CN217509110U

CN217509110U - Integrated circuit layout structure convenient to test

Info

Publication number: CN217509110U
Application number: CN202221029994.6U
Authority: CN
Inventors: 陈恒辉; 罗德知
Original assignee: Hunan Luhedao Technology Co ltd
Current assignee: Hunan Luhedao Technology Co ltd
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2022-09-27
Anticipated expiration: 2032-04-29

Abstract

The utility model relates to the technical field of integrated circuit layout, in particular to an integrated circuit layout structure which is convenient for testing, comprising a circuit board, a protective strip is sleeved on the outer side of the circuit board, two ends of the protective strip are fixedly provided with bumps, and the bumps are sleeved On the screw and slidingly connected with the screw, the screw is threadedly connected with the nut, the nut is located at the upper end of the bump, the screw is symmetrically arranged at both ends of the heat dissipation plate, the surface of the heat dissipation plate is provided with a number of grooves, and a second groove is arranged in the groove A spring, the top of the second spring is fixedly connected with the bottom of the heat-conducting rod, and several heat-dissipating holes are provided on both sides of the upper surface and the lower surface of the heat-dissipating plate. In the utility model, the heat generated by the circuit board is transferred to the heat sink for heat dissipation through the contact between the heat-conducting rod and the circuit board. It is directly attached to the heat sink, and then fixed with a nut, which is convenient for maximum heat dissipation and improves heat dissipation efficiency.

Description

Integrated circuit layout structure convenient to test

Technical Field

The utility model relates to an integrated circuit territory technical field, specifically speaking relates to an integrated circuit territory structure convenient to test.

Background

The integrated circuit board is a carrier for loading the integrated circuit, but the integrated circuit is usually carried on the integrated circuit board, and the integrated circuit board is mainly composed of silica gel.

Along with the more and more complicated of circuit board structure preparation, the heat that the circuit board produced is also more and more big, and current circuit board all dispels the heat through seting up the louvre, but the size of louvre is unified, can not adjust according to the heat dissipation demand of circuit board, and also can get into through the louvre at radiating in-process dust and adhere to on the circuit board, through long-time accumulation, can collect a large amount of dusts on the circuit board, cause the influence to the use of circuit board, in view of this, need improve.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an integrated circuit territory structure convenient to test to solve the problem that proposes among the above-mentioned background art.

For realizing the above-mentioned purpose, the utility model provides an integrated circuit layout structure convenient to test, which comprises a circuit board, circuit board outside cover has the protecting strip, the fixed lug that sets up in both ends of protecting strip, the lug cover on the screw rod and with screw rod sliding connection, screw rod and nut threaded connection, the nut is located the upper end of lug, the screw rod symmetry sets up the both ends at the heating panel, the inside hollow structure that is of heating panel, a plurality of recesses are seted up to the heating panel upper surface, be equipped with the second spring in the recess, second spring top and heat conduction pole bottom fixed connection, the lower fixed surface that fin and circuit board were passed to the top of heat conduction pole is connected, the fin is located the upper surface of heating panel, a plurality of louvres are all seted up with the both sides of lower surface to the heating panel upper surface.

As a further improvement of the technical scheme, a first spring is sleeved on the screw rod and is positioned on the screw rod at the lower end of the projection.

As a further improvement of the technical scheme, elastic pieces are arranged on two sides of the upper surface of the heat radiating fin, and the upper end of each elastic piece is attached to the lower surface of the circuit board.

As a further improvement of the technical scheme, the side walls of the two sides of the heat dissipation plate are provided with symmetrical through holes, fixed blocks are arranged in the through holes in a sliding mode, and threaded holes are formed in the upper surfaces of the fixed blocks.

As a further improvement of the technical scheme, a third spring is arranged in the through hole, and one end of the third spring is fixedly connected with one end of the fixing block.

As a further improvement of the technical scheme, a plurality of air holes are formed in the side walls of the other two sides of the heat dissipation plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. in this integrated circuit territory structure convenient to test, through the contact of conducting rod with the circuit board, the heat transfer that produces the circuit board dispels the heat for the fin, the louvre on the heating panel also does benefit to the exchange that promotes cold and hot air current simultaneously, reach the purpose of accelerating the heat dissipation, when the heat dissipation dynamics is strengthened to needs, through the sliding connection of circuit board and screw rod, with the circuit board lapse, until directly laminating with the fin, recycle the nut and fix, the at utmost of being convenient for dispels the heat, and the efficiency of heat dissipation is improved.

2. In this integrated circuit territory structure convenient to test, the louvre on the radiating plate is sheltered from to the fin, and through the cooperation of fin and radiating plate, also isolated with the dust when can guarantee the heat dissipation, protects the circuit board.

Drawings

Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention;

FIG. 2 is an exploded view of the overall structure of the embodiment of the present invention;

FIG. 3 is a sectional view of the heat dissipating plate and the heat dissipating fins of the embodiment of the present invention;

fig. 4 is a view for separating the fixing block and the third spring structure according to the embodiment of the present invention.

The various reference numbers in the figures mean:

1. a circuit board; 2. a protective strip; 21. a bump; 3. a screw; 31. a nut; 32. a first spring; 4. a heat sink; 41. an elastic member; 5. a heat dissipation plate; 51. a groove; 52. a second spring; 53. a heat conducting rod; 54. heat dissipation holes; 55. air holes are formed; 56. a through hole; 57. a third spring; 58. a fixed block; 59. a threaded bore.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the embodiment, referring to fig. 1-4, the embodiment provides an integrated circuit layout structure convenient for testing, which includes a circuit board 1, in view of the fragile material of the circuit board 1, in order to protect the circuit board 1, a protection strip 2 is sleeved outside the circuit board 1, in order to adjust the distance between the circuit board 1 and a heat sink 4, two ends of the protection strip 2 are fixedly provided with a bump 21, the bump 21 is sleeved on a screw rod 3 and slidably connected with the screw rod 3, the screw rod 3 is in threaded connection with a nut 31, the nut 31 is located at the upper end of the bump 21, the screw rods 3 are symmetrically arranged at two ends of a heat dissipation plate 5, in order for cold air to enter the interior of the heat dissipation plate 5, the interior of the heat dissipation plate 5 is a hollow structure, the upper surface of the heat dissipation plate 5 is provided with a plurality of grooves 51, second springs 52 are arranged in the grooves 51, the top ends of the second springs 52 are fixedly connected with the bottoms of heat conducting rods 53, the top end of the heat conducting rod 53 penetrates through the heat radiating fin 4 to be fixedly connected with the lower surface of the circuit board 1, the heat radiating fin 4 is located on the upper surface of the heat radiating plate 5 in order to shield dust entering from the heat radiating holes 54, and the heat radiating holes 54 are formed in the two sides of the upper surface and the lower surface of the heat radiating plate 5.

The heat-conducting rod 53 is preferably made of a metal such as copper, and the heat-dissipating fin 4 and the heat-dissipating plate 5 are preferably made of an aluminum alloy.

In this embodiment, under the normal condition, the circuit board 1 produces heat and gives the heat dissipation fin 4 through heat conduction pole 53 in the use, heat dissipation fin 4 and heating panel 5 and dispel the heat, simultaneously the exchange of air current can be promoted to the cold wind that louvre 54 department got into, strengthen radiating effect, when needs increase the effect, can slide circuit board 1 downwards on screw rod 3, make heat conduction pole 53 receive pressure and extrude second spring 52 and get into in the recess 51, rethread nut 31 and screw rod 3's threaded connection, it is fixed with circuit board 1, thereby make the lower surface of circuit board 1 and the upper surface direct contact of heat dissipation fin 4, and the heat dissipation effect is improved.

Considering that the material of the circuit board 1 is fragile, in order to buffer and protect the circuit board 1, the first spring 32 is sleeved on the screw rod 3, the first spring 32 is positioned on the screw rod 3 at the lower end of the bump 21, the circuit board 1 can be buffered when being pressed by the elasticity of the first spring 32, and meanwhile, the first spring 32 can bring the circuit board 1 to the original position rapidly after the nut 31 is loosened.

Furthermore, the two sides of the upper surface of the heat sink 4 are provided with elastic members 41, the upper ends of the elastic members 41 are attached to the lower surface of the circuit board 1, and the elastic action of the elastic members 41 can strengthen the protection of the circuit board 1.

Considering that the circuit board 1 may not be conveniently mounted by adding the heat dissipation structure at the lower end of the circuit board 1, the two side walls of the heat dissipation plate 5 are provided with symmetrical through holes 56, fixing blocks 58 are slidably disposed in the through holes 56, the upper surfaces of the fixing blocks 58 are provided with threaded holes 59, the fixing blocks 58 can be pulled out from the through holes 56 through the sliding connection between the fixing blocks 58 and the through holes 56, and the circuit board 1 is fixed by the cooperation of the threaded holes 59 and the bolts.

Furthermore, a third spring 57 is arranged in the through hole 56, one end of the third spring 57 is fixedly connected with one end of the fixing block 58, and the stability of the fixing block 58 can be enhanced through the elastic action of the third spring 57, so that the fixing block 58 is prevented from being separated from the through hole 56.

In order to accelerate the air circulation, the side walls of the other two sides of the heat dissipation plate 5 are provided with a plurality of air holes 55, and the air holes 55 and the two sides of the heat dissipation plate 5 with the hollow structure can facilitate the entry of external cold air and the discharge of internal heat.

When the integrated circuit layout structure is used specifically, under normal conditions, heat generated in the using process of the circuit board 1 is transferred to the radiating fins 4 through the heat conducting rods 53, the heat is radiated through the radiating fins 4 and the radiating plate 5, meanwhile, cold air entering from the radiating holes 54 can promote the exchange of air flows and enhance the radiating effect, when the effect needs to be increased, the circuit board 1 can slide downwards on the screw rods 3, so that the heat conducting rods 53 are pressed to extrude the second springs 52 into the grooves 51, meanwhile, the first springs 32 and the elastic pieces 41 are also extruded downwards, the elastic pieces 41 enter the accommodating grooves on the upper surfaces of the radiating fins 4, then the circuit board 1 is fixed through the threaded connection of the screw caps 31 and the screw rods 3, so that the lower surface of the circuit board 1 is in direct contact with the upper surfaces of the radiating fins 4, the radiating effect is improved, the fixing blocks 58 are pulled out of the through holes 56, and simultaneously, the third spring 57 is stretched and is connected with the bolt through a threaded hole 59 on the fixing block 58, so that the circuit board 1 is fixed.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. An integrated circuit layout structure that is convenient for testing, comprising a circuit board (1), characterized in that: the outer side of the circuit board (1) is sleeved with a protective strip (2), and both ends of the protective strip (2) are fixed A protrusion (21) is provided, the protrusion (21) is sleeved on the screw rod (3) and is slidably connected with the screw rod (3), the screw rod (3) is threadedly connected with the nut (31), and the screw cap ( 31) Located at the upper end of the bump (21), the screw (3) is symmetrically arranged at both ends of the heat dissipation plate (5), the interior of the heat dissipation plate (5) is a hollow structure, and the heat dissipation plate (5) The upper surface is provided with a plurality of grooves (51), the grooves (51) are provided with a second spring (52), the top of the second spring (52) is fixedly connected with the bottom of the heat-conducting rod (53), and the heat-conducting rod The top end of (53) is fixedly connected to the lower surface of the circuit board (1) through the heat sink (4), the heat sink (4) is located on the upper surface of the heat sink (5), and the heat sink (5) Several heat dissipation holes (54) are provided on both sides of the upper surface and the lower surface.

2. The integrated circuit layout structure according to claim 1, characterized in that: a first spring (32) is sleeved on the screw (3), and the first spring (32) is located on the bump (21) on the screw (3) at the lower end.

3. The integrated circuit layout structure according to claim 1, characterized in that: elastic members (41) are provided on both sides of the upper surface of the heat sink (4), and the upper end of the elastic member (41) is provided with elastic members (41). It is attached to the lower surface of the circuit board (1).

4. The integrated circuit layout structure according to claim 3, characterized in that: symmetrical through holes (56) are provided on both side walls of the heat dissipation plate (5), and the through holes (56) A fixing block (58) is slidably arranged, and a threaded hole (59) is provided on the upper surface of the fixing block (58).

5. The integrated circuit layout structure according to claim 4, wherein a third spring (57) is provided in the through hole (56), and one end of the third spring (57) is connected to the One end of the fixing block (58) is fixedly connected.

6 . The integrated circuit layout structure according to claim 5 , wherein a plurality of ventilation holes ( 55 ) are formed on the side walls of the other two sides of the heat dissipation plate ( 5 ). 7 .