CN111584508B - Organic insulating film and display panel - Google Patents
Organic insulating film and display panel Download PDFInfo
- Publication number
- CN111584508B CN111584508B CN202010403863.9A CN202010403863A CN111584508B CN 111584508 B CN111584508 B CN 111584508B CN 202010403863 A CN202010403863 A CN 202010403863A CN 111584508 B CN111584508 B CN 111584508B
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- Prior art keywords
- organic insulating
- insulating layer
- display panel
- insulating film
- main
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- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000000654 additive Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 claims description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 abstract description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 33
- 238000000034 method Methods 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- KHXKESCWFMPTFT-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-(1,2,2-trifluoroethenoxy)propane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)C(F)(F)F KHXKESCWFMPTFT-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Formation Of Insulating Films (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an organic insulating film and a display panel, wherein the organic insulating film comprises: at least one main organic insulating layer, wherein the material of the main organic insulating layer is set photosensitive resin; at least one pair of organic insulating layers is arranged on one side of the main organic insulating layer, and the materials of the auxiliary organic insulating layers comprise the setting photosensitive resin and the thermoplastic polymer. The organic insulating film and the display panel can improve the capability of isolating water and oxygen.
Description
[ field of technology ]
The invention relates to the technical field of display, in particular to an organic insulating film and a display panel.
[ background Art ]
In order to meet the charging rate requirement and reduce the risk of mis-charging, conventional thin film transistors with metal oxide semiconductor layers generally use an organic insulating film as a protection layer (passivation).
However, compared with the protection layer of the common insulating material (SiNx or SiOx) manufactured by the traditional Chemical Vapor Deposition (CVD) coating film, the organic insulating film has relatively weak water oxygen isolation property, so that the device is easily influenced by the external environment to generate electrical drift.
[ invention ]
The invention aims to provide an organic insulating film and a display panel, which can improve the capability of isolating water and oxygen.
In order to solve the above technical problems, the present invention provides an organic insulating film comprising:
at least one main organic insulating layer, wherein the material of the main organic insulating layer is set photosensitive resin;
at least one pair of organic insulating layers is arranged on one side of the main organic insulating layer, and the materials of the auxiliary organic insulating layers comprise the setting photosensitive resin and the thermoplastic polymer.
The invention also provides a display panel comprising the organic insulating film.
The organic insulating film and the display panel comprise at least one main organic insulating layer, wherein the main organic insulating layer is made of set photosensitive resin; at least one pair of organic insulating layers, locate one side of the said main organic insulating layer, the material of the said pair of organic insulating layers includes setting photosensitive resin and thermoplastic polymer; the thermoplastic polymer is added, so that the water-oxygen barrier capability of the organic insulating film is improved.
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of an organic insulating film according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of an organic insulating film according to a second embodiment of the present invention;
FIG. 3 is a schematic diagram of a display panel according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a display panel according to another embodiment of the invention.
[ detailed description ] of the invention
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the invention may be practiced. The terms of directions used in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., refer only to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the invention and is not limiting of the invention. In the drawings, like structural elements are denoted by like reference numerals.
The terms first, second and the like in the description and in the claims of the present application and in the above-described figures, are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an organic insulating film according to a first embodiment of the invention.
As shown in fig. 1, the organic insulating film 20 of the present embodiment includes: a main organic insulating layer 21 and a sub organic insulating layer 22.
Wherein the material of the main organic insulating layer 21 is a set photosensitive resin; in one embodiment, the setting photosensitive resin includes PFA, which is a copolymer of a small amount of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene, and the material of the setting photosensitive resin may include at least one of an acrylic resin and a silicone resin.
The sub organic insulating layer 22 is provided above the main organic insulating layer 21, but may be provided below the main organic insulating layer 21. The material of the sub organic insulating layer 22 includes the setting photosensitive resin and a thermoplastic polymer.
In one embodiment, to further improve the water-oxygen barrier capability, the thermoplastic polymer includes at least one of an ethylene-vinyl alcohol copolymer and an ethylene-vinyl acetate copolymer.
In one embodiment, the thickness of the secondary organic insulating layer 22 is in the range of 0.3um to 2um for further improving the water-oxygen barrier capability.
In one embodiment, the material of the secondary organic insulating layer 22 further includes a photoinitiator, a solvent, and an additive.
In one embodiment, the weight percentage of the thermoplastic polymer in the secondary organic insulating layer 22 ranges from 0.1% to 5%; the weight percentage of the set photosensitive resin in the secondary organic insulating layer 22 ranges from 1% to 25%; the weight percentage of the photoinitiator in the secondary organic insulating layer 22 ranges from 0.05% to 10%; the weight percentage of the additive in the auxiliary organic insulating layer 22 ranges from 0.01% to 5%, and the rest is solvent.
In one embodiment, the polarity of the main organic insulating layer 21 is positive, and the polarity of the sub organic insulating layer 22 is positive or negative.
In one embodiment, the preparation of the secondary organic insulating layer 22 is specifically as follows:
1 to 25wt% of PFA resin, 0.1 to 8wt% of thermoplastic polymer, 0.05 to 10wt% of photoinitiator, 0.01 to 5wt% of additive and solvent are mixed and then heated, and the resin and the thermoplastic polymer undergo a crosslinking reaction, wherein the PFA resin comprises acrylic resin, silicone resin and the like, and the exposure, development, mechanics and chemical characteristics of the film layer are mainly affected. The photoinitiator may be a usual initiator for photoresists, such as PAC (polyaluminum chloride), PAG (polyalkylene glycol), etc.; additives are, for example, adhesion promoters, leveling agents, etc.
When the photoinitiator is an initiator of the positive photoresist, the auxiliary organic insulating layer with positive polarity is obtained through the steps.
When the photoinitiator is an initiator of the negative photoresist, the negative auxiliary organic insulating layer is obtained through the steps. Wherein the common initiator of the negative photoresist can generate free radicals under the irradiation of ultraviolet light, such as acetophenones, benzophenones, imidazoles and the like.
The organic insulating film of the present embodiment specifically includes the following steps in the manufacturing process:
s101, a photosensitive resin (for example, positive PFA) is coated on the substrate, and after yellow light and development, the main organic insulating layer 21 is formed by high temperature baking (Oven).
The film thickness of the main organic insulating layer 21 may range from 0.3um to 2um, with 0.7um being preferred.
S102, coating a set photosensitive resin and a thermoplastic polymer on the main organic insulating layer, and forming a secondary organic insulating layer after yellow light development and high-temperature baking (Oven).
The thickness of the sub-organic insulating layer 22 may be in the range of 0.3um to 2um, and among them, 0.7um is preferable.
The thermoplastic polymer is added, so that the water-oxygen barrier capability of the organic insulating film is improved, and in addition, the materials of all layers in the organic insulating film are the same, so that the production efficiency is improved by one etching process forming process.
It can be understood that if a common insulating layer is added above or below the organic insulating film to improve the property of isolating water and oxygen, the common insulating material and the organic insulating material are different, so that the via holes are inconvenient to form on the common insulating material at one time, and the difficulty of the etching process is increased; if step etching is adopted, a mask process is increased, and the production efficiency is reduced.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an organic insulating film according to a second embodiment of the invention.
As shown in fig. 2, the organic insulating film 20 of the present embodiment is different from the previous embodiment in that: the main organic insulating layer of the present embodiment is two layers, that is, includes the first main organic insulating layer 21 and the second main organic insulating layer 23. The sub organic insulating layer 22 is provided between the first main organic insulating layer 21 and the second main organic insulating layer 23.
The organic insulating film of the present embodiment specifically includes the following steps in the manufacturing process:
s201, a photosensitive resin (such as positive PFA) is coated on the substrate, and after yellow light and development, the first main organic insulating layer 21 is formed by high temperature baking (Oven).
The film thickness of the first main organic insulating layer 21 may range from 0.3um to 2um, with 0.7um being preferred.
S202, coating a set photosensitive resin and a thermoplastic polymer on the main organic insulating layer, and forming a secondary organic insulating layer after yellow light development and high-temperature baking (Oven).
The thickness of the sub-organic insulating layer 22 may be in the range of 0.3um to 2um, and among them, 0.7um is preferable.
S203, a second main organic insulating layer 23 is formed by coating a set photosensitive resin (such as positive PFA) on the substrate, performing yellow light, developing, and then performing high temperature baking (Oven).
The thickness of the second main organic insulating layer 23 may range from 0.3um to 2um, with 0.7um being preferred.
Of course, it is understood that the organic insulating film 20 may include a plurality (greater than 2) of main organic insulating layers and a plurality (greater than 1) of sub organic insulating layers, wherein the total number of layers of the main organic insulating layers and the sub organic insulating layers is 2 or more and 10 or less. Through setting up the multilayer rete, further promote barrier capability, because each layer thick thinner hardness that makes the barrier layer increases to the compressive capacity of panel has been improved.
As shown in fig. 3 and 4, the present invention further provides a display panel including: the substrate 10, the first metal layer, the gate insulating layer 12, the second metal layer, the organic insulating film 20 and the transparent conductive layer 30, wherein the first metal layer is used for forming the gate electrode and the first auxiliary electrode 12, the second metal layer is used for forming the source electrode and the drain electrode and the second auxiliary electrode 13, the first via hole 201 and the second via hole 202 are formed on the organic insulating film 20, the first via hole 201 and the second via hole 202 can be manufactured through a Dry etching process (Dry), and the organic insulating film is made of the same material, so that the forming process can be performed through one etching process, the inner clearance of the via hole is smoother, and the connection stability is improved.
The first auxiliary electrode 12 is connected to the transparent conductive layer 30 through the first via 201; the second auxiliary electrode 13 is connected to the transparent conductive layer 30 through a second via 202.
Fig. 3 and 4 give schematic views of only the connection regions of the display panel, and the remaining regions are not shown. It will be appreciated that fig. 3 and 4 illustrate the organic insulating film according to the first embodiment, but the present invention is not limited thereto, and the organic insulating film according to the other embodiments of the present invention can be applied to the display panel as described above.
The organic insulating film and the display panel comprise at least one main organic insulating layer, wherein the main organic insulating layer is made of set photosensitive resin; at least one pair of organic insulating layers, locate one side of the said main organic insulating layer, the material of the said pair of organic insulating layers includes setting photosensitive resin and thermoplastic polymer; the thermoplastic polymer is added, so that the water-oxygen barrier capability of the organic insulating film is improved, and in addition, the materials of all layers in the organic insulating film are the same, so that the production efficiency is improved by one etching process. Namely, the production efficiency is improved while the capability of isolating water and oxygen is improved.
In summary, although the present invention has been described in terms of the preferred embodiments, the preferred embodiments are not limited to the above embodiments, and various modifications and changes can be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention is defined by the appended claims.
Claims (8)
1. A display panel, comprising:
a substrate base;
the second auxiliary electrode is arranged on the substrate base plate;
an organic insulating film disposed on the second auxiliary electrode;
a transparent conductive layer disposed on the organic insulating film;
the organic insulating film comprises at least one main organic insulating layer and at least one auxiliary organic insulating layer, wherein the main organic insulating layer is made of set photosensitive resin; the auxiliary organic insulating layer is arranged on one side of the main organic insulating layer, and the material of the auxiliary organic insulating layer comprises the setting photosensitive resin and a thermoplastic polymer;
the organic insulating film comprises a second via hole, and the transparent conductive layer is connected with the second auxiliary electrode through the second via hole;
wherein the organic insulating film comprises a first main organic insulating layer and a second main organic insulating layer; the secondary organic insulating layer is arranged between the first main organic insulating layer and the second main organic insulating layer.
2. The display panel of claim 1, wherein the display panel comprises,
the thermoplastic polymer includes at least one of an ethylene vinyl alcohol copolymer and an ethylene vinyl acetate copolymer.
3. The display panel of claim 1, wherein the display panel comprises,
the thickness of the auxiliary organic insulating layer ranges from 0.3um to 2um.
4. The display panel of claim 1, wherein the display panel comprises,
the material of the secondary organic insulating layer further comprises a photoinitiator, a solvent and an additive.
5. The display panel of claim 4, wherein the display panel comprises,
the weight percentage of the thermoplastic polymer in the auxiliary organic insulating layer ranges from 0.1% to 5%;
the weight percentage range of the set photosensitive resin in the auxiliary organic insulating layer is 1% -25%;
the weight percentage range of the photoinitiator in the auxiliary organic insulating layer is 0.05% -10%;
the weight percentage of the additive in the auxiliary organic insulating layer ranges from 0.01% to 5%.
6. The display panel of claim 1, wherein the display panel comprises,
the setting photosensitive resin is PFA.
7. The display panel of claim 6, wherein the display panel comprises,
the setting photosensitive resin includes at least one of an acrylic resin and a silicone resin.
8. The display panel of claim 1, wherein the display panel comprises,
the organic insulating film includes a plurality of main organic insulating layers and a plurality of sub-organic insulating layers, wherein the total number of layers of the main organic insulating layers and the sub-organic insulating layers is 10 or less.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010403863.9A CN111584508B (en) | 2020-05-13 | 2020-05-13 | Organic insulating film and display panel |
| PCT/CN2020/096498 WO2021227191A1 (en) | 2020-05-13 | 2020-06-17 | Organic insulating film and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010403863.9A CN111584508B (en) | 2020-05-13 | 2020-05-13 | Organic insulating film and display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111584508A CN111584508A (en) | 2020-08-25 |
| CN111584508B true CN111584508B (en) | 2024-02-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010403863.9A Active CN111584508B (en) | 2020-05-13 | 2020-05-13 | Organic insulating film and display panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111584508B (en) |
| WO (1) | WO2021227191A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112406237A (en) * | 2020-11-19 | 2021-02-26 | 太湖华强科技有限公司 | Organic insulating film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09265183A (en) * | 1996-03-29 | 1997-10-07 | Hitachi Chem Co Ltd | Production of phosphor pattern |
| JP2003131377A (en) * | 2001-10-22 | 2003-05-09 | Fuji Photo Film Co Ltd | Photosensitive resin composition for interlayer insulating film and photosensitive transfer material |
| CN103477284A (en) * | 2011-03-17 | 2013-12-25 | 李允炯 | Chemically amplified positive photosensitive composition for an organic insulation film, and method for forming an organic insulation film using same |
| CN106597809A (en) * | 2016-12-01 | 2017-04-26 | 杭州福斯特光伏材料股份有限公司 | Photosensitive polyimide resin composition for high-frequency transmission circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09265184A (en) * | 1996-03-29 | 1997-10-07 | Hitachi Chem Co Ltd | Photosensitive element and production of phosphor pattern formed by using the same |
| US6797760B1 (en) * | 1999-10-15 | 2004-09-28 | Alphagary Corporation | Non-dripping, flame retardant, fluoroelastomer insulative compositions for telecommunication cables |
-
2020
- 2020-05-13 CN CN202010403863.9A patent/CN111584508B/en active Active
- 2020-06-17 WO PCT/CN2020/096498 patent/WO2021227191A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09265183A (en) * | 1996-03-29 | 1997-10-07 | Hitachi Chem Co Ltd | Production of phosphor pattern |
| JP2003131377A (en) * | 2001-10-22 | 2003-05-09 | Fuji Photo Film Co Ltd | Photosensitive resin composition for interlayer insulating film and photosensitive transfer material |
| CN103477284A (en) * | 2011-03-17 | 2013-12-25 | 李允炯 | Chemically amplified positive photosensitive composition for an organic insulation film, and method for forming an organic insulation film using same |
| CN106597809A (en) * | 2016-12-01 | 2017-04-26 | 杭州福斯特光伏材料股份有限公司 | Photosensitive polyimide resin composition for high-frequency transmission circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021227191A1 (en) | 2021-11-18 |
| CN111584508A (en) | 2020-08-25 |
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