CN110676209A - Picking device for chip production line measurement and control system - Google Patents
Picking device for chip production line measurement and control system Download PDFInfo
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- CN110676209A CN110676209A CN201910963515.4A CN201910963515A CN110676209A CN 110676209 A CN110676209 A CN 110676209A CN 201910963515 A CN201910963515 A CN 201910963515A CN 110676209 A CN110676209 A CN 110676209A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention relates to a picking device for a chip production line measurement and control system, which comprises a connecting plate, a processor, a lifting mechanism, a lifting plate, a suction pipe, a suction cup, an adsorption mechanism and two placing mechanisms, wherein the placing mechanisms comprise transverse plates, vertical rods, limiting frames, rotating rods, supporting rods, a hinge assembly and supporting plates, the adsorption mechanism comprises a fan, a filter screen and a cleaning assembly, the cleaning assembly comprises a cleaning rod, a sliding rod, a pressing block, a supporting unit and two fan blades, the picking device for the chip production line measurement and control system is convenient for placing chips on the two supporting plates through the two placing mechanisms and surrounds the chips by the two limiting frames, accidental falling caused by shaking or collision of the device in the chip transportation process is prevented, the chips are convenient to pick up through the adsorption mechanism, the chips are fixed through the pressing block after falling on the supporting plates, and the stability of chip picking and transportation is further enhanced, thereby improving the practicability of the equipment.
Description
Technical Field
The invention relates to the field of production line measurement and control equipment, in particular to pickup equipment for a chip production line measurement and control system.
Background
Integrated Circuits (ICs), also known as microchips, chips, or chips, are a way in electronics to miniaturize circuits, including semiconductor devices, also including passive components, and the like, and are often fabricated on the surface of semiconductor wafers.
With the development of the semiconductor industry, the thinner the thickness of the integrated circuit chip is, the more diversified the size of the chip is, and in the production measurement and control system of the chip, the transportation work of the chip is usually realized by using various pickup devices. But current chip pickup apparatus, moreover, the steam trap is simple in structure, only rely on the fan to bleed from the sucking disc, absorb the chip of sucking disc below, after adsorbing the chip, the sucking disc is not firm with being connected of chip, pickup apparatus is because of collision or removal rate is too fast easily, lead to the chip to break away from the sucking disc, and in order to increase the adsorption affinity to the chip, simply increase the suction of sucking disc, can lead to the sucking disc too big to the extrusion force of chip, cause the chip to damage, and not only, after equipment has been used for a long time, between the straw between sucking disc and the fan, adsorb dust impurity easily, influence the circulation of air, further lead to the adsorption affinity to reduce, thereby the practicality of current chip pickup apparatus has been reduced.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in order to overcome the defects of the prior art, the picking device for the chip production line measurement and control system is provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: a picking device for a chip production line measurement and control system comprises a connecting plate, a processor, a lifting mechanism, a lifting plate, a suction pipe, a suction disc, an adsorption mechanism and two placing mechanisms, wherein the processor is fixed on the connecting plate, a PLC is arranged in the processor, the top end of the suction pipe is arranged below the processor through the lifting mechanism, the suction disc is fixed at the bottom end of the suction pipe, the lifting mechanism is in transmission connection with the lifting plate, the two placing mechanisms are respectively positioned on two sides of the suction pipe, and the adsorption mechanism is arranged in the suction pipe;
the placing mechanisms comprise transverse plates, vertical rods, limiting frames, rotating rods, supporting rods, hinge assemblies and supporting plates, the transverse plates are fixed on the suction tubes, the transverse plates are sleeved on the vertical rods, the top ends of the vertical rods are fixed below the lifting plate, the bottom ends of the vertical rods are fixedly connected with the limiting frames, the limiting frames are U-shaped, the limiting frames in the two placing mechanisms are arranged oppositely, the limiting frames and the supporting plates are sequentially arranged below the suction cups from top to bottom, the rotating rods are located on one sides of the vertical rods, away from the suction tubes, the top ends of the rotating rods are connected with the transverse plates through the hinge assemblies, the bottom ends of the rotating rods are fixedly connected with the supporting plates, and two ends of the supporting rods are respectively hinged with the vertical rods and the;
adsorption apparatus constructs from the top and includes fan, filter screen and clean subassembly in proper order, be equipped with two gas vents on the top of straw, the fan is connected with the PLC electricity, the periphery of filter screen and the inner wall sealing connection of straw, clean subassembly includes clean pole, slide bar, presses piece, support unit and two fan blades, the below of the center department at clean pole is fixed on the top of slide bar, press the bottom at the slide bar according to the piece to be fixed, two fan blades are located the both sides of the lower part of slide bar respectively, the center department of slide bar is located through the support unit setting in the straw, the top of clean pole is equipped with a plurality of brushes.
Preferably, in order to drive the lifting plate to move up and down, the lifting mechanism comprises an electromagnet and a support column, the electromagnet is fixed below the processor and electrically connected with the PLC, the support column is fixed between the electromagnet and the suction pipe, the lifting plate is sleeved on the support column, and the lifting plate is made of iron.
Preferably, in order that the two support plates abut against each other and maintain a horizontal angle when the lifting plate is lowered to the lowest position, a support block is provided at the top end of the suction pipe, the support block is fixed at the top end of the suction pipe, and the support block abuts against the lower side of the lifting plate.
Preferably, for the convenience of dwang rotation, hinge assembly includes center pin and two sleeves, the sleeve pipe is fixed in the below of diaphragm, the both ends of center pin set up respectively in two sleeves, the center department of center pin and the top fixed connection of dwang.
Preferably, in order to avoid dust entering the exhaust port, filter cloth is arranged on the inner side of the exhaust port.
Preferably, in order to ensure the stable rotation of the slide bar, the support unit comprises a support ring and two side rods, the support ring is sleeved on the slide bar, the two side rods are respectively positioned at two sides of the support ring, and the support ring is fixedly connected with the inner wall of the suction pipe through the side rods.
Preferably, in order to reduce the pressure of the pressing block on the chip, a spring is provided above the side lever, a buffer ring is provided below the cleaning lever, and the buffer block is fixed to a tip of the spring.
Preferably, the pressing block is made of silicone to prevent the chip from being damaged by excessive compression.
Preferably, in order to reinforce the connection between the vertical rod and the limiting frame, the vertical rod and the limiting frame are of an integrally formed structure.
Preferably, in order to facilitate remote control of the operating device, an antenna is further arranged in the processor, and the antenna is electrically connected with the PLC.
The picking device for the chip production line measurement and control system has the advantages that the chips are conveniently placed on the two supporting plates through the two placing mechanisms and are surrounded by the two limiting frames, the chips are prevented from falling off due to accidental conditions such as shaking or collision of the device in the chip transportation process, the chips are conveniently picked up through the adsorption mechanism, the chips are fixed through the pressing block after falling on the supporting plates, the picking and transportation stability of the chips is further enhanced, and the practicability of the device is improved.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural diagram of a pick-up device for a chip production line measurement and control system according to the present invention;
FIG. 2 is a schematic structural diagram of a placement mechanism of a pick-up device for a chip production line measurement and control system according to the present invention;
FIG. 3 is a top view of the limiting frame of the pick-up device for the chip production line measurement and control system of the present invention;
FIG. 4 is a schematic structural diagram of an adsorption mechanism of a pick-up device for a chip production line measurement and control system according to the present invention;
FIG. 5 is an enlarged view of portion A of FIG. 4;
in the figure: 1. the device comprises a connecting plate, 2 parts of a processor, 3 parts of a lifting plate, 4 parts of a suction pipe, 5 parts of a suction cup, 6 parts of a transverse plate, 7 parts of a vertical rod, 8 parts of a limit frame, 9 parts of a rotating rod, 10 parts of a supporting rod, 11 parts of a supporting plate, 12 parts of a fan, 13 parts of a filter screen, 14 parts of a cleaning rod, 15 parts of a sliding rod, 16 parts of a pressing block, 17 parts of a fan blade, 18 parts of an electromagnet, 19 parts of a supporting column, 20 parts of a supporting block, 21 parts of a central shaft, 22 parts of a sleeve pipe, 23 parts of filter cloth, 24 parts of a supporting ring.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic views illustrating only the basic structure of the present invention in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1, a pickup device for a chip production line measurement and control system comprises a connecting plate 1, a processor 2, a lifting mechanism, a lifting plate 3, a suction tube 4, a suction cup 5, an adsorption mechanism and two placement mechanisms, wherein the processor 2 is fixed on the connecting plate 1, a PLC is arranged in the processor 2, the top end of the suction tube 4 is arranged below the processor 2 through the lifting mechanism, the suction cup 5 is fixed at the bottom end of the suction tube 4, the lifting mechanism is in transmission connection with the lifting plate 3, the two placement mechanisms are respectively positioned at two sides of the suction tube 4, and the adsorption mechanism is arranged in the suction tube 4;
a PLC, i.e., a programmable logic controller, which employs a programmable memory for storing therein a program, executing instructions for user-oriented operations such as logic operation, sequence control, timing, counting, and arithmetic operation, and controlling various types of machines or production processes through digital or analog input/output, is essentially a computer dedicated for industrial control, has a hardware structure substantially the same as that of a microcomputer, and is generally used for data processing and instruction reception and output for realizing central control.
When the chip picking device is used, the connecting plate 1 is installed in a chip production line measurement and control system, the movement of the sucking disc 5 and the suction pipe 4 below can be controlled through the movement of the connecting plate 1, when the chip is picked, the sucking disc 5 is moved to be right above the chip, the PLC in the processor 2 controls the lifting mechanism to be started, the lifting plate 3 moves upwards to act on the placing mechanism, the adsorption mechanism in the suction pipe 4 is started, air flows upwards and enters the suction pipe 4 through the sucking disc 5, so that the chip below is adsorbed below the sucking disc 5, the lifting mechanism drives the lifting plate 3 to move downwards, the placing mechanism is started, the limiting frame 8 and the supporting plate 11 in the placing mechanism move to be below the sucking disc 5, the adsorption mechanism stops running, the chip falls on the two placing mechanisms, and the chip is supported through the two placing mechanisms, then the connecting plate 1 moves to drive the chip to move, and the picking and moving operation of the chip is realized.
As shown in fig. 2-3, the placing mechanisms include a transverse plate 6, a vertical rod 7, a limiting frame 8, a rotating rod 9, a supporting rod 10, a hinge assembly and a supporting plate 11, the transverse plate 6 is fixed on the straw 4, the transverse plate 6 is sleeved on the vertical rod 7, the top end of the vertical rod 7 is fixed below the lifting plate 3, the bottom end of the vertical rod 7 is fixedly connected with the limiting frame 8, the limiting frame 8 is U-shaped, the limiting frames 8 in the two placing mechanisms are oppositely arranged, the limiting frames 8 and the supporting plate 11 are sequentially arranged below the suction cup 5 from top to bottom, the rotating rod 9 is located on one side of the vertical rod 7 away from the straw 4, the top end of the rotating rod 9 is connected with the transverse plate 6 through the hinge assembly, the bottom end of the rotating rod 9 is fixedly connected with the supporting plate 11, and two ends of the supporting rod 10 are respectively hinged with;
in the placing mechanism, the position of the transverse plate 6 is fixed, the lifting mechanism drives the lifting plate 3 to move up and down, so that the vertical rod 7 can move up and down along the axis of the vertical rod 7, when the vertical rod 7 moves up, the vertical rod 7 drives the limiting frame 8 to move up synchronously, the vertical rod 7 acts on the rotating rod 9 through the support rod 10, so that the rotating rod 9 rotates up under the supporting action of the hinge assembly to drive the supporting plate 11 to rotate up, so that the sucking disc 5 is opened, at the moment, the adsorption mechanism in the sucking tube 4 operates to generate upward attraction, after the chip is attracted to be contacted with the sucking disc 5, the PLC controls the lifting mechanism to drive the lifting plate 3 to move down, in the process that the lifting plate 3 drives the limiting frame 8 to move down through the vertical rod 7, the vertical rod 7 acts on the rotating rod 9 through the support rod 10, so that under the supporting action of the hinge assembly, the support rod 10 drives the supporting plate 11 to, support plate 11 in final two placement mechanism supports each other and support plate 11 is in the coplanar, and simultaneously, two spacing frame 8 downstream to the top of support plate 11, then adsorption apparatus stop motion, make sucking disc 5 lose ascending appeal after, receive the top that gravity influences dropped on two support plates 11, and the chip is located the enclosure frame of the spacing frame 8 of two U-shapes, then equipment can remove, because the chip is located the enclosure region of two spacing frame 8, and utilize two support plates 11 to support, can guarantee the stable transportation of chip, avoid picking up equipment and bumping or shaking the in-process, the chip drops, and then realized the stable transportation of chip.
As shown in fig. 4-5, the adsorption mechanism includes fan 12, filter screen 13 and clean subassembly from the top down in proper order, be equipped with two gas vents on the top of straw 4, fan 12 is connected with the PLC electricity, the periphery of filter screen 13 and the inner wall sealing connection of straw 4, clean subassembly includes clean pole 14, slide bar 15, presses piece 16, support unit and two fan blades 17, the below of the center department at clean pole 14 is fixed on the top of slide bar 15, press piece 16 to be fixed in the bottom of slide bar 15, two fan blades 17 are located the both sides of the lower part of slide bar 15 respectively, the center department of slide bar 15 passes through the support unit setting in straw 4, the top of clean pole 14 is equipped with a plurality of brushes.
When the supporting plate 11 rotates upwards to be separated from the lower part of the sucker 5, the PLC controls the fan 12 to be started to generate an air flow flowing upwards, the outside air is sucked to enter the suction pipe 4 through the sucker 5 and flows upwards, and is finally discharged through the exhaust port, the air is filtered by using the filter screen 13, particulate matters in the air are prevented from being adsorbed on blades of the fan 12, the air acts on the fan blade 17 and the pressing block 16 in the upward flowing process, the fan blade 17 and the pressing block 16 are sucked to move upwards until a brush on the rotating rod 9 at the top end of the sliding rod 15 abuts against the lower part of the filter screen 13, and the air blows the fan blade 17 to rotate at the same time, so that the sliding rod 15 rotates around the axis of the sliding rod under the action of the supporting component, the brush on the rotating rod 9 is further driven to rotate under the filter screen 13, impurities on the filter screen 13 are removed, the influence of, make the drum produce ascending appeal to the chip, support to lean on in the below of sucking disc 5 until the chip, then 3 downstream of elevating system drive lifter plate, make layer board 11 and stopper move to sucking disc 5's below after, PLC control fan 12 bring to rest, make slide bar 15, fan blade 17 and according to parts such as briquetting 16 receive the action of gravity downstream, finally stretch out the top that sucking disc 5 fell at the chip according to briquetting 16, fix the chip from the top, fix the chip in the top of layer board 11 and the inboard of spacing frame 8, avoid the chip to drop, guarantee the stable transportation of chip, and then the practicality of equipment has been improved.
Preferably, in order to drive the lifting plate 3 to move up and down, the lifting mechanism comprises an electromagnet 18 and a support column 19, the electromagnet 18 is fixed below the processor 2, the electromagnet 18 is electrically connected with the PLC, the support column 19 is fixed between the electromagnet 18 and the suction pipe 4, the lifting plate 3 is sleeved on the support column 19, and the lifting plate 3 is made of iron.
PLC control electro-magnet 18 circular telegram back, produces magnetism, can attract the lifter plate 3 rebound of being made by iron, and the lifter plate 3 cover is established on pillar 19 for lifter plate 3 is along the axis rebound of pillar 19, and after PLC control electro-magnet 18 outage, makes electro-magnet 18 lose magnetism, and then makes lifter plate 3 receive the effect of gravity to influence, drops downwards along pillar 19.
Preferably, in order to make the two pallets 11 abut against each other and maintain a horizontal angle when the elevating plate 3 is lowered to the lowest position, the top end of the suction pipe 4 is provided with a support block 20, the support block 20 is fixed to the top end of the suction pipe 4, and the support block 20 abuts against the lower side of the elevating plate 3. The lowest descending position of the lifting plate 3 can be limited by the supporting block 20, so that after the electromagnet 18 is powered off, the lifting plate 3 abuts against the lower part of the supporting block 20, and the two supporting plates 11 are at a horizontal angle and abut against each other while the supporting block 20 supports the lifting plate 3.
Preferably, in order to facilitate the rotation of the rotating rod 9, the hinge assembly includes a central shaft 21 and two sleeves 22, the sleeves 22 are fixed below the horizontal plate 6, two ends of the central shaft 21 are respectively disposed in the two sleeves 22, and the center of the central shaft 21 is fixedly connected to the top end of the rotating rod 9.
The two sleeves 22 fixed below the horizontal plate 6 can support the central shaft 21 to rotate around the axis of the sleeves 22, and the rotation of the rotating rod 9 is facilitated because the center of the central shaft 21 is fixedly connected with the rotating rod 9.
Preferably, a filter cloth 23 is provided inside the exhaust port to prevent dust from entering the exhaust port. The filter cloth 23 can prevent dust in the outside air from entering the suction pipe 4, and ensure the cleanness of the inside of the suction pipe 4.
Preferably, in order to ensure the stable rotation of the slide rod 15, the support unit includes a support ring 24 and two side rods 25, the support ring 24 is sleeved on the slide rod 15, the two side rods 25 are respectively located at two sides of the support ring 24, and the support ring 24 is fixedly connected with the inner wall of the suction pipe 4 through the side rods 25.
The position of the support ring 24 is fixed by means of the side bars 25 so that the slide bar 15 can be rotated inside the support ring 24 while facilitating the lifting movement of the slide bar 15 along the axis of the support ring 24.
Preferably, a spring 26 is provided above the side lever 25, and a buffer ring 27 is provided below the cleaning lever 14, in order to reduce the pressure of the pressing block 16 on the chip, and the buffer block is fixed to the tip of the spring 26. After the pressing block 16 moves downwards, the sliding rod 15 drives the cleaning rod 14 to move downwards, so that the cleaning rod 14 is in contact with the buffer ring 27, the cleaning rod 14 on the buffer ring 27 is supported by the spring 26, the pressure of the pressing block 16 on the chip is reduced, and the chip is prevented from being excessively extruded and damaged.
Preferably, the pressing block 16 is made of silicone to prevent the chip from being damaged by excessive compression. The silica gel has soft elasticity, and the pressing block 16 is made of the material, so that the pressing block 16 has a certain buffering function, and the chip is prevented from being damaged due to excessive extrusion.
Preferably, the characteristic of stable integral structure is utilized, and in order to reinforce the connection between the vertical rod 7 and the limiting frame 8, the vertical rod 7 and the limiting frame 8 are of the integral structure.
Preferably, in order to facilitate remote control of the operating device, an antenna is further disposed in the processor 2, and the antenna is electrically connected to the PLC. The antenna is convenient for receiving the control signal from the chip production measurement and control system, and the signal is transmitted to the PLC, so that the pickup device can be remotely controlled.
When the chip picking device picks up a chip, the lifting plate 3 is driven to move upwards through the lifting mechanism, so that the supporting plate 11 is driven to rotate upwards by the rotating rod 9, after the limiting frame 8 is driven by the vertical rod 7 to move upwards, the fan 12 in the suction pipe 4 is started to generate an upward airflow to attract the pressing block 16 to move upwards, and simultaneously the upward airflow acts on the fan blade 17 to drive the sliding rod 15 to rotate around the axis of the supporting ring 24, so that the brush on the cleaning rod 14 cleans the filter screen 13, the circulation of the air is ensured, the chip is attracted by the sucking disc 5 conveniently, then the lifting plate 3 moves downwards, so that the two supporting plates 11 rotate to the horizontal position and are abutted together, meanwhile, the limiting frame 8 contacts with the supporting plates 11 downwards, and then when the fan 12 stops operating, the chip and the pressing block 16 move downwards, the chip falls on the two supporting plates 11 and is positioned in the surrounding area of, and press the piece 16 and advance to press down the chip to the position of fixed chip avoids the chip to lead to the chip to drop because of other unexpected situations such as the shake or the collision of equipment after picking up, thereby is convenient for the stable transportation of chip, has improved the practicality of equipment.
Compared with the prior art, this a pick up equipment for chip production line system of observing and controling is convenient for place the chip on two layer boards 11 through two placement mechanism, and utilize two spacing frames 8 to surround the chip, prevent in the chip transportation because of unexpected situations such as the shake of equipment or collision drop, moreover, conveniently pick up the chip through adsorption mechanism, fall on layer board 11 at the chip after, fix the chip through pressing according to pressure piece 16, the stability that the chip picked up and transported has further been strengthened, thereby the practicality of equipment has been improved.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. The picking equipment for the chip production line measurement and control system is characterized by comprising a connecting plate (1), a processor (2), a lifting mechanism, a lifting plate (3), a sucker (4), a sucker (5), an adsorption mechanism and two placing mechanisms, wherein the processor (2) is fixed on the connecting plate (1), a PLC is arranged in the processor (2), the top end of the sucker (4) is arranged below the processor (2) through the lifting mechanism, the sucker (5) is fixed at the bottom end of the sucker (4), the lifting mechanism is in transmission connection with the lifting plate (3), the two placing mechanisms are respectively positioned at two sides of the sucker (4), and the adsorption mechanism is arranged in the sucker (4);
the placing mechanism comprises a transverse plate (6), a vertical rod (7), a limiting frame (8), a rotating rod (9), a support rod (10), a hinge assembly and a support plate (11), the transverse plate (6) is fixed on the suction tube (4), the transverse plate (6) is sleeved on the vertical rod (7), the top end of the vertical rod (7) is fixed below the lifting plate (3), the bottom end of the vertical rod (7) is fixedly connected with the limiting frame (8), the limiting frame (8) is U-shaped, the limiting frames (8) in the two placing mechanisms are arranged relatively, the limiting frames (8) and the support plate (11) are sequentially arranged below the suction disc (5) from top to bottom, the rotating rod (9) is positioned on one side of the vertical rod (7) far away from the suction tube (4), the top end of the rotating rod (9) is connected with the transverse plate (6) through the hinge assembly, the bottom end of the rotating rod (9) is fixedly connected with the support plate (11), two ends of the supporting rod (10) are respectively hinged with the vertical rod (7) and the rotating rod (9);
adsorption apparatus constructs from the top and includes fan (12), filter screen (13) and clean subassembly in proper order, be equipped with two gas vents on the top of straw (4), fan (12) are connected with the PLC electricity, the periphery of filter screen (13) and the inner wall sealing connection of straw (4), clean subassembly is including clean pole (14), slide bar (15), presses piece (16), support element and two fan blades (17), the below of locating at the center of clean pole (14) is fixed on the top of slide bar (15), press piece (16) to be fixed in the bottom of slide bar (15), two fan blades (17) are located the both sides of the lower part of slide bar (15) respectively, the center department of slide bar (15) sets up in straw (4) through the support element, the top of clean pole (14) is equipped with a plurality of brushes.
2. The pickup apparatus for the measurement and control system of the chip production line according to claim 1, wherein the lifting mechanism comprises an electromagnet (18) and a pillar (19), the electromagnet (18) is fixed below the processor (2), the electromagnet (18) is electrically connected with the PLC, the pillar (19) is fixed between the electromagnet (18) and the suction pipe (4), the lifting plate (3) is sleeved on the pillar (19), and the lifting plate (3) is made of iron.
3. The pick-up device for the chip production line measurement and control system according to claim 1, wherein a support block (20) is provided at the top end of the suction pipe (4), the support block (20) is fixed at the top end of the suction pipe (4), and the support block (20) abuts against the lower side of the lifting plate (3).
4. The pickup apparatus for the measurement and control system of the chip production line as claimed in claim 1, wherein the hinge assembly comprises a central shaft (21) and two sleeves (22), the sleeves (22) are fixed below the horizontal plate (6), two ends of the central shaft (21) are respectively arranged in the two sleeves (22), and the center of the central shaft (21) is fixedly connected with the top end of the rotating rod (9).
5. The pick-up device for the measurement and control system of the chip production line as claimed in claim 1, wherein the inside of the exhaust port is provided with a filter cloth (23).
6. The pickup apparatus for the measurement and control system of the chip production line as claimed in claim 1, wherein the supporting unit comprises a supporting ring (24) and two side bars (25), the supporting ring (24) is sleeved on the sliding rod (15), the two side bars (25) are respectively located at two sides of the supporting ring (24), and the supporting ring (24) is fixedly connected with the inner wall of the suction pipe (4) through the side bars (25).
7. The pick-up device for the measurement and control system of the chip production line as claimed in claim 6, wherein a spring (26) is arranged above the side bar (25), a buffer ring (27) is arranged below the cleaning bar (14), and the buffer block is fixed at the top end of the spring (26).
8. The pick-up device for the measurement and control system of the chip production line as claimed in claim 1, wherein the pressing block (16) is made of silicone.
9. The pick-up device for the measurement and control system of the chip production line as claimed in claim 1, wherein the vertical rod (7) and the limit frame (8) are of an integrally formed structure.
10. The pick-up device for the measurement and control system of the chip production line as claimed in claim 1, wherein an antenna is further disposed in the processor (2), and the antenna is electrically connected to the PLC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910963515.4A CN110676209A (en) | 2019-10-11 | 2019-10-11 | Picking device for chip production line measurement and control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910963515.4A CN110676209A (en) | 2019-10-11 | 2019-10-11 | Picking device for chip production line measurement and control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110676209A true CN110676209A (en) | 2020-01-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910963515.4A Withdrawn CN110676209A (en) | 2019-10-11 | 2019-10-11 | Picking device for chip production line measurement and control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110676209A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599726A (en) * | 2020-06-01 | 2020-08-28 | 厦门通富微电子有限公司 | Suspender and wafer processing equipment |
| CN112295978A (en) * | 2020-10-14 | 2021-02-02 | 杨龙兵 | Anti-drop type chip adsorption equipment |
-
2019
- 2019-10-11 CN CN201910963515.4A patent/CN110676209A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111599726A (en) * | 2020-06-01 | 2020-08-28 | 厦门通富微电子有限公司 | Suspender and wafer processing equipment |
| CN112295978A (en) * | 2020-10-14 | 2021-02-02 | 杨龙兵 | Anti-drop type chip adsorption equipment |
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Application publication date: 20200110 |