetic connecting device |
| CN208440158U (en) * | 2018-07-18 | 2019-01-29 | 泉州重达机械有限公司 | A kind of crane explosion proof suspension hook being easily installed |
| CN110676209A (en) * | 2019-10-11 | 2020-01-10 | 深圳市奈士迪技术研发有限公司 | Picking device for chip production line measurement and control system |
-
2020
- 2020-06-01 CN CN202010485344.1A patent/CN111599726A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010208798A (en) * | 2009-03-10 | 2010-09-24 | Osurogureen Kk | Suspending device of steel plate |
| CN105261575A (en) * | 2014-05-30 | 2016-01-20 | 盛美半导体设备（上海）有限公司 | Magnetic connecting device |
| CN208440158U (en) * | 2018-07-18 | 2019-01-29 | 泉州重达机械有限公司 | A kind of crane explosion proof suspension hook being easily installed |
| CN110676209A (en) * | 2019-10-11 | 2020-01-10 | 深圳市奈士迪技术研发有限公司 | Picking device for chip production line measurement and control system |
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Application publication date: 20200828 |