CN111599006A - Three-dimensional reconstruction method and system for internal cracks of corn seeds - Google Patents

Three-dimensional reconstruction method and system for internal cracks of corn seeds Download PDF

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CN111599006A
CN111599006A CN202010439294.3A CN202010439294A CN111599006A CN 111599006 A CN111599006 A CN 111599006A CN 202010439294 A CN202010439294 A CN 202010439294A CN 111599006 A CN111599006 A CN 111599006A
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corn
image
crack
cracks
image information
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刘双喜
江浩
王金星
李玉风
刘雪梅
慕君林
徐春保
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Shandong Agricultural University
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Shandong Agricultural University
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    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T17/00Three dimensional [3D] modelling, e.g. data description of 3D objects
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/10Segmentation; Edge detection
    • G06T7/11Region-based segmentation
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/10Segmentation; Edge detection
    • G06T7/155Segmentation; Edge detection involving morphological operators
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/10Segmentation; Edge detection
    • G06T7/187Segmentation; Edge detection involving region growing; involving region merging; involving connected component labelling

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Abstract

The application discloses a three-dimensional reconstruction method and a three-dimensional reconstruction system for internal cracks of corn seeds, wherein image information of each layer of polished surface in the corn seeds is obtained; preprocessing the image information to enable cracks of each layer of polished surface to be clear; and constructing the internal cracks of the corn seeds according to the preprocessed image, so as to realize the three-dimensional visualization of the cracks of the corn seeds. Because the image information corresponding to each layer of the polished surface of the corn seed is a part of the internal crack of the corn seed, the three-dimensional view of the internal crack of the corn seed constructed by the image information of the parts can quickly and intuitively show the internal crack of the corn seed, thereby being beneficial to deeply researching the internal structure of the corn seed and having important guiding function and scientific significance for the quality of the dried corn and the selection of drying parameters.

Description

Three-dimensional reconstruction method and system for internal cracks of corn seeds
Technical Field
The application relates to the technical field of grain internal structure reconstruction, in particular to a three-dimensional reconstruction method and a three-dimensional reconstruction system for internal cracks of corn seeds.
Background
Corn harvest is usually at a higher moisture level and must therefore be dried below safe moisture for storage. Both the rapid drying and exposure of the dried corn to high humidity conditions can cause the corn to crack, which is generally believed to be due to the tensile and compressive stresses generated by the corn seeds under the action of the thermal-humidity gradient. The stress crack rate of corn is an important index for evaluating the quality of corn, the crack rate of the dried corn is not more than 35% as specified by the national grain drying standard, but the crack rate often exceeds the standard due to improper drying process and parameter selection in actual production, so that the quality of the grain is greatly reduced.
Cracks in corn can adversely affect the handling of corn: cracked corn is easy to break in the subsequent conveying and processing processes, and waste is caused. Experimental studies have shown that cracked corn has a high cracking rate, the starch yield is reduced, cracked corn tends to absorb moisture, mildew and cause diseases and pests during storage, and cracked corn cannot be used in some food processing (such as processing of corn flakes). The cracking of the corn can reduce the grain grade of the corn, the cracked corn seed as the seed can influence the germination rate, and the research on the cracking of the corn has important practical significance.
Therefore, how to realize the accurate construction of the three-dimensional structure of the internal crack of the corn seed and further accurately and intuitively present the structure of the internal crack of the corn seed is a technical problem to be solved in the field.
Disclosure of Invention
In order to solve the technical problems, the following technical scheme is provided:
in a first aspect, an embodiment of the present application provides a three-dimensional reconstruction method for an internal crack of a corn seed, where the method includes: acquiring image information of each layer of polished surface in the corn seeds; preprocessing the image information to enable cracks of each layer of polished surface to be clear; and constructing the internal cracks of the corn seeds according to the preprocessed image, so as to realize the three-dimensional visualization of the cracks of the corn seeds.
By adopting the implementation mode, the image information corresponding to each layer of the polished surface of the corn seed is a part of the internal crack of the corn seed, and the three-dimensional view of the internal crack of the corn seed constructed by the multi-part image information shows the internal crack of the corn seed quickly and intuitively, so that the method is favorable for deeply researching the internal structure of the corn seed and has important guiding function and scientific significance for the quality of the dried corn and the selection of the drying parameters.
With reference to the first aspect, in a first possible implementation manner of the first aspect, the acquiring image information of each layer of polished surface inside the corn seeds includes: selecting corn seeds with cracks inside to prepare lipid sticks; carrying out layered grinding on the lipid sticks by adopting a corn seed grinding machine; and carrying out image information acquisition on each polished layer until the polishing of the lipid stick is finished, and sequentially marking the acquired image information of the corn seed layered polished cotton according to the acquisition sequence.
With reference to the first aspect, in a second possible implementation manner of the first aspect, the preprocessing the image information includes: performing rough segmentation operation on the image information, removing redundant parts and line noise in the image information except the polished surface of the corn seeds, enlarging the area to ensure the connection of the broken parts of the connected domain, reducing the area of the area, and only segmenting the corn area; and carrying out binarization processing on the image after the rough segmentation, finely segmenting the image after the rough segmentation, and extracting the corn image.
With reference to the first aspect, in a third possible implementation manner of the first aspect, the constructing the internal crack of the corn seed according to the preprocessed image, and implementing three-dimensional visualization of the crack of the corn seed includes: converting the preprocessed image into a first preset format image file; and sequentially guiding the first preset format image file into a three-dimensional construction platform according to the mark number, connecting the surface of the region through morphological closing operation, and then extracting the crack part in the corn seed by using a region growing method to complete the reconstruction of the internal crack of the corn seed.
With reference to the third possible implementation manner of the first aspect, in a fourth possible implementation manner of the first aspect, the extracting a crack portion in the corn seed by using a region growing method, and completing the reconstruction of the internal crack of the corn seed includes: carrying out segmentation and extraction on cracks in the corn seeds, and then carrying out noise reduction treatment after the segmentation and extraction, so as to ensure the accuracy of the result; using a region growing method, and selecting a crack part in the polished surface image of the corn seed in a clicking mode; and selecting and removing redundant image information layer by layer, storing all the segmented and extracted pixels under a mask, extracting and perfecting required parts in the mask, and performing 3D modeling through the edited mask to complete the reconstruction of the internal cracks of the corn seeds.
In a second aspect, the present application provides a three-dimensional reconstruction system for an internal crack of a corn seed, including: the image acquisition module is used for acquiring image information of each layer of polished surface in the corn seeds; the image preprocessing module is used for preprocessing the image information to enable cracks of each layer of polished surface to be clear; and the crack three-dimensional construction module is used for constructing the internal cracks of the corn seeds according to the preprocessed images so as to realize the three-dimensional visualization of the cracks of the corn seeds.
With reference to the second aspect, in a first possible implementation manner of the second aspect, the image obtaining module includes: the lipid stick manufacturing unit is used for selecting corn seeds with cracks inside to manufacture lipid sticks; the layered grinding unit is used for carrying out layered grinding on the lipid stick by adopting a corn seed grinding machine; and the image acquisition unit is used for acquiring image information of each polished layer until the polishing of the lipid stick is finished, and sequentially labeling the acquired image information of the layered polished cotton of the corn seeds according to the acquisition sequence.
With reference to the second aspect, in a second possible implementation manner of the second aspect, the image preprocessing module includes: the rough segmentation unit is used for performing rough segmentation operation on the image information, removing redundant parts and line noise in the image information except the polished surface of the corn seeds, expanding the area to ensure that the connection of the broken parts of the connected domain is ensured, reducing the area of the area and only segmenting the corn region; and the fine segmentation unit is used for carrying out binarization processing on the image after the coarse segmentation, finely segmenting the image after the coarse segmentation and extracting the corn image.
With reference to the second aspect, in a third possible implementation manner of the second aspect, the crack three-dimensional building module includes: the image conversion unit is used for converting the preprocessed image into a first preset format image file; and the three-dimensional construction unit is used for sequentially guiding the first preset format image file into a three-dimensional construction platform according to the marks, connecting the surface of the region through morphological closing operation, and then extracting the crack part in the corn seed by using a region growing method to complete the reconstruction of the internal crack of the corn seed.
With reference to the third possible implementation manner of the second aspect, in a fourth possible implementation manner of the second aspect, the three-dimensional construction unit includes: the pretreatment subunit is used for segmenting and extracting cracks in the corn seeds, and performing noise reduction treatment after segmentation and extraction to ensure the accuracy of results; the crack processing subunit is used for selecting a crack part in the polished surface image of the corn seed by clicking by using a region growing method; and the three-dimensional construction subunit is used for selecting and removing redundant image information layer by layer, storing all the segmented and extracted pixels under a mask, extracting and perfecting required parts in the mask, and performing 3D modeling through the edited mask to complete the reconstruction of the internal cracks of the corn seeds.
In a third aspect, an embodiment of the present application provides a three-dimensional reconstruction apparatus for an internal crack of a corn seed, including: a processor; a memory for storing computer executable instructions; when the processor executes the computer-executable instructions, the processor executes any one of the above-mentioned first aspect or the first aspect of the possible three-dimensional reconstruction method for the internal crack of the corn seed to reconstruct the internal crack of the corn seed.
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Fig. 1 is a schematic flow chart of a three-dimensional reconstruction method for an internal crack of a corn seed according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a three-dimensional reconstruction system for internal cracks of corn seeds according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a three-dimensional reconstruction device for internal cracks of corn seeds according to an embodiment of the present application.
Detailed Description
The present invention will be described with reference to the accompanying drawings and embodiments.
Fig. 1 is a schematic flow chart of a three-dimensional reconstruction method for an internal crack of a corn seed according to an embodiment of the present application, and referring to fig. 1, the method includes:
s101, obtaining image information of each layer of polished surface in the corn seeds.
Selecting corn seeds with cracks inside to prepare the lipid stick. Specifically, corn seeds are cleaned and dried, liquid cold-buried resin is poured into a cylindrical container, powder cold-buried resin is added into the container and is uniformly stirred for 30 seconds, and the weight mixing ratio of the powder cold-buried resin to the liquid cold-buried resin is 10: 8. tying the tip part of the corn seed with a cotton thread, slowly immersing the corn seed in the cold-setting resin, keeping the corn seed upright while immersing the corn seed in the center position, waiting for the cold-setting resin to harden, forming a lipid stick after the cold-setting resin hardens, and taking the lipid stick out of the container.
And carrying out layered grinding on the lipid stick by adopting a corn seed grinding machine. Specifically, a three-jaw chuck is used for fixing the lipid rod, a single chip microcomputer is programmed according to experiment requirements, a grinding machine, a feeding motor and a turnover motor are started, a ball screw is driven by the feeding motor to rotate, the grinding machine is enabled to move close to the lipid rod and polish the lipid rod, and a single chip microcomputer timer starts timing when polishing starts.
And carrying out image information acquisition on each polished layer until the polishing of the lipid stick is finished, and sequentially marking the acquired image information of the corn seed layered polished cotton according to the acquisition sequence.
After the lipid stick is ground for 0.5s, the feeding motor stops working, the overturning motor drives the three-jaw chuck to overturn upwards for 90 degrees, a camera is used for photographing the ground surface of the corn seed, after 5s, the overturning motor drives the clamping device to reset, the feeding motor is started again, the grinding machine is continuously driven to move close to the lipid stick and the lipid stick is ground; and step six, repeating the step five until the whole corn seed is polished.
During grinding, in order to clearly show the internal structure of the corn seeds, one corn seed is divided into a plurality of grinding stages. Each stage is divided into grinding time and pause grinding time, when the grinding time is 0.5s, the internal structure effect of the corn seeds constructed by the shot grinding surface picture is the best, and when the pause grinding time is 5s, sufficient time is provided for shooting the grinding surface by using a computer-controlled miniature camera.
It should be noted that, in order to ensure the accuracy of the collected image, before polishing begins, the light intensity is selected, and collecting the image under the appropriate light intensity is beneficial to ensuring the accuracy of the result.
S102, preprocessing the image information to enable cracks of each layer of the polished surface to be clear.
Preprocessing the image of the polished surface of the corn seeds: and removing redundant parts by using edge extraction rough segmentation, and then removing line noise by using morphological opening operation, and enlarging an area to ensure connection of a broken place of a connected domain. And reducing the area of the area by using a morphological erosion operation, and only dividing the corn area. And selecting a proper threshold value, carrying out binarization processing on the image, finely dividing the roughly divided image, and extracting the corn image. Through the operation, the corns and the internal cracks are clear and obvious, and the segmentation effect is good.
S103, constructing the internal cracks of the corn seeds according to the preprocessed images, and realizing three-dimensional visualization of the cracks of the corn seeds.
And converting the preprocessed image into a first preset format image file. And sequentially guiding the first preset format image file into a three-dimensional construction platform according to the mark number, connecting the surface of the region through morphological closing operation, and then extracting the crack part in the corn seed by using a region growing method to complete the reconstruction of the internal crack of the corn seed.
Specifically, after the pretreatment, the picture of the layered polished surface of the corn seed is converted into a DICOM file format; and importing the corn seed layered polished surface picture converted into the DICOM file format into a Mimics platform according to the label, wherein the Mimics can automatically import all suitable images into the project during import.
Because the file in the DICOM format is imported, the Mimics can automatically match corresponding images, but in order to ensure the accurate effect of three-dimensional reconstruction, the Mimics are manually registered front, back, left, right, up and down after being automatically registered.
Because the difference between the corn cracks and other tissue parts in the corn is larger, the cracking method selects a proper threshold value to segment and extract the cracks in the corn seeds. And after segmentation and extraction, denoising is carried out, so that the accuracy of a result is ensured. By using a region growing method, a crack part in the polished surface image of the corn seed is selected in a clicking mode, the surrounding part with approximate gray values is also selected, and tissues with similar gray values and discrete edges are not selected. And selecting and removing redundant image information layer by layer to ensure the accuracy of the reconstruction result. All the pixels extracted by the segmentation are stored under a Mask called Mask, and the required parts are extracted and perfected in the Mask. And 3D modeling is carried out through the edited mask, the reconstruction of the internal cracks of the corn seeds is completed, and the three-dimensional visualization of the internal cracks of the corn seeds is realized.
The method for three-dimensional reconstruction of the internal cracks of the corn seeds is characterized in that the image information corresponding to each layer of the polished surface of the corn seeds is a part of the internal cracks of the corn seeds, and the three-dimensional view of the internal cracks of the corn seeds constructed by the image information of the parts shows the internal cracks of the corn seeds quickly and intuitively, so that the method is beneficial to deep research of the internal structure of the corn seeds, and has important guiding function and scientific significance for selection of quality and drying parameters of the dried corn seeds.
Corresponding to the three-dimensional reconstruction method for the internal crack of the corn seed provided by the embodiment, the application also provides an embodiment of a three-dimensional reconstruction system for the internal crack of the corn seed. Referring to fig. 2, the system includes: the device comprises an image acquisition module 201, an image preprocessing module 202 and a crack three-dimensional construction module 203.
The image acquisition module 201 is configured to acquire image information of each layer of polished surface inside the corn seeds. The image preprocessing module 202 is configured to preprocess the image information to make cracks on the polished surface of each layer clear. The crack three-dimensional construction module 203 constructs the internal cracks of the corn seeds according to the preprocessed images, so as to realize three-dimensional visualization of the cracks of the corn seeds.
Further, the image acquisition module 201 includes: the device comprises a lipid rod manufacturing unit, a layered grinding unit and an image acquisition unit.
And a lipid stick making unit for selecting corn seeds with cracks inside to make lipid sticks. And the layered grinding unit is used for performing layered grinding on the lipid rod by adopting a corn seed grinding machine. And the image acquisition unit is used for acquiring image information of each polished layer until the polishing of the lipid stick is finished, and sequentially labeling the acquired image information of the layered polished cotton of the corn seeds according to the acquisition sequence.
The image preprocessing module 202 includes: a coarse division unit and a fine division unit.
The rough segmentation unit is used for performing rough segmentation operation on the image information, removing redundant parts and line noise in the image information except the polished surface of the corn seeds, expanding the area to ensure the connection of the broken parts of the connected domain, reducing the area of the area and only segmenting the corn region. And the fine segmentation unit is used for carrying out binarization processing on the image subjected to the coarse segmentation, finely segmenting the image subjected to the coarse segmentation and extracting the corn image.
The crack three-dimensional building module 203 comprises: an image conversion unit and a three-dimensional construction unit.
And the image conversion unit is used for converting the preprocessed image into a first preset format image file. The three-dimensional construction unit is used for sequentially guiding the first preset format image file into a three-dimensional construction platform according to the mark number, connecting the surface of the region through morphological closing operation, and then extracting the crack part in the corn seed by using a region growing method to complete the reconstruction of the internal crack of the corn seed.
Further, the three-dimensional construction unit includes: the device comprises a pretreatment subunit, a crack treatment subunit and a three-dimensional construction subunit.
The pretreatment subunit is used for cutting and extracting cracks in the corn seeds, and after cutting and extraction, noise reduction treatment is carried out to ensure the accuracy of results. And the crack processing subunit is used for selecting the crack part in the polished surface image of the corn seed by clicking by using a region growing method. The three-dimensional construction subunit is used for selecting and removing redundant image information layer by layer, storing all segmented and extracted pixels under a mask, extracting and perfecting required parts in the mask, and performing 3D modeling through the edited mask to complete reconstruction of the internal cracks of the corn seeds.
The embodiment of the present application further provides a three-dimensional reconstruction device 30 for internal cracks of corn seeds, referring to fig. 3, where the three-dimensional reconstruction device 30 for internal cracks of corn seeds includes: a processor 301, a memory 302, and a communication interface 303.
In fig. 3, the processor 301, the memory 302, and the communication interface 303 may be connected to each other by a bus; the bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one thick line is shown in FIG. 3, but this does not mean only one bus or one type of bus.
The processor 301 generally controls the overall function of the three-dimensional maize seed internal crack reconstruction device 30, for example, the three-dimensional maize seed internal crack reconstruction device 30 is started, and image information of each layer of polished surface in the maize seed is acquired after the three-dimensional maize seed internal crack reconstruction device 30 is started;
preprocessing the image information to enable cracks of each layer of polished surface to be clear;
and constructing the internal cracks of the corn seeds according to the preprocessed image, and realizing three-dimensional visualization of the cracks of the corn seeds.
Further, the processor 301 may be a general-purpose processor, such as a Central Processing Unit (CPU), a Network Processor (NP), or a combination of a CPU and an NP. The processor may also be a Microprocessor (MCU). The processor may also include a hardware chip. The hardware chips may be Application Specific Integrated Circuits (ASICs), Programmable Logic Devices (PLDs), or a combination thereof. The PLD may be a Complex Programmable Logic Device (CPLD), a Field Programmable Gate Array (FPGA), or the like.
The memory 302 is configured to store computer executable instructions to support the operation of the apparatus 30 data for three-dimensional reconstruction of internal cracks of corn seeds. The memory 301 may be implemented by any type or combination of volatile or non-volatile memory devices, such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.
After the three-dimensional reconstruction device 30 for the internal cracks of the corn seeds is started, the processor 301 and the memory 302 are powered on, and the processor 301 reads and executes the computer executable instructions stored in the memory 302 to complete all or part of the steps in the above-mentioned embodiment of the method for measuring the internal component volume of the corn kernels.
The communication interface 303 is used for transmitting data to the three-dimensional reconstruction device 30 for the internal crack of the corn seed, for example, data communication with an image acquisition device, an image processing device, and the like is realized. The communication interface 303 includes a wired communication interface, and may also include a wireless communication interface. The wired communication interface comprises a USB interface, a Micro USB interface and an Ethernet interface. The wireless communication interface may be a WLAN interface, a cellular network communication interface, a combination thereof, or the like.
In an exemplary embodiment, the three-dimensional corn seed internal crack reconstruction device 30 provided by the embodiment of the present application further includes a power supply assembly for providing power to various components of the three-dimensional corn seed internal crack reconstruction device 30. The power components may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power for the corn seed internal crack three-dimensional reconstruction device 30.
A communication component configured to facilitate communication between the three-dimensional reconstruction device 30 for internal cracks of corn seeds and other equipment in a wired or wireless manner. The three-dimensional reconstruction device 30 for the internal crack of the corn seed can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. The communication component receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. The communication component also includes a Near Field Communication (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.
In an exemplary embodiment, the three-dimensional reconstruction apparatus 30 for internal cracks of corn seeds may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, processors, or other electronic components.
The same and similar parts among the various embodiments in the specification of the present application may be referred to each other. In particular, for the system and apparatus embodiments, since the method therein is substantially similar to the method embodiments, the description is relatively simple, and reference may be made to the description of the method embodiments for relevant points.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Of course, the above description is not limited to the above examples, and technical features that are not described in this application may be implemented by or using the prior art, and are not described herein again; the above embodiments and drawings are only for illustrating the technical solutions of the present application and not for limiting the present application, and the present application is only described in detail with reference to the preferred embodiments instead, it should be understood by those skilled in the art that changes, modifications, additions or substitutions within the spirit and scope of the present application may be made by those skilled in the art without departing from the spirit of the present application, and the scope of the claims of the present application should also be covered.

Claims (10)

1. A three-dimensional reconstruction method for internal cracks of corn seeds is characterized by comprising the following steps:
acquiring image information of each layer of polished surface in the corn seeds;
preprocessing the image information to enable cracks of each layer of polished surface to be clear;
and constructing the internal cracks of the corn seeds according to the preprocessed image, so as to realize the three-dimensional visualization of the cracks of the corn seeds.
2. The three-dimensional reconstruction method for the internal crack of the corn seed as claimed in claim 1, wherein the obtaining of the image information of each layer of the polished surface inside the corn seed comprises:
selecting corn seeds with cracks inside to prepare lipid sticks;
carrying out layered grinding on the lipid sticks by adopting a corn seed grinding machine;
and carrying out image information acquisition on each polished layer until the polishing of the lipid stick is finished, and sequentially marking the acquired image information of the corn seed layered polished cotton according to the acquisition sequence.
3. The method for three-dimensional reconstruction of the internal crack of the corn seed according to claim 1, wherein the preprocessing the image information comprises:
performing rough segmentation operation on the image information, removing redundant parts and line noise in the image information except the polished surface of the corn seeds, enlarging the area to ensure the connection of the broken parts of the connected domain, reducing the area of the area, and only segmenting the corn area;
and carrying out binarization processing on the image after the rough segmentation, finely segmenting the image after the rough segmentation, and extracting the corn image.
4. The method for three-dimensional reconstruction of the internal crack of the corn seed according to claim 1, wherein the constructing the internal crack of the corn seed according to the preprocessed image, and the three-dimensional visualization of the crack of the corn seed comprises:
converting the preprocessed image into a first preset format image file;
and sequentially guiding the first preset format image file into a three-dimensional construction platform according to the mark number, connecting the surface of the region through morphological closing operation, and then extracting the crack part in the corn seed by using a region growing method to complete the reconstruction of the internal crack of the corn seed.
5. The three-dimensional reconstruction method for the internal crack of the corn seed as claimed in claim 4, wherein the crack part in the corn seed is extracted by using the region growing method, and the reconstruction of the internal crack of the corn seed is completed by:
carrying out segmentation and extraction on cracks in the corn seeds, and then carrying out noise reduction treatment after the segmentation and extraction, so as to ensure the accuracy of the result;
using a region growing method, and selecting a crack part in the polished surface image of the corn seed in a clicking mode;
and selecting and removing redundant image information layer by layer, storing all the segmented and extracted pixels under a mask, extracting and perfecting required parts in the mask, and performing 3D modeling through the edited mask to complete the reconstruction of the internal cracks of the corn seeds.
6. A three-dimensional reconstruction system for internal cracks of corn seeds, which is characterized by comprising:
the image acquisition module is used for acquiring image information of each layer of polished surface in the corn seeds;
the image preprocessing module is used for preprocessing the image information to enable cracks of each layer of polished surface to be clear;
and the crack three-dimensional construction module is used for constructing the internal cracks of the corn seeds according to the preprocessed images so as to realize the three-dimensional visualization of the cracks of the corn seeds.
7. The maize seed internal crack three-dimensional reconstruction system of claim 6, wherein the image acquisition module comprises:
the lipid stick manufacturing unit is used for selecting corn seeds with cracks inside to manufacture lipid sticks;
the layered grinding unit is used for carrying out layered grinding on the lipid stick by adopting a corn seed grinding machine;
and the image acquisition unit is used for acquiring image information of each polished layer until the polishing of the lipid stick is finished, and sequentially labeling the acquired image information of the layered polished cotton of the corn seeds according to the acquisition sequence.
8. The maize seed internal crack three-dimensional reconstruction system of claim 6, wherein the image preprocessing module comprises:
the rough segmentation unit is used for performing rough segmentation operation on the image information, removing redundant parts and line noise in the image information except the polished surface of the corn seeds, expanding the area to ensure that the connection of the broken parts of the connected domain is ensured, reducing the area of the area and only segmenting the corn region;
and the fine segmentation unit is used for carrying out binarization processing on the image after the coarse segmentation, finely segmenting the image after the coarse segmentation and extracting the corn image.
9. The maize seed internal crack three-dimensional reconstruction system of claim 6, wherein the crack three-dimensional construction module comprises:
the image conversion unit is used for converting the preprocessed image into a first preset format image file;
and the three-dimensional construction unit is used for sequentially guiding the first preset format image file into a three-dimensional construction platform according to the marks, connecting the surface of the region through morphological closing operation, and then extracting the crack part in the corn seed by using a region growing method to complete the reconstruction of the internal crack of the corn seed.
10. The corn seed internal crack three-dimensional reconstruction system of claim 9, wherein the three-dimensional construction unit comprises:
the pretreatment subunit is used for segmenting and extracting cracks in the corn seeds, and performing noise reduction treatment after segmentation and extraction to ensure the accuracy of results;
the crack processing subunit is used for selecting a crack part in the polished surface image of the corn seed by clicking by using a region growing method;
and the three-dimensional construction subunit is used for selecting and removing redundant image information layer by layer, storing all the segmented and extracted pixels under a mask, extracting and perfecting required parts in the mask, and performing 3D modeling through the edited mask to complete the reconstruction of the internal cracks of the corn seeds.
CN202010439294.3A 2020-05-22 2020-05-22 Three-dimensional reconstruction method and system for internal cracks of corn seeds Pending CN111599006A (en)

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