WO2021227191A1 - Organic insulating film and display panel - Google Patents
Organic insulating film and display panel Download PDFInfo
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- WO2021227191A1 WO2021227191A1 PCT/CN2020/096498 CN2020096498W WO2021227191A1 WO 2021227191 A1 WO2021227191 A1 WO 2021227191A1 CN 2020096498 W CN2020096498 W CN 2020096498W WO 2021227191 A1 WO2021227191 A1 WO 2021227191A1
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- WIPO (PCT)
- Prior art keywords
- organic insulating
- insulating layer
- insulating film
- auxiliary
- display panel
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- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 21
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 20
- 239000000654 additive Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 4
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 claims description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 71
- 239000010408 film Substances 0.000 description 34
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000003999 initiator Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004383 yellowing Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- KHXKESCWFMPTFT-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-(1,2,2-trifluoroethenoxy)propane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)C(F)(F)F KHXKESCWFMPTFT-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
Definitions
- the present invention relates to the field of display technology, in particular to an organic insulating film and a display panel.
- the organic insulating film has relatively weak water and oxygen isolation characteristics, making the device vulnerable to the external environment. Electrical drift.
- the purpose of the present invention is to provide an organic insulating film and a display panel, which can improve the ability to block water and oxygen.
- an organic insulating film including:
- At least one main organic insulating layer the material of the main organic insulating layer is a set photosensitive resin
- At least one secondary organic insulating layer is arranged on one side of the main organic insulating layer, and the material of the secondary organic insulating layer includes the set photosensitive resin and a thermoplastic polymer.
- the present invention also provides a display panel including the above-mentioned organic insulating film.
- the organic insulating film and the display panel of the present invention comprise at least one main organic insulating layer, the material of the main organic insulating layer is set photosensitive resin; at least one secondary organic insulating layer is arranged on one side of the main organic insulating layer
- the material of the auxiliary organic insulating layer includes the set photosensitive resin and the thermoplastic polymer; the addition of the thermoplastic polymer improves the water and oxygen barrier capacity of the organic insulating film.
- FIG. 1 is a schematic diagram of the structure of an organic insulating film according to the first embodiment of the present invention
- FIG. 2 is a schematic diagram of the structure of an organic insulating film according to the second embodiment of the present invention.
- FIG. 3 is a schematic diagram of the structure of a display panel according to an embodiment of the present invention.
- FIG. 4 is a schematic structural diagram of a display panel according to another embodiment of the present invention.
- FIG. 1 is a schematic structural diagram of an organic insulating film according to Embodiment 1 of the present invention.
- the organic insulating film 20 of this embodiment includes: a main organic insulating layer 21 and a sub organic insulating layer 22.
- the material of the main organic insulating layer 21 is a set photosensitive resin; in one embodiment, the set photosensitive resin includes PFA, and PFA is a copolymer of a small amount of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene
- the material for setting the photosensitive resin may include at least one of acrylic resin and silicone resin.
- the auxiliary organic insulating layer 22 is provided above the main organic insulating layer 21, of course, it can also be provided below the main organic insulating layer 21.
- the material of the auxiliary organic insulating layer 22 includes the set photosensitive resin and a thermoplastic polymer.
- the thermoplastic polymer includes at least one of an ethylene-vinyl alcohol copolymer and an ethylene-vinyl acetate copolymer.
- the thickness of the secondary organic insulating layer 22 ranges from 0.3um to 2um.
- the material of the secondary organic insulating layer 22 further includes a photoinitiator, a solvent, and additives.
- the weight percentage of the thermoplastic polymer in the secondary organic insulating layer 22 ranges from 0.1% to 5%; the weight percentage of the set photosensitive resin in the secondary organic insulating layer 22 ranges from 1. %-25%; the weight percentage of the photoinitiator in the auxiliary organic insulating layer 22 ranges from 0.05% to 10%; the weight percentage of the additive in the auxiliary organic insulating layer 22 ranges from 0.01% to 5% ,
- the remaining content is solvent.
- the polarity of the main organic insulating layer 21 is positive, and the polarity of the auxiliary organic insulating layer 22 is positive or negative.
- the preparation method of the secondary organic insulating layer 22 is specifically as follows:
- PFA resins such as acrylic resins, silicone resins, etc.
- the photoinitiator may be a commonly used initiator for photoresist, such as PAC (polyaluminum chloride), PAG (polyalkylene glycol), etc.; additives such as adhesion aids, leveling agents, etc.
- a secondary organic insulating layer with a positive polarity is obtained through the above steps.
- the photoinitiator is an initiator of a negative photoresist
- a negative-polarity secondary organic insulating layer is obtained through the above steps.
- the commonly used initiators of negative photoresist can generate free radicals under ultraviolet light irradiation, such as acetophenones, benzophenones, imidazoles, etc.
- S101 Coating and setting a photosensitive resin (such as positive PFA) on a base substrate, after yellowing, developing, and then baking (Oven) at a high temperature to form the main organic insulating layer 21.
- a photosensitive resin such as positive PFA
- the film thickness of the main organic insulating layer 21 can range from 0.3um to 2um, and preferably 0.7um.
- S102 Coating and setting photosensitive resin and thermoplastic polymer on the main organic insulating layer, after yellowing, developing, and then baking (Oven) at a high temperature to form a secondary organic insulating layer.
- the film thickness of the secondary organic insulating layer 22 may range from 0.3 um to 2 um, and preferably 0.7 um.
- thermoplastic polymer Due to the addition of thermoplastic polymer, the water and oxygen barrier capacity of the organic insulating film is increased. In addition, since the materials of each layer in the organic insulating film are the same, it can be formed through an etching process, which improves production efficiency.
- FIG. 2 is a schematic structural diagram of an organic insulating film according to the second embodiment of the present invention.
- the difference between the organic insulating film 20 of this embodiment and the previous embodiment is that the main organic insulating layer of this embodiment is two layers, that is, it includes a first main organic insulating layer 21 and a second main organic insulating layer 21. Insulation layer 23.
- the auxiliary organic insulating layer 22 is provided between the first main organic insulating layer 21 and the second main organic insulating layer 23.
- S201 Coating and setting a photosensitive resin (such as positive PFA) on a base substrate, after yellowing, developing, and then baking (Oven) at a high temperature to form the first main organic insulating layer 21.
- a photosensitive resin such as positive PFA
- the film thickness of the first main organic insulating layer 21 may range from 0.3um to 2um, and preferably 0.7um.
- S202 Coating and setting photosensitive resin and thermoplastic polymer on the main organic insulating layer, after yellowing, developing, and then baking (Oven) at a high temperature to form a secondary organic insulating layer.
- the film thickness of the secondary organic insulating layer 22 may range from 0.3 um to 2 um, and preferably 0.7 um.
- S203 Coating and setting photosensitive resin (such as positive PFA) on the base substrate, after yellow light, developing, and then high-temperature baking (Oven) to form the second main organic insulating layer 23.
- photosensitive resin such as positive PFA
- the film thickness of the second main organic insulating layer 23 may range from 0.3 um to 2 um, and preferably 0.7 um.
- the organic insulating film 20 may include multiple (more than 2) main organic insulating layers and multiple (more than 1) auxiliary organic insulating layers, wherein the main organic insulating layer and the auxiliary organic insulating layer
- the total number of layers is greater than or equal to 2 and less than or equal to 10.
- the present invention also provides a display panel, including: a base substrate 10, a first metal layer, a gate insulating layer 12, a second metal layer, an organic insulating film 20, and a transparent conductive layer 30,
- the first metal layer is used to form the gate and the first auxiliary electrode 12
- the second metal layer is used to form the source and drain electrodes and the second auxiliary electrode 13
- the organic insulating film 20 is formed with a first via 201 and a second Two via holes 202, the first via hole 201 and the second via hole 202 can be made by dry etching process (Dry). Since the material of the organic insulating film is the same, it can be formed by one etching process, and the internal avoidance of the via hole Smoother, thereby improving the stability of the connection.
- Dry dry etching process
- the first auxiliary electrode 12 is connected to the transparent conductive layer 30 through the first via hole 201; the second auxiliary electrode 13 is connected to the transparent conductive layer 30 through the second via hole 202.
- FIGS. 3 and 4 only show schematic diagrams of the connection area of the display panel, and the remaining areas are not shown. It is understandable that FIGS. 3 and 4 take the organic insulating film of the first embodiment as an example for description, but the present invention is not limited. The organic insulating films of other embodiments of the present invention can also be adapted to the above-mentioned display panel.
- the organic insulating film and the display panel of the present invention comprise at least one main organic insulating layer, the material of the main organic insulating layer is set photosensitive resin; at least one secondary organic insulating layer is arranged on one side of the main organic insulating layer
- the material of the auxiliary organic insulating layer includes the set photosensitive resin and thermoplastic polymer; due to the addition of the thermoplastic polymer, the water and oxygen barrier capacity of the organic insulating film is improved.
- due to the The material is the same, so it can be formed through an etching process, which improves production efficiency. That is, while improving the ability to isolate water and oxygen characteristics, it also improves production efficiency.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Formation Of Insulating Films (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Provided are an organic insulating film and a display panel. The organic insulating film comprises: at least one primary organic insulating layer, with the material of the primary organic insulating layer being a set photosensitive resin; and at least one secondary organic insulating layer, which is disposed at one side of the primary organic insulating layer, with the material of the secondary organic insulating layer comprising the set photosensitive resin and a thermoplastic polymer.
Description
本发明涉及显示技术领域，特别是涉及一种有机绝缘膜及显示面板。The present invention relates to the field of display technology, in particular to an organic insulating film and a display panel.
现有金属氧化物半导体层的薄膜晶体管，为了满足充电率要求以及降低错充风险，一般采用有机绝缘膜作为保护层（Passiviation）。Existing thin film transistors with metal oxide semiconductor layers generally use an organic insulating film as a protective layer (Passiviation) in order to meet the charging rate requirements and reduce the risk of mischarging.
然而有机绝缘膜与传统的化学气相沉积（CVD）镀膜制作的普通绝缘材料（SiNx或SiOx）的保护层相比，有机绝缘膜隔绝水氧特性相对较弱，使得器件易受外界环境影响而发生电性漂移。However, compared with the protective layer of ordinary insulating material (SiNx or SiOx) made by traditional chemical vapor deposition (CVD) coating, the organic insulating film has relatively weak water and oxygen isolation characteristics, making the device vulnerable to the external environment. Electrical drift.
本发明的目的在于提供一种有机绝缘膜及显示面板，能够提高隔绝水氧的能力。The purpose of the present invention is to provide an organic insulating film and a display panel, which can improve the ability to block water and oxygen.
为解决上述技术问题，本发明提供一种有机绝缘膜，包括：In order to solve the above technical problems, the present invention provides an organic insulating film, including:
至少一主有机绝缘层，所述主有机绝缘层的材料为设定感光树脂；At least one main organic insulating layer, the material of the main organic insulating layer is a set photosensitive resin;
至少一副有机绝缘层，设于所述主有机绝缘层的一侧，所述副有机绝缘层的材料包括所述设定感光树脂和热塑性聚合物。At least one secondary organic insulating layer is arranged on one side of the main organic insulating layer, and the material of the secondary organic insulating layer includes the set photosensitive resin and a thermoplastic polymer.
本发明还提供一种显示面板，其包括上述有机绝缘膜。The present invention also provides a display panel including the above-mentioned organic insulating film.
本发明的有机绝缘膜及显示面板，包括至少一主有机绝缘层，所述主有机绝缘层的材料为设定感光树脂；至少一副有机绝缘层，设于所述主有机绝缘层的一侧，所述副有机绝缘层的材料包括所述设定感光树脂和热塑性聚合物；由于添加了热塑性聚合物，因此提高了有机绝缘膜的水氧阻隔能力。The organic insulating film and the display panel of the present invention comprise at least one main organic insulating layer, the material of the main organic insulating layer is set photosensitive resin; at least one secondary organic insulating layer is arranged on one side of the main organic insulating layer The material of the auxiliary organic insulating layer includes the set photosensitive resin and the thermoplastic polymer; the addition of the thermoplastic polymer improves the water and oxygen barrier capacity of the organic insulating film.
图1为本发明实施例一的有机绝缘膜的结构示意图；FIG. 1 is a schematic diagram of the structure of an organic insulating film according to the first embodiment of the present invention;
图2为本发明实施例二的有机绝缘膜的结构示意图；2 is a schematic diagram of the structure of an organic insulating film according to the second embodiment of the present invention;
图3为本发明一实施方式的显示面板的结构示意图；3 is a schematic diagram of the structure of a display panel according to an embodiment of the present invention;
图4为本发明另一实施方式的显示面板的结构示意图。FIG. 4 is a schematic structural diagram of a display panel according to another embodiment of the present invention.
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是以相同标号表示。The description of the following embodiments refers to the attached drawings to illustrate specific embodiments that the present invention can be implemented. The directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "inner", "outer", "side", etc., are for reference only The direction of the additional schema. Therefore, the directional terms used are used to describe and understand the present invention, rather than to limit the present invention. In the figure, units with similar structures are indicated by the same reference numerals.
本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别不同对象，而不是用于描述特定顺序。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific sequence. In addition, the terms "including" and "having" and any variations of them are intended to cover non-exclusive inclusions.
请参照图1，图1为本发明实施例一的有机绝缘膜的结构示意图。Please refer to FIG. 1, which is a schematic structural diagram of an organic insulating film according to Embodiment 1 of the present invention.
如图1所示，本实施例的有机绝缘膜20包括：主有机绝缘层21和副有机绝缘层22。As shown in FIG. 1, the organic insulating film 20 of this embodiment includes: a main organic insulating layer 21 and a sub organic insulating layer 22.
其中所述主有机绝缘层21的材料为设定感光树脂；在一实施方式中，所述设定感光树脂包括PFA，PFA为少量全氟丙基全氟乙烯基醚与聚四氟乙烯的共聚物，所述设定感光树脂的材料可包括丙烯酸树脂和硅氧树脂中的至少一种。The material of the main organic insulating layer 21 is a set photosensitive resin; in one embodiment, the set photosensitive resin includes PFA, and PFA is a copolymer of a small amount of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene The material for setting the photosensitive resin may include at least one of acrylic resin and silicone resin.
副有机绝缘层22设于所述主有机绝缘层21的上方，当然也可设于所述主有机绝缘层21的下方。所述副有机绝缘层22的材料包括所述设定感光树脂和热塑性聚合物。The auxiliary organic insulating layer 22 is provided above the main organic insulating layer 21, of course, it can also be provided below the main organic insulating layer 21. The material of the auxiliary organic insulating layer 22 includes the set photosensitive resin and a thermoplastic polymer.
在一实施方式中，为了进一步提高水氧阻隔能力，所述热塑性聚合物包括乙烯-乙烯醇共聚物和乙烯-乙酸乙烯酯共聚物中的至少一种。In one embodiment, in order to further improve the water and oxygen barrier capacity, the thermoplastic polymer includes at least one of an ethylene-vinyl alcohol copolymer and an ethylene-vinyl acetate copolymer.
在一实施方式中，为了进一步提高水氧阻隔能力，所述副有机绝缘层22的厚度范围为0.3um~2um。In one embodiment, in order to further improve the water and oxygen barrier capacity, the thickness of the secondary organic insulating layer 22 ranges from 0.3um to 2um.
在一实施方式中，所述副有机绝缘层22的材料还包括光引发剂、溶剂和添加剂。In one embodiment, the material of the secondary organic insulating layer 22 further includes a photoinitiator, a solvent, and additives.
在一实施方式中，所述副有机绝缘层22中所述热塑性聚合物的重量百分比范围为0.1%-5%；所述副有机绝缘层22中所述设定感光树脂的重量百分比范围为1%-25%；所述副有机绝缘层22中所述光引发剂的重量百分比范围为0.05%-10%；所述副有机绝缘层22中所述添加剂的重量百分比范围为0.01%~5%，其余含量为溶剂。In one embodiment, the weight percentage of the thermoplastic polymer in the secondary organic insulating layer 22 ranges from 0.1% to 5%; the weight percentage of the set photosensitive resin in the secondary organic insulating layer 22 ranges from 1. %-25%; the weight percentage of the photoinitiator in the auxiliary organic insulating layer 22 ranges from 0.05% to 10%; the weight percentage of the additive in the auxiliary organic insulating layer 22 ranges from 0.01% to 5% , The remaining content is solvent.
在一实施方式中，所述主有机绝缘层21的极性为正型，所述副有机绝缘层22的极性为正或者负。In one embodiment, the polarity of the main organic insulating layer 21 is positive, and the polarity of the auxiliary organic insulating layer 22 is positive or negative.
在一实施方式中，副有机绝缘层22的制备方式具体如下：In one embodiment, the preparation method of the secondary organic insulating layer 22 is specifically as follows:
将1-25wt%的PFA树脂、0.1-8wt%的热塑性聚合物、0.05-10wt%的光引发剂、0.01~5wt%添加剂以及溶剂混合，之后进行加热，上述树脂与热塑性聚合物发生交联反应，其中PFA树脂比如包括丙烯酸树脂、硅氧树脂等，主要影响膜层的曝光、显影、力学以及化学特性。光引发剂可以为光刻胶的常用引发剂，如PAC（聚合氯化铝）、PAG（聚亚烷基二醇）等；添加剂比如为附着助剂、流平剂等。Mix 1-25wt% of PFA resin, 0.1-8wt% of thermoplastic polymer, 0.05-10wt% of photoinitiator, 0.01~5wt% of additives and solvent, and then heat, the above resin and thermoplastic polymer will undergo cross-linking reaction Among them, PFA resins, such as acrylic resins, silicone resins, etc., mainly affect the exposure, development, mechanical and chemical properties of the film. The photoinitiator may be a commonly used initiator for photoresist, such as PAC (polyaluminum chloride), PAG (polyalkylene glycol), etc.; additives such as adhesion aids, leveling agents, etc.
当所述光引发剂为正型光刻胶的引发剂时，通过上述步骤得到极性为正型副有机绝缘层。When the photoinitiator is an initiator of a positive photoresist, a secondary organic insulating layer with a positive polarity is obtained through the above steps.
当所述光引发剂为负型光刻胶的引发剂时，通过上述步骤得到极性为负型副有机绝缘层。其中负型光刻胶的常用引发剂在紫外光照射下能产能自由基，如苯乙酮类、二苯甲酮类、咪唑类等。When the photoinitiator is an initiator of a negative photoresist, a negative-polarity secondary organic insulating layer is obtained through the above steps. Among them, the commonly used initiators of negative photoresist can generate free radicals under ultraviolet light irradiation, such as acetophenones, benzophenones, imidazoles, etc.
本实施例的有机绝缘膜具体在制作过程中包括以下步骤：The organic insulating film of this embodiment specifically includes the following steps in the manufacturing process:
S101、在衬底基板上涂布设定感光树脂（比如正型PFA）、经过黄光、显影后，再高温烘烤（Oven）后，形成主有机绝缘层21。S101: Coating and setting a photosensitive resin (such as positive PFA) on a base substrate, after yellowing, developing, and then baking (Oven) at a high temperature to form the main organic insulating layer 21.
主有机绝缘层21的膜厚范围可为0.3um~2um，其中优选为0.7um。The film thickness of the main organic insulating layer 21 can range from 0.3um to 2um, and preferably 0.7um.
S102、在主有机绝缘层上涂布设定感光树脂和热塑性聚合物、经过黄光、显影后，再高温烘烤（Oven）后，形成副有机绝缘层。S102: Coating and setting photosensitive resin and thermoplastic polymer on the main organic insulating layer, after yellowing, developing, and then baking (Oven) at a high temperature to form a secondary organic insulating layer.
副有机绝缘层22的膜厚范围可为0.3um~2um，其中优选为0.7um。The film thickness of the secondary organic insulating layer 22 may range from 0.3 um to 2 um, and preferably 0.7 um.
由于添加热塑性聚合物，因此增加有机绝缘膜的水氧阻隔能力，此外由于有机绝缘膜中的各层的材料相同，因此可以通过一道蚀刻工艺形成过程，提高了生产效率。Due to the addition of thermoplastic polymer, the water and oxygen barrier capacity of the organic insulating film is increased. In addition, since the materials of each layer in the organic insulating film are the same, it can be formed through an etching process, which improves production efficiency.
可以理解的，如果在有机绝缘膜上方或者下方增加一层普通绝缘层以提升隔绝水氧的特性，但是由于普通绝缘材料与有机绝缘的材料差异，不便于一次性在其上形成过孔，增加了蚀刻工艺的难度；如采用分步蚀刻会增加掩膜工艺，降低了生产效率。It is understandable that if a common insulating layer is added above or below the organic insulating film to improve the water and oxygen isolation characteristics, but due to the difference between the common insulating material and the organic insulating material, it is not convenient to form vias on it at one time. This reduces the difficulty of the etching process; if stepwise etching is used, it will increase the masking process and reduce the production efficiency.
请参照图2，图2为本发明实施例二的有机绝缘膜的结构示意图。Please refer to FIG. 2, which is a schematic structural diagram of an organic insulating film according to the second embodiment of the present invention.
如图2所示，本实施例的有机绝缘膜20与上一实施例的区别在于：本实施例的主有机绝缘层为两层，也即包括第一主有机绝缘层21和第二主有机绝缘层23。所述副有机绝缘层22设于第一主有机绝缘层21和所述第二主有机绝缘层23之间。As shown in FIG. 2, the difference between the organic insulating film 20 of this embodiment and the previous embodiment is that the main organic insulating layer of this embodiment is two layers, that is, it includes a first main organic insulating layer 21 and a second main organic insulating layer 21. Insulation layer 23. The auxiliary organic insulating layer 22 is provided between the first main organic insulating layer 21 and the second main organic insulating layer 23.
本实施例的有机绝缘膜具体在制作过程中包括以下步骤：The organic insulating film of this embodiment specifically includes the following steps in the manufacturing process:
S201、在衬底基板上涂布设定感光树脂（比如正型PFA）、经过黄光、显影后，再高温烘烤（Oven）后，形成第一主有机绝缘层21。S201: Coating and setting a photosensitive resin (such as positive PFA) on a base substrate, after yellowing, developing, and then baking (Oven) at a high temperature to form the first main organic insulating layer 21.
第一主有机绝缘层21的膜厚范围可为0.3um~2um，其中优选为0.7um。The film thickness of the first main organic insulating layer 21 may range from 0.3um to 2um, and preferably 0.7um.
S202、在主有机绝缘层上涂布设定感光树脂和热塑性聚合物、经过黄光、显影后，再高温烘烤（Oven）后，形成副有机绝缘层。S202: Coating and setting photosensitive resin and thermoplastic polymer on the main organic insulating layer, after yellowing, developing, and then baking (Oven) at a high temperature to form a secondary organic insulating layer.
副有机绝缘层22的膜厚范围可为0.3um~2um，其中优选为0.7um。The film thickness of the secondary organic insulating layer 22 may range from 0.3 um to 2 um, and preferably 0.7 um.
S203、在衬底基板上涂布设定感光树脂（比如正型PFA）、经过黄光、显影后，再高温烘烤（Oven）后，形成第二主有机绝缘层23。S203: Coating and setting photosensitive resin (such as positive PFA) on the base substrate, after yellow light, developing, and then high-temperature baking (Oven) to form the second main organic insulating layer 23.
第二主有机绝缘层23的膜厚范围可为0.3um~2um，其中优选为0.7um。The film thickness of the second main organic insulating layer 23 may range from 0.3 um to 2 um, and preferably 0.7 um.
当然，可以理解的，所述有机绝缘膜20可包括多层（大于2）主有机绝缘层和多层（大于1）副有机绝缘层，其中所述主有机绝缘层和所述副有机绝缘层的总层数大于等于2小于等于10。通过设置多层膜层，进一步提升阻隔能力，由于各层膜厚较薄使得阻隔层的硬度增加，从而提高了面板的抗压能力。Of course, it is understandable that the organic insulating film 20 may include multiple (more than 2) main organic insulating layers and multiple (more than 1) auxiliary organic insulating layers, wherein the main organic insulating layer and the auxiliary organic insulating layer The total number of layers is greater than or equal to 2 and less than or equal to 10. By providing multiple layers of film, the barrier capacity is further improved, and the thickness of each layer is thinner, so that the hardness of the barrier layer is increased, thereby improving the pressure resistance of the panel.
如图3和图4所示，本发明还提供一种显示面板，包括：衬底基板10、第一金属层、栅绝缘层12、第二金属层、有机绝缘膜20以及透明导电层30，其中第一金属层用于形成栅极和第一辅助电极12、第二金属层用于形成源极和漏极以及第二辅助电极13，有机绝缘膜20上形成有第一过孔201和第二过孔202，第一过孔201和第二过孔202可通过干刻工艺（Dry）制作得到，由于有机绝缘膜的材料相同，因此可以通过一道蚀刻工艺形成过程，且过孔的内避较平滑，从而提高连接的稳定性。As shown in FIGS. 3 and 4, the present invention also provides a display panel, including: a base substrate 10, a first metal layer, a gate insulating layer 12, a second metal layer, an organic insulating film 20, and a transparent conductive layer 30, The first metal layer is used to form the gate and the first auxiliary electrode 12, the second metal layer is used to form the source and drain electrodes and the second auxiliary electrode 13, and the organic insulating film 20 is formed with a first via 201 and a second Two via holes 202, the first via hole 201 and the second via hole 202 can be made by dry etching process (Dry). Since the material of the organic insulating film is the same, it can be formed by one etching process, and the internal avoidance of the via hole Smoother, thereby improving the stability of the connection.
第一辅助电极12通过第一过孔201与透明导电层30连接；第二辅助电极13通过第二过孔202与透明导电层30连接。The first auxiliary electrode 12 is connected to the transparent conductive layer 30 through the first via hole 201; the second auxiliary electrode 13 is connected to the transparent conductive layer 30 through the second via hole 202.
图3和图4仅给出显示面板的连接区域的示意图，其余区域未示出。可以理解的，图3和图4以实施例一的有机绝缘膜为例进行说明，但是不能对本发明构成限定，本发明其余实施例的有机绝缘膜同样可以适应与上述显示面板中。3 and 4 only show schematic diagrams of the connection area of the display panel, and the remaining areas are not shown. It is understandable that FIGS. 3 and 4 take the organic insulating film of the first embodiment as an example for description, but the present invention is not limited. The organic insulating films of other embodiments of the present invention can also be adapted to the above-mentioned display panel.
本发明的有机绝缘膜及显示面板，包括至少一主有机绝缘层，所述主有机绝缘层的材料为设定感光树脂；至少一副有机绝缘层，设于所述主有机绝缘层的一侧，所述副有机绝缘层的材料包括所述设定感光树脂和热塑性聚合物；由于添加了热塑性聚合物，因此提高了有机绝缘膜的水氧阻隔能力，此外由于有机绝缘膜中的各层的材料相同，因此可以通过一道蚀刻工艺形成过程，提高了生产效率。也即在提高隔绝水氧特性的能力的同时，提高了生产效率。The organic insulating film and the display panel of the present invention comprise at least one main organic insulating layer, the material of the main organic insulating layer is set photosensitive resin; at least one secondary organic insulating layer is arranged on one side of the main organic insulating layer The material of the auxiliary organic insulating layer includes the set photosensitive resin and thermoplastic polymer; due to the addition of the thermoplastic polymer, the water and oxygen barrier capacity of the organic insulating film is improved. In addition, due to the The material is the same, so it can be formed through an etching process, which improves production efficiency. That is, while improving the ability to isolate water and oxygen characteristics, it also improves production efficiency.
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。In summary, although the present invention has been disclosed in preferred embodiments as above, the above-mentioned preferred embodiments are not intended to limit the present invention. Those of ordinary skill in the art can make various modifications without departing from the spirit and scope of the present invention. Such changes and modifications, so the protection scope of the present invention is subject to the scope defined by the claims.
Claims (20)
- 一种有机绝缘膜，其包括：An organic insulating film, which includes:至少一主有机绝缘层，所述主有机绝缘层的材料为设定感光树脂；At least one main organic insulating layer, the material of the main organic insulating layer is a set photosensitive resin;至少一副有机绝缘层，设于所述主有机绝缘层的一侧，所述副有机绝缘层的材料包括所述设定感光树脂和热塑性聚合物。At least one secondary organic insulating layer is arranged on one side of the main organic insulating layer, and the material of the secondary organic insulating layer includes the set photosensitive resin and a thermoplastic polymer.
- 根据权利要求1所述的有机绝缘膜，其中The organic insulating film according to claim 1, wherein所述热塑性聚合物包括乙烯-乙烯醇共聚物和乙烯-乙酸乙烯酯共聚物中的至少一种。The thermoplastic polymer includes at least one of ethylene-vinyl alcohol copolymer and ethylene-vinyl acetate copolymer.
- 根据权利要求1所述的有机绝缘膜，其中The organic insulating film according to claim 1, wherein所述副有机绝缘层的厚度范围为0.3um~2um。The thickness of the secondary organic insulating layer ranges from 0.3um to 2um.
- 根据权利要求1所述的有机绝缘膜，其中The organic insulating film according to claim 1, wherein所述副有机绝缘层的材料还包括光引发剂、溶剂以及添加剂。The material of the auxiliary organic insulating layer further includes a photoinitiator, a solvent and an additive.
- 根据权利要求4所述的有机绝缘膜，其中The organic insulating film according to claim 4, wherein所述副有机绝缘层中所述热塑性聚合物的重量百分比范围为0.1%-5%；The weight percentage of the thermoplastic polymer in the auxiliary organic insulating layer ranges from 0.1% to 5%;所述副有机绝缘层中所述设定感光树脂的重量百分比范围为1%-25%；The weight percentage range of the set photosensitive resin in the auxiliary organic insulating layer is 1%-25%;所述副有机绝缘层中所述光引发剂的重量百分比范围为0.05%-10%；The weight percentage of the photoinitiator in the auxiliary organic insulating layer ranges from 0.05% to 10%;所述副有机绝缘层中所述添加剂的重量百分比范围为0.01%~5%。The weight percentage of the additive in the auxiliary organic insulating layer ranges from 0.01% to 5%.
- 根据权利要求1所述的有机绝缘膜，其中The organic insulating film according to claim 1, wherein所述设定感光树脂为PFA。The setting photosensitive resin is PFA.
- 根据权利要求6所述的有机绝缘膜，其中The organic insulating film according to claim 6, wherein所述设定感光树脂包括丙烯酸树脂和硅氧树脂中的至少一种。The setting photosensitive resin includes at least one of acrylic resin and silicone resin.
- 根据权利要求1所述的有机绝缘膜，其中所述有机绝缘膜还包括：The organic insulating film according to claim 1, wherein the organic insulating film further comprises:所述第一主有机绝缘层和所述第二主有机绝缘层；所述副有机绝缘层设于第一主有机绝缘层和所述第二主有机绝缘层之间。The first main organic insulating layer and the second main organic insulating layer; the auxiliary organic insulating layer is disposed between the first main organic insulating layer and the second main organic insulating layer.
- 根据权利要求1所述的有机绝缘膜，其中The organic insulating film according to claim 1, wherein所述有机绝缘膜包括多层主有机绝缘层和多层副有机绝缘层，其中所述主有机绝缘层和所述副有机绝缘层的总层数小于等于10。The organic insulating film includes multiple primary organic insulating layers and multiple secondary organic insulating layers, wherein the total number of layers of the primary organic insulating layer and the secondary organic insulating layer is less than or equal to 10.
- 一种显示面板，其包括有机绝缘膜，其包括：A display panel includes an organic insulating film, which includes:至少一主有机绝缘层，所述主有机绝缘层的材料为设定感光树脂；At least one main organic insulating layer, the material of the main organic insulating layer is a set photosensitive resin;至少一副有机绝缘层，设于所述主有机绝缘层的一侧，所述副有机绝缘层的材料包括所述设定感光树脂和热塑性聚合物。At least one secondary organic insulating layer is arranged on one side of the main organic insulating layer, and the material of the secondary organic insulating layer includes the set photosensitive resin and a thermoplastic polymer.
- 根据权利要求10所述的显示面板，其中The display panel according to claim 10, wherein所述热塑性聚合物包括乙烯-乙烯醇共聚物和乙烯-乙酸乙烯酯共聚物中的至少一种。The thermoplastic polymer includes at least one of ethylene-vinyl alcohol copolymer and ethylene-vinyl acetate copolymer.
- 根据权利要求10所述的显示面板，其中The display panel according to claim 10, wherein所述副有机绝缘层的厚度范围为0.3um~2um。The thickness of the secondary organic insulating layer ranges from 0.3um to 2um.
- 根据权利要求10所述的显示面板，其中The display panel according to claim 10, wherein所述副有机绝缘层的材料还包括光引发剂、溶剂以及添加剂。The material of the auxiliary organic insulating layer further includes a photoinitiator, a solvent and an additive.
- 根据权利要求13所述的显示面板，其中The display panel according to claim 13, wherein所述副有机绝缘层中所述热塑性聚合物的重量百分比范围为0.1%-5%；The weight percentage of the thermoplastic polymer in the auxiliary organic insulating layer ranges from 0.1% to 5%;所述副有机绝缘层中所述设定感光树脂的重量百分比范围为1%-25%；The weight percentage range of the set photosensitive resin in the auxiliary organic insulating layer is 1%-25%;所述副有机绝缘层中所述光引发剂的重量百分比范围为0.05%-10%；The weight percentage of the photoinitiator in the auxiliary organic insulating layer ranges from 0.05% to 10%;所述副有机绝缘层中所述添加剂的重量百分比范围为0.01%~5%。The weight percentage of the additive in the auxiliary organic insulating layer ranges from 0.01% to 5%.
- 根据权利要求10所述的显示面板，其中The display panel according to claim 10, wherein所述设定感光树脂为PFA。The setting photosensitive resin is PFA.
- 根据权利要求15所述的显示面板，其中The display panel according to claim 15, wherein所述设定感光树脂包括丙烯酸树脂和硅氧树脂中的至少一种。The setting photosensitive resin includes at least one of acrylic resin and silicone resin.
- 根据权利要求10所述的显示面板，其中所述有机绝缘膜还包括：The display panel according to claim 10, wherein the organic insulating film further comprises:所述第一主有机绝缘层和所述第二主有机绝缘层；所述副有机绝缘层设于第一主有机绝缘层和所述第二主有机绝缘层之间。The first main organic insulating layer and the second main organic insulating layer; the auxiliary organic insulating layer is disposed between the first main organic insulating layer and the second main organic insulating layer.
- 根据权利要求10所述的显示面板，其中The display panel according to claim 10, wherein所述有机绝缘膜包括多层主有机绝缘层和多层副有机绝缘层，其中所述主有机绝缘层和所述副有机绝缘层的总层数小于等于10。The organic insulating film includes multiple primary organic insulating layers and multiple secondary organic insulating layers, wherein the total number of layers of the primary organic insulating layer and the secondary organic insulating layer is less than or equal to 10.
- 根据权利要求10所述的显示面板，其中所述有机绝缘膜上形成有第一过孔和第二过孔。10. The display panel of claim 10, wherein a first via hole and a second via hole are formed on the organic insulating film.
- 根据权利要求19所述的显示面板，其还包括：The display panel of claim 19, further comprising:第一金属层，包括第一辅助电极；The first metal layer includes a first auxiliary electrode;第二金属层，设于所述第一金属层上，所述第二金属层包括第二辅助电极；A second metal layer disposed on the first metal layer, and the second metal layer includes a second auxiliary electrode;透明导电层，设于所述有机绝缘膜上；A transparent conductive layer arranged on the organic insulating film;所述第一辅助电极通过所述第一过孔与所述透明导电层连接；The first auxiliary electrode is connected to the transparent conductive layer through the first via;所述第二辅助电极通过所述第二过孔与所述透明导电层连接。The second auxiliary electrode is connected to the transparent conductive layer through the second via hole.
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| JPH09265184A (en) * | 1996-03-29 | 1997-10-07 | Hitachi Chem Co Ltd | Photosensitive element and production of phosphor pattern formed by using the same |
| JPH09265183A (en) * | 1996-03-29 | 1997-10-07 | Hitachi Chem Co Ltd | Production of phosphor pattern |
| US6797760B1 (en) * | 1999-10-15 | 2004-09-28 | Alphagary Corporation | Non-dripping, flame retardant, fluoroelastomer insulative compositions for telecommunication cables |
| CN106597809A (en) * | 2016-12-01 | 2017-04-26 | 杭州福斯特光伏材料股份有限公司 | Photosensitive polyimide resin composition for high-frequency transmission circuit board |
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| JPH09265183A (en) * | 1996-03-29 | 1997-10-07 | Hitachi Chem Co Ltd | Production of phosphor pattern |
| US6797760B1 (en) * | 1999-10-15 | 2004-09-28 | Alphagary Corporation | Non-dripping, flame retardant, fluoroelastomer insulative compositions for telecommunication cables |
| CN106597809A (en) * | 2016-12-01 | 2017-04-26 | 杭州福斯特光伏材料股份有限公司 | Photosensitive polyimide resin composition for high-frequency transmission circuit board |
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