CN111584442A - Heat sink device - Google Patents
Heat sink device Download PDFInfo
- Publication number
- CN111584442A CN111584442A CN202010327932.2A CN202010327932A CN111584442A CN 111584442 A CN111584442 A CN 111584442A CN 202010327932 A CN202010327932 A CN 202010327932A CN 111584442 A CN111584442 A CN 111584442A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation device
- heat
- heat dissipating
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Abstract
The invention relates to the field of heat dissipation, in particular to a heat dissipation device. The heat dissipating double-fuselage includes: the extension part extends outwards from one side of the bottom plate, and the other side, opposite to the extension part, of the bottom plate is used for being in contact with the heating part; the heat sink is made of silicon carbide ceramic composite material. The extension part is arranged on the other side of the heating part connected to the bottom plate, so that heat emitted by the heating part can be effectively dissipated, and the heat dissipation device is made of silicon carbide ceramic composite materials, so that the size of the heat dissipation device can be reduced while a better heat dissipation effect is achieved.
Description
Technical Field
The invention relates to the field of heat dissipation, in particular to a heat dissipation device.
Background
With the improvement of data processing capability of a processor, the number of internal crystals of a chip is greatly increased, accompanying heat dissipation problems become important for industrial research, at present, most of light and thin heat dissipation equipment in the market is made of aluminum or copper parts, but the heat dissipation capability of aluminum and copper materials is limited, and in order to achieve the corresponding heat dissipation purpose, the volume of the heat dissipation equipment is relatively large and complex.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a heat dissipation device, which can achieve a better heat dissipation effect and reduce the volume of the heat dissipation device.
The invention provides a heat dissipation device, comprising:
the extension part extends outwards from one side of the bottom plate, and the other side, opposite to the extension part, of the bottom plate is used for being in contact with the heating part;
the heat sink is made of silicon carbide ceramic composite material.
The heat dissipation device of the embodiment of the invention at least has the following beneficial effects: the extension portion is arranged on the other side of the heating piece connected to the bottom plate, so that heat emitted by the heating piece can be effectively dissipated, the heat dissipation device is made of silicon carbide ceramic composite materials, the silicon carbide ceramic composite materials have good heat conduction capacity, when a certain amount of heat on the heat dissipation piece needs to be dissipated, the heat dissipation device can be realized only by the heat dissipation device with the small size, and the effect of reducing the size of the heat dissipation device is achieved.
According to another embodiment of the heat dissipating device of the present invention, the bottom plate has a plurality of extending portions, and the extending portions are prism-shaped.
According to other embodiments of the heat dissipating device of the present invention, the cross-section of the extension portion is a diamond shape.
According to other embodiments of the heat dissipating device of the present invention, one of the internal angles α of the diamond shape is 45 °.
According to the heat dissipation device of other embodiments of the present invention, the plurality of extension portions are arranged in a first row structure, each of the first row structures is disposed in parallel, and the extension portions of two adjacent first row structures are disposed in a staggered manner.
According to other embodiments of the heat dissipation device of the present invention, a protrusion is disposed between the two extending portions.
According to other embodiments of the heat dissipating device of the present invention, the longitudinal section of the protrusion is triangular.
According to other embodiments of the heat dissipating device of the present invention, the extension portion includes a first plane and a second plane which are parallel, and the first plane and the second plane are in contact with adjacent extension portions, respectively.
According to other embodiments of the heat dissipating device of the present invention, the inclination angle between the inclined surface of the protrusion and the bottom plate is 5 ° to 7 °.
According to other embodiments of the heat dissipating device of the present invention, all the extending portions are disposed in parallel.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a heat dissipation device;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a schematic structural diagram of another embodiment of a heat dissipation device;
FIG. 4 is a top view of FIG. 3;
fig. 5 is a cross-sectional view taken along line a-a in fig. 4.
Reference numerals: heat sink 101, base plate 102, extension 103, first row structure 202, protrusion 301, first plane 401, second plane 402, and slope 501.
Detailed Description
The concept and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments to fully understand the objects, features and effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention.
In the description of the embodiments of the present invention, if an orientation description is referred to, for example, the orientations or positional relationships indicated by "upper", "lower", "front", "rear", "left", "right", etc. are based on the orientations or positional relationships shown in the drawings, only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, if a feature is referred to as being "disposed", "fixed", "connected", or "mounted" to another feature, it may be directly disposed, fixed, or connected to the other feature or may be indirectly disposed, fixed, connected, or mounted to the other feature. In the description of the embodiments of the present invention, if "several" is referred to, it means more than one, if "several" is referred to, it means more than two, if "more than", "less than" or "more than" is referred to, it is understood that the number is not included, and if "more than", "less than" or "within" is referred to, it is understood that the number is included. If reference is made to "first" or "second", this should be understood to distinguish between features and not to indicate or imply relative importance or to implicitly indicate the number of indicated features or to implicitly indicate the precedence of the indicated features.
As an embodiment, the heat dissipation device includes a bottom plate and an extension portion located on the bottom plate, both the bottom plate and the extension portion can be used for heat dissipation, one end of the extension portion is fixedly connected with the bottom plate, and the other end of the extension portion extends to the outer side (above as shown in fig. 1) of the bottom plate, the length of the extension portion is not limited, as long as the heat dissipation requirement of the heat dissipation device can be met, and the extension portion increases the heat dissipation area of the whole heat dissipation device. Compared with heat dissipation equipment made of copper materials or aluminum materials, the heat dissipation device made of the material can also enable the heat dissipation device to have a compact structure on the premise of ensuring the heat dissipation efficiency, and the purposes of reducing weight and size are achieved.
In this embodiment, the heat dissipation device has a flat structure, so that the area of the heat dissipation device is more distributed in two-dimensional directions, and the thickness of the heat dissipation device can be reduced.
Referring to fig. 1 and fig. 2, as an embodiment of the heat dissipation device 101, a plurality of extension portions 103 are disposed on the same side of a bottom plate 102 of the heat dissipation device 101, the extension portions 103 are in a prism structure, and a cross section of each extension portion 103 may be a polygon, for example, a quadrangle or a hexagon, and it is conceivable that the shape of the heat dissipation device 101 may satisfy the requirement of the present solution as long as the shape can ensure the heat dissipation requirement.
Referring to fig. 1 to 2, as an embodiment, all the extending portions 103 are arranged in parallel, a cross section of each extending portion 103 is a rhombus, and one of the inner angles of the rhombus is an angle α, when the angle α is 45 °, the heat dissipation effect of the heat dissipation device 101 is better.
As an embodiment, as shown in fig. 2, a plurality of extending portions 103 are arranged in a row in the horizontal direction, all the extending portions 103 arranged in a row are defined as first row structures 202, the whole heat dissipation device 101 includes a plurality of first row structures 202, each first row structure 202 is arranged in parallel, and the extending portions 103 on two adjacent first row structures 202 are arranged in a staggered manner, so that under the condition that the area of the bottom plate 102 is fixed, more extending portions 103 can be arranged to achieve a better heat dissipation effect. Based on the structure, more extension parts 103 can be arranged in the two-dimensional space of the heat dissipation device 101, so that the length of each extension part 103 is not too long, the spatial thickness of the heat dissipation device 101 is further reduced, and the heat dissipation device is in accordance with the flat arrangement.
As another embodiment, referring to fig. 3 to 5, the bottom plate 102 includes a plurality of extending portions 103, the extending portions 103 are parallel to each other, and the extending portions 103 are plate-shaped, and it is contemplated that the extending portions 103 may be rectangular parallelepiped or any other plate-shaped as long as the heat dissipation effect of the heat dissipation device 101 can be satisfied.
As another embodiment, referring to fig. 3 to 5, a protrusion 301 is disposed between at least two extending portions 103 on the bottom plate 102, the protrusion 301 is integrally connected with the bottom plate 102, and the protrusion 301 has an effect of expanding a heat dissipation area, so that the heat dissipation effect of the heat dissipation device 101 is better.
It is contemplated that the shape of the protrusion 301 may be any shape as long as the heat dissipation effect of the heat dissipation device 101 is satisfied, for example, the protrusion 301 may be polygonal, arc-shaped, or any shape suitable for other requirements of the heat dissipation device 101.
As another embodiment, referring to fig. 3 to 5, the protrusion 301 includes a slope 501 inclined downward from the middle to both sides, which serves to increase a heat dissipation area. The inclined surface 501 has an inclination with respect to the base plate, and thus, in the a-a section, the cross section of the protrusion is triangular or approximately triangular. Where a middle portion is an opposing side, it is positioned relatively midway between the sides and is not limited to the center of the structure. In this embodiment, the two inclined surfaces 501 of the protrusion 300 are symmetrical to each other, so that the two inclined surfaces 501 form the same inclination angle β with respect to the bottom surface, the specific angle of the inclination angle β can be reasonably set according to actual needs, and when the inclination angle β is between 5 ° and 7 °, the heat dissipation effect of the heat dissipation device 101 is better.
As an example, referring to fig. 3 to 5, the extension portion includes a first plane 401 and a second plane 402, and the first plane 401 and the second plane 402 respectively abut on two adjacent extension portions 103, so that the bottom plate 102, the protrusion 301, and all the extension portions 103 are integrated.
As an example, referring to fig. 5, the inclined surface of the protrusion 301 extends from the middle portion to the left and right edges of the bottom plate, further increasing the heat dissipation area of the heat dissipation device 101.
Based on the above structure, since the protrusions 301 can increase the heat dissipation area of the heat dissipation device 101, which is equivalent to increase the distribution of the heat dissipation device 101 in a two-dimensional space, the thickness of the heat dissipation device 101 can be reduced under the condition of achieving the same heat dissipation effect, so that the heat dissipation device 101 better conforms to the flat arrangement.
As an example, referring to fig. 4, all the extensions 103 have a protrusion 301 disposed therebetween.
As an embodiment, as shown in fig. 1 to 5, the heat dissipation device 101 has a flattened structure, which enables the heat dissipation device 101 to achieve a better heat dissipation effect.
In conclusion, the heat dissipation structure has the beneficial effects that:
1. the whole heat dissipation device 101 is made of the ceramic carbide composite material, and the ceramic carbide composite material has the characteristics of high heat transfer coefficient and light weight, for example, under the air-cooled or water-cooled heat dissipation condition, the heat dissipation efficiency of the heat dissipation device 101 made of the silicon carbide ceramic composite material reaches 2 times of that of a metal aluminum heat dissipation device with the same heat dissipation area and reaches 1.3 times of that of a copper heat dissipation device, so that the heat dissipation device 101 made of the material has smaller volume and lighter weight compared with heat dissipation equipment made of aluminum or steel under the condition of the same heat dissipation effect.
2. In the embodiment of fig. 1 to 2, all the extending portions 103 are arranged in parallel in the horizontal direction, and are staggered in the horizontal direction, and the cross section of the extending portions 103 is a diamond shape, and the best heat dissipation effect is achieved when the angle α of the diamond shape is 45 °.
3. In the embodiment of fig. 3 to 5, all the extending portions 103 are arranged in parallel, and the protrusions 301 are disposed between adjacent extending portions 103, the a-a direction of the protrusions 301 is triangular, and the inclination angle β between the side surface and the bottom surface of the protrusions 301 is between 5 ° and 7 °, so that the heat dissipation device 101 as a whole can achieve a better heat dissipation effect.
4. Due to the structure and material of the heat dissipation device 101, the volume of the heat dissipation device can be further reduced, and the heat dissipation device 101 can better conform to the design concept of flattening.
As an example, the present heat dissipation device 101 can be used for heat dissipation of a chip. The high-efficiency heat dissipation performance of the heat dissipation device 101 enables the chip to dissipate heat efficiently, so that stable operation of the chip is ensured, and the service life is prolonged.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (10)
1. A heat sink, comprising:
the heating device comprises a base plate and an extension part, wherein the extension part extends outwards from one side of the base plate, and the other side of the base plate, which is opposite to the extension part, is used for being in contact with a heating part;
the heat dissipation device is made of silicon carbide ceramic composite materials.
2. The heat dissipating device of claim 1, wherein the bottom plate has a plurality of said extensions, and the extensions are prism-shaped.
3. The heat dissipating device of claim 2, wherein the cross-section of the extension is diamond-shaped.
4. A heat sink according to claim 3, wherein one of the internal angles α of said rhombus is 45 °.
5. The heat dissipating device as claimed in any one of claims 1 to 3, wherein a plurality of the extending portions are arranged in a first row structure, each of the first row structures is arranged in parallel, and the extending portions of two adjacent first row structures are arranged in a staggered manner.
6. The heat dissipating device of claim 1, wherein a protrusion is disposed between two of said extensions.
7. The heat dissipating device of claim 6, wherein the longitudinal cross-section of the protrusion is triangular.
8. The heat dissipating device of claim 5, wherein said extensions comprise first and second parallel planar surfaces, each of said first and second planar surfaces contacting an adjacent one of said extensions.
9. The heat dissipating device of claim 7, wherein the slope of the protrusion is inclined at an angle of 5 ° to 7 ° with respect to the bottom plate.
10. The heat dissipating device of claim 1, wherein all of said extensions are disposed in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010327932.2A CN111584442A (en) | 2020-04-23 | 2020-04-23 | Heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010327932.2A CN111584442A (en) | 2020-04-23 | 2020-04-23 | Heat sink device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111584442A true CN111584442A (en) | 2020-08-25 |
Family
ID=72127065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010327932.2A Pending CN111584442A (en) | 2020-04-23 | 2020-04-23 | Heat sink device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111584442A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6318451B1 (en) * | 2000-03-15 | 2001-11-20 | Foxconn Precision Components Co., Ltd. | Heat sink for integrated circuit |
| CN2731923Y (en) * | 2004-09-14 | 2005-10-05 | 大同股份有限公司 | Radiator structure |
| CN103298317A (en) * | 2012-02-24 | 2013-09-11 | 三菱电机株式会社 | Cooler and cooling device |
| CN208706623U (en) * | 2018-07-17 | 2019-04-05 | 西安法迪复合材料有限公司 | A kind of new power electronics aluminium silicon carbide board structure |
| CN209249397U (en) * | 2018-12-03 | 2019-08-13 | 乐清市丰驰电气有限公司 | A kind of novel breaker |
-
2020
- 2020-04-23 CN CN202010327932.2A patent/CN111584442A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6318451B1 (en) * | 2000-03-15 | 2001-11-20 | Foxconn Precision Components Co., Ltd. | Heat sink for integrated circuit |
| CN2731923Y (en) * | 2004-09-14 | 2005-10-05 | 大同股份有限公司 | Radiator structure |
| CN103298317A (en) * | 2012-02-24 | 2013-09-11 | 三菱电机株式会社 | Cooler and cooling device |
| CN208706623U (en) * | 2018-07-17 | 2019-04-05 | 西安法迪复合材料有限公司 | A kind of new power electronics aluminium silicon carbide board structure |
| CN209249397U (en) * | 2018-12-03 | 2019-08-13 | 乐清市丰驰电气有限公司 | A kind of novel breaker |
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| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200825 |
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| RJ01 | Rejection of invention patent application after publication |