CN111584508A - Organic insulating film and display panel - Google Patents
Organic insulating film and display panel Download PDFInfo
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- CN111584508A CN111584508A CN202010403863.9A CN202010403863A CN111584508A CN 111584508 A CN111584508 A CN 111584508A CN 202010403863 A CN202010403863 A CN 202010403863A CN 111584508 A CN111584508 A CN 111584508A
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- organic insulating
- insulating layer
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- 229920005989 resin Polymers 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 28
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 claims description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 10
- 239000001301 oxygen Substances 0.000 abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 239000010408 film Substances 0.000 description 37
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- KHXKESCWFMPTFT-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-(1,2,2-trifluoroethenoxy)propane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)C(F)(F)F KHXKESCWFMPTFT-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Formation Of Insulating Films (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an organic insulating film and a display panel, the organic insulating film includes: at least one main organic insulating layer, wherein the material of the main organic insulating layer is set photosensitive resin; and at least one auxiliary organic insulating layer arranged on one side of the main organic insulating layer, wherein the materials of the auxiliary organic insulating layer comprise the setting photosensitive resin and a thermoplastic polymer. The organic insulating film and the display panel can improve the capability of isolating water and oxygen.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to the field of display technologies, and in particular, to an organic insulating film and a display panel.
[ background of the invention ]
In a conventional thin film transistor of a metal oxide semiconductor layer, an organic insulating film is generally used as a passivation layer (passivation) in order to satisfy a charging rate requirement and reduce a risk of mischarging.
However, compared with the protection layer made of the common insulating material (SiNx or SiOx) made by the conventional Chemical Vapor Deposition (CVD) coating, the organic insulating film has a relatively weak property of insulating water and oxygen, so that the device is susceptible to the external environment and electrical drift occurs.
[ summary of the invention ]
The invention aims to provide an organic insulating film and a display panel, which can improve the capability of isolating water and oxygen.
In order to solve the above technical problem, the present invention provides an organic insulating film comprising:
at least one main organic insulating layer, wherein the material of the main organic insulating layer is set photosensitive resin;
and at least one auxiliary organic insulating layer arranged on one side of the main organic insulating layer, wherein the materials of the auxiliary organic insulating layer comprise the setting photosensitive resin and a thermoplastic polymer.
The present invention also provides a display panel including the above organic insulating film.
The organic insulating film and the display panel comprise at least one main organic insulating layer, wherein the main organic insulating layer is made of set photosensitive resin; at least one auxiliary organic insulating layer arranged on one side of the main organic insulating layer, wherein the materials of the auxiliary organic insulating layer comprise the set photosensitive resin and a thermoplastic polymer; the water oxygen barrier ability of the organic insulating film is improved due to the addition of the thermoplastic polymer.
[ description of the drawings ]
FIG. 1 is a schematic view of the structure of an organic insulating film according to a first embodiment of the present invention;
FIG. 2 is a schematic view showing the structure of an organic insulating film according to a second embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a display panel according to another embodiment of the invention.
[ detailed description ] embodiments
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. In the present invention, directional terms such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", etc. refer to directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.
The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an organic insulating film according to a first embodiment of the invention.
As shown in fig. 1, the organic insulating film 20 of the present embodiment includes: a main organic insulating layer 21 and a sub organic insulating layer 22.
Wherein the material of the main organic insulating layer 21 is a setting photosensitive resin; in one embodiment, the set photosensitive resin includes PFA, PFA is a copolymer of a small amount of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene, and the material of the set photosensitive resin may include at least one of acrylic resin and silicone resin.
The sub-organic insulating layer 22 is provided above the main organic insulating layer 21, but may be provided below the main organic insulating layer 21. The material of the sub organic insulating layer 22 includes the setting photosensitive resin and a thermoplastic polymer.
In one embodiment, to further improve the water oxygen barrier capability, the thermoplastic polymer comprises at least one of an ethylene vinyl alcohol copolymer and an ethylene vinyl acetate copolymer.
In one embodiment, the thickness of the secondary organic insulating layer 22 ranges from 0.3um to 2um in order to further improve the water and oxygen barrier capability.
In one embodiment, the material of the secondary organic insulating layer 22 further includes a photoinitiator, a solvent, and an additive.
In one embodiment, the weight percentage of the thermoplastic polymer in the secondary organic insulating layer 22 ranges from 0.1% to 5%; the weight percentage range of the set photosensitive resin in the secondary organic insulating layer 22 is 1% -25%; the weight percentage range of the photoinitiator in the secondary organic insulating layer 22 is 0.05% -10%; the additive in the auxiliary organic insulating layer 22 is 0.01-5 wt%, and the rest is solvent.
In one embodiment, the polarity of the main organic insulating layer 21 is positive, and the polarity of the sub organic insulating layer 22 is positive or negative.
In one embodiment, the sub-organic insulating layer 22 is specifically prepared as follows:
mixing 1-25 wt% of PFA resin, 0.1-8 wt% of thermoplastic polymer, 0.05-10 wt% of photoinitiator, 0.01-5 wt% of additive and solvent, and heating, wherein the PFA resin and the thermoplastic polymer are subjected to crosslinking reaction, wherein the PFA resin comprises acrylic resin, silicone resin and the like, and mainly influences the exposure, development, mechanical and chemical properties of the film layer. The photoinitiator may be a common initiator for photoresist, such as PAC (polyaluminium chloride), PAG (polyalkylene glycol), and the like; additives are, for example, adhesion promoters, levelling agents, etc.
When the photoinitiator is an initiator of a positive photoresist, the polarity of the positive-type sub-organic insulating layer is obtained through the steps.
When the photoinitiator is an initiator of a negative photoresist, the secondary organic insulating layer with the negative polarity is obtained through the steps. The common initiator of negative photoresist can generate free radicals under the irradiation of ultraviolet light, such as acetophenone, benzophenone, imidazole and the like.
The organic insulating film of the present embodiment specifically includes the following steps in the manufacturing process:
s101, a photosensitive resin (such as positive PFA) is coated on the substrate, and the main organic insulating layer 21 is formed after the photosensitive resin is yellow-light developed and then baked at high temperature (Oven).
The film thickness of the main organic insulating layer 21 may range from 0.3um to 2um, with 0.7um being preferred.
S102, coating a fixed photosensitive resin and a thermoplastic polymer on the main organic insulating layer, performing yellow light and development, and then baking at high temperature (Oven) to form a secondary organic insulating layer.
The film thickness of the sub-organic insulating layer 22 may range from 0.3um to 2um, with 0.7um being preferred.
The addition of thermoplastic polymer increases the water and oxygen blocking capacity of the organic insulating film, and the same material is used for each layer in the organic insulating film, so that the organic insulating film can be formed through one etching process, and the production efficiency is improved.
It can be understood that if a common insulating layer is added above or below the organic insulating film to improve the water and oxygen isolation, it is inconvenient to form a via hole thereon at one time due to the difference between the common insulating material and the organic insulating material, which increases the difficulty of the etching process; if step etching is used, the mask process is increased, and the production efficiency is reduced.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an organic insulating film according to a second embodiment of the present invention.
As shown in fig. 2, the organic insulating film 20 of the present embodiment is different from the previous embodiment in that: the main organic insulating layer of the present embodiment is two layers, that is, includes a first main organic insulating layer 21 and a second main organic insulating layer 23. The sub organic insulating layer 22 is disposed between the first main organic insulating layer 21 and the second main organic insulating layer 23.
The organic insulating film of the present embodiment specifically includes the following steps in the manufacturing process:
s201, a photosensitive resin (such as positive PFA) is coated on the substrate, and the first main organic insulating layer 21 is formed after the photosensitive resin is yellow-light developed and then baked at high temperature (Oven).
The film thickness of the first main organic insulating layer 21 may range from 0.3um to 2um, with 0.7um being preferred.
S202, coating a fixed photosensitive resin and a thermoplastic polymer on the main organic insulating layer, performing yellow light and development, and then baking at high temperature (Oven) to form a secondary organic insulating layer.
The film thickness of the sub-organic insulating layer 22 may range from 0.3um to 2um, with 0.7um being preferred.
S203, coating a predetermined photosensitive resin (such as positive PFA) on the substrate, performing yellow light and development, and then performing high temperature baking (Oven), thereby forming a second main organic insulating layer 23.
The film thickness of the second main organic insulation layer 23 can be in the range of 0.3um to 2um, wherein 0.7um is preferred.
Of course, it is understood that the organic insulating film 20 may include a plurality of (greater than 2) main organic insulating layers and a plurality of (greater than 1) sub organic insulating layers, wherein the total number of layers of the main organic insulating layers and the sub organic insulating layers is 2 or more and 10 or less. Through setting up multilayer rete, further promote the separation ability, because the thick thin hardness that makes the barrier layer of each layer increases to the compressive capacity of panel has been improved.
As shown in fig. 3 and 4, the present invention also provides a display panel including: the substrate comprises a substrate base plate 10, a first metal layer, a gate insulating layer 12, a second metal layer, an organic insulating film 20 and a transparent conducting layer 30, wherein the first metal layer is used for forming a gate electrode and a first auxiliary electrode 12, the second metal layer is used for forming a source electrode, a drain electrode and a second auxiliary electrode 13, a first through hole 201 and a second through hole 202 are formed on the organic insulating film 20, the first through hole 201 and the second through hole 202 can be manufactured through a Dry etching process (Dry), and the organic insulating film is made of the same material, so that an etching process can be used for forming the first through hole, the inner part of the through hole is smooth, and the connection stability is improved.
The first auxiliary electrode 12 is connected to the transparent conductive layer 30 through the first via 201; the second auxiliary electrode 13 is connected to the transparent conductive layer 30 through the second via hole 202.
Fig. 3 and 4 only show schematic views of the connection area of the display panel, and the remaining area is not shown. It is to be understood that fig. 3 and 4 illustrate the organic insulating film of the first embodiment, but the present invention is not limited thereto, and the organic insulating films of the other embodiments of the present invention can be applied to the display panel as well.
The organic insulating film and the display panel comprise at least one main organic insulating layer, wherein the main organic insulating layer is made of set photosensitive resin; at least one auxiliary organic insulating layer arranged on one side of the main organic insulating layer, wherein the materials of the auxiliary organic insulating layer comprise the set photosensitive resin and a thermoplastic polymer; the thermoplastic polymer is added, so that the water and oxygen blocking capability of the organic insulating film is improved, and in addition, the materials of all layers in the organic insulating film are the same, so that the organic insulating film can be formed through one etching process, and the production efficiency is improved. Namely, the production efficiency is improved while the capability of isolating the water and oxygen is improved.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (10)
1. An organic insulating film, comprising:
at least one main organic insulating layer, wherein the material of the main organic insulating layer is set photosensitive resin;
and at least one auxiliary organic insulating layer arranged on one side of the main organic insulating layer, wherein the materials of the auxiliary organic insulating layer comprise the setting photosensitive resin and a thermoplastic polymer.
2. The organic insulating film according to claim 1,
the thermoplastic polymer includes at least one of an ethylene-vinyl alcohol copolymer and an ethylene-vinyl acetate copolymer.
3. The organic insulating film according to claim 1,
the thickness range of the auxiliary organic insulating layer is 0.3 um-2 um.
4. The organic insulating film according to claim 1,
the material of the secondary organic insulating layer further comprises a photoinitiator, a solvent and an additive.
5. The organic insulating film according to claim 4,
the weight percentage of the thermoplastic polymer in the secondary organic insulating layer ranges from 0.1% to 5%;
the weight percentage range of the set photosensitive resin in the auxiliary organic insulating layer is 1% -25%;
the weight percentage range of the photoinitiator in the auxiliary organic insulating layer is 0.05% -10%;
the additive in the auxiliary organic insulating layer accounts for 0.01-5% of the total weight of the insulating layer.
6. The organic insulating film according to claim 1,
the photosensitive resin is PFA.
7. The organic insulating film according to claim 6,
the set photosensitive resin includes at least one of an acrylic resin and a silicone resin.
8. The organic insulating film according to claim 1, further comprising:
the first main organic insulating layer and the second main organic insulating layer; the sub organic insulating layer is disposed between the first main organic insulating layer and the second main organic insulating layer.
9. The organic insulating film according to claim 1,
the organic insulating film comprises a plurality of layers of main organic insulating layers and a plurality of layers of auxiliary organic insulating layers, wherein the total number of layers of the main organic insulating layers and the auxiliary organic insulating layers is less than or equal to 10.
10. A display panel, comprising: the organic insulating film according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010403863.9A CN111584508B (en) | 2020-05-13 | 2020-05-13 | Organic insulating film and display panel |
| PCT/CN2020/096498 WO2021227191A1 (en) | 2020-05-13 | 2020-06-17 | Organic insulating film and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010403863.9A CN111584508B (en) | 2020-05-13 | 2020-05-13 | Organic insulating film and display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111584508A true CN111584508A (en) | 2020-08-25 |
| CN111584508B CN111584508B (en) | 2024-02-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010403863.9A Active CN111584508B (en) | 2020-05-13 | 2020-05-13 | Organic insulating film and display panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111584508B (en) |
| WO (1) | WO2021227191A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112406237A (en) * | 2020-11-19 | 2021-02-26 | 太湖华强科技有限公司 | Organic insulating film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09265183A (en) * | 1996-03-29 | 1997-10-07 | Hitachi Chem Co Ltd | Production of phosphor pattern |
| JP2003131377A (en) * | 2001-10-22 | 2003-05-09 | Fuji Photo Film Co Ltd | Photosensitive resin composition for interlayer insulating film and photosensitive transfer material |
| CN103477284A (en) * | 2011-03-17 | 2013-12-25 | 李允炯 | Chemically amplified positive photosensitive composition for an organic insulation film, and method for forming an organic insulation film using same |
| CN106597809A (en) * | 2016-12-01 | 2017-04-26 | 杭州福斯特光伏材料股份有限公司 | Photosensitive polyimide resin composition for high-frequency transmission circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09265184A (en) * | 1996-03-29 | 1997-10-07 | Hitachi Chem Co Ltd | Photosensitive element and production of phosphor pattern formed by using the same |
| US6797760B1 (en) * | 1999-10-15 | 2004-09-28 | Alphagary Corporation | Non-dripping, flame retardant, fluoroelastomer insulative compositions for telecommunication cables |
-
2020
- 2020-05-13 CN CN202010403863.9A patent/CN111584508B/en active Active
- 2020-06-17 WO PCT/CN2020/096498 patent/WO2021227191A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09265183A (en) * | 1996-03-29 | 1997-10-07 | Hitachi Chem Co Ltd | Production of phosphor pattern |
| JP2003131377A (en) * | 2001-10-22 | 2003-05-09 | Fuji Photo Film Co Ltd | Photosensitive resin composition for interlayer insulating film and photosensitive transfer material |
| CN103477284A (en) * | 2011-03-17 | 2013-12-25 | 李允炯 | Chemically amplified positive photosensitive composition for an organic insulation film, and method for forming an organic insulation film using same |
| CN106597809A (en) * | 2016-12-01 | 2017-04-26 | 杭州福斯特光伏材料股份有限公司 | Photosensitive polyimide resin composition for high-frequency transmission circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112406237A (en) * | 2020-11-19 | 2021-02-26 | 太湖华强科技有限公司 | Organic insulating film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111584508B (en) | 2024-02-27 |
| WO2021227191A1 (en) | 2021-11-18 |
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